Liquid cooling mechanism and vehicle-mounted domain controller
By incorporating temperature-sensitive materials and fine-tuning blocks within the liquid cooling cap, the flow rate and channel area of the coolant are dynamically adjusted, thus resolving the chip overheating issue caused by liquid cooling system delays. This achieves efficient adaptive heat dissipation, protecting the performance and lifespan of the domain controller.
Patent Information
- Application Number
- CN202520159900.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-01-23
AI Technical Summary
Existing liquid cooling systems have a delay in the heat dissipation process of domain controllers, which may cause the chip temperature to exceed the safety threshold, affecting performance and lifespan.
The control mechanism inside the liquid cooling cover utilizes materials that change volume with temperature, such as metals or shape memory alloys, to dynamically adjust the coolant flow rate and channel area through the cooperation of fine-tuning blocks and baffles, thereby achieving adaptive heat dissipation.
When the chip temperature rises rapidly, the coolant flow rate and channel area are automatically adjusted to improve heat dissipation efficiency, prevent the chip temperature from becoming too high, and protect the chip performance and lifespan.
Smart Images

Figure CN223957825U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of domain controller especially relates to a liquid cooling mechanism and vehicle-mounted domain controller. BACKGROUND
[0002] With the development of vehicle intelligence, the number of controllers used by vehicles gradually increases, and the whole vehicle electronic architecture is also evolving from distributed to centralized. The domain controller is a key component in the centralized electronic architecture. The domain controller is usually used to realize the automatic driving or assisted driving function of the vehicle, such as at least one of positioning, path planning, decision control, high-speed communication, etc. Since the domain controller has computing power, the power consumption is high, and a certain amount of heat will be generated during work. It is necessary to set a heat dissipation structure for the domain controller to promptly discharge the heat generated during the work of the domain controller and ensure the normal work of the domain controller.
[0003] In the prior art, the heat dissipation strategy is to monitor the temperature of the high-performance computing chip in real time, and start the liquid cooling system when the temperature exceeds the preset threshold. According to the actual temperature of the chip, the flow rate and flow of the cooling liquid are dynamically adjusted to achieve the best heat dissipation effect. However, in the actual detection process, because of the response time of the sensor, reading data from the sensor, and passing these data to the control system for processing, there will be a slight delay in this process. After receiving the temperature data, the control system needs to analyze, judge, and make corresponding control decisions, which also takes a certain amount of time. In addition, the actuator (such as pump, valve, etc.) needs time to respond to the instruction, and the cooling liquid in the pipeline needs time to adapt to the change of flow rate and flow, which will also cause a certain delay. The total delay may affect the timeliness and accuracy of the heat dissipation system, especially in the case of rapid temperature rise of the chip. If the delay is too long, the chip temperature may exceed the safety threshold, which will adversely affect the performance and life of the chip. Therefore, a liquid cooling mechanism and vehicle-mounted domain controller are proposed. SUMMARY
[0004] To solve the above problems, the utility model discloses a kind of liquid cooling mechanism and vehicle-mounted domain controller.
[0005] Specific scheme is as follows:
[0006] A liquid cooling mechanism, comprising a liquid cooling cover provided with a first flow channel and a second flow channel for cooling liquid to flow, and a cover plate fixedly connected outside the liquid cooling cover; liquid outlets and liquid inlets for controlling the in and out of liquid are arranged outside the liquid cooling cover, a circuit board is fixedly connected to a side of the liquid cooling cover away from the cover plate, and a lower bottom plate is fixedly connected outside the liquid cooling cover; a control mechanism for fine tuning the flow rate of the cooling liquid is arranged inside the liquid cooling cover, the control mechanism comprises a control box arranged inside the liquid cooling cover, a control plate is slidably connected inside the control box, a material with a volume that changes under the influence of temperature is arranged between the control box and the control plate, a fine tuning block is fixedly connected outside the control plate, the control plate moves through the material with a volume that changes under the influence of temperature, the fine tuning block is slidably connected between the fine tuning block and the liquid cooling cover, and the fine tuning block is blocked inside the first flow channel and the second flow channel through a partitioning rib; the material with a volume that changes under the influence of temperature comprises a metal material, a memory alloy or a smart material.
[0007] Preferably, a receiving groove is arranged outside the liquid cooling cover, and the cover plate is fixed outside the liquid cooling cover through the receiving groove.
[0008] Preferably, the fine tuning block is slidably connected between the fine tuning block and the partitioning rib.
[0009] Preferably, a baffle plate is fixedly connected outside the control plate, and the baffle plate is fixedly connected between a side of the baffle plate away from the control plate and the fine tuning block.
[0010] A vehicle-mounted domain controller, comprising a circuit board, a chip fixedly connected outside the circuit board, a liquid cooling cover fixedly connected to a side of the circuit board close to the chip, a lower bottom plate fixedly connected outside the liquid cooling cover, a heat-conducting adhesive layer connected to an outer surface of a bottom of the liquid cooling cover, and the heat-conducting adhesive layer capable of being filled between the chip and the liquid cooling cover; the liquid cooling cover and the lower bottom plate are tightly bonded through glue, and an inner cavity is formed; dry gas is input through vacuum extraction to prevent water in gas in the controller from condensing, the input gas in the cavity can be nitrogen or other dry gas without water molecules, the vacuum extraction and gas filling approaches involved can be connectors, air holes or other holes, a sealing cover is installed at a rear side of an air cap, a rubber plug is installed on the connector, and the rest is not installed; after the glue is dry, the controller is vacuumed through the air holes by using a vacuum pump, and nitrogen or other gas without water molecules is filled into the controller, so that the internal and external pressures of the product are consistent, and a sealing plug is installed.
[0011] Preferably, air holes are arranged outside the lower bottom plate, and the air holes are sealed through sealing plugs.
[0012] The vehicle-mounted domain controller has the advantages that:
[0013] The material of which the volume affected by temperature changes is arranged between the control box and the control plate expands when the temperature of the chip rapidly rises, then the control plate moves, the control plate drives the fine adjustment block to move through the baffle, the baffle ensures that the material is not in contact with the outside in the control box during the movement of the fine adjustment block, the fine adjustment block moves to the direction of the first flow channel, then the flow area of the cooling liquid in the first flow channel becomes smaller, but the flow rate increases, although the flow area becomes smaller, the cooling area required for cooling the vehicle-mounted area controller does not change, then the cooling efficiency is self-adjusted to increase, the liquid cooling system is prevented from being delayed for too long, the temperature of the chip exceeds the safety threshold, and thus the performance and service life of the chip are adversely affected. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 is a structural schematic diagram of the utility model;
[0015] Figure 2 is a first part structural schematic diagram of the utility model;
[0016] Figure 3 is a second part structural schematic diagram in the utility model;
[0017] Figure 4 is a third part structural schematic diagram of the utility model;
[0018] Figure 5 is Figure 4 enlarged schematic view of A in the figure.
[0019] LIST OF REFERENCE NUMERALS
[0020] 1, liquid cooling cover; 2, lower bottom plate; 3, circuit board; 4, cover plate; 5, liquid outlet; 6, liquid inlet; 7, chip; 8, sealing plug; 9, through hole; 10, separation rib; 11, first flow channel; 12, second flow channel; 13, fine adjustment block; 14, control box; 15, baffle; 16, control plate; 17, containing groove. DETAILED DESCRIPTION
[0021] The utility model is further illustrated below in combination with the drawings and specific embodiments, and it should be understood that the following specific embodiments are only used for illustrating the utility model and are not used for limiting the scope of the utility model.
[0022] Please refer to Figures 1-5 The utility model discloses a liquid cooling mechanism, which comprises a liquid cooling cover 1, the liquid cooling cover 1 is provided with a first flow channel 11 and a second flow channel 12 for the flow of cooling liquid, and the liquid cooling cover 1 is externally fixedly connected with a cover plate 4.
[0023] The liquid cooling cover 1 is provided with an outlet 5 and an inlet 6 for controlling the liquid inflow and outflow. A circuit board 3 is fixedly connected to the side of the liquid cooling cover 1 away from the cover plate 4. A bottom plate 2 is fixedly connected to the outside of the liquid cooling cover 1.
[0024] The liquid cooling cover 1 is equipped with a control mechanism for fine-tuning the coolant flow rate. The control mechanism includes a control box 14 installed inside the liquid cooling cover 1. A control plate 16 is slidably connected inside the control box 14. A material whose volume changes with temperature is provided between the control box 14 and the control plate 16. A fine-tuning block 13 is fixedly connected to the outside of the control plate 16. The control plate 16 moves by the material whose volume changes with temperature. The fine-tuning block 13 is slidably connected to the liquid cooling cover 1. The fine-tuning block 13 passes through the partition rib 10 and is blocked inside the first flow channel 11 and the second flow channel 12.
[0025] Materials whose volume changes with temperature include metallic materials, shape memory alloys, and smart materials.
[0026] In one embodiment, for the liquid cooling cover 1, a receiving groove 17 is provided on the outside of the liquid cooling cover 1, and the cover plate 4 is fixed to the outside of the liquid cooling cover 1 through the receiving groove 17.
[0027] In one embodiment, the fine-tuning block 13 is slidably connected to the partition rib 10.
[0028] In one embodiment, for the control board 16, a baffle 15 is fixedly connected to the outside of the control board 16, and the side of the baffle 15 away from the control board 16 is fixedly connected to the fine-tuning block 13.
[0029] The working principle of the liquid cooling mechanism proposed in this utility model is that the refrigerant flows through the outlet 5 and the inlet 6 in the first flow channel 11 and the second flow channel 12. During the flow process, the temperature of the vehicle domain controller is carried away, and the heat dissipation area is increased through the thermally conductive adhesive layer.
[0030] When the chip temperature rises rapidly, the material between the control box 14 and the control board 16, whose volume changes due to temperature, expands, thereby controlling the movement of the control board 16. The control board 16, through the baffle 15, moves the fine-tuning block 13. During this movement, the baffle 15 ensures that the material inside the control box 14 does not come into contact with the outside environment. Figure 3 As shown, the fine-tuning block 13 moves toward the first flow channel 11, thereby reducing the coolant flow area inside the first flow channel 11, but increasing its flow rate. Although the flow area is reduced, the cooling area required to cool the vehicle domain controller remains unchanged, and the cooling efficiency increases automatically. At the same time, the fine-tuning block 13 moves toward the first flow channel 11, thereby increasing the coolant flow area inside the second flow channel 12, which can accelerate the outflow and circulation of coolant.
[0031] A vehicle-mounted domain controller, comprising a circuit board 3, a chip 7 is fixedly connected outside the circuit board 3, a liquid cooling cover 1 is fixedly connected to one side of the circuit board 3 close to the chip 7, a lower bottom plate 2 is fixedly connected outside the liquid cooling cover 1, a heat-conducting glue layer is connected to the outer surface of the bottom of the liquid cooling cover 1, and the heat-conducting glue layer can be filled between the chip 7 and the liquid cooling cover 1;
[0032] The liquid cooling cover 1 and the lower bottom plate 2 are tightly bonded through glue, and an inner cavity is formed; through vacuumizing and inputting dry gas, condensation of water in the gas in the controller is prevented; the input gas in the cavity can be nitrogen or other dry gas without water molecules; the vacuumizing and gas filling path can be a connector, a gas hole or other holes; a sealing cover is installed at the rear side of the gas cap, a rubber plug is installed on the connector, and the rest is not installed; after the glue is dry, the controller is vacuumized through the through hole 9 by using a vacuum pump, and nitrogen or other gas without water molecules is filled into the controller, so that the internal and external pressures of the product are consistent, and the sealing plug 8 is installed.
[0033] In an embodiment, the lower bottom plate 2 is provided with a through hole 9 outside the lower bottom plate 2, and the through hole 9 is sealed by the sealing plug 8.
[0034] The technical means disclosed in the utility model scheme is not only limited to the technical means disclosed in the above-mentioned embodiments, but also includes the technical scheme composed of any combination of the above technical features. It should be noted that, for ordinary skilled persons in the technical field, under the premise of not departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements are also regarded as the protection range of the utility model.
Claims
1. A liquid cooling mechanism characterized by, The liquid cooling cover is externally fixedly connected with a cover plate; liquid outlets and liquid inlets for controlling the inflow and outflow of the cooling liquid are arranged on the outer side of the liquid cooling cover; a circuit board is fixedly connected to the side of the liquid cooling cover away from the cover plate; a lower bottom plate is fixedly connected to the outer side of the liquid cooling cover; a control mechanism for fine-tuning the flow rate of the cooling liquid is arranged in the liquid cooling cover; the control mechanism comprises a control box arranged in the liquid cooling cover; a control plate is slidably connected to the inside of the control box; a material whose volume changes with temperature is arranged between the control box and the control plate; a fine-tuning block is fixedly connected to the outer side of the control plate; the control plate moves through the material whose volume changes with temperature; the fine-tuning block is slidably connected to the liquid cooling cover; and the fine-tuning block is blocked in the first flow channel and the second flow channel by the partitioning rib.
2. The liquid cooling mechanism according to claim 1, wherein The material whose volume changes with temperature is metal material, memory alloy or smart material.
3. The liquid cooling mechanism of claim 1, wherein, The outer side of the liquid cooling cover is provided with a receiving groove, and the cover plate is fixed to the outer side of the liquid cooling cover through the receiving groove.
4. The liquid cooling mechanism of claim 1, wherein, The fine-tuning block is slidably connected to the partitioning rib.
5. The liquid cooling mechanism of claim 1, wherein, A baffle plate is fixedly connected to the outer side of the control plate, and the side of the baffle plate away from the control plate is fixedly connected to the fine-tuning block.
6. An in-vehicle domain controller characterized by comprising: The circuit board is externally fixedly connected with a chip; a liquid cooling cover is fixedly connected to the side of the circuit board close to the chip; a lower bottom plate is fixedly connected to the outer side of the liquid cooling cover; a heat-conducting adhesive layer is connected to the outer surface of the bottom of the liquid cooling cover; the heat-conducting adhesive layer can be filled between the chip and the liquid cooling cover; the liquid cooling cover and the lower bottom plate are tightly bonded by glue, and an internal cavity is formed; the gas input into the cavity is nitrogen or other dry gas without water molecules; a sealing cover is installed at the rear side of the gas-permeable cap; and a rubber plug is installed on the connector.
7. The in-vehicle domain controller of claim 6, wherein, The lower bottom plate is externally provided with a through hole, and the through hole is sealed by a sealing plug.