Fastening and positioning mechanism for chip packaging box
The positioning assembly driven by the rotating ring and adjusting rod converts rotational motion into linear motion, solving the problem of inaccurate positioning of chip packaging boxes, achieving efficient and accurate fixing, and reducing the risk of damage and contamination during transportation.
Patent Information
- Application Number
- CN202520798488.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2035-04-25
AI Technical Summary
Existing chip packaging box positioning mechanisms are difficult to achieve efficient and accurate fixation during transportation, which can easily lead to chip damage and contamination.
The positioning assembly, driven by a rotating ring and adjusting rod, converts rotational motion into linear motion, enabling synchronized operation of multiple positioning assemblies. This ensures that the positioning assembly is inserted into the positioning hole of the chip packaging box, and the mounting surface drives the positioning assembly to rise and fall, achieving efficient and precise fixation.
This achieves efficient and precise fixation of chip packaging boxes, reducing the risk of damage and contamination during transportation.
Smart Images

Figure CN223973042U_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the field of semiconductor carrier technology, specifically to a chip packaging box clamping and positioning mechanism. Background Technology
[0002] After production, chips typically require packaging, usually using boxes to completely house them. Chip packaging is an indispensable part of the chip supply chain, and its design must balance protection, functionality, compatibility, and environmental friendliness to meet the stringent requirements of chip transportation, storage, and use. After the chip is placed inside the packaging box, the box needs to be positioned during transportation. Current positioning mechanisms are generally not very effective, making it difficult to control damage and contamination during transport. Summary of the Invention
[0003] In view of this, the embodiments of this specification provide a chip packaging box fastening and positioning mechanism. The rotating ring is driven to rotate by an externally extended adjusting rod. During the rotation, the mounting surface drives the positioning components to rise and fall, converting the rotational motion into linear motion. The synchronous action of multiple positioning components can be controlled by a single adjusting rod, ensuring that the positioning components can be inserted into the positioning holes on the chip packaging box, thereby achieving efficient and precise fixing of the chip packaging box.
[0004] This specification provides the following technical solution through its embodiments: a chip packaging box fastening and positioning mechanism, the fastening and positioning mechanism being used for positioning the chip packaging box and mounted on an external base, the fastening and positioning mechanism comprising:
[0005] A rotating ring, wherein an adjusting rod extends outward from the rotating ring and is used to drive the rotating ring to rotate; and a mounting surface is formed on the top of the rotating ring.
[0006] A positioning component, at least partially in contact with the mounting surface, wherein the adjusting rod drives the rotating ring to rotate, thereby enabling at least a portion of the positioning component to rise or fall;
[0007] The chip packaging box has a positioning hole that cooperates with the positioning component, and the positioning component passes through at least part of the positioning hole to fasten the chip packaging box above the rotating ring.
[0008] Preferably, the mounting surface includes a continuous first plane, an inclined plane, and a second plane, the inclined plane connecting the first plane and the second plane, the first plane being at a higher position than the second plane, and the positioning component rising when it slides from the first plane along the inclined plane to the second plane.
[0009] Preferably, the mounting surface is provided in three sets, and the three sets of mounting surfaces are evenly distributed on the rotating ring.
[0010] Preferably, the positioning component includes a lifting column, a support column, and an explosive bolt. The support column is mounted on an external base, and the lifting column engages with the support column. The lifting column extends toward the mounting surface to form a guide buckle, which engages with the mounting surface. The explosive bolt passes through the positioning hole and connects with the support column.
[0011] Preferably, the support column has slots extending outward on both sides, and the lifting column has strips extending outward on both sides. The strips are at least partially embedded in the slots so that the lifting column and the support column can engage.
[0012] Preferably, the lifting column is in contact with the mounting surface, and when the rotating ring rotates, the mounting surface causes the lifting column to rise or fall.
[0013] Preferably, the positioning component further includes a threaded sleeve, which is fitted over the outside of the explosive bolt and passes through the positioning hole.
[0014] Preferably, the support column has a first threaded groove, and the bottom end of the explosive bolt is screwed into the first threaded groove.
[0015] Preferably, the positioning component further includes a fixing bolt, and the support column has a second threaded groove, the fixing bolt passing through the outer base and engaging with the second threaded groove.
[0016] Preferably, the top of the adjusting rod is connected to a handle, and the top of the handle is higher than the outer base.
[0017] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:
[0018] The rotating ring is driven to rotate by an externally extended adjusting rod. During the rotation, the mounting surface drives the positioning components to rise and fall, converting the rotational motion into linear motion. The synchronous action of multiple positioning components can be controlled by a single adjusting rod, ensuring that the positioning components can be inserted into the positioning holes on the chip packaging box, thus achieving efficient and precise fixation of the chip packaging box. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the chip packaging box fastening and positioning mechanism provided in this application when positioning the chip packaging box;
[0021] Figure 2 This is a schematic diagram of the chip packaging box fastening and positioning mechanism provided in this application installed on an external base;
[0022] Figure 3 This is a schematic diagram of the chip packaging box fastening and positioning mechanism provided in this application;
[0023] Figure 4 This is an exploded view of the positioning component of the chip packaging box fastening and positioning mechanism provided in this application;
[0024] Figure 5 This is a schematic diagram of the positioning component of the chip packaging box fastening and positioning mechanism provided in this application.
[0025] In the diagram, 1. Chip packaging box; 2. External base; 3. Positioning component; 31. Lifting column; 32. Support column; 33. Explosion bolt; 34. Screw sleeve; 35. Guide buckle; 36. Second threaded groove; 37. Fixing bolt; 38. First threaded groove; 39. Slot; 310. Locking strip; 4. Adjusting rod; 5. Rotary ring; 6. Mounting surface; 61. First plane; 62. Inclined surface; 63. Second plane; 7. Handle. Detailed Implementation
[0026] The embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0027] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.
[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0030] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.
[0031] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.
[0032] like Figures 1-3 As shown, a chip packaging box fastening and positioning mechanism is used to position the chip packaging box 1, and is installed on an external base 2. The fastening and positioning mechanism includes:
[0033] A rotating ring 5 has an adjusting rod 4 extending outward from it. The adjusting rod 4 is used to drive the rotating ring 5 to rotate. A mounting surface 6 is formed on the top of the rotating ring 5.
[0034] The positioning component 3 is at least partially in contact with the mounting surface 6. The adjusting rod 4 drives the rotating ring 5 to rotate, which can realize the raising or lowering of at least part of the structure of the positioning component 3.
[0035] The chip packaging box 1 has a positioning hole that cooperates with the positioning component 3. The positioning component 3 passes through the positioning hole at least partially to fasten the chip packaging box 1 above the rotating ring 5.
[0036] By setting a rotating ring 5 with a mounting surface 6 on its top, the positioning component 3 is at least partially in contact with the mounting surface 6. An adjusting rod 4 is connected to the rotating ring 5, which drives the rotating ring 5 to rotate. The mounting surface 6 moves relative to the positioning component 3. As the mounting surface 6 moves, at least a part of the structure of the positioning component 3 can rise or fall. A positioning hole that matches the positioning component 3 is opened on the chip packaging box 1. When the positioning component 3 rises, it is inserted into the positioning hole, thereby completing the chip positioning operation.
[0037] like Figure 3 As shown, in some embodiments, the mounting surface 6 includes a continuous first plane 61, an inclined plane 62, and a second plane 63. The inclined plane 62 connects the first plane 61 and the second plane 63. The first plane 61 is at a higher position than the second plane 63. When the positioning component 3 slides from the first plane 61 along the inclined plane 62 to the second plane 63, the positioning component 3 rises. The mounting surface 6 is continuously composed of the first plane 61, the inclined plane 62, and the second plane 63, with the first plane 61 being higher than the second plane 63. When the adjusting rod 4 drives the rotating ring 5 to rotate, the positioning component 3 slides along the mounting surface 6.
[0038] Initial position (second plane 63): The liftable part of the positioning component 3 is in a low position, and at this time it is not inserted into the positioning hole of the chip packaging box 1, which makes it easy to place or take out the chip packaging box 1;
[0039] Transition phase (sliding of inclined plane 62): The rotation of the rotating ring 5 causes the liftable part of the positioning component 3 to move along the inclined plane 62. The tilt angle of the inclined plane 62 converts the horizontal rotational motion into vertical upward motion, realizing the linear lifting of the liftable part of the positioning component 3.
[0040] Termination position (first plane 61): When the positioning component 3 reaches the first plane 61, its height reaches its maximum value and it is stably embedded in the positioning hole, thus completing the positioning of the chip packaging box 1.
[0041] like Figure 3 As shown, in some embodiments, the mounting surface 6 is provided in three sets, and the three sets of mounting surfaces 6 are evenly distributed on the rotating ring 5. By providing three sets of mounting surfaces 6 evenly distributed on the rotating ring 5, the synchronous movement of the three sets of positioning components 3 can be realized simultaneously, and the chip packaging box 1 can be positioned by the three sets of positioning components 3 to ensure the positioning effect.
[0042] like Figures 1-5As shown, in some embodiments, the positioning component 3 includes a lifting column 31, a support column 32, and an expansion bolt 33. The support column 32 is mounted on the external base 2, and the lifting column 31 engages with the support column 32. The lifting column 31 extends towards the mounting surface 6 to form a guide buckle 35, which engages with the mounting surface 6. The expansion bolt 33 passes through the positioning hole and connects to the support column 32. The support column 32, mounted on the external base 2, serves as the static load-bearing core of the overall structure, ensuring the vertical stability of the positioning component 3. The lifting column 31 is slidably embedded into the support column 32 to achieve vertical height adjustment, adapting to the positioning requirements of different specifications of chip packaging boxes 1. The lifting column 31 is mounted on the mounting surface 6 via the guide buckle 35. When the rotating ring 5 rotates, the mounting surface 6 slides relative to the lifting column 31, causing the positioning component 3 to rise and insert into the positioning hole of the chip packaging box 1. The expansion bolt 33 is tightened, causing the lifting column 31 and the support column 32 to expand and fix the chip packaging box 1.
[0043] like Figures 1-5 As shown, in some embodiments, the support column 32 has slots 39 extending outward on both sides, and the lifting column 31 has strips 310 extending outward on both sides. The strips 310 are at least partially embedded in the slots 39, allowing the lifting column 31 and the support column 32 to engage. By providing slots 39 on the support column 32 and strips 310 on the lifting column 31 that mate with the slots 39, the strips 310 slide within the slots 39 when the lifting column 31 moves up and down. The engaging structure of the slots 39 and strips 310, through geometric constraints and modular design, ensures high-precision movement of the lifting column 31 while improving assembly efficiency.
[0044] like Figures 1-5 As shown, in some embodiments, the lifting column 31 is in contact with the mounting surface 6. When the rotating ring 5 rotates, the mounting surface 6 drives the lifting column 31 to rise or fall. The lifting column 31 is mounted on the mounting surface 6 through the guide buckle 35. The lifting column 31 is in contact with the mounting surface 6. When the rotating ring 5 rotates, the mounting surface 6 moves relative to the lifting column 31. Since the mounting surface 6 has an inclined surface 62, when the inclined surface 62 moves relative to the lifting column 31, the lifting column 31 can be lifted or lowered.
[0045] like Figures 4-5 As shown, in some embodiments, the positioning component 3 further includes a screw sleeve 34, which is sleeved on the outside of the explosive bolt 33. The screw sleeve 34 passes through the positioning hole. By setting the screw sleeve 34, when the explosive bolt 33 is tightened, the screw sleeve 34 expands, causing the lifting column 31 and the support column 32 to expand, thereby fixing the chip packaging box 1.
[0046] like Figures 4-5 As shown, in some embodiments, the support column 32 is provided with a first threaded groove 38, and the bottom end of the explosive bolt 33 is screwed into the first threaded groove 38. By providing the first threaded groove 38 on the support column 32, the connection between the explosive bolt 33 and the support column 32 can be realized.
[0047] like Figures 4-5 As shown, in some embodiments, the positioning component 3 further includes a fixing bolt 37, and the support column 32 is provided with a second threaded groove 36. The fixing bolt 37 passes through the outer base 2 and engages with the second threaded groove 36. By providing the second threaded groove 36 on the support column 32 and screwing the fixing bolt 37 through the outer base 2 and the second threaded groove 36, the connection between the support column 32 and the outer base 2 can be realized.
[0048] like Figures 1-3 As shown, in some embodiments, a handle 7 is connected to the top of the adjusting rod 4, and the top of the handle 7 is higher than the outer base 2. By providing a handle 7 at the top of the adjusting rod 4, the adjusting rod 4 can be rotated via the handle 7, thereby realizing the rotation of the rotating ring 5.
[0049] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.
[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A chip packaging box fastening and positioning mechanism, characterized in that, The tight fixing position mechanism is used for positioning a chip packaging box, is installed on an external base, and comprises: A swivel ring, an adjusting rod is formed outside the swivel ring, the adjusting rod is used to drive the swivel ring to rotate, and a mounting surface is formed on the top of the swivel ring; A positioning assembly, at least part of the positioning assembly is in contact with the mounting surface, the adjusting rod drives the swivel ring to rotate, and at least part of the positioning assembly can be lifted or lowered; Wherein, the chip packaging box is provided with a positioning hole matched with the positioning assembly, and the positioning assembly is at least partially inserted into the positioning hole to tightly fix the chip packaging box above the swivel ring.
2. The chip package tight fixing position mechanism according to claim 1, wherein The mounting surface comprises a continuous first plane, an inclined plane and a second plane, the inclined plane is used to connect the first plane and the second plane, the position of the first plane is higher than that of the second plane, and the positioning assembly is lifted when sliding from the first plane to the second plane along the inclined plane.
3. The chip package tight fixing position mechanism according to claim 2, wherein The mounting surface is provided with three groups, and the three groups of mounting surfaces are uniformly distributed on the swivel ring.
4. The chip package tight fixing seat mechanism according to any one of claims 1-3, characterized in that, The positioning assembly comprises a lifting column, a supporting column and an explosive bolt, the supporting column is installed on the external base, the lifting column is engaged with the supporting column, the lifting column extends towards the mounting surface to form a guide buckle, the guide buckle is engaged with the mounting surface, and the explosive bolt is connected between the supporting column and the positioning hole.
5. The chip package box fixing mechanism according to claim 4, wherein The supporting column extends outward on both sides to form a clamping groove, the lifting column extends outward on both sides to form a clamping strip, and the clamping strip is at least partially embedded in the clamping groove, so that the lifting column is engaged with the supporting column.
6. The chip package box fixing mechanism according to claim 5, wherein The lifting column is in contact with the mounting surface, and the mounting surface drives the lifting column to rise or fall when the swivel ring rotates.
7. The chip package box fixing mechanism according to claim 4, wherein The positioning assembly further comprises a screw sleeve, the screw sleeve is sleeved outside the explosive bolt, and the screw sleeve passes through the positioning hole.
8. The chip package box fixing mechanism according to claim 4, wherein A first threaded groove is formed in the supporting column, and the bottom end of the explosive bolt is screwed with the first threaded groove.
9. The chip package box fixing mechanism according to claim 4, wherein The positioning assembly further comprises a fixing bolt, a second threaded groove is formed in the supporting column, and the fixing bolt passes through the external base and is matched with the second threaded groove.
10. The chip package box fixing mechanism according to claim 1, wherein A handle is connected to the top of the adjusting rod, and the top of the handle is higher than the external base.