Fish tank thermostat based on semiconductor chilling plate

Abstract

The utility model provides a fish tank constant temperature machine based on a semiconductor chilling plate, which relates to the technical field of constant temperature devices, and comprises a cooling liquid circulation assembly, a semiconductor refrigeration assembly, a heat exchange assembly, a temperature sensor and a main control board, and the cooling liquid circulation assembly comprises a semiconductor chilling plate, a liquid circulation box, a pipeline, a radiator and a water pump. The semiconductor refrigeration assembly is attached to the outer surface of the liquid circulation box, the heat exchange assembly is attached to the outer surface of the semiconductor refrigeration assembly, the liquid circulation box, the semiconductor refrigeration assembly, the heat exchange assembly and the temperature sensor are all put into the fish tank, and the cooling liquid circulation assembly, the semiconductor refrigeration assembly and the temperature sensor are all electrically connected with the main control panel. When the temperature sensor detects that the temperature in the fish tank is lower than or higher than the preset temperature, the main control board achieves heating or refrigeration by switching the current direction of the semiconductor refrigeration assembly, and then it is ensured that the temperature of water in the fish tank is constant.

Description

Technical Field

[0001] This utility model relates to the field of temperature control device technology, and in particular to a fish tank temperature control machine based on a semiconductor refrigeration chip. Background Technology

[0002] With the improvement of people's living standards, keeping ornamental fish has become a popular lifestyle. Different types of ornamental fish have strict requirements for the water temperature of their living environment to ensure that they maintain optimal physiological condition, healthy growth, and successful reproduction. For example, tropical fish need a relatively high and constant water temperature (usually between 24℃ and 30℃), while some cold-water fish are more suitable for living in lower water temperatures. To meet the needs of ornamental fish for an ideal water temperature environment, aquarium chillers have emerged. This device can effectively regulate the water temperature in the aquarium, creating a suitable living space for the fish. Traditional aquarium heaters only have a heating function and no cooling function. Therefore, an additional chiller is needed. Common chillers include compressor chillers and semiconductor chillers.

[0003] Compressor-type water chillers lower water temperature by using a compressor. Their working principle involves first compressing the refrigerant to a high-temperature, high-pressure state, then cooling it through a condenser to become a high-pressure liquid. The liquid then passes through a throttling valve to reduce its pressure, becoming a low-temperature, low-pressure liquid, and absorbs heat in the evaporator to achieve a cooling effect. While compressor-type water chillers provide effective cooling, the noise and vibration they generate during operation can disturb users, and most cannot provide heating. Furthermore, some traditional refrigerants contain environmentally harmful components, and long-term use may have adverse ecological impacts.

[0004] Semiconductor chillers are based on the Peltier effect principle of semiconductor cooling chips, which draws heat from the cold side to the hot side. Since Peltier chips do not require refrigerant, have a simple structure, and can generate heat by changing the direction of current, semiconductor chillers have the advantages of simple and compact structure, low noise, and the ability to both heat and cool. They solve some of the pain points of compressor-type chillers and are very suitable for constant temperature scenarios in small aquariums.

[0005] Existing semiconductor chillers maintain a constant temperature in aquariums by pumping water from the aquarium through pipes and pumps to the cold side of a semiconductor cooling chip inside the chiller for cooling, and then returning the water to the aquarium. The semiconductor cooling chip dissipates the heat pumped to the hot side into the air using heat sinks and fans.

[0006] However, existing semiconductor chillers have the following drawbacks:

[0007] (1) Fish feces, fish food and other impurities in the fish tank can easily enter the pumping pipe and cause blockage;

[0008] (2) Because the residual water in the pipes is difficult to clean, bacteria can easily grow when the chiller is not running, which can easily cause pollution of the aquarium water when it is used again.

[0009] (3) Semiconductor cooling uses air cooling, which has low heat dissipation efficiency and affects cooling efficiency.

[0010] Therefore, it is necessary to propose a thermostat for aquariums based on semiconductor cooling chips to avoid the above problems and to effectively conduct heat to the aquarium, so as to ensure the constant temperature of the aquarium for a long time. Utility Model Content

[0011] To address the aforementioned problems, this invention proposes a fish tank thermostat based on a semiconductor cooling chip to avoid these issues and effectively conduct heat to the fish tank, thereby ensuring a constant temperature for an extended period.

[0012] This utility model is achieved through the following technical solution:

[0013] This invention proposes a thermostat for aquariums based on a semiconductor refrigeration chip, comprising a coolant circulation assembly, a semiconductor refrigeration assembly, a temperature sensor, and a main control board. The coolant circulation assembly includes a semiconductor refrigeration chip, a liquid circulation tank, pipes, a water pump, and a radiator. The liquid circulation tank is connected to the water pump and the radiator via the pipes, allowing liquid circulation. The semiconductor refrigeration assembly is located on the outer surface of the liquid circulation tank. The semiconductor refrigeration assembly, the liquid circulation tank, and the temperature sensor are all placed in the aquarium. The semiconductor refrigeration assembly and the temperature sensor are electrically connected to the main control board. When the temperature detected by the temperature sensor in the aquarium is lower or higher than a preset temperature, the main control board switches the current direction of the semiconductor refrigeration assembly to achieve heating or cooling, thereby ensuring a constant water temperature in the aquarium.

[0014] Furthermore, the surface of the liquid circulation tank not attached to the semiconductor cooling component is insulated from the water using air or a low thermal conductivity insulation material.

[0015] Furthermore, the aquarium thermostat based on a semiconductor refrigeration chip also includes a heat exchange component, which is located on the side of the semiconductor refrigeration chip away from the liquid circulation tank.

[0016] Furthermore, the semiconductor cooling assembly includes at least two sets, each disposed on the side of the liquid circulation tank, to increase the heat exchange area between the semiconductor cooling assembly and the water, and to reduce the heat exchange area between the coolant circulation assembly and the water.

[0017] Furthermore, the semiconductor cooling assembly includes at least two sets of semiconductor cooling chips, each set comprising multiple semiconductor cooling chips arranged sequentially. Each set of semiconductor cooling chips is electrically connected to the main control board. Each set of semiconductor cooling chips is attached to both sides of the liquid circulation tank, and the heat exchange assembly is disposed on the outside of each set of semiconductor cooling chips.

[0018] Furthermore, it also includes a sealing element, one side of which is fitted onto one side of the liquid circulation tank to form a sealed and fixed connection. The sealing element is also arranged around the periphery of multiple semiconductor cooling chips. The heat exchange assembly includes heat exchange plates with the same number of semiconductor cooling chip groups, one heat exchange plate corresponding to one group of semiconductor cooling chips. The other side of the sealing element is fitted onto one side of the heat exchange plate to form a sealed and fixed connection.

[0019] Furthermore, the sealing element is provided with a plurality of embedding grooves, which are arranged in sequence, and a plurality of semiconductor cooling chips correspond one-to-one with the plurality of embedding grooves. The semiconductor cooling chips are housed in the embedding grooves and are in close contact with the groove walls.

[0020] Furthermore, it also includes at least two clamping assemblies, which are X-shaped, and one of the clamping assemblies clamps one side of at least two of the heat exchange plates to increase the adhesion between the heat exchange plates and the thermoelectric cooling plates.

[0021] Furthermore, the clamping assembly includes a first clamping member, a second clamping member, and a locking member. Both the first clamping member and the second clamping member have a D-shaped structure and are elastic. One side of the first clamping member is connected to one side of one of the heat exchange plates by a hook, and one side of the second clamping member is connected to one side of the other heat exchange plate by a hook. The first clamping member and the second clamping member are symmetrically arranged. The locking member passes through the middle of the second clamping member and the middle of the first clamping member in sequence. The locking member is threadedly connected to the middle of the first clamping member. Tilting the locking member can bring the middle of the first clamping member and the middle of the second clamping member together, so that the elasticity of the first clamping member and the second clamping member themselves can clamp the two sides of the two heat exchange plates.

[0022] The beneficial effects of this utility model are:

[0023] This invention utilizes an internal circulation system within a coolant circulation assembly for temperature conduction, avoiding issues such as impurities clogging the circulating water or bacterial growth. By attaching a semiconductor cooling component to the liquid circulation tank and employing a temperature sensor to detect the water temperature in the aquarium, heat exchange is achieved through a heat exchange assembly. When the temperature detected by the temperature sensor is higher or lower than a preset temperature, the main control board switches the current direction of the semiconductor cooling component to achieve heating or cooling, thereby ensuring a constant water temperature in the aquarium. In summary, this aquarium thermostat based on a semiconductor cooling chip employs internal circulation heat conduction technology to effectively conduct heat to the aquarium, ensuring a constant temperature for an extended period. Attached Figure Description

[0024] Figure 1 This is a structural block diagram of the aquarium thermostat based on a semiconductor refrigeration chip according to this utility model;

[0025] Figure 2 This is an exploded view of part of the structure of the aquarium thermostat based on a semiconductor refrigeration chip of this utility model;

[0026] Figure 3 An exploded view of the aquarium thermostat based on a semiconductor refrigeration chip according to this utility model;

[0027] Figure 4 This is a partial structural schematic diagram of the aquarium thermostat based on a semiconductor refrigeration chip according to this utility model;

[0028] Figure 5 This is a schematic diagram of the sealing component of the aquarium thermostat based on a semiconductor refrigeration chip according to this utility model;

[0029] Figure 6 This is a schematic diagram of the clamping assembly of the aquarium thermostat based on a semiconductor refrigeration chip according to this utility model;

[0030] Figure 7 This is a schematic diagram of the heat exchange plate of the aquarium thermostat based on a semiconductor refrigeration chip of this utility model.

[0031] Figure 8 This is a statistical chart showing the relationship between the cooling time of water bodies and the data of this utility model.

[0032] The attached figures are labeled as follows:

[0033] Coolant circulation assembly 1, liquid circulation tank 11, liquid outlet 111, liquid inlet 112, water pump 12, radiator 13;

[0034] Semiconductor cooling component 2, semiconductor cooling chip 21;

[0035] Heat exchange component 3, heat exchange plate 31, and clip groove 311;

[0036] Temperature sensor 4;

[0037] Main control board 5;

[0038] Seal 6, embedded groove 61;

[0039] The clamping assembly 7 includes a first clamping member 71, a first hook rod 711, a first maintaining rod 712, a second clamping member 72, a second hook rod 721, a second maintaining rod 722, and a locking member 73. Detailed Implementation

[0040] To more clearly and completely illustrate the technical solution of this utility model, the following description, in conjunction with the accompanying drawings, will further explain this utility model.

[0041] Please refer to Figures 1-7 This invention proposes a thermostat for aquariums based on a semiconductor refrigeration chip, comprising a coolant circulation assembly 1, a semiconductor refrigeration assembly 2, a heat exchange assembly 3, a temperature sensor 4, and a main control board 5. The coolant circulation assembly 1 includes a semiconductor refrigeration chip 21, a liquid circulation tank 11, pipes, a water pump 12, and a radiator 13. The liquid circulation tank 11 is connected to the water pump 12 and the radiator 13 via pipes, allowing for liquid circulation. The liquid circulation tank 11 can be made entirely of metal, or only the surface to which the semiconductor refrigeration chip 2 is attached can be made of metal. The semiconductor refrigeration chip 2 is attached to the outer surface of the liquid circulation tank 11, and the heat exchange assembly 3 is attached to the outer surface of the semiconductor refrigeration chip 2. The heat exchange assembly 3 is located on the side of the semiconductor refrigeration chip 21 away from the liquid circulation tank 11, increasing the heat exchange rate with water. The semiconductor refrigeration chip 2, the heat exchange assembly 3, and the temperature sensor 4 are all placed in the aquarium. The heat exchange assembly 3, made of metal, has good thermal conductivity. The other end of component 1, the semiconductor cooling component 2, and the temperature sensor 4 are all electrically connected to the main control board 5. The main control board 5 operates by connecting to mains power or using battery power via a conductive wire. When the temperature in the aquarium detected by the temperature sensor 4 is higher or lower than the preset temperature, the main control board 5 switches the current direction of the semiconductor cooling component 2 to achieve heating or cooling, thereby ensuring that the water temperature in the aquarium is constant. The main control board 5 is equipped with a current conversion module, which is connected to the semiconductor cooling component 2 via a conductive wire. The current conversion module is used to switch the current direction of the semiconductor cooling component 2, so that the conductive surface of the semiconductor cooling component 2 can perform cooling or heating. The surface of the liquid circulation tank 11 not attached to the semiconductor cooling component 2 is insulated from the water using air or other low thermal conductivity insulation materials. At least two surfaces of the liquid circulation tank 11 are attached to the semiconductor cooling component 2, thereby increasing the heat exchange surface between the semiconductor cooling component 2 and the water, while reducing the heat exchange area between the liquid circulation tank 11 and the water.

[0042] In this embodiment, the internal circulation of the coolant circulation component 1 is used for temperature conduction. The coolant circulation component 1 has the function of internal liquid circulation, avoiding the problem of impurities clogging or bacteria growth caused by using the water in the fish tank as the circulating water. By attaching the semiconductor cooling component 2 to the liquid circulation tank 11, the heating or cooling of the semiconductor cooling component 2 can be transferred to the liquid circulation tank 11. The liquid circulating in the liquid circulation tank 11 carries away the temperature on one side of the semiconductor cooling component 2, so that the semiconductor cooling component 2 can work normally. The temperature sensor 4 is used to detect the temperature of the water in the fish tank. The heat exchange component 3 is used to exchange heat with the water in the fish tank. When the temperature in the fish tank detected by the temperature sensor 4 is higher or lower than the preset temperature, the main control board 5 switches the current direction of the semiconductor cooling component 2 to achieve heating or cooling. When heating, the heat exchange component 3 is heated, that is, the water in the fish tank is heated. When cooling, the heat exchange component 3 is cooled to cool the water in the fish tank, thereby ensuring that the water temperature in the fish tank is constant.

[0043] In summary, this aquarium thermostat based on a semiconductor cooling chip uses internal circulation heat conduction technology to effectively conduct heat to the aquarium, ensuring a constant temperature for an extended period of time.

[0044] In this embodiment, one end of the liquid circulation tank 11 is connected to one end of the water pump 12 via a pipe, and the other end of the water pump 12 is connected to one end of the radiator 13 via a pipe. The other end of the radiator 13 is connected to the other end of the liquid circulation tank 11 via a pipe. Both the water pump 12 and the radiator 13 are electrically connected to the main control board 5. Before the coolant circulation assembly 1 is started, the liquid circulation tank 11 needs to be filled with liquid, which can be water or other coolant. For low cost, water can be filled. When the coolant circulation assembly 1 is started, if the heat exchange assembly 3 needs cooling, semiconductor cooling is used. The side of component 2 that is in contact with the liquid circulation tank 11 is for heating. The water pump 12 draws hot water from the liquid circulation tank 11 and delivers it to the radiator 13 for cooling, and then returns it to the liquid circulation tank 11 to achieve internal circulation heat conduction. If the heat exchange component 3 needs to generate heat, the side of the semiconductor cooling component 2 that is in contact with the liquid circulation tank 11 is for cooling. The water pump 12 draws cold water from the liquid circulation tank 11 and delivers it to the radiator 13 for heating. At this time, the radiator 13 does not need to start heat dissipation and the temperature is raised by room temperature. The radiator 13 is not limited to a radiator, but can also be a radiator for cold water, etc.

[0045] Different component sizes can affect the cooling efficiency of the aquarium. This invention does not limit the size of each component; during manufacturing, the dimensions of the semiconductor cooling component 2 will be adjusted according to actual conditions, such as the number of cooling plates, the diameter of the pipes, and the size of the heat sink. For example, for an aquarium with a height of 30*30*30cm, three 4*4cm cooling plates, 8mm diameter pipes, and a 12*12cm heat sink are used. In this embodiment, the heat sink is the aforementioned radiator 13. Please refer to [reference needed] for details. Figure 8 This table compares the temperature and time relationship between the present invention and existing technology refrigerators over a specific time period. The comparison data is obtained by testing every 10 minutes over a 7.5-hour period. The data from the present invention is the experimental data, while the data from the existing technology refrigerator is the reference data for comparison. Figure 8 As can be seen, at the start of the test, when the present invention was placed in water, the water temperature was approximately 28 degrees Celsius, while the existing cooler's temperature was approximately 26.4 degrees Celsius. After 20 minutes, the temperatures of both were basically the same. It was then observed that the present invention had a significant cooling effect, while the existing cooler's cooling was relatively slow. For example, after 161 minutes of the present invention being placed in water, the water temperature was approximately 20 degrees Celsius, while the existing cooler's temperature was 23.5 degrees Celsius. After 231 minutes of the present invention being placed in water, the water temperature was approximately 18 degrees Celsius, while the existing cooler's temperature was 22.1 degrees Celsius. After 341 minutes of the present invention being placed in water, the water temperature was approximately 16 degrees Celsius, while the existing cooler's temperature was 20.9 degrees Celsius. Compared to the existing cooler, the present invention has a higher efficiency in cooling the water in the aquarium.

[0046] In this embodiment, the liquid circulation tank 11 is provided with a liquid outlet 111, which is connected to one end of the water pump 12 through a pipe. The liquid outlet 111 facilitates the connection of the pipe to the liquid circulation tank 11, so that the liquid can be drawn out from the liquid circulation tank 11. The liquid circulation tank 11 is provided with a liquid inlet 112, which is connected to one end of the radiator 13 through a pipe. The liquid inlet 112 facilitates the connection of the pipe to the liquid circulation tank 11, so that the liquid after temperature conduction can enter the liquid circulation tank 11.

[0047] In this embodiment, the semiconductor cooling component 2 includes at least two sets of semiconductor cooling chips 21, each set of semiconductor cooling chips 21 comprises multiple semiconductor cooling chips 21, and the multiple semiconductor cooling chips 21 are arranged sequentially. Each set of semiconductor cooling chips 21 is electrically connected to the main control board 5. Each set of semiconductor cooling chips 21 is attached to both sides of the liquid circulation tank 11, and the heat exchange component 3 is attached to the surface of each set of semiconductor cooling chips 21. If the liquid circulation tank 11 has a rectangular structure, then there are two sets of semiconductor cooling chips 21, which are attached to the corresponding two sides of the liquid circulation tank 11. If the liquid circulation tank 11 has a polygonal prism structure, such as a hexagonal prism structure, then there are three sets of semiconductor cooling chips 21, which are attached to the spaced sides of the liquid circulation tank 11. The arrangement of multiple semiconductor cooling chips 21 increases the heating or cooling efficiency of the heat exchange component 3.

[0048] In this embodiment, the heat exchange assembly 3 includes the same number of heat exchange plates 31 as the number of semiconductor cooling chips 2. One heat exchange plate 31 is attached to the surface of a group of semiconductor cooling chips 21. The heat exchange plates 31 are made of metal and are used to conduct heat to the water in the aquarium. If the liquid circulation tank 11 is a rectangular structure, there are two heat exchange plates 31. If the liquid circulation tank 11 is a polygonal prism structure, such as a hexagonal prism structure, there are three heat exchange plates 31.

[0049] In this embodiment, the aquarium thermostat based on a thermoelectric cooler also includes a sealing element 6. One side of the sealing element 6 is fitted onto one side of the liquid circulation tank 11 to form a sealed and fixed connection. The sealing element 6 is also arranged around the periphery of multiple thermoelectric coolers 21. The other side of the sealing element 6 is fitted onto one side of the heat exchange plate 31 to form a sealed and fixed connection. The sealing element 6 is used to seal the periphery of the thermoelectric cooler 21 to prevent water from seeping into the internal conductive wires and to avoid affecting the operation of the thermoelectric cooler 21. Since the thermoelectric cooler 21 heats up on one side and cools down on the other side when it is working, the setting of the sealing element 6 can also ensure that the working temperature of the thermoelectric cooler 21 is not directly conducted to the aquarium water from its side. That is, the sides of multiple thermoelectric coolers 21 are insulated so that the temperature can only be conducted to the water from the heat exchange plate 31, thereby improving the heat conduction efficiency of the heat exchange plate 31.

[0050] In this embodiment, the sealing member 6 is provided with multiple embedding grooves 61, which are arranged sequentially. Multiple thermoelectric coolers 21 correspond one-to-one with the multiple embedding grooves 61. The thermoelectric coolers 21 are housed in the embedding grooves 61 and are tightly attached to the groove walls of the embedding grooves 61. The embedding grooves 61 are provided to facilitate the alignment and attachment of the thermoelectric coolers 21. When installing the thermoelectric coolers 21, one side of the sealing member 6 is first fitted onto the side of the liquid circulation tank 11 to be attached. Then, after applying a thermal conductive agent, the thermoelectric coolers 21 are embedded into the embedding grooves 61 and attached to the side of the liquid circulation tank 11. After all the thermoelectric coolers 21 are embedded into the embedding grooves 61 and attached, a thermal conductive agent is applied to the surface of the thermoelectric coolers 21 and the heat exchange plate 31 is pressed and attached. At this time, the other side of the sealing member 6 will fit onto the heat exchange plate 31 to seal the edge of the heat exchange plate 31 and fix the heat exchange plate 31.

[0051] In this embodiment, the aquarium thermostat based on a thermoelectric cooler also includes at least two clamping components 7. The clamping components 7 have an X-shaped structure. One clamping component 7 clamps one side of at least two heat exchange plates 31 to increase the adhesion between the heat exchange plates 31 and the thermoelectric cooler 21. The clamping components 7 clamp and fix two aligned or adjacent heat exchange plates 31. The clamping force can be adjusted by the clamping components 7 to increase the adhesion between the thermoelectric cooler 21 and the heat transfer efficiency of the thermoelectric cooler 21 to the heat exchange plates 31. The X-shaped structure facilitates quick picking and clamping by workers during assembly.

[0052] In this embodiment, the clamping assembly 7 includes a first clamping member 71, a second clamping member 72, and a locking member 73. Both the first clamping member 71 and the second clamping member 72 have a D-shaped structure and are elastic. One side of the first clamping member 71 is connected to one side of a heat exchange plate 31 via a hook, and one side of the second clamping member 72 is connected to one side of another heat exchange plate 31 via a hook. A first hook rod 711 is provided at each of the two corners of one side of the first clamping member 71, and the first hook rod 711 is perpendicular to the first clamping member 71 and extends outwards. A second hook rod 721 is provided at each of the two corners of one side of the second clamping member 72, and the second hook rod 721 is perpendicular to the second clamping member 72 and extends outwards. Each heat exchange plate 31 has two hook slots 311 on both its left and right sides, meaning each heat exchange plate 31 has a total of four hook slots 311. Two first hook rods 711 are respectively connected to the two hook slots 311 on the left side of one heat exchange plate 31 to form hook claws, and two second hook rods 721 are respectively connected to the two hook slots 311 on the right side of another heat exchange plate 31 to form hook claws. The first clamping member 71 and the second clamping member 72 are symmetrically arranged. The locking member 73 passes through the middle of the second clamping member 72 and the middle of the first clamping member 71 in sequence. The locking member 73 is threadedly connected to the middle of the first clamping member 71. The knob locking member 73 can lock the middle of the first clamping member 71 and the second clamping member 72. The two heat exchange plates 31 are clamped together at the middle, with the locking member 73 being a screw. The first clamping member 71 and the second clamping member 72 clamp the two sides of the heat exchange plate 31 using their own elastic force. A first supporting rod 712 is provided between the two first hooks 711 to maintain the distance between the two first hooks 711 and prevent deformation during clamping. A second supporting rod 722 is provided between the two second hooks 721 to maintain the distance between the two second hooks 721 and prevent deformation during clamping. When clamping and fixing adjacent or aligned heat exchange plates 31, the first hook 711 of the first clamping member 71 is first hooked into a heat exchange plate. The first clamping member 71 and the second clamping member 72 are inserted into the hook groove 311 on the left side of the heat exchange plate 31, and then the second hook 721 of the second clamping member 72 is hooked into the hook groove 311 on the right side of the other heat exchange plate 31. Then, the locking member 73 is used to tighten the middle part of the first clamping member 71 and the middle part of the second clamping member 72 so that they are brought together. During the process of bringing together, the first clamping member 71 and the second clamping member 72 will both undergo elastic deformation. This elastic deformation will cause the first hook 711 and the second hook 721 to simultaneously apply a force to bring together the two heat exchange plates 31, so as to increase the adhesion force of the two heat exchange plates 31 to the semiconductor cooling plate 21 and improve the heat transfer efficiency of the semiconductor cooling plate 21 to the heat exchange plate 31.

[0053] Of course, there may be other implementations of this utility model. Based on this implementation, other implementations obtained by those skilled in the art without any creative effort are all within the scope of protection of this utility model.

Claims

1. A thermostat for aquariums based on a semiconductor refrigeration chip, characterized in that, The application relates to a cooling device for a fish tank, which comprises a cooling liquid circulating assembly, a semiconductor refrigeration assembly, a temperature sensor and a main control board, wherein the cooling liquid circulating assembly comprises semiconductor refrigeration sheets, a liquid circulating box, pipelines, a water pump and a radiator; the liquid circulating box is connected with the water pump and the radiator through the pipelines and can circulate liquid; the semiconductor refrigeration assembly is arranged on the outer surface of the liquid circulating box; the semiconductor refrigeration assembly, the liquid circulating box and the temperature sensor are all arranged in the fish tank; the semiconductor refrigeration assembly and the temperature sensor are electrically connected with the main control board; when the temperature detected by the temperature sensor is lower than or higher than a preset temperature, the main control board switches the current direction of the semiconductor refrigeration assembly to realize heating or refrigeration, so as to ensure the constant water temperature in the fish tank.

2. The semiconductor refrigeration flake-based aquarium thermostat according to claim 1, characterized by, The surface of the liquid circulating box which is not attached to the semiconductor refrigeration assembly is insulated from water by air or a low-thermal-conductivity thermal insulation member.

3. The semiconductor refrigeration-based aquarium thermostat according to claim 1, characterized by, The application further comprises a heat exchange assembly arranged on the side of the semiconductor refrigeration sheets away from the liquid circulating box.

4. The semiconductor refrigeration-based aquarium thermostat according to claim 2, characterized by, The semiconductor refrigeration assembly comprises at least two groups of semiconductor refrigeration sheets arranged on the side surfaces of the liquid circulating box to increase the heat exchange area between the semiconductor refrigeration assembly and water.

5. The semiconductor refrigeration-based aquarium thermostat according to claim 3, characterized by, The semiconductor refrigeration assembly comprises at least two groups of semiconductor refrigeration sheets, each group of semiconductor refrigeration sheets comprises a plurality of semiconductor refrigeration sheets arranged in sequence, each group of semiconductor refrigeration sheets is electrically connected with the main control board, and each group of semiconductor refrigeration sheets is attached to the two side surfaces of the liquid circulating box.

6. The semiconductor Peltier element-based aquarium thermostat according to claim 5, wherein The application further comprises a sealing member, one side of the sealing member is sleeved with one side of the liquid circulating box to form a sealing and fixed connection, the sealing member is arranged around the periphery of the plurality of semiconductor refrigeration sheets, the heat exchange assembly comprises heat exchange sheets which are equal in number to the groups of semiconductor refrigeration sheets, one heat exchange sheet corresponds to one group of semiconductor refrigeration sheets, and the other side of the sealing member is sleeved with one side of the heat exchange sheet to form a sealing and fixed connection.

7. The semiconductor refrigeration-based aquarium thermostat according to claim 6, characterized by The sealing member is provided with a plurality of embedding grooves arranged in sequence, the plurality of semiconductor refrigeration sheets are one-to-one corresponding to the plurality of embedding grooves, and the semiconductor refrigeration sheets are accommodated in the embedding grooves and tightly attached to the groove walls of the embedding grooves.

8. The semiconductor refrigeration-based aquarium thermostat according to claim 6, characterized by, The application further comprises at least two clamping and locking assemblies, the clamping and locking assemblies are X-shaped structures, and one clamping and locking assembly clamps one side of at least two heat exchange sheets to increase the adhesion between the heat exchange sheets and the semiconductor refrigeration sheets.

9. The semiconductor refrigeration-based aquarium thermostat according to claim 8, characterized by, The clamping assembly comprises a first clamping piece, a second clamping piece and a locking piece, the first clamping piece and the second clamping piece are in D-shaped structure and have elasticity, one side of the first clamping piece is claw-connected to one side of one heat exchange sheet, one side of the second clamping piece is claw-connected to one side of another heat exchange sheet, the first clamping piece and the second clamping piece are symmetrically arranged, the locking piece penetrates the middle part of the second clamping piece and the middle part of the first clamping piece in sequence, the locking piece is threadedly connected with the middle part of the first clamping piece, and the locking piece can move the middle part of the first clamping piece and the middle part of the second clamping piece close to each other, so that the first clamping piece and the second clamping piece clamp two sides of the two heat exchange sheets by the elastic force of the first clamping piece and the second clamping piece.

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