Cultural relic peeling test device

Abstract

The utility model discloses a cultural relic stripping testing device, and relates to the technical field of adhesive tape stripping. The cultural relic stripping testing device comprises a shell with an opening in one side, a pressure applying assembly and a bonding assembly, the pressure applying assembly and the bonding assembly are arranged in the shell, the bonding assembly is arranged close to the opening side, and the pressure applying assembly applies preset pressure to the opening side to push the bonding assembly to be bonded with the surface of a to-be-tested object located at the opening. The device can accurately control the bonding pressure of the adhesive tape.

Description

Technical Field

[0001] This application relates to the field of tape peeling technology, and more specifically, to a device for testing the peeling of cultural relics. Background Technology

[0002] Immovable rock and soil artifacts carry a wealth of historical and cultural information. However, because most of them are exposed to the natural environment, they have endured the ravages of time, suffering from sun, rain, wind, and biological erosion. Furthermore, they are frequently damaged by human activities, causing these precious artifacts to deteriorate and even face the crisis of disappearing. Especially against the backdrop of global climate change and environmental degradation, the protection of rock and soil artifacts has become an urgent matter.

[0003] With the continuous advancement of science and technology, cultural heritage workers have made significant progress in the field of site protection. In the fields of cultural heritage protection and materials science, numerous technical methods have emerged and been widely applied to accurately assess the surface condition of historical buildings and artworks, and to measure the effectiveness of protective measures. Methods such as drill resistance testing, surface hardness testing, and wave velocity measurement all play their respective roles. Among them, the tape peel test stands out, providing a relatively simple and cost-effective solution for this field. Its principle is to use double-sided pressure-sensitive adhesive tape to assess the cohesion and adhesion of the material surface, thereby helping experts understand the degree of material degradation and the effectiveness of protective treatments. In operation, pre-weighed double-sided pressure-sensitive adhesive tape is typically used, tightly adhered to the surface to be evaluated, ensuring complete adhesion, and then quickly peeled off. At this point, loose powder and particles on the surface will adhere to the tape, and the weight of the detached material is then measured.

[0004] The tape peel test has certain limitations in practical applications. It requires precise control of the adhesive pressure applied to the tape, which undoubtedly sets a high skill level for the operator, significantly increasing the complexity and difficulty of the test. Utility Model Content

[0005] The purpose of this application is to provide a cultural relic peeling test device that can precisely control the adhesive pressure of the tape.

[0006] The embodiments of this application are implemented as follows:

[0007] This application provides a cultural relic peeling test device, including a housing with an opening on one side and a pressure application component and an adhesive component disposed within the housing. The adhesive component is disposed near the opening side, and the pressure application component applies a preset pressure to the opening side to push the adhesive component to adhere to the surface of the object to be tested located at the opening.

[0008] Alternatively, as one possible implementation, the pressure application assembly includes a compression spring and a pressure plate connected to one end of the compression spring, the other end of the compression spring being connected to the inner wall of the housing, and the pressure plate being driven to move the adhesive assembly toward the opening side.

[0009] Alternatively, as an implementable method, the housing is provided with a plurality of slots for engaging with the pressure plate, and the pressure plate is driven to switch between the plurality of slots so that the compression spring accumulates different elastic potential energies.

[0010] Alternatively, as an implementable method, a lever is connected to the pressure plate, the lever extending out of the housing and engaging with the slot.

[0011] Optionally, as an implementable method, the slot includes a first slot, a second slot, and a third slot arranged sequentially along the pressure direction of the pressure-applying component, and the lever engages with the first slot, the second slot, or the third slot to accumulate elastic potential energy in the compression spring.

[0012] Alternatively, as an implementable method, the lever is slidably connected to the pressure plate so that the lever slides into or out of the slot.

[0013] Optionally, as an implementable method, the inner wall of the housing is further provided with a slide rail, and the pressure plate and the slide rail are slidably connected.

[0014] Optionally, as one implementable method, the adhesive assembly includes a mounting box removably mounted within the housing and a buffer block slidably disposed on the mounting box. The mounting box has an adhesive interface, and the buffer block is provided with adhesive tape on the side facing the adhesive interface. The back of the buffer block and the adhesive tape are adhesively engaged, and the buffer block is slidably mounted on the mounting box for engaging with the pressure-applying assembly to provide resistance.

[0015] Optionally, as an implementable method, the mounting box has an opening on the side away from the adhesive interface, the edge of the opening has a groove, the side wall of the buffer block has a slider corresponding to the groove, and the buffer block is slidably connected to the groove via the slider.

[0016] Alternatively, as an implementable method, the buffer block and the mounting box are connected by a reset element.

[0017] The beneficial effects of the embodiments of this application include:

[0018] The artifact peeling test device provided in this application includes a housing with an opening on one side, and a pressure-applying component and an adhesive component disposed within the housing. The adhesive component is positioned near the opening, and the pressure-applying component applies a preset pressure to the opening to push the adhesive component to adhere to the surface of the object to be tested located at the opening. By applying a preset pressure through the built-in pressure-applying component to push the adhesive component, the adhesive pressure between the tape and the artifact surface can be precisely controlled and stably maintained. This avoids the problem of difficulty in accurately controlling pressure due to manual operation in traditional tape peeling tests, greatly improving the accuracy and reliability of test data and providing more precise evidence for artifact conservation research. It also reduces operational difficulty: operators only need to align the device with the artifact and set the pressure parameters, without requiring advanced manual skills to control the tape adhesion pressure. This reduces the professional skill requirements for operators, and ordinary artifact conservation workers can operate it proficiently after simple training, saving labor training costs and improving work efficiency. Because the pressure is precisely controllable, it effectively reduces additional damage to the artifact surface caused by uneven pressure during tape application and removal, maximizing the protection of precious rock and soil artifacts, conforming to the principle of "minimal intervention" in artifact conservation, extending the lifespan of artifacts, and ensuring the integrity of historical and cultural heritage carriers. Moreover, the device's operation process is standardized and simplified. Compared with traditional tape peeling tests, it reduces the time wasted due to repeated adjustments and concerns about poor adhesion. It can complete multiple tests in a short time, quickly obtain a large amount of effective data, accelerate the research process of cultural relic protection, and promptly formulate scientific and reasonable protection plans for cultural relics. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is one of the structural schematic diagrams of the artifact peeling test device provided in the embodiments of this application;

[0021] Figure 2 This is the second schematic diagram of the structure of the artifact peeling test device provided in the embodiments of this application;

[0022] Figure 3 The third schematic diagram of the structure of the cultural relic peeling test device provided in the embodiments of this application.

[0023] Icons: 100 - Artifact peeling test device; 110 - Housing; 111 - Slot; 1111 - First slot; 1112 - Second slot; 1113 - Third slot; 120 - Pressure application component; 121 - Compression spring; 122 - Pressure plate; 123 - Pulse block; 130 - Adhesive component; 131 - Mounting box; 132 - Buffer block; 133 - Adhesive tape. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] Please refer to Figure 1 , Figure 2 and Figure 3 This embodiment provides a cultural relic peeling test device 100, including a housing 110 with an opening on one side, and a pressure application component 120 and an adhesive component 130 disposed in the housing 110. The adhesive component 130 is disposed close to the opening side, and the pressure application component 120 applies a preset pressure to the opening side to push the adhesive component 130 to adhere to the surface of the object to be tested located at the opening.

[0029] Specifically, when using the artifact peeling test device 100 provided in this application to perform a peeling test, align the opening of the artifact peeling test device 100 with the surface of the artifact to be tested, bring the adhesive component 130 close to but not in contact with the artifact, turn on the pressure application component 120, set the required preset pressure value through the control system, and the pressure application component 120 starts to work, pushing the adhesive component 130 towards the opening side, so that the double-sided pressure-sensitive adhesive tape slowly and steadily contacts and tightly adheres to the surface of the artifact, so that the adhesive component 130 adheres to the surface of the artifact under fixed pressure. After the adhesion is completed, remove the device from the surface of the artifact and observe and analyze the adhesion on the adhesive component 130.

[0030] The artifact peeling test device 100 provided in this application includes a housing 110 with an opening on one side, and a pressure-applying component 120 and an adhesive component 130 disposed within the housing 110. The adhesive component 130 is disposed near the opening side. The pressure-applying component 120 applies a preset pressure to the opening side to push the adhesive component 130 to adhere to the surface of the object to be tested located at the opening. By applying a preset pressure through the built-in pressure-applying component 120 to push the adhesive component 130, the adhesive pressure between the tape and the artifact surface can be precisely controlled and stably maintained. This avoids the problem of difficulty in accurately controlling pressure due to manual operation in traditional tape peeling tests, greatly improving the accuracy and reliability of test data and providing more accurate evidence for artifact conservation research. At the same time, it reduces the difficulty of operation: operators only need to align the device with the artifact and set the pressure parameters, without the need for advanced manual skills to control the tape adhesion pressure. This reduces the professional skill requirements for operators, and ordinary artifact conservation workers can operate it proficiently after simple training, saving labor training costs and improving work efficiency. Because the pressure is precisely controllable, it effectively reduces additional damage to the surface of cultural relics caused by uneven pressure during the application and removal of tape, maximizing the protection of precious rock and soil artifacts. This aligns with the principle of "minimal intervention" in cultural relic protection, extends the lifespan of cultural relics, and ensures the integrity of historical and cultural heritage carriers. Furthermore, the device's standardized and simplified operation process reduces the time wasted on repeated pressure adjustments and concerns about poor adhesion compared to traditional tape peeling tests. It allows for multiple tests to be completed in a short time, quickly acquiring a large amount of effective data, accelerating the research process in cultural relic protection, and enabling the timely development of scientific and reasonable protection plans for cultural relics.

[0031] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the pressure application assembly 120 includes a compression spring 121 and a pressure plate 122 connected to one end of the compression spring 121. The other end of the compression spring 121 is connected to the inner wall of the housing 110. The pressure plate 122 is driven to move the adhesive assembly 130 toward the opening side.

[0032] Specifically, when using the artifact peeling test device 100 provided in this application for peeling testing, the compression spring 121 is manually or through other driving methods to move the pressure plate 122 away from the opening side, accumulating elastic potential energy. The device opening is then aligned with the surface of the artifact to be tested. The pressure plate 122 is released, and the compression spring 121 releases its elastic potential energy, pushing the pressure plate 122 to move the adhesive component 130 towards the opening side, bonding it to the artifact surface. After a period of time, the device is removed from the artifact surface.

[0033] By employing a compression spring 121 and a pressure plate 122 to form a pressure application assembly 120, the elastic properties of the spring can provide a relatively stable and adjustable pressure during the application process. The buffering effect of the spring can prevent damage to cultural relics caused by excessive pressure in an instant, and the elastic potential energy of the spring can be adjusted as needed to adapt to the testing requirements of different cultural relics, thereby improving the accuracy and safety of the test.

[0034] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the housing 110 is provided with multiple slots 111 for engaging with the pressure plate 122. The pressure plate 122 can be driven to switch between multiple slots 111 so that the compression spring 121 can accumulate different elastic potential energies.

[0035] Specifically, when using the artifact peeling test device 100 provided in this application for peeling testing, a suitable slot 111 is selected according to the characteristics of the artifact to be tested. The pressure plate 122 is moved to the position corresponding to the selected slot 111 and engages with the slot 111, allowing the compression spring 121 to accumulate corresponding elastic potential energy. The device opening is aligned with the surface of the artifact to be tested. The engagement between the pressure plate 122 and the slot 111 is released, the compression spring 121 releases its elastic potential energy, and pushes the pressure plate 122 to drive the adhesive component 130 to adhere to the surface of the artifact. After the test is completed, the device is removed from the surface of the artifact. Multiple slots 111 are provided on the housing 110 to engage with the pressure plate 122, allowing the compression spring 121 to accumulate different elastic potential energies, thereby achieving multi-level adjustment of the test pressure. This design enhances the applicability of the device, allowing for the selection of appropriate test pressures for artifacts of different materials and conditions, and improving the reliability and accuracy of the test results.

[0036] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a lever 123 is connected to the pressure plate 122. The lever 123 extends out of the housing 110 and is engaged with the slot 111.

[0037] The lever 123 connected to the pressure plate 122 extends out of the housing 110, allowing operators to manually switch the pressure plate 122 between different slots 111. This design makes pressure adjustment more intuitive and convenient, reduces operational difficulty, and improves work efficiency, enabling pressure adjustment to be easily completed even in complex testing environments.

[0038] When performing a peeling test using the artifact peeling test device 100 provided in this application, hold the lever 123 by hand and slide it out of the current slot 111. If necessary, move the lever 123 to another suitable slot 111 position. Insert the lever 123 into the selected slot 111, causing the compression spring 121 to accumulate the corresponding elastic potential energy. Align the device opening with the surface of the artifact to be tested. Release the lever 123 from the slot 111 and perform the test. After the test is completed, remove the device.

[0039] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the slot 111 includes a first slot 1111, a second slot 1112 and a third slot 1113 arranged sequentially along the pressure direction of the pressure application assembly 120. The push block 123 is engaged with the first slot 1111, the second slot 1112 or the third slot 1113 to store elastic potential energy in the compression spring 121.

[0040] When using the artifact peeling test device 100 provided in this application to conduct peeling tests, the material and surface condition of the artifact to be tested are assessed to determine the required pressure level. If a lower pressure is required, the lever 123 is engaged in the first slot 1111; if a medium pressure is required, it is engaged in the second slot 1112; and if a higher pressure is required, it is engaged in the third slot 1113. The device opening is aligned with the surface of the artifact to be tested. The lever 123 is released from the slot 111, allowing the adhesive component 130 to adhere to the surface of the artifact. After the test is completed, the device is removed. The first slot 1111, the second slot 1112, and the third slot 1113 are clearly defined, providing specific pressure level selections. Operators can accurately select different pressure levels according to the actual condition of the artifact, further improving the adaptability of the device to different artifacts and the accuracy of the test.

[0041] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the lever 123 is slidably connected to the pressure plate 122 so that the lever 123 slides into or out of the slot 111.

[0042] When using the artifact peeling test device 100 provided in this application to conduct a peeling test, push the lever 123 by hand to slide it on the pressure plate 122 and disengage it from the current slot 111. According to the test requirements, slide the lever 123 to the target slot 111. Slide the lever 123 into the target slot 111, allowing the compression spring 121 to accumulate corresponding elastic potential energy. Align the device opening with the surface of the artifact to be tested. Push the lever 123 again to disengage it from the slot 111 and conduct the test. After the test, slide the lever 123 back to its initial position.

[0043] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a slide rail is also provided on the inner wall of the housing 110, and the pressure plate 122 is slidably connected to the slide rail.

[0044] The slide rails on the inner wall of the housing 110 are slidably connected to the pressure plate 122, ensuring the linearity and stability of the pressure plate 122 during movement. This allows the pressure applied by the pressure assembly 120 to be accurately transmitted to the bonding assembly 130, avoiding deviations and losses during pressure transmission and improving the accuracy and reliability of the test.

[0045] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the adhesive assembly 130 includes a mounting box 131 detachably mounted in the housing 110 and a buffer block 132 slidably disposed on the mounting box 131. The mounting box 131 has an adhesive interface, and the buffer block 132 is provided with adhesive tape 133 on the side facing the adhesive interface. The back of the buffer block 132 and the adhesive tape 133 are bonded together. The buffer block 132 is slidably mounted on the mounting box 131 for cooperating with the pressure application assembly 120 to resist.

[0046] Specifically, the bonding component 130 employs a detachable mounting box 131 and a sliding buffer block 132, facilitating the replacement of the adhesive tape 133 and improving the maintainability of the device. The buffer block 132 adheres to the back of the adhesive tape 133, providing cushioning during pressure application to prevent excessive pressure on the artifact's surface and protect it from damage. Simultaneously, the buffer block 132 slides on the mounting box 131, facilitating its engagement with the pressure application component 120 and ensuring smooth bonding.

[0047] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the mounting box 131 has an opening on the side away from the adhesive interface, and a groove is provided on the edge of the opening. The side wall of the buffer block 132 is provided with a slider corresponding to the groove, and the buffer block 132 is slidably connected by the slider and the groove.

[0048] Specifically, the groove on the mounting box 131 cooperates with the slider on the buffer block 132, enabling the buffer block 132 to slide smoothly on the mounting box 131. This sliding connection method ensures the stability and accuracy of the buffer block 132 during movement, allowing the adhesive tape 133 to make stable contact with the surface of the artifact, further improving the stability and reliability of the test.

[0049] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the buffer block 132 and the mounting box 131 are connected by a reset component.

[0050] Specifically, the buffer block 132 and the mounting box 131 are connected by a reset component, allowing the buffer block 132 to automatically return to its initial position after testing. This not only improves the ease of operation of the device but also reduces manual intervention and increases testing efficiency. Simultaneously, the presence of the reset component ensures that the initial state is consistent for each test, improving the comparability of test results.

[0051] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An artifact delamination testing device, comprising: The application relates to a pressure applying device, which comprises a shell with an opening on one side, a pressure applying assembly arranged in the shell and a bonding assembly arranged near the opening side, wherein the pressure applying assembly applies preset pressure to the opening side to push the bonding assembly to bond with the surface of a to-be-tested object located at the opening.

2. The artifact peel test device of claim 1, wherein, The pressure applying assembly comprises a compression spring and a pressure applying plate connected to one end of the compression spring, and the other end of the compression spring is connected to the inner wall of the shell, and the pressure applying plate drives the bonding assembly to move towards the opening side.

3. The artifact peel test device of claim 2, wherein, The shell is provided with a plurality of clamping grooves for clamping the pressure applying plate, and the pressure applying plate can be switched between the clamping grooves to make the compression spring accumulate different elastic potential energy.

4. The artifact peel test device of claim 3, wherein, The pressure applying plate is connected with a dial block, which extends out of the shell and is clamped with the clamping grooves.

5. The artifact peel test device of claim 4, wherein, The clamping grooves comprise a first clamping groove, a second clamping groove and a third clamping groove arranged in sequence along the pressure applying direction of the pressure applying assembly, and the dial block is clamped with the first clamping groove, the second clamping groove or the third clamping groove to accumulate elastic potential energy of the compression spring.

6. The artifact peel test device of claim 4, wherein, The dial block is slidably connected with the pressure applying plate to make the dial block slide into or out of the clamping groove.

7. The artifact peel test device of claim 2, wherein, The inner wall of the shell is further provided with a sliding rail, and the pressure applying plate is slidably connected with the sliding rail.

8. The artifact peel test device of claim 1, wherein, The bonding assembly comprises a mounting box detachably mounted in the shell and a buffer block slidably arranged on the mounting box, the mounting box is provided with a bonding port, one side of the buffer block towards the bonding port is provided with an adhesive tape, the buffer block and the adhesive tape are bonded at the back surface, and the buffer block is slidably mounted on the mounting box to abut against the pressure applying assembly.

9. The artifact peel test device of claim 8, wherein, One side of the mounting box away from the bonding port is provided with an opening, the edge of the opening is provided with a sliding groove, the side wall of the buffer block is provided with a sliding block corresponding to the sliding groove, and the buffer block is slidably connected with the sliding groove through the sliding block.

10. The artifact peel test device of claim 9, wherein, The buffer block and the mounting box are connected through a reset member.

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