Vertical moving device for semiconductor device and semiconductor device
By combining encoders and magnetic scales in semiconductor equipment for position detection and control, the problem of inaccurate vertical movement control of semiconductor equipment is solved, achieving higher control precision and material conveying accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-03-03
AI Technical Summary
Existing semiconductor devices suffer from low accuracy in controlling vertical movement, especially after prolonged operation when hardware loosens, leading to mismatched position data.
Position detection and control are achieved by combining encoders and magnetic scales. The encoder collects parameter information of the drive source component, while the magnetic scale collects material position data. The control component controls the operation or stop of the drive source component based on the difference.
It improves the accuracy of vertical movement control of semiconductor equipment, ensures accurate material delivery, avoids delivery errors caused by mismatched position data, and protects the integrity of materials.
Smart Images
Figure CN223962840U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of semiconductor technology, and more specifically to a vertical movement device for semiconductor equipment and a semiconductor equipment. Background Technology
[0002] Currently, in the processing of semiconductor materials, the vertical movement of the semiconductor equipment is typically utilized to transport the materials vertically. For example, when transporting wafers, semiconductor equipment needs to precisely control its vertical movement, including parameters such as distance, time, and position. To achieve accurate control of the vertical movement of semiconductor equipment, sophisticated components are usually used for control and detection, such as servo motors and magnetic scales. However, the use of these components alone cannot accurately reflect the vertical movement of the semiconductor equipment.
[0003] Therefore, there is a need to provide a vertical movement device for semiconductor devices to achieve accurate control of the semiconductor devices' vertical movement. Utility Model Content
[0004] In view of this, the present disclosure provides a vertical moving device for a semiconductor device and a semiconductor device, which solves the problem of low control accuracy of the vertical moving device in its own vertical movement.
[0005] In a first aspect, embodiments of this disclosure provide a vertical movement device for a semiconductor device, comprising: a transmission assembly configured to drive a material to move along a first direction, the first direction being a vertical direction; a drive source assembly connected to the transmission assembly and configured to drive the transmission assembly to move along the first direction, the drive source assembly having an output shaft and an encoder connected to the output shaft, the encoder being configured to acquire parameter information of the drive source assembly, the parameter information including at least rotation information of the output shaft, and the rotation information being convertible into first position data of the material; a magnetic scale connected to the transmission assembly and configured to acquire second position data of the material in the first direction when the transmission assembly drives the material to move along the first direction; and a control assembly communicatively connected to the encoder and the magnetic scale, configured to control the drive source assembly to run or stop based on the difference between the first position data and the second position data.
[0006] In some embodiments, the transmission assembly includes a support portion; a transmission portion rotatably connected to the support portion and connected to the output shaft; and a moving portion drively connected to the transmission portion, such that the transmission portion can drive the moving portion to move along the first direction, and the moving portion can drive the material to move along the first direction.
[0007] In some embodiments, the vertical movement device for a semiconductor device further includes a position measurement module that is communicatively connected to the magnetic scale and the control component.
[0008] In some embodiments, the encoder includes an absolute encoder, the magnetic scale includes an absolute magnetic scale, and the position measurement module includes a Beckhoff position measurement module.
[0009] In some embodiments, the magnetic scale includes: a benchmark connected to the support portion and extending along the first direction, and having magnetism; a reading head disposed on the benchmark and connected to the moving portion, so that the moving portion can drive the reading head to move along the first direction on the benchmark, wherein the reading head cooperates with the benchmark to collect the second position data, and the reading head is communicatively connected to the control component.
[0010] In some embodiments, when the difference between the first position data and the second position data is greater than a preset value at the same time, the control component controls the drive source component to stop; wherein the preset value is in the range of 0.1mm-1mm.
[0011] In some embodiments, the drive source assembly includes: a motor having the output shaft and the encoder; wherein the transmission assembly includes: a support base forming the support portion and extending along the first direction; a ball screw forming the transmission portion and extending along the first direction, one end of the ball screw being rotatably connected to the support base, and the other end of the ball screw being connected to the output shaft so that the output shaft can drive the ball screw to rotate; a nut threadedly connected to the ball screw so that the nut can be driven to move along the first direction during the rotation of the ball screw; and a slide block connected to the nut so that the nut can drive the slide block to move along the first direction, the slide block being able to drive the material to move along the first direction, wherein the nut and the slide block form the moving portion.
[0012] In some embodiments, the vertical moving device for a semiconductor device further includes: at least one clamping component configured to clamp the material, the clamping component being disposed on mounting positions on which the number of moving parts arranged along a second direction corresponds to the number of clamping components, so that the moving parts can drive at least one of the clamping components to move along the first direction, wherein the second direction is perpendicular to the first direction.
[0013] In a second aspect, embodiments of this disclosure provide a semiconductor device, including: the vertical moving device for the semiconductor device described in the first aspect, configured to convey material in a vertical direction, and to detect the position of the material during the conveying of the material.
[0014] In some embodiments, the semiconductor device is an electroplating device, and the semiconductor device further includes: an electroplating chamber configured to contain the material and perform an electroplating process on the material; a fixture located within the electroplating chamber, the fixture being configured to place the material within the electroplating chamber after the material is conveyed to the fixture in a vertical direction; wherein the material includes a wafer.
[0015] The vertical movement device for semiconductor equipment provided in this disclosure uses an encoder and a magnetic scale to detect and control its own vertical movement. This avoids the problem that when the hardware structure of the device becomes loose after long-term operation, the position data collected by the encoder alone may not match the actual position data of the device, resulting in the device being unable to accurately control its own vertical movement. This improves the accuracy of the vertical movement device for semiconductor equipment in controlling its own vertical movement. Attached Figure Description
[0016] Figure 1 The diagram shown is an application scenario illustration of a vertical moving device for semiconductor equipment provided in an embodiment of this disclosure.
[0017] Figure 2 The diagram shown is a structural schematic of a transmission assembly, a drive source assembly, a clamping assembly, and a material provided in an embodiment of this disclosure.
[0018] Figure 3 The diagram shown is a structural schematic of a transmission assembly, magnetic scale, control assembly, and material provided in an embodiment of this disclosure.
[0019] Figure 4 The diagram shown is a structural schematic of a drive source assembly, a transmission assembly, a magnetic scale, a clamping assembly, and a material provided in an embodiment of this disclosure.
[0020] Figure 5 The diagram shown is an application scenario illustration of a semiconductor device provided in an embodiment of this disclosure.
[0021] Figure label:
[0022] 123. Semiconductor equipment; 10. Vertical moving device for semiconductor equipment; 100. Transmission assembly; 110. Support base; 101. Support part; 120. Ball screw; 102. Transmission part; 130. Nut; 140. Slide; 103. Moving part; 1031. Mounting position; 200. Drive source assembly; 210. Motor; 2001. Output shaft; 2002. Encoder; 300. Magnetic scale; 310. Scale; 320. Reading head; 400. Control assembly; 500. Position measurement module; 600. Clamping assembly; X1. First direction; X2. Second direction; 20. Electroplating chamber; 30. Fixture; 2. Material. Detailed Implementation
[0023] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.
[0024] Figure 1 The diagram illustrates an application scenario of a vertical movement device for semiconductor equipment according to an embodiment of this disclosure. Figure 1 As shown, the vertical movement device 10 for semiconductor equipment includes a transmission assembly 100, a drive source assembly 200, a magnetic scale 300, and a control assembly 400. The transmission assembly 100 is configured to move the material 2 along a first direction X1, where X1 is a vertical direction. The drive source assembly 200 is connected to the transmission assembly 100 and configured to drive the transmission assembly 100 to move along the first direction X1. The drive source assembly 200 includes an output shaft 2001 and an encoder 2002 connected to the output shaft 2001. The encoder 2002 is configured to collect parameter information of the drive source assembly 200, including at least rotation information of the output shaft 2001, and the rotation information can be converted into first position data of the material 2. The magnetic scale 300 is connected to the transmission assembly 100 and configured to collect second position data of the material 2 in the first direction X1 when the transmission assembly 100 moves the material 2 along the first direction X1. The control component 400 is communicatively connected to the encoder 2002 and the magnetic scale 300, and is configured to control the drive source component 200 to run or stop based on the difference between the first position data and the second position data.
[0025] The vertical movement device 10 for semiconductor equipment uses an encoder 2002 and a magnetic scale 300 to detect and control its own vertical movement. This avoids the problem that when the hardware structure of the device becomes loose after long-term operation, the position data collected by the encoder 2002 does not match the actual position data of the device, which leads to the device being unable to accurately control its own vertical movement. This improves the accuracy of the vertical movement device 10 for semiconductor equipment in controlling its own vertical movement.
[0026] For example, the transmission assembly 100 includes a threaded rod-like structure and a movable structure fitted onto and threadedly connected to the rod-like structure. The rod-like structure is connected to an output shaft 2001 so that the output shaft 2001 can drive the rod-like structure to rotate, and the rod-like structure extends along a first direction X1. During the rotation of the rod-like structure, the movable structure can move relative to the rod-like structure along the first direction X1, and the movable structure can drive the material 2 to move along the first direction X1.
[0027] For example, the transmission assembly 100 includes a gear, a rack, and a support structure. The rack extends along a first direction X1, the gear meshes with the rack, and is connected to the output shaft 2001, so that during the gear-rack meshing transmission, the gear can drive the drive source assembly 200 to move along the first direction X1, and the support structure is connected to the drive source assembly 200, so that the drive source assembly 200 can drive the support structure to move along the first direction X1, and the support structure can drive the material 2 to move along the first direction X1.
[0028] In some embodiments, such as Figure 2 As shown, the transmission assembly 100 includes a support portion 101, a transmission portion 102, and a moving portion 103. The transmission portion 102 is rotatably connected to the support portion 101 and connected to the output shaft 2001, so that the output shaft 2001 can drive the transmission portion 102 to rotate. The moving portion 103 is drively connected to the transmission portion 102, so that the transmission portion 102 can drive the moving portion 103 to move along a first direction X1, and the moving portion 103 can drive the material 2 to move along the first direction X1. The transmission assembly 100 has a simple structure, and the transmission method is simple and reliable.
[0029] In some embodiments, such as Figure 1 As shown, the vertical movement device 10 for semiconductor equipment also includes a position measurement module 500, which is communicatively connected to the magnetic scale 300 and the control component 400.
[0030] The position measurement module 500 collects the second position data transmitted by the magnetic scale 300 and transmits the second position data to the control component 400.
[0031] The position measurement module 500 has multiple communication interfaces, which can be compatible with different types of encoders and magnetic scales, thereby improving the compatibility and flexibility of the device.
[0032] In some embodiments, encoder 2002 includes an absolute encoder, magnetic scale 300 includes an absolute magnetic scale, and position measurement module 500 includes a Beckhoff position measurement module.
[0033] The absolute encoder can immediately acquire the rotation information of the output shaft 2001 when the drive source component 200 stops and restarts, without having to re-acquire the rotation information of the output shaft 2001 based on the reference point. This allows the control component 400 to quickly convert the rotation information of the output shaft 2001 acquired by the absolute encoder into the first position data of the material 2, thereby improving the efficiency of the device in acquiring the first position data.
[0034] The absolute value magnetic grating ruler can immediately collect the second position data of material 2 in the first direction X1 without having to re-collect the second position data based on the reference point when the drive source component 200 is restarted after it stops running, thus improving the efficiency of the device in collecting the second position data.
[0035] Beckhoff position measurement modules offer high compatibility and flexibility, featuring multiple communication interfaces to accommodate different types of encoders and magnetic scales, thus enhancing the device's overall compatibility and flexibility. Furthermore, Beckhoff position measurement modules provide high accuracy in acquiring position data, improving the accuracy of the device's acquisition of secondary position data.
[0036] In some embodiments, such as Figure 3 As shown, the magnetic scale 300 includes a scale 310 and a reading head 320. The scale 310 is connected to the support portion 101, extends along a first direction X1, and is magnetic. The reading head 320 is disposed on the scale 310 and connected to the moving portion 103, so that the moving portion 103 can drive the reading head 320 to move along the first direction X1 on the scale 310. The reading head 320 cooperates with the scale 310 to collect second position data, and the reading head 320 is communicatively connected to the control component 400.
[0037] For example, the ruler 310 is detachably connected to the support 101 to facilitate the installation and removal of the ruler 310. For example, the reading head 320 is detachably connected to the moving part 103 to facilitate the installation and removal of the reading head 320.
[0038] In some embodiments, when the difference between the first position data and the second position data is greater than a preset value at the same time, the control component 400 controls the drive source component 200 to stop. The preset value ranges from 0.1mm to 1mm.
[0039] For example, the preset value can be 0.2mm, 0.5mm, 0.6mm, etc.
[0040] This disclosure does not impose specific limitations on the preset values. In actual process, the preset values can be set as needed.
[0041] In some embodiments, such as Figures 1 to 4 As shown, the drive source assembly 200 includes a motor 210, which has an output shaft 2001 and an encoder 2002. The transmission assembly 100 includes a support 110, a ball screw 120, a nut 130, and a slide 140. The support 110 forms a support portion 101 and extends along a first direction X1. The ball screw 120 forms a transmission portion 102 and extends along the first direction X1. One end of the ball screw 120 is rotatably connected to the support 110, and the other end of the ball screw 120 is connected to the output shaft 2001 so that the output shaft 2001 can drive the ball screw 120 to rotate. The nut 130 is threadedly connected to the ball screw 120 so that the nut 130 can be moved along the first direction X1 during the rotation of the ball screw 120. The slide 140 is connected to the nut 130 so that the nut 130 can drive the slide 140 to move along the first direction X1, and the slide 140 can drive the material 2 to move along the first direction X1. The nut 130 and the slide 140 form the moving part 103. The drive source assembly 200 and the transmission assembly 100 have simple structures, and the transmission method of the transmission assembly 100 is simple and reliable.
[0042] For example, the vertical movement device 10 for a semiconductor device also includes a coupling configured to connect the output shaft 2001 to the ball screw 120.
[0043] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the vertical moving device 10 for semiconductor equipment also includes at least one clamping assembly 600 configured to clamp the material 2. The clamping assemblies 600 are disposed on mounting positions 1031 of the moving part 103 arranged along the second direction X2, with a number corresponding to the number of clamping assemblies 600, so that the moving part 103 can drive at least one clamping assembly 600 to move along the first direction X1, the second direction X2 being perpendicular to the first direction X1.
[0044] With multiple clamping components 600 and mounting positions 1031, the vertical moving device 10 for semiconductor equipment can simultaneously transport multiple materials 2 along the first direction X1, thereby improving the conveying efficiency of the device.
[0045] For example, such as Figure 4As shown, the slide 140 has a mounting position 1031, and there are two clamping components 600 and two mounting positions 1031. One clamping component 600 is mounted on each mounting position 1031, and each clamping component 600 clamps one material 2.
[0046] For example, the gripping component 600 may be a robotic arm, a gripper, or other structure with gripping capabilities.
[0047] Figure 5 The diagram shown illustrates an application scenario of a semiconductor device provided in an embodiment of this disclosure. Figure 5 As shown, the semiconductor device 123 includes the vertical moving device 10 for semiconductor devices mentioned in the above embodiments. The vertical moving device 10 for semiconductor devices is configured to convey material 2 in a vertical direction and detect the position of material 2 during the conveying process.
[0048] In some embodiments, such as Figure 5 As shown, semiconductor equipment 123 is an electroplating apparatus. Semiconductor equipment 123 also includes an electroplating chamber 20 and a fixture 30 located within the electroplating chamber 20. The fixture 30 is configured to place the material 2 into the electroplating chamber 20 after the material 2 is vertically conveyed to the fixture 30. The electroplating chamber 20 is configured to contain the material 2 and perform the electroplating process on the material 2, the material 2 including a wafer.
[0049] Combination Figure 4 and Figure 5 When the semiconductor device 123 is an electroplating device, an electroplating chamber 20 can be provided below the clamping assembly 600. The number of electroplating chambers 20 is the same as that of the clamping assembly 600, preferably two. In this case, the clamping assembly 600 can move the material 2 (i.e., the wafer) in the vertical direction to place the material 2 in the fixture 30, or the clamping assembly 600 can also clamp the material 2 in the fixture 30 and then remove the material 2 from the fixture 30.
[0050] The vertical moving device 10 for semiconductor equipment improves the accuracy of controlling its own up and down movement, thereby improving the accuracy of conveying material 2 in the vertical direction. This ensures that material 2 can be accurately conveyed to the clamping position, thus ensuring that the clamp 30 can accurately clamp material 2. This avoids damage to material 2 caused by the clamp 30 being unable to accurately clamp material 2 due to the material 2 not being accurately conveyed to the clamping position.
[0051] Since the semiconductor device 123 includes a vertical moving device 10 for the semiconductor device, all the technical features and effects of the vertical moving device 10 for the semiconductor device are included in the semiconductor device 123 and will not be described in detail here.
[0052] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts, nuts, screws, clips, magnets, etc. In some connections where there is no particular requirement for a detachable fit, a non-detachable connection can be achieved through welding, bonding, etc.
[0053] The terms "an embodiment" or "embodiment" used in this specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Additionally, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.
[0054] It should be understood that “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).
[0055] Furthermore, for ease of explanation, spatial relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of a component or feature relative to other components or features as shown in the figures. Spatial relative terms are intended to encompass different orientations of components in use or operation other than those shown in the figures. Devices may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein may be interpreted accordingly.
[0056] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0057] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications or equivalent substitutions made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. A vertical moving device for a semiconductor apparatus, characterized by, The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device.
2. The vertical moving device for a semiconductor apparatus according to claim 1, wherein The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device.
3. The vertical moving device for a semiconductor apparatus according to claim 1, wherein The application relates to a material moving device. The application relates to a material moving device.
4. The vertical moving device for a semiconductor apparatus according to claim 3, wherein The application relates to a material moving device.
5. The vertical moving device for a semiconductor apparatus according to claim 2, wherein The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device.
6. The vertical moving device for a semiconductor apparatus according to any one of claims 1 to 5, wherein The application relates to a material moving device. The application relates to a material moving device.
7. The vertical moving device for a semiconductor apparatus according to claim 2, wherein The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device.
8. The vertical moving device for a semiconductor apparatus according to claim 7, wherein The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. The application relates to a material moving device. 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9. A semiconductor device, characterized by comprising: Comprise: The vertical moving device for semiconductor equipment according to any one of claims 1 to 8, configured to transport a material along a vertical direction, and detect a position of the material during the transportation of the material.
10. The semiconductor device according to claim 9, wherein The semiconductor equipment is an electroplating equipment, and the semiconductor equipment further comprises: An electroplating cavity configured to accommodate the material and perform an electroplating process on the material; A clamp located in the electroplating cavity, the clamp being configured to place the material in the electroplating cavity after the material is transported to the clamp along the vertical direction; wherein the material comprises a wafer.