Novel pressing structure of touchpad

Abstract

The utility model discloses a novel pressing structure of a touch pad, which comprises a printed circuit board (PCB), back glue, a middle plate, a reinforcing iron piece and a supporting iron piece, a space is reserved on the periphery and / or the middle area of the back glue, hot melt glue is arranged in a dispensing mode through a hot pressing process, the thickness of the glue is even 0.1 mm after the back glue is pressed, the middle plate is a plastic middle plate, a balance rod is arranged at the bottom of the middle plate, and the balance rod is connected with the supporting iron piece. Conductive foam is arranged at the bottom of the middle plate, a fixing screw is arranged between the reinforcing iron piece and the supporting iron piece, and the hot melt adhesive can be replaced by AB adhesive. The novel pressing structure of the touchpad is good in strength, stable in flatness, uniform in pressing force, good in structural stability and good in hand feeling of a user.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a novel pressing structure for a touchpad. Background Technology

[0002] With the advancement of technology and the increasing demand from consumers for thinner, lighter, and higher-performance electronic devices, traditional touchpads, with their connection structure designs such as screw connections and single-piece adhesive backing, are no longer sufficient to meet the requirements of modern electronic devices. Traditional touchpads often suffer from uneven pressing pressure and poor tactile feedback. Utility Model Content

[0003] Purpose of the utility model: The present utility model aims to provide a novel pressing structure for a touchpad that increases the uniformity of pressing pressure.

[0004] Technical solution: The present invention provides a novel pressing structure for a touch panel, comprising a PCB board, adhesive backing, a middle plate, reinforcing iron parts, and supporting iron parts. The adhesive backing has reserved space around its perimeter and / or in the middle area, and hot melt adhesive is applied by hot pressing process through dispensing.

[0005] Furthermore, the adhesive thickness after lamination is uniformly 0.1 mm.

[0006] Furthermore, the middle plate is a plastic middle plate.

[0007] Furthermore, a balance bar is provided at the bottom of the middle plate.

[0008] Furthermore, conductive foam is provided at the bottom of the middle plate.

[0009] Furthermore, fixing screws are provided between the reinforcing iron and the supporting iron.

[0010] Furthermore, the hot melt adhesive is replaced with AB glue.

[0011] Beneficial effects: Compared with the prior art, the present invention has the following significant advantages: 1. The hot melt adhesive process has good strength, stable flatness, and relatively uniform pressing pressure; 2. Replacing the back adhesive with hot melt adhesive / AB glue results in better structural stability and a better feel; 3. The hot melt adhesive / AB glue process does not limit the flatness of the structure, and the deformation of the PCB does not affect the height and feel. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0013] Figure 2 This is a cross-sectional view of the adhesive backing structure according to an embodiment of the present utility model;

[0014] Figure 3This is a schematic diagram of the shape of the hot melt adhesive according to an embodiment of the present invention;

[0015] Figure 4 This is a schematic diagram of the hot melt adhesive setting method according to an embodiment of the present invention. Detailed Implementation

[0016] The technical solution of this utility model will be further described below with reference to the accompanying drawings.

[0017] like Figures 1 to 4 As shown, this embodiment provides a novel pressing structure for a touchpad, including a PCB board 1, adhesive backing 7, a middle plate 2, reinforcing iron parts 3, and supporting iron parts 4. The adhesive backing 7 has reserved space in the surrounding and / or middle areas, and hot melt adhesive 5 is applied by hot pressing process through dispensing.

[0018] Furthermore, the adhesive backing 7 has a uniform thickness of 0.1 mm after pressing.

[0019] Furthermore, the middle plate 2 is a plastic middle plate.

[0020] Furthermore, a balance bar 10 is provided at the bottom of the middle plate 2.

[0021] Furthermore, conductive foam 8 is provided at the bottom of the middle plate 2.

[0022] Furthermore, a fixing screw 9 is provided between the reinforcing iron part 3 and the supporting iron part 4.

[0023] Furthermore, the hot melt adhesive 5 is replaced with AB adhesive.

[0024] Table 1 shows a comparison of the effects of the hot melt adhesive setting process in this embodiment. It can be seen that the pressing stroke of this solution is small, the strength is relatively strong, and the feel is relatively good (the higher the percentage, the better the feel).

[0025] Table 1 Comparison of Hot Melt Adhesive Settings

[0026]

Claims

1. A novel pressing structure of a touchpad, comprising a PCB board (1), a back adhesive (7), a middle board (2), a reinforcing iron piece (3), and a supporting iron piece (4), characterized in that, The back adhesive (7) is reserved space at the four corners and / or middle area, and is provided with hot melt adhesive (5) by hot pressing process in the form of dispensing.

2. The touchpad novel press structure according to claim 1, characterized in that, The thickness of the back adhesive (7) after pressing is uniformly 0.1mm.

3. The touchpad novel press structure according to claim 1, characterized in that, The middle plate (2) is a plastic middle plate.

4. The touchpad novel press structure according to claim 1, characterized in that, The bottom of the middle plate (2) is provided with a balance bar (10).

5. The touchpad novel press structure according to claim 1, characterized in that, The bottom of the middle plate (2) is provided with conductive foam (8).

6. The touchpad novel press structure according to claim 1, characterized in that, The reinforcing iron piece (3) and the supporting iron piece (4) are provided with a fixing screw (9).

7. The touchpad novel press structure according to claim 1, characterized in that, The hot melt adhesive (5) is replaced by AB adhesive.

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