Novel terminal wire tin dipping structure

Abstract

The utility model provides a novel terminal wire tin dipping structure, and belongs to the technical field of terminal wire welding. At least one section of the copper wire extends out of one end of the insulating skin; one section of the copper wire extending out of the insulating skin comprises a tin dipping section and a buffer section; the tin dipping section and the buffer section are arranged along the length direction of the copper wire, the buffer section is arranged between the tin dipping section and the insulating skin, the tin dipping section ensures the welding quality of the terminal wire, when external force is applied to welding, a stress point is transferred to the buffer section, the buffer section improves the bending resistance of the terminal wire, the terminal wire is prevented from being broken, and the service life of the terminal wire is prolonged. And the application range of the terminal wire is expanded under the condition that the welding quality is ensured.

Description

Technical Field

[0001] This utility model relates to the field of terminal wire welding technology, and more specifically, to a novel terminal wire tin-dipping structure. Background Technology

[0002] Terminal wire soldering refers to using metal terminal wires to maintain an electrical connection between electronic devices and terminal wires. There are many methods and approaches for terminal wire soldering, such as thermoforming, ultrasonic soldering, and inverted soldering (i.e., tapping or flipping soldering). The quality of the product is closely related to the quality of the soldering. To improve soldering quality, the enamel coating at the solder joint needs to be removed before soldering, and the terminal wires are then dipped in tin to coat their surface with a layer of tin. For example, publication number CN110961754A, invention titled "Tin Dipping Device and Method," discloses a method for performing tin dipping on metal wires, which significantly improves the soldering quality and conductivity of the terminal wires after tinning. However, since terminal wires are made of metal, the hardness of the metal increases and its toughness decreases after tinning. When there are assembly requirements such as bending or twisting after soldering, the risk of breakage of the tinned terminal wires increases. The aforementioned patent documents do not solve these problems.

[0003] Existing technologies typically reduce the number of materials stacked to less than 200 pieces and strictly prohibit twisting or stretching individual units during assembly to prevent the terminal wires from bending or breaking under external force after tinning. However, using the above methods increases the production process and difficulty, and cannot solve the problem of terminal wires breaking under external force after tinning.

[0004] Therefore, there is an urgent need for a new type of terminal wire tinning structure that can achieve assembly requirements such as bending and twisting after the terminal wire is tinned. Utility Model Content

[0005] In view of this, the present invention proposes a terminal wire tinning structure by setting a buffer section between the insulating skin and the tinning section, so that the force after welding is transferred to the buffer section.

[0006] The technical solution of this utility model is implemented as follows: a novel terminal wire tinning structure, comprising copper wire and insulating sheath, wherein,

[0007] The insulating sheath wraps around the copper wire;

[0008] At least one section of the copper wire extends from one end of the insulation;

[0009] The section of the copper wire extending beyond the insulation includes a tin-dipped section and a buffer section;

[0010] The tin-dipping section and the buffer section are arranged along the length of the copper wire, and the buffer section is arranged between the tin-dipping section and the insulating layer.

[0011] Based on the above technical solutions, preferably, the end of the tin-dipping section away from the insulation is flush with the end of the copper wire away from the insulation.

[0012] Based on the above technical solutions, preferably, it also includes a tin layer, which surrounds the outer periphery of the tin-dipping section.

[0013] Based on the above technical solutions, preferably, the end of the tin layer away from the insulating skin is flush with the end of the tin-dipping section away from the insulating skin, and the end of the tin layer close to the insulating skin is connected to the buffer section.

[0014] Based on the above technical solutions, preferably, one end of the buffer section is close to the tin-dip section, and the other end is close to the insulating skin.

[0015] Based on the above technical solution, preferably, the length of the solder-dipping section is H, and the length of the buffer section is L.

[0016] This utility model provides a novel terminal wire soldering structure that has the following advantages over existing technologies:

[0017] (1) The tin-dip section ensures the welding quality of the terminal wire. When the welding is subjected to external force, the force point is transferred to the buffer section. The buffer section improves the bending resistance of the terminal wire and avoids the terminal wire from breaking. While ensuring the welding quality, the application range of the terminal wire is improved.

[0018] (2) The tinning section is calculated from the end that extends out of the insulation, which saves copper wire;

[0019] (3) The tin layer is fully set around the outer periphery of the tin-dipping section. Only when the tin-dipping section is fully wrapped by the tin layer can the soldering quality be improved.

[0020] (4) The end of the tin layer near the insulation layer is connected to the buffer section. At this time, the area of ​​the tin-dipped section is fully utilized, saving copper wire. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a front view of a copper wire according to the present invention;

[0023] Figure 2 This is a front view of a novel terminal wire soldering structure according to this utility model. Detailed Implementation

[0024] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0025] like Figure 1-2 As shown, a novel terminal wire tinning structure includes a copper wire 1 and an insulating sheath 2.

[0026] The insulating layer 2 wraps around the copper wire 1, which is used for conducting electricity and welding electronic components. The insulating layer 2 provides insulation and protection, and therefore the insulating layer 2 is often made of flame-retardant PE plastic.

[0027] In order to improve the welding quality of the terminal wires, we adopt the method of dipping the copper wire 1 in tin before welding. In order to perform the tinning operation on the copper wire 1, at least one section of the copper wire 1 extends from one end of the insulation sheath 2. This part of the copper wire 1 is dipped in tin before welding, thereby improving the welding quality.

[0028] To address the issue of increased hardness and decreased toughness of the copper wire 1 after tinning, which can easily lead to breakage during assembly processes such as bending and twisting after welding, the section of the copper wire 1 extending beyond the insulation 2 includes a tin-dipping section 11 and a buffer section 12. The tin-dipping section 11 and the buffer section 12 are positioned along the length of the copper wire 1. The buffer section 12 is located between the tin-dipping section 11 and the insulation 2. An untinned buffer section 12 is added to the copper wire 1 extending beyond the insulation 2. The tin-dipping section 11 ensures the welding quality of the terminal wire, while the buffer section 12 shifts the stress point to the terminal wire during bending and twisting after welding, improving the terminal wire's bending resistance and preventing breakage. This ensures welding quality while expanding the application range of the terminal wire.

[0029] like Figure 1 As shown, the tin-dipping section 11 is used for soldering after tin dipping. Since the buffer section 12 is located between the tin-dipping section 11 and the insulating layer 2, if the copper wire 1 of the tin-dipping section 11 that is far from the buffer section 12 cannot be used for soldering, the copper wire 1 is wasted. In order to make full use of the tin-dipping section 11 and avoid wasting the copper wire 1, as a preferred embodiment, the end of the tin-dipping section 11 that is far from the insulating layer 2 is flush with the end of the copper wire 1 that is far from the insulating layer 2. At this time, the tin-dipping section 11 is calculated from the end that extends out of the insulating layer 2, thus saving the copper wire 1.

[0030] like Figure 2As shown, it also includes a tin layer 3, which surrounds the outer periphery of the tin-dipping section 11. In order to improve the soldering quality, the tin layer 3 must be fully set around the outer periphery of the tin-dipping section 11. Only when the tin layer 3 is fully set around the tin-dipping section 11 can the soldering quality be improved. Once there is an area that is not surrounded by the tin layer 3, the soldering quality will be reduced.

[0031] Based on the positional relationship between the tin-dipping section 11 and the copper wire 1, it can be seen that the copper wire 1 can only improve the welding quality after being tinned. Therefore, the position of the tin layer 3 in the tin-dipping section 11 determines the effective welding position of the tin-dipping section 11. In order to make full use of the area of ​​the tin-dipping section 11, as a preferred embodiment, the end of the tin layer 3 away from the insulating skin 2 is flush with the end of the tin-dipping section 11 away from the insulating skin 2, and the end of the tin layer 3 close to the insulating skin 2 is connected to the buffer section 12. At this time, the area of ​​the tin-dipping section 11 is fully utilized, and the copper wire 1 is saved.

[0032] To save copper wire 1 and make the buffering effect of buffer section 12 more obvious, one end of buffer section 12 is close to tin-dip section 11 and the other end is close to insulation 2. The closer buffer section 12 is to tin-dip section 11, the more obvious the buffering effect. Therefore, one end of buffer section 12 is close to tin-dip section 11, and the closer buffer section 12 is to insulation 2, the shorter the part of copper wire 1 that extends out of insulation 2, which can save copper wire 1 and reduce costs. Therefore, the other end of buffer section 12 is close to insulation 2.

[0033] like Figure 1 As shown, the tin-dipping section 11 is used for soldering and fixing. The length of the tin-dipping section 11 needs to be determined according to the performance and parameters of the product being soldered. When the tin-dipping section 11 is longer, the soldering length is longer, and the fixing of the entire copper wire 1 is more secure. When subjected to external force, the buffer section 12 absorbs a larger force, making it prone to breakage. Therefore, the length of the buffer section 12 needs to be determined based on the length of the tin-dipping section 11. The length of the tin-dipping section 11 is H, and the length of the buffer section 12 is L. After multiple implementations, the ratio of the length of the tin-dipping section 11 to the length of the buffer section 12 is found to be... The buffering effect of buffer segment 12 is most obvious at this time.

[0034] The following describes the method of using the novel terminal wire soldering structure of this utility model:

[0035] Heat the solder pot to melt the solder. Increase the temperature of the solder pot from 300℃ to 350℃. Remove the varnish film from the solder dipping section 11, and after dipping it in solder paste, insert it into the solder pot and hold it there for 1 second until the solder dipping section 11 is fully dipped in solder.

[0036] The high temperature inside the tin pot is transferred to the insulating layer 2 through the copper wire 1, and melts the area near the tin-dipping section 11. At this time, a buffer section 12 is formed on the copper wire 1.

[0037] The tin-dip section 11 is soldered to the MIC unit, while the buffer section 12 retains the original toughness of the copper wire 1. When the product is bent under stress after soldering, the stress point is transferred to the buffer section 12, ensuring good bending resistance during material transfer and assembly, and preventing the copper wire 1 from breaking.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel terminal wire dip tinning structure comprising a copper wire (1) and an insulating sheath (2), wherein, The insulating sheath (2) wraps the copper wire (1); characterized in that: at least one section of the copper wire (1) extends from one end of the insulating sheath (2); the section of the copper wire (1) extending out of the insulating sheath (2) comprises a tinned section (11) and a buffer section (12); the tinned section (11) and the buffer section (12) are arranged along the length direction of the copper wire (1), and the buffer section (12) is arranged between the tinned section (11) and the insulating sheath (2).

2. A novel terminal wire dip tinning structure as claimed in claim 1, wherein: The end of the tinned section (11) away from the insulating sheath (2) is flush with the end of the copper wire (1) away from the insulating sheath (2).

3. A novel terminal wire dip tinning structure as claimed in claim 2, wherein: Further comprising a tin layer (3) surrounding the outer periphery of the tinned section (11).

4. A novel terminal wire dip tinning structure as claimed in claim 3, wherein: The end of the tin layer (3) away from the insulating sheath (2) is flush with the end of the tinned section (11) away from the insulating sheath (2), and the end of the tin layer (3) close to the insulating sheath (2) is connected with the buffer section (12).

5. A novel terminal wire dip tinning structure as claimed in claim 1, wherein: One end of the buffer section (12) is close to the tinned section (11), and the other end is close to the insulating sheath (2).

6. A novel terminal wire dip tinning structure as claimed in claim 1, wherein: The length of the dipping tin section (11) is H, and the length of the buffer section (12) is L,

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