Ultrahigh vacuum wafer edge searching device

Abstract

The utility model provides an ultrahigh vacuum wafer edge searching device which comprises a shell, a vacuum cavity is formed in the shell, the upper end face and the lower end face of the shell are fixedly connected to a laser receiver and a laser transmitter respectively, a through hole is formed in the lower end face of the shell, a mounting plate is fixedly connected to the through hole, and a clamping groove is formed in the lower end face of the shell. A first magnet and a second magnet are arranged at the upper end and the lower end of the mounting plate correspondingly, the first magnet and the second magnet are in magnetic fit, a rotating shaft is fixedly connected to the upper end of the first magnet, a bearing disc is fixedly connected to the upper end of the rotating shaft, and a driving motor is arranged below the second magnet; and the output end of the driving motor is in transmission connection with the second magnet. Through attraction between the first magnet and the second magnet, the situation that a hole is formed in the bottom of the vacuum cavity to be connected with an external motor can be avoided, sealing at the position does not need to be considered, and leakage of the vacuum cavity is avoided.

Description

TECHNICAL FIELD

[0001] The application relates to the field of wafer manufacturing technology, in particular to an ultrahigh vacuum wafer edge finding device. BACKGROUND

[0002] Etching is a very important step in semiconductor manufacturing process, microelectronic IC manufacturing process and micro-nano manufacturing process. Etching is a process of selectively removing unwanted materials from the surface of a silicon wafer by chemical or physical methods, and the basic goal is to correctly reproduce the mask pattern on the coated silicon wafer.

[0003] The edge finding step can position the wafer, and is one of the important steps before wafer etching. The existing structure is usually that a motor in the edge finding cavity drives a carrier disc to rotate to rotate the wafer for edge finding. Since the edge finding cavity is in a vacuum environment, and the motor is usually outside the cavity, the connection between the motor rotating shaft and the cavity needs to be dynamically sealed. The existing sealing method is usually magnetic fluid sealing, but there is still a risk of leakage, which has safety hazards. SUMMARY

[0004] To solve the above problems, the application discloses an ultrahigh vacuum wafer edge finding device, which comprises a shell, a vacuum chamber is arranged in the shell, a laser receiver and a laser emitter are fixedly connected to the upper end face and the lower end face of the shell respectively, a through hole is arranged in the lower end face of the shell, and a mounting plate is fixedly connected to the through hole, first magnets and second magnets are arranged at the upper end and the lower end of the mounting plate respectively, and the first magnets and the second magnets are magnetically matched. That is, the first magnets are located in the vacuum chamber, and the second magnets are located outside the vacuum chamber and are connected by magnetic force transmission. The structure has the advantages that no hole needs to be arranged on the mounting plate, and transmission sealing does not need to be considered.

[0005] A rotating shaft is fixedly connected to the upper end of the first magnet, a carrier disc is fixedly connected to the upper end of the rotating shaft, a driving motor is arranged below the second magnet, and the output end of the driving motor is in transmission connection with the second magnet. When the driving motor is started, the second magnet rotates, and the first magnet is driven to rotate through the action of the magnetic field.

[0006] Preferably, the laser emitter is fixed on the mounting plate, a second glass plate is arranged between the laser emitter and the mounting plate, a light-transmitting slot hole is arranged on the mounting plate, and the light-transmitting slot hole is located directly above the second glass plate. That is, the laser emitted by the laser emitter passes through the light-transmitting slot hole and is shot towards the laser receiver.

[0007] Preferably, the upper end surface of the shell is provided with an opening, and a first glass plate is arranged on the opening, the edge of the first glass plate is provided with a mounting compression ring, and the mounting compression ring and the shell are fixedly connected. The arrangement of the first glass plate, the second glass plate and the light-transmitting slot hole ensures that the laser can irradiate on the laser receiver.

[0008] Preferably, the laser receiver is fixedly connected on the mounting compression ring.

[0009] Preferably, the upper end of the driving motor is fixedly connected with a connecting column, and the upper end of the connecting column is fixedly connected with the mounting plate. The driving motor is fixedly connected with the mounting plate through the connecting column.

[0010] Preferably, the output end of the driving motor is fixedly connected with a shaft coupling, and the upper portion of the shaft coupling is fixedly connected with the second magnet. The output end of the driving motor and the second magnet are fixedly connected through the shaft coupling.

[0011] Preferably, the outer side of the first magnet is sleeved with a fixing ring, the inner side of the fixing ring is fixedly connected with a bearing, and the rotating shaft is fixedly connected with the inner ring of the bearing. The arrangement of the fixing ring and the bearing ensures the stability of the rotating shaft.

[0012] The beneficial effects of the present application are as follows: through the attraction between the first magnet and the second magnet, the driving motor connected to the outside through the opening at the bottom of the vacuum cavity can be avoided, so that the sealing at this place is not necessary, and the leakage of the vacuum cavity is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 is a perspective view of the present application;

[0014] Fig. 2 is an explosion view of the bottom perspective view of the present application;

[0015] Fig. 3 is an explosion view of the transmission structure of the present application.

[0016] LIST OF REFERENCE NUMERALS

[0017] 1, driving motor; 2, shell; 3, mounting compression ring; 4, first glass plate; 5, laser receiver; 6, laser emitter; 7, mounting plate; 8, connecting column; 9, light-transmitting slot hole; 10, bearing disc; 11, rotating shaft; 12, bearing; 13, fixing ring; 14, first magnet; 15, second magnet; 16, shaft coupling. DETAILED DESCRIPTION

[0018] The present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, and the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0019] like Figs. 1 to 3 As shown, an ultra-high vacuum wafer edge finding device includes a housing 2, inside which a vacuum chamber is provided. Due to the vacuum setting inside the housing 2, the housing 2 is a heavy-duty component. The upper and lower ends of the housing 2 are respectively fixedly connected to a laser receiver 5 and a laser emitter 6, that is, the laser receiver 5 irradiates the laser generator 6 from below. The lower end of the housing 2 is provided with a through hole, and a mounting plate 7 is fixedly connected to the through hole. Note that a seal is provided between the mounting plate 7 and the housing 2. The upper and lower ends of the mounting plate 7 are provided with a first magnet 14 and a second magnet 15, and the first magnet 14 and the second magnet 15 are magnetically coupled. That is, the first magnet 14 is located in the vacuum chamber, and the second magnet 15 is located outside the housing 2. The two are driven by magnetic force, eliminating the need to consider dynamic sealing and ensuring the airtightness of the vacuum chamber.

[0020] The upper end of the first magnet 14 is fixedly connected to a rotating shaft 11, and the upper end of the rotating shaft 11 is fixedly connected to a carrier plate 10, which is used to place the wafer. The lower part of the second magnet 15 is provided with a drive motor 1, and the output end of the drive motor 1 is connected to the second magnet 15. When the drive motor 1 is started, the placed wafer is driven to rotate by means of the second magnet 15, the first magnet 14, the rotating shaft 11 and other components.

[0021] The laser emitter 6 is fixed on the mounting plate 7, and a second glass plate is provided between the laser emitter 6 and the mounting plate 7. That is, a groove is provided at the lower end of the mounting plate 7, and the second glass plate is fixedly connected in the groove. Note that a sealing ring is provided between the second glass plate and the mounting plate 7. The mounting plate 7 is provided with a light-transmitting slot 9, which extends through the groove and is located directly above the second glass plate. That is, the structure illuminated by the laser emitter 6 passes through the second glass plate and the light-transmitting slot 9 into the vacuum chamber.

[0022] The upper surface of the housing 2 is provided with an opening, and a first glass plate 4 is provided on the opening. The edge of the first glass plate 4 is provided with a mounting ring 3, and the mounting ring 3 is fixedly connected to the housing 2. The first glass plate 4 is pressed and fixed on the top of the housing 2 by the mounting ring 3. At the same time, sealing rings are provided on the upper and lower edges of the first glass plate 4.

[0023] The laser receiver 5 is fixedly connected to the mounting ring 3. The laser receiver 5 is fixed to the mounting ring 3 by means of a U-shaped mounting bracket, and at this time, the laser receiver 5 is directly above the laser emitter 6.

[0024] In use, the wafer is placed above the bearing disc 10, the driving motor 1 is driven to work, the wafer is driven to rotate, when the notch on the wafer rotates to the line connecting the laser emitter 5 and the laser receiver 6, the driving motor 1 stops rotating, and the wafer edge detection operation is completed

[0025] The upper end of the driving motor 1 is fixedly connected with a connecting column 8, and the upper end of the connecting column 8 is fixedly connected with the mounting plate 7.

[0026] The output end of the driving motor 1 is fixedly connected with a shaft coupling 16, and the upper portion of the shaft coupling 16 is fixedly connected with the second magnet 15.

[0027] The outer side of the first magnet 14 is sleeved with a fixing ring 13, and the fixing ring 13 is fixedly connected to the upper end surface of the mounting plate 7. The inner side of the fixing ring 13 is fixedly connected with a bearing 12, and the rotating shaft 11 is fixedly connected to the inner ring of the bearing 12. The rotating shaft 11 and the first magnet 14 are suspended by the connection of the bearing 12.

[0028] The technical means disclosed in the scheme of the application is not limited to the technical means disclosed in the above-mentioned embodiments, and also includes the technical scheme composed of any combination of the above technical features.

Claims

1. An ultrahigh vacuum wafer edge finding device, comprising a housing (2), an interior of the housing (2) is provided with a vacuum chamber, and an upper end surface and a lower end surface of the housing (2) are fixedly connected to a laser receiver (5) and a laser emitter (6) respectively, characterized in that, The lower end surface of the shell (2) is provided with a through hole, and the through hole is fixedly connected with a mounting plate (7), the upper and lower ends of the mounting plate (7) are provided with a first magnet (14) and a second magnet (15), and the first magnet (14) and the second magnet (15) are magnetically matched; The upper end of the first magnet (14) is fixedly connected with a rotating shaft (11), the upper end of the rotating shaft (11) is fixedly connected with a bearing disc (10), the lower side of the second magnet (15) is provided with a driving motor (1), and the output end of the driving motor (1) is drivingly connected with the second magnet (15).

2. The ultra-high vacuum wafer edge-finding device of claim 1, wherein: The laser emitter (6) is fixed on the mounting plate (7), and a second glass plate is arranged between the laser emitter (6) and the mounting plate (7), the mounting plate (7) is provided with a light transmission slot (9), and the light transmission slot (9) is located directly above the second glass plate.

3. The ultra-high vacuum wafer edge-finding device of claim 1, wherein: The upper end surface of the shell (2) is provided with an opening, and the opening is covered with a first glass plate (4), the edge of the first glass plate (4) is provided with a mounting compression ring (3), and the mounting compression ring (3) and the shell (2) are fixedly connected.

4. The ultra-high vacuum wafer edge-finding device of claim 3, wherein: The laser receiver (5) is fixedly connected to the mounting compression ring (3).

5. The ultra-high vacuum wafer edge-finding device of claim 1, wherein: The upper end of the driving motor (1) is fixedly connected with a connecting column (8), and the upper end of the connecting column (8) is fixedly connected with the mounting plate (7).

6. The ultra-high vacuum wafer edge-finding device of claim 1, wherein: The output end of the driving motor (1) is fixedly connected with a shaft coupling (16), and the upper part of the shaft coupling (16) is fixedly connected with the second magnet (15).

7. The ultra-high vacuum wafer edge-finding device of claim 1, wherein: The outer side of the first magnet (14) is sleeved with a fixing ring (13), the inner side of the fixing ring (13) is fixedly connected with a bearing (12), and the rotating shaft (11) is fixedly connected to the inner ring of the bearing (12).

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