Heat dissipation device

Abstract

The utility model relates to the technical field of refrigeration, in particular to a heat dissipation device. In the prior art, aluminum radiating fins are commonly used for heat conduction of a chip cooler, and heat dissipation is carried out by means of air convection of a fan; or the pipeline flows through an embedded or brazed heat conducting plate to form a refrigerant flow channel, and the heat is taken away by the circular flow of the refrigerant; cooling efficiency is low, process is complex, and cost is high. According to the heat dissipation device, at least a first metal heat conduction plate used for transferring heat is embedded in a non-metal base, and a porous cooling plate through which a refrigerant flows is arranged above the base; the porous cooling plate is internally provided with a plurality of through microporous circulation channels, the middle of one end of the porous cooling plate is sealed and separated to divide the porous cooling plate into two independent circulation channels, and the other end of the porous cooling plate forms confluence to form a complete circulation flow channel; the heat of the heating device is taken away through circular flowing of the refrigerant for heat dissipation. The cooling area is greatly increased, namely, the heat exchange efficiency is improved, and the cooling effect is good.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, and more specifically to a heat dissipation device. Background Technology

[0002] Existing household appliances, such as air conditioners, require chips to control their operating status. When chips or high-power transistors are working, they generate a lot of heat, causing the chip temperature to rise. If the chip operates at high temperatures for a long time, it is easy to burn out or affect its computing power. Therefore, it is necessary to cool down the chip or heat-generating module, that is, a cooler needs to be installed on the chip or heat-generating module.

[0003] In existing technologies, chip coolers often use aluminum heat sinks as heat conduction devices, and then rely on fan airflow for heat dissipation. In circuit board controllers within cooling systems, there are also designs that utilize refrigerant as a medium, flowing through pipes to an embedded or brazed heat-conducting plate, forming a refrigerant channel. The heat-conducting plate is in close contact with the chip, and the circulating flow of the refrigerant carries away heat, thus dissipating heat from the chip or heat-generating module. However, the shape and installation location of the refrigerant pipes are limited, resulting in a limited refrigerant channel area. This means that cooling is only achieved through the limited outer surface of the pipes and the heat-conducting plate, indirectly cooling the chip. This leads to low cooling efficiency, complex manufacturing processes, and high costs. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a heat dissipation device with a large cooling area, high heat dissipation efficiency, small size, and low cost.

[0005] A heat dissipation device includes a non-metallic base, on which at least one first metal heat-conducting plate for heat transfer is embedded. A porous cooling plate through which refrigerant flows is positioned above the base. One side of the first metal heat-conducting plate is in close contact with the chip and the heat-generating module, and the other side is in close contact with the porous cooling plate. The porous cooling plate has multiple through-hole microporous flow channels inside. One end of the porous cooling plate is sealed in the middle, dividing it into two independent flow channels. The other end forms a confluence, constituting a complete circulation channel. The refrigerant enters from one side of one end, flows out from the other side of the same end after confluence at the tail end, and dissipates heat from the heat-generating device through the circulation of the refrigerant. This practical device has a reasonable structure, greatly increases the cooling area, thus improving heat exchange efficiency, resulting in good cooling effect and effective protection of the chip.

[0006] As a further improvement and supplement to the above solution, this utility model also includes the following additional technical features:

[0007] The porous cooling plate has a front cover and a rear cover at both ends. The front cover has an inlet pipe and an outlet pipe. The refrigerant enters through the inlet pipe, flows through a flow channel on one side of the porous cooling plate, converges and rotates through the rear cover, then flows out through a flow channel on the other side of the porous cooling plate, and finally flows out through the outlet pipe. This reasonable structure allows for the refrigerant to flow in a circuitous manner, greatly improving heat exchange efficiency and resulting in excellent cooling performance.

[0008] The porous cooling plate has a harmonica-shaped flat tube structure, which is small in size and thin, and has a large contact area between the refrigerant and the porous cooling plate. It is lightweight and low in cost.

[0009] The front cover has two spaced-apart long grooves, with a round hole above each groove. This design effectively isolates the incoming and outgoing refrigerant.

[0010] The base is also equipped with a second metal heat-conducting plate for heat transfer. The arrangement of multiple metal heat-conducting plates, positioned above the chip, enables rapid heat transfer.

[0011] The first and second metal heat-conducting plates are made of copper alloy, aluminum alloy, or other metals with thermal conductivity. They offer good heat transfer performance.

[0012] The porous cooling plate is made of copper or aluminum alloy. It has good heat transfer performance.

[0013] The base is made of plastic or other non-metallic materials. It is lightweight, strong, and low in cost.

[0014] The following beneficial effects can be achieved by using this utility model: The utility model has a reasonable structure, with a multi-channel, porous cooling plate and a microporous channel structure, which fully expands the contact area between the refrigerant and the heat-conducting plate, increasing the heat exchange area, thus improving heat exchange efficiency and cooling effect. Furthermore, the porous cooling plate is thin, lightweight, and low-cost. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of this utility model (after removing the card holder 8).

[0017] Figure 3 This is the front view of the present invention (after removing the card holder 8).

[0018] Figure 4 This is a top view of the present invention (after removing the card holder 8).

[0019] Figure 5 This is a bottom view of the present invention (after removing the card holder 8).

[0020] Figure 6 This is a schematic diagram of the structure of the base 4 in this utility model.

[0021] Figure 7 This is a schematic diagram of the front cover 5 in this utility model.

[0022] Figure 8 This is a schematic diagram of the structure of the rear end cover 6 in this utility model.

[0023] Figure 9 This is a structural schematic diagram of the present invention in use. Detailed Implementation

[0024] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0025] like Figure 1-8 As shown, this utility model is a heat dissipation device.

[0026] The heat dissipation device described in this embodiment includes a non-metallic base 4 with at least one through slot. The through slot cooperates with a first metal heat-conducting plate 7. At least one first metal heat-conducting plate 7 for heat transfer is embedded in the base 4. A porous cooling plate 3 through which refrigerant flows is provided above the base 4. One side of the first metal heat-conducting plate 7 is in close contact with the chip and the heat-generating module, and the other side is in close contact with the porous cooling plate 3. The porous cooling plate 3 has multiple through-hole microporous flow channels inside. One end of the porous cooling plate 3 is sealed in the middle, dividing the porous cooling plate 3 into two independent flow channels. The other end forms a confluence, constituting a complete circulation channel. The refrigerant enters from one side of one end, flows out from the other side of the same end after confluence at the tail end, and uses the circulation of the refrigerant to carry away the heat of the heat-generating device for heat dissipation. The cooling area is greatly increased, the cooling efficiency is greatly improved, and the heat generated by the chip and the heat-generating module is carried away quickly, effectively ensuring the lifespan of the chip and the heat-generating module. The base 4 has protrusions 41 on both sides above it. The inner end faces of the two protrusions 41 are in contact with the porous cooling plate 3, thus engaging the porous cooling plate 3. In this embodiment, firstly, there are many channels for refrigerant flow, and secondly, the porous cooling plate 3 is in contact with the entire base 4, resulting in a large contact area and good heat exchange effect.

[0027] Furthermore, the porous cooling plate 3 is provided with a front end cover 5 and a rear end cover 6 at both ends. The front end cover 5 is provided with an inlet pipe 1 and an outlet pipe 2. The refrigerant enters through the inlet pipe 1, flows through a flow channel on one side inside the porous cooling plate 3, converges and rotates through the rear end cover 6, and then flows out through a flow channel on the other side inside the porous cooling plate 3, finally flowing out through the outlet pipe 2. The front end cover 5 and the rear end cover 6 seal both ends of the porous cooling plate 3, forming a refrigerant channel. Because the porous cooling plate 3 has many flow channels, the cooling speed is fast. The front end cover 5 abuts against the end face of the base 4; a step 42 is provided on the rear side of the base 4, and the rear end cover 6 abuts against the step 42, providing effective support.

[0028] Furthermore, the porous cooling plate 3 has a harmonica-shaped flat tube structure, which is small in size and thin in thickness, and has a large contact area between the refrigerant and the porous cooling plate.

[0029] Furthermore, the front cover 5 has two spaced elongated slots 52, with a circular hole 51 above each slot 52. The two elongated slots 52 and the two circular holes 51 are connected, and an input pipe 1 and an output pipe 2 are respectively provided on the circular holes 51. The front cover 5 and the rear cover 6 are both open at one end, and each opening has a concave elongated slot. The two sides of the porous cooling plate 3 extend into the concave elongated slots, sealing the two sides of the porous cooling plate 3.

[0030] Furthermore, the base 4 is also provided with a second metal heat-conducting plate 9 for transferring heat, and the base 4 is also provided with another through slot, which cooperates with the second metal heat-conducting plate 9. Similarly, the second metal heat-conducting plate 9 is also positioned directly above the chip and the heating module. The number of metal heat-conducting plates is set according to the number of chips and the heating module.

[0031] Furthermore, the materials of the first metal heat-conducting plate 7 and the second metal heat-conducting plate 9 are copper alloy, aluminum alloy, or other metals with thermal conductivity.

[0032] Furthermore, the porous cooling plate 3 is made of copper or aluminum alloy.

[0033] Furthermore, the base 4 is made of plastic or other non-metallic materials.

[0034] When using this heat dissipation device, simply use the plastic bracket 8 to fix the base 4 onto the circuit board.

[0035] The above are preferred embodiments of the present utility model and do not limit the scope of protection of the present utility model. Any modifications and improvements made by those skilled in the art based on the design concept of the present utility model should be considered within the scope of protection of the present utility model.

Claims

1. A heat dissipation device, comprising a non-metallic base (4), characterized in that: The base (4) is inlaid with at least a first metal heat-conducting plate (7) for transferring heat. A porous cooling plate (3) through which the refrigerant flows is provided above the base (4). One side of the first metal heat-conducting plate (7) is in close contact with the chip and the heat-generating module, and the other side is in close contact with the porous cooling plate (3). The porous cooling plate (3) has multiple through-hole flow channels inside. One end of the porous cooling plate (3) is sealed and partitioned in the middle, dividing the porous cooling plate (3) into two independent flow channels. The other end forms a confluence, constituting a complete circulation channel. The refrigerant enters from one side of one end, flows out from the other side of the same end after confluence at the tail end, and circulates to dissipate heat.

2. The heat dissipation device as described in claim 1, characterized in that: The porous cooling plate (3) is provided with a front end cover (5) and a rear end cover (6) at both ends. The front end cover (5) is provided with an input pipe (1) and an output pipe (2). The refrigerant enters from the input pipe (1), enters through the flow channel on one side of the porous cooling plate (3), flows back through the rear end cover (6), flows out from the flow channel on the other side of the porous cooling plate (3), and finally flows out from the output pipe (2).

3. The heat dissipation device as described in claim 1, characterized in that: The porous cooling plate (3) has a harmonica-style flat tube structure.

4. The heat dissipation device as described in claim 2, characterized in that: The front cover (5) is provided with two long grooves (52) spaced apart, and a round hole (51) is provided above the long grooves (52).

5. The heat dissipation device as described in claim 2, characterized in that: The base (4) is also provided with a second metal heat-conducting plate (9) for transferring heat.

6. The heat dissipation device as described in claim 5, characterized in that: The materials of the first metal heat-conducting plate (7) and the second metal heat-conducting plate (9) are copper alloy, aluminum alloy or other metals with thermal conductivity.

7. The heat dissipation device as described in claim 1, characterized in that: The porous cooling plate (3) is made of copper or aluminum alloy.

8. The heat dissipation device according to any one of claims 1-7, characterized in that: The base (4) is made of plastic or other non-metallic materials.

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