Dual-mode signal enhancement circuit module based on Bluetooth earphone

Abstract

The utility model relates to the technical field of Bluetooth earphones, and discloses a dual-mode signal enhancement circuit module based on a Bluetooth earphone, comprising a Bluetooth dual-mode module; a signal amplification module; an antenna matching module; a power management module; through the design of the Bluetooth dual-mode module, the Bluetooth earphone supports a BT protocol and a BLE protocol at the same time, so that the Bluetooth earphone can be compatible with more devices, meets communication requirements in different scenes, is low in power consumption, supports audio transmission and data transmission, facilitates intelligent selection of an optimal communication mode for data transmission, and improves the stability and reliability of signals; through the design of the signal amplification module, weak signals obtained from the antenna are converted into stable signals for subsequent processing, it is ensured that the Bluetooth earphone stably receives Bluetooth signals from external equipment, the definition of the signals is improved, through signal enhancement, signal attenuation and interference are effectively reduced, and the communication quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth headset technology, specifically to a dual-mode signal enhancement circuit module based on Bluetooth headsets. Background Technology

[0002] Bluetooth headsets connect to devices such as mobile phones and tablets via Bluetooth technology to achieve wireless audio transmission, freeing users from the constraints of traditional wired headphones. The decoding chip in the mobile phone decodes the audio file, generating a digital signal, which is then sent to the Bluetooth headset via Bluetooth. The Bluetooth headset receives the digital signal and converts it into an analog signal using its internal digital-to-analog converter chip. This analog signal is then amplified and emitted as sound by the headphone unit.

[0003] A search revealed that patent application number CN201721244882.1 discloses a wireless Bluetooth headset with signal enhancement function, including a shell, a speaker, and a power interface. The speaker is connected to one side of the shell, and the power interface is located at the lower end of the shell. A hinge is connected to one side of the shell, and the shell is movably connected to the speaker via the hinge. A rubber sleeve is provided on one side of the speaker. A ceramic antenna is disposed inside the shell, and absorbing particles are connected to the upper end of the ceramic antenna. A telescopic antenna is movably connected to the upper end of the shell. This invention enhances the signal reception of the wireless Bluetooth headset by placing a ceramic antenna inside the shell and movably connecting a telescopic antenna to the upper end of the shell. The absorbing particles on the upper end of the ceramic antenna and the rubber sleeve on one side of the speaker enhance the stability of signal reception and prevent noise from entering. The solar panel on the surface of the shell improves the convenience of energy use and environmental friendliness.

[0004] Current Bluetooth headsets operate on a single communication mode, either supporting the classic Bluetooth protocol (high power consumption, supporting audio protocols and high-speed data transmission) or the low-power Bluetooth protocol (low power consumption, low data transmission), which reduces the applicability of Bluetooth headsets. Furthermore, current Bluetooth headsets suffer from significant signal attenuation and interference during signal transmission, reducing communication quality. Therefore, we need to propose a dual-mode signal enhancement circuit module based on Bluetooth headsets. Utility Model Content

[0005] The purpose of this invention is to provide a dual-mode signal enhancement circuit module for Bluetooth headsets. Through the design of this dual-mode Bluetooth module, it simultaneously supports both BT and BLE protocols, enabling the Bluetooth headset to be compatible with more devices and meet communication needs in different scenarios. It not only boasts low power consumption but also supports both audio and data transmission, facilitating intelligent selection of the optimal communication mode for data transmission and improving signal stability and reliability. The signal amplification module transforms the weak signal acquired from the antenna into a stable signal for subsequent processing, ensuring stable reception of Bluetooth signals from external devices by the Bluetooth headset and improving signal clarity. Signal enhancement effectively reduces signal attenuation and interference, improving communication quality and addressing the problems mentioned in the background section.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a dual-mode signal enhancement circuit module based on a Bluetooth headset, comprising:

[0007] A dual-mode Bluetooth module that supports two Bluetooth protocols and is responsible for handling the reception, transmission, and protocol conversion of Bluetooth signals;

[0008] A signal amplification module that amplifies the received weak Bluetooth signal;

[0009] The antenna matching module is responsible for efficiently transmitting the radio frequency signals generated by the Bluetooth dual-mode module to the antenna and ensuring that the signals received by the antenna are transmitted back to the Bluetooth dual-mode module without loss.

[0010] The power management module is responsible for providing a stable power supply to the above modules;

[0011] The Bluetooth dual-mode module, signal amplification module, and antenna matching module are all electrically connected to the power management module, and the signal amplification module and antenna matching module are all electrically connected to the Bluetooth dual-mode module.

[0012] Preferably, the Bluetooth dual-mode module includes chip U1, chip U2, speaker interface P1 connected to chip U2, chip U3, and speaker interface P2 connected to chip U3. A capacitor C7 is connected to pin 7 of chip U1, a resistor R5 and a light-emitting diode BLED1 are connected in series to pin 13 of chip U1, a capacitor C4 connected to an antenna is connected to pin 21 of chip U1, and a crystal oscillator Y1 is connected between pins 23 and 24 of chip U1.

[0013] Preferably, pin 20 of the chip U1 is connected to resistors R8, R11, R12, R14, and R15 arranged in parallel. One end of resistor R11 is connected to the MODE button, one end of resistor R12 is connected to the PREV / VOL- button, one end of resistor R14 is connected to the PP button, and one end of resistor R15 is connected to the NEXT / VOL+ button.

[0014] Preferably, pin 1 of chip U2 is connected to resistors R1 and R2, pin 2 of chip U2 is connected to capacitor C1, pin 3 of chip U2 is connected to resistor R3, and pin 4 of chip U2 is connected to resistor R4 and capacitor C2 connected in series.

[0015] The resistor R1 is connected to pin 5 of chip U1, the resistors R2 and R3 are both connected to pin 18 of chip U1, and the capacitor C2 is connected to pin 10 of chip U1.

[0016] Preferably, a capacitor C9 is connected to pin 2 of the chip U3, a resistor R6 is connected to pin 3 of the chip U3, and a resistor R7 and a capacitor C10 connected in series are connected to pin 4 of the chip U3.

[0017] One end of the resistor R6 is connected to pin 18 of the chip U1, and the capacitor C10 is connected to pin 11 of the chip U1.

[0018] Preferably, the signal amplification module includes a chip U4, a connector POUT, and a connector POW. Pin 1 of the chip U4 is connected to pin 2 of the connector POUT. A resistor R18, a resistor R17, and a capacitor C17 are connected in series between pins 1 and 7 of the chip U4. Pin 3 of the chip U4 is connected to a 5V resistor R19, a parallel resistor R20, and a capacitor C1. Pin 5 of the chip U4 is connected to a parallel capacitor CL and an inductor L1. Pin 7 of the chip U4 is connected to a series resistor R22 and a resistor R21. One end of each of the resistor R21, capacitor CL, and inductor L1 is connected to pin 3 of the chip U4. A capacitor C100, a capacitor C101, and a capacitor C102 are connected in parallel between pins 1 and 4 of the connector POW.

[0019] Preferably, the antenna matching module includes a chip U5, with a capacitor C23 connected to the antenna at pin 1 of the chip U5, an inductor L13 and a capacitor C13 connected to one end of the capacitor C23, an inductor L23 connected to the other end of the capacitor C23, a capacitor C33 connected to pin 3 of the chip U5, a capacitor C43 connected to pin 6 of the chip U5, and a crystal oscillator Y1 connected to pin 8 of the chip U5.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] 1. This utility model, through the design of a Bluetooth dual-mode module, simultaneously supports both BT and BLE protocols, enabling Bluetooth headsets to be compatible with more devices and meet communication needs in different scenarios. In addition to low power consumption, it also supports audio and data transmission, making it easy to intelligently select the optimal communication mode for data transmission and improve signal stability and reliability.

[0022] 2. This utility model, through the design of a signal amplification module, converts the weak signal obtained from the antenna into a stable signal for subsequent processing, ensuring that the Bluetooth headset stably receives Bluetooth signals from external devices, improving signal clarity, and effectively reducing signal attenuation and interference through signal enhancement, thereby improving communication quality.

[0023] 3. This utility model, through the design of an antenna matching module, adjusts the antenna impedance to match the output impedance of the signal source or the input impedance of the receiving device, thereby achieving the optimal signal transmission state, improving signal transmission efficiency, reducing energy loss, and ensuring the stability of Bluetooth signals and communication. Attached Figure Description

[0024] Figure 1 This is a system diagram of the present invention;

[0025] Figure 2 This is a circuit diagram of the Bluetooth dual-mode module of this utility model;

[0026] Figure 3 This is a circuit diagram of the signal amplification module of this utility model;

[0027] Figure 4 This is the circuit diagram of the antenna matching module of this utility model. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-4 This utility model provides a technical solution: a dual-mode signal enhancement circuit module based on Bluetooth headsets, comprising:

[0030] A dual-mode Bluetooth module that supports two Bluetooth protocols and is responsible for handling the reception, transmission, and protocol conversion of Bluetooth signals;

[0031] The Bluetooth dual-mode module includes chip U1, chip U2, speaker interface P1 connected to chip U2, chip U3, and speaker interface P2 connected to chip U3. A capacitor C7 is connected to pin 7 of chip U1. A resistor R5 and a light-emitting diode BLED1 are connected in series to pin 13 of chip U1. A capacitor C4 connected to an antenna is connected to pin 21 of chip U1. A crystal oscillator Y1 is connected between pins 23 and 24 of chip U1, and crystal oscillator Y1 provides a stable clock signal for chip U1.

[0032] Chip U1 is a dual-mode Bluetooth chip, while chips U2 and U3 are mono audio amplifiers. Chip U1's communication interface (RXD / TXD) is used for serial data exchange with other devices. Chip U1's analog-to-digital converter (ADC) pins and audio input / output pins (MIC, DACL, DACR) are used to process audio signals, acquire external sound, and output audio data. Chip U1's BT_RF pin connects to an antenna (ANT) to enable Bluetooth signal transmission and reception.

[0033] Chips U2 and U3 receive audio signals through the IN pin, amplify them, and then output the amplified audio signals from the VOP and VON pins to drive the two speakers to produce sound.

[0034] Pin 20 of the chip U1 is connected to resistors R8, R11, R12, R14, and R15, which are arranged in parallel. One end of resistor R11 is connected to the MODE button, one end of resistor R12 is connected to the PREV / VOL- button, one end of resistor R14 is connected to the PP button, and one end of resistor R15 is connected to the NEXT / VOL+ button.

[0035] The aforementioned buttons are connected to the ADKEY pin of chip U1 via resistors to achieve functions such as mode switching, volume adjustment, and play / pause. When a button is pressed, it changes the voltage value of the ADKEY pin, and chip U1 identifies the button operation by detecting the voltage change.

[0036] Pin 1 of chip U2 is connected to resistors R1 and R2 respectively, pin 2 of chip U2 is connected to capacitor C1, pin 3 of chip U2 is connected to resistor R3, and pin 4 of chip U2 is connected to resistor R4 and capacitor C2 connected in series.

[0037] The resistor R1 is connected to pin 5 of chip U1, the resistors R2 and R3 are both connected to pin 18 of chip U1, and the capacitor C2 is connected to pin 10 of chip U1.

[0038] A capacitor C9 is connected to pin 2 of chip U3, a resistor R6 is connected to pin 3 of chip U3, and a resistor R7 and a capacitor C10 connected in series are connected to pin 4 of chip U3.

[0039] One end of the resistor R6 is connected to pin 18 of the chip U1, and the capacitor C10 is connected to pin 11 of the chip U1.

[0040] A signal amplification module that amplifies the received weak Bluetooth signal;

[0041] The signal amplification module includes a chip U4, a connector POUT, and a connector POW. Pin 1 of the chip U4 is connected to pin 2 of the connector POUT. A resistor R18, a resistor R17, and a capacitor C17 are connected in series between pins 1 and 7 of the chip U4. Pin 3 of the chip U4 is connected to a 5V resistor R19, a parallel resistor R20, and a capacitor C1. Pin 5 of the chip U4 is connected to a parallel capacitor CL and an inductor L1. Pin 7 of the chip U4 is connected to a series resistor R22 and a resistor R21. One end of each of the resistor R21, capacitor CL, and inductor L1 is connected to pin 3 of the chip U4. A capacitor C100, a capacitor C101, and a capacitor C102 are connected in parallel between pins 1 and 4 of the connector POW.

[0042] Chip U4 is a dual operational amplifier chip. Pins 1 and 7 of chip U4 are the output pins of the two operational amplifiers. Pins 2 and 3 of chip U4 are the inverting and non-inverting inputs of the first operational amplifier, and pins 5 and 6 of chip U4 are the inverting and non-inverting inputs of the second operational amplifier.

[0043] The POUT connector is the signal input port, connected to the inverting input of the first operational amplifier via resistor R18, providing current limiting and impedance matching for the input signal. The output signal of the OUTA pin of chip U4 is used for further signal processing via a circuit consisting of resistor R17 and capacitor C17.

[0044] The voltage divider circuit composed of resistors R19 and R20 provides a suitable bias voltage to the non-inverting input of the operational amplifier. Capacitor C1 plays the role of filtering and stabilizing the bias voltage to prevent voltage fluctuations from affecting the operation of the operational amplifier.

[0045] Capacitor CL and inductor L1 form an LC resonant circuit, which is connected to resistors R21 and R22, as well as the output and input pins of the second operational amplifier. This circuit is used for frequency selective amplification, allowing signals of a specific frequency to pass through and be amplified, while suppressing signals of other frequencies.

[0046] The antenna matching module is responsible for efficiently transmitting the radio frequency signals generated by the Bluetooth dual-mode module to the antenna and ensuring that the signals received by the antenna are transmitted back to the Bluetooth dual-mode module without loss.

[0047] The antenna matching module includes a chip U5, which is a wireless transceiver chip. Pin 1 of the chip U5 is connected to a capacitor C23 for connecting to the antenna. One end of the capacitor C23 is connected to an inductor L13 and a capacitor C13, and the other end of the capacitor C23 is connected to an inductor L23. Pin 3 of the chip U5 is connected to a capacitor C33. Pin 6 of the chip U5 is connected to a capacitor C43. Pin 8 of the chip U5 is connected to a crystal oscillator Y1.

[0048] The antenna ANT is used to receive or transmit wireless signals at a specific frequency. Capacitors C23 and C13, and inductors L13 and L23 form a matching circuit to match the impedance of the antenna with the input impedance of chip U5, thereby improving signal transmission efficiency and reducing signal reflection and loss.

[0049] The power management module is responsible for providing a stable power supply to the above modules;

[0050] The power management circuit is responsible for providing a stable power supply to the Bluetooth dual-mode module and other circuit modules, and dynamically adjusting the power supply according to the device's operating status. It typically consists of a voltage regulator, battery protection circuitry, and charging management circuitry. It ensures that the Bluetooth dual-mode module and other circuit modules operate under a stable operating voltage, improving the device's reliability and stability. By dynamically adjusting the power supply, it reduces unnecessary power consumption and extends the Bluetooth headset's battery life.

[0051] The power management module can dynamically adjust the supply voltage and current of each chip to adapt to different operating conditions. This helps reduce the power consumption of the Bluetooth headset, thereby extending battery life.

[0052] The power management module ensures the stability of the entire system by monitoring the power supply status in real time (such as parameters like input voltage, output voltage, and output current). This helps prevent system crashes or performance degradation caused by power supply issues.

[0053] The Bluetooth dual-mode module, signal amplification module, and antenna matching module are all electrically connected to the power management module, and the signal amplification module and antenna matching module are all electrically connected to the Bluetooth dual-mode module.

[0054] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dual-mode signal enhancement circuit module based on Bluetooth headsets, characterized in that, include: A dual-mode Bluetooth module that supports two Bluetooth protocols and is responsible for handling the reception, transmission, and protocol conversion of Bluetooth signals; A signal amplification module that amplifies the received weak Bluetooth signal; The antenna matching module is responsible for efficiently transmitting the radio frequency signals generated by the Bluetooth dual-mode module to the antenna and ensuring that the signals received by the antenna are transmitted back to the Bluetooth dual-mode module without loss. The power management module is responsible for providing a stable power supply to the above modules; The Bluetooth dual-mode module, signal amplification module, and antenna matching module are all electrically connected to the power management module, and the signal amplification module and antenna matching module are all electrically connected to the Bluetooth dual-mode module.

2. The dual-mode signal enhancement circuit module based on Bluetooth headset according to claim 1, characterized in that: The Bluetooth dual-mode module includes chip U1, chip U2, speaker interface P1 connected to chip U2, chip U3, and speaker interface P2 connected to chip U3. A capacitor C7 is connected to pin 7 of chip U1. A resistor R5 and a light-emitting diode BLED1 are connected in series to pin 13 of chip U1. A capacitor C4 connected to an antenna is connected to pin 21 of chip U1. A crystal oscillator Y1 is connected between pins 23 and 24 of chip U1.

3. The dual-mode signal enhancement circuit module based on Bluetooth headset according to claim 2, characterized in that: Pin 20 of the chip U1 is connected to resistors R8, R11, R12, R14, and R15, which are arranged in parallel. One end of resistor R11 is connected to the MODE button, one end of resistor R12 is connected to the PREV / VOL- button, one end of resistor R14 is connected to the PP button, and one end of resistor R15 is connected to the NEXT / VOL+ button.

4. The dual-mode signal enhancement circuit module based on Bluetooth headset according to claim 2, characterized in that: Pin 1 of chip U2 is connected to resistors R1 and R2 respectively, pin 2 of chip U2 is connected to capacitor C1, pin 3 of chip U2 is connected to resistor R3, and pin 4 of chip U2 is connected to resistor R4 and capacitor C2 connected in series. The resistor R1 is connected to pin 5 of chip U1, the resistors R2 and R3 are both connected to pin 18 of chip U1, and the capacitor C2 is connected to pin 10 of chip U1.

5. The dual-mode signal enhancement circuit module based on Bluetooth headset according to claim 2, characterized in that: A capacitor C9 is connected to pin 2 of chip U3, a resistor R6 is connected to pin 3 of chip U3, and a resistor R7 and a capacitor C10 connected in series are connected to pin 4 of chip U3. One end of the resistor R6 is connected to pin 18 of the chip U1, and the capacitor C10 is connected to pin 11 of the chip U1.

6. The dual-mode signal enhancement circuit module based on Bluetooth headset according to claim 1, characterized in that: The signal amplification module includes a chip U4, a connector POUT, and a connector POW. Pin 1 of the chip U4 is connected to pin 2 of the connector POUT. A resistor R18, a resistor R17, and a capacitor C17 are connected in series between pins 1 and 7 of the chip U4. Pin 3 of the chip U4 is connected to a 5V resistor R19, a parallel resistor R20, and a capacitor C1. Pin 5 of the chip U4 is connected to a parallel capacitor CL and an inductor L1. Pin 7 of the chip U4 is connected to a series resistor R22 and a resistor R21. One end of each of the resistor R21, capacitor CL, and inductor L1 is connected to pin 3 of the chip U4. A capacitor C100, a capacitor C101, and a capacitor C102 are connected in parallel between pins 1 and 4 of the connector POW.

7. The dual-mode signal enhancement circuit module based on Bluetooth headset according to claim 1, characterized in that: The antenna matching module includes a chip U5. Pin 1 of the chip U5 is connected to a capacitor C23 for connecting to the antenna. One end of the capacitor C23 is connected to an inductor L13 and a capacitor C13, and the other end of the capacitor C23 is connected to an inductor L23. Pin 3 of the chip U5 is connected to a capacitor C33. Pin 6 of the chip U5 is connected to a capacitor C43. Pin 8 of the chip U5 is connected to a crystal oscillator Y1.

Images