Earphone

Abstract

The utility model relates to an earphone, in particular to the technical field of electronic equipment. The first loudspeaker comprises a first vibrating diaphragm, the first vibrating diaphragm is matched with the movement shell to form a first front cavity and a first rear cavity which are located on the two sides of the first vibrating diaphragm, the second loudspeaker comprises a second vibrating diaphragm and a loudspeaker shell, and the second vibrating diaphragm is matched with the loudspeaker shell and the movement shell to form a second front cavity and a second rear cavity which are located on the two sides of the second vibrating diaphragm; the movement shell is provided with a first sound outlet hole used for conducting sound in the first front cavity to the outside of the movement shell and a second sound outlet hole used for conducting sound in the second front cavity to the outside of the movement shell. The second loudspeaker is further provided with a communication hole for communicating the second rear cavity with the outside of the second loudspeaker. According to the invention, the second loudspeaker is provided with the communication hole for communicating the first rear cavity with the outside of the second loudspeaker, so that the sound cracking phenomenon of the second loudspeaker is improved.

Description

[0001] This application is a divisional application of Chinese patent application filed on May 27, 2024, with application number 202421184443.6 and invention title "An Earphone". Technical Field

[0002] This application relates to the technical field of electronic devices, specifically to a pair of headphones. Background Technology

[0003] With the development of acoustic technology, headphones have become widely used in people's daily lives. Headphones can potentially use multiple speakers combined to output sound, in order to provide users with an auditory feast. In headphone use, different speakers may be responsible for outputting sound in different frequency bands, thus requiring improvements in the headphone's acoustic performance. Utility Model Content

[0004] This application provides an earphone, which includes a mechanism module and a hook-shaped structure. The hook-shaped structure is connected to the mechanism module. The mechanism module has a connecting end and a free end. The connecting end is connected to the hook-shaped structure, and the free end is not connected to the hook-shaped structure. The mechanism module includes a mechanism housing, a first speaker, and a second speaker. The mechanism housing is used to accommodate the first speaker and the second speaker. The frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker. The mechanism housing is provided with a first sound outlet and a second sound outlet. The first speaker is configured to output sound through the first sound outlet, and the second speaker is configured to output sound through the second sound outlet. In the wearing state, the mechanism module is located on the front side of the ear, at least part of the hook-shaped structure is located on the back side of the ear, and the free end extends into the concha cavity of the ear. Without blocking the external auditory canal, the mechanism module cooperates with the concha cavity to form an auxiliary cavity. The auxiliary cavity communicates with the external auditory canal, and at least part of the first sound outlet and the second sound outlet are located in the auxiliary cavity.

[0005] In some embodiments, in the wearing state, the free end abuts against the concha cavity.

[0006] In some embodiments, the mechanism module has an inner side surface; in the wearing state, the inner side surface is located on the side of the mechanism module facing the ear; the mechanism housing has a bottom wall corresponding to the inner side surface, and the first sound outlet and the second sound outlet are disposed on the bottom wall; in the wearing state, the portion of the bottom wall corresponding to the inner side surface has a certain distance between it and the concha cavity.

[0007] In some embodiments, the first sound outlet is arranged circumferentially around the second sound outlet and partially located on the side of the second sound outlet near the free end.

[0008] In some embodiments, the first loudspeaker cooperates with the housing to form a first front cavity on the front side of the first diaphragm of the first loudspeaker, the first front cavity is in communication with the first sound outlet, and the second loudspeaker is disposed in the first front cavity.

[0009] In some embodiments, a groove is provided on the inner wall of the housing, the groove being recessed in a direction away from the first speaker and used to accommodate the second speaker.

[0010] In some embodiments, the second loudspeaker includes a second diaphragm and a loudspeaker housing. The second diaphragm, together with the loudspeaker housing and the core housing, forms a second front cavity and a second rear cavity. The second front cavity and the second rear cavity are located on both sides of the second diaphragm. The second front cavity communicates with the second sound outlet. The first front cavity and the second front cavity are isolated from each other.

[0011] In some embodiments, the second speaker is further provided with a communication hole that connects the second rear cavity and the first front cavity.

[0012] In some embodiments, the second speaker is further provided with a second magnetic circuit system, the connecting hole penetrating the second magnetic circuit system, and the diameter of the connecting hole is 0.8mm-1.2mm.

[0013] In some embodiments, on a reference plane perpendicular to the axial direction of the first speaker, the orthographic projection of the second speaker at least partially overlaps with the orthographic projection of the first speaker, and the axial direction of the second speaker points towards the first speaker.

[0014] In this application, the auxiliary cavity is designed to concentrate sound waves, allowing more sound waves to propagate into the external auditory canal, thereby increasing the volume and sound quality of the sound heard by the user in the near field, which is beneficial to improving the acoustic performance of the headphones. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 These are schematic diagrams of the headphone structure in some embodiments of this application;

[0017] Figure 2 yes Figure 1 A structural schematic diagram of the earphone from another perspective;

[0018] Figure 3 yes Figure 1 A structural diagram of the headphone from another perspective;

[0019] Figure 4 This is a schematic diagram of the front outline of the ear of a user or simulator in some embodiments;

[0020] Figure 5 yes Figure 1 A schematic diagram of the earphone in a wearing state in some embodiments;

[0021] Figure 6 yes Figure 1 A cross-sectional view of the middle earphone along line VI-VI in some embodiments;

[0022] Figure 7 yes Figure 1 A cross-sectional view of the middle earphone along line VII-VII in some embodiments;

[0023] Figure 8 yes Figure 6 A schematic diagram of the structure of the first housing in some embodiments;

[0024] Figure 9 This is a circuit diagram of a speaker assembly in some embodiments of this application;

[0025] Figure 10 This is a schematic diagram showing the crossover effect of the second speaker 122 under different crossover processing conditions when adjusting the high-pass crossover 1304 in some embodiments of this application.

[0026] Figure 11 for Figure 7 A schematic diagram of the structure of the second loudspeaker in some other embodiments;

[0027] Figure 12 for Figure 11 A partial structural diagram of the central mechanism module in some other embodiments. Detailed Implementation

[0028] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0029] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0030] This application describes an earphone. Please refer to... Figure 1 , Figure 2 and Figure 3 , Figure 1 These are schematic diagrams of the headphone structure in some embodiments of this application. Figure 2 yes Figure 1 A structural diagram of the headphones from another perspective. Figure 3 yes Figure 1 A schematic diagram of the headphone structure from another perspective. The headphone 100 may include a mechanism module 10 and a hook-shaped structure 20 connected to the mechanism module 10. The mechanism module 10 provides sound to achieve an auditory experience, and may also provide different experiences by having other functions such as sound pickup, touch control, pressing, and lighting. The mechanism module 10 can be used with the hook-shaped structure 20 to achieve wearing.

[0031] Please see Figure 4 , Figure 4 This is a schematic diagram of the anterior contour of the ear of a user or simulator in some embodiments. The ear 200 may include physiological parts such as the external auditory canal 2001, the concha 2002, the cymba conchae 2003, the triangular fossa 2004, the antihelix 2005, the scaphoid fossa 2006, the helix 2007, and the antitragus 2008. The external auditory canal 2001 has a certain depth and can extend to the tympanic membrane; however, for ease of description, unless otherwise specified, the external auditory canal 2001 may refer to the ear opening of the ear 200. Additionally, the physiological parts such as the concha 2002, the cymba conchae 2003, and the triangular fossa 2004 may also have a certain volume and depth. The concha 2002 may be directly connected to the external auditory canal 2001; that is, the ear opening can be considered to be located at the bottom of the concha 2002.

[0032] Understandably, individual differences may exist between users, leading to variations in the shape, size, and other dimensions of the earpiece 200. To facilitate description and reduce (or even eliminate) these individual differences, a simulator containing the head and its earpiece (generally a left and right earpiece; here, we'll use one earpiece as an example) 200 can be created based on standards such as ANS: S3.36, S3.25, and IEC: 60318-7. Examples include GRAS 45BC KEMAR, HEADAcoustics, B&K 4128 series, or B&K 5128 series, etc., to simulate the scenario of most users wearing the headphones 100. Using GRAS KEMAR as an example, the earpiece 200 simulator can be any of the GRAS 45AC, GRAS 45BC, GRAS45CC, or GRAS 43AG. Taking HEAD Acoustics as an example, the ear 200 simulator can be any one of HMS II.3, HMS II.3LN, or HMS II.3LN HEC.

[0033] It should be noted that in fields such as medicine and anatomy, three basic planes—the sagittal plane, the coronal plane, and the horizontal plane—and three basic axes—the sagittal axis, the coronal axis, and the vertical axis—can be defined for the human body or human simulator. The sagittal plane is a plane perpendicular to the ground along the anteroposterior direction of the body, dividing the human body or human simulator into left and right parts. The coronal plane is a plane perpendicular to the ground along the left and right direction of the body, dividing the human body or human simulator into anterior and posterior parts. The horizontal plane is a plane parallel to the ground along the vertical direction of the body, dividing the human body or human simulator into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left and right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear away from the head, while the latter refers to the side of the ear facing the head. Both refer to the ear 200 of the user or simulator. Specifically, when viewing the ear 200 of the human body or human simulator along the coronal axis, it can be as follows... Figure 4 As shown.

[0034] Please see Figure 5 , Figure 5 yes Figure 1A schematic diagram of the earphone 100 in a wearing state in some embodiments. The mechanism module 10 is located on the front side of the ear 200 in the wearing state. At least part of the hook structure 20 is located on the rear side of the ear 200 in the wearing state, so that the earphone 100 is hung on the ear 200 in the wearing state.

[0035] In this application, descriptions of the process or action of wearing headphones 100, such as "wearing headphones 100," "headphones 100 being worn," and "in the wearing state," all refer to headphones 100 being worn on the ear 200. Of course, due to individual differences among users, the way headphones 100 are worn by different users may differ from how they are worn on the ear 200 of a simulator; however, such differences should be tolerable.

[0036] The mechanism module 10 can be configured not to block the outer ear canal 2001 when worn, thus making the earphone 100 an "open-back earphone". Understandably, the earphone 100 may partially cover the outer ear canal 2001 in different wearing states, but the outer ear canal 2001 is still not blocked.

[0037] Please see Figure 1 , Figure 2 and Figure 3 The mechanism module 10 may have a connecting end CE connected to the hook-shaped structure 20 and a free end FE not connected to the hook-shaped structure 20. In the wearing state, the free end FE of the mechanism module 10 may extend into the concha 2002, or may only cover at least a portion of the concha 2002. The mechanism module 10 and the hook-shaped structure 20 may be configured to clamp the ear 200 from both the front and rear sides of the ear 200 region corresponding to the concha 2002, thereby increasing the resistance to the earphone 100 falling off the ear 200 and improving the stability of the earphone 100 in the wearing state.

[0038] The movement module 10 may have a thickness direction X and a length direction Y and a width direction Z that are perpendicular to and orthogonal to each other. In some embodiments, the length direction Y may be defined as the direction in which the movement module 10 approaches or moves away from the back of the head when worn, the width direction Z may be defined as the direction in which the movement module 10 approaches or moves away from the top of the head when worn, and the thickness direction X may be defined as the direction in which the movement module 10 faces or moves away from the user's ear when worn. In some embodiments, the length direction Y may be defined as the direction from the connecting end of the movement module 10 to the free end of the movement module 10, and the thickness direction X may be defined as the direction in which the movement module 10 faces or moves away from the user's ear when worn. In some embodiments, the free end FE is pressed against the concha 2002 in the thickness direction X. For example, the free end FE abuts against the concha 2002 in both the length direction Y and the width direction Z.

[0039] It should be noted that, when worn, the free end FE of the movement module 10 can not only extend into the concha cavity 2002, but also be projected onto the antihelix 2005, or be projected onto the left and right sides of the head and located on the front side of the ear 200 on the sagittal axis.

[0040] Of course, in other scenarios, at least part of the movement module 10 can also be orthogonally projected onto the antihelix 2005, or onto the left and right sides of the head and located on the front side of the ear 200 on the sagittal axis.

[0041] In other words, the hook-shaped structure 20 can support the movement module 10 to be worn in the concha 2002, antihelix 2005, and the front of the ear 200.

[0042] Please see Figure 1 , Figure 2 and Figure 5 When worn and viewed along the coronal axis, the movement module 10 can be shaped like a circle, an ellipse, a rounded square, or a rounded rectangle. Therefore, for ease of description, this embodiment uses a rounded rectangle as an example. In some embodiments, the length of the movement module 10 in the longitudinal direction Y can be greater than its width in the width direction Z.

[0043] The mechanism module 10 may have an inner surface IS facing the ear 200 along the thickness direction X when worn, an outer surface OS facing away from the ear 200, and connecting surfaces (e.g., a lower surface LS, an upper surface US, and a rear surface RS) connecting the inner surface IS and the outer surface OS. Specifically, when the mechanism module 10 is worn, the upper surface US connects the inner surface IS and the outer surface OS, the lower surface LS connects the inner surface IS and the outer surface OS, the upper surface US is closer to the top of the user's head along the width direction Z, the lower surface LS is further away from the top of the user's head along the width direction Z, and the rear surface RS connects the upper surface US and the lower surface LS, and may also connect the inner surface IS and the outer surface OS. The thickness direction X can also be defined as the direction in which the mechanism module 10 approaches or moves away from the ear 200 when worn. At least part of the connecting surface, such as the rear surface RS, is located within the concha 2002 when worn and forms a first contact area with the front of the ear 200 region. That is, the rear surface RS may be located at one end facing the back of the head along the length direction Y when worn, and is at least partially located within the concha 2002. In some embodiments, the hook structure 20 forms a second contact area with the rear side of the ear 200 region during the wearing state. The second contact area and the first contact area at least partially overlap in the ear thickness direction of the ear 200 region. Furthermore, the mechanism module 10 and the hook structure 20 can jointly clamp the ear 200 from both the front and rear sides, and the clamping force formed is mainly compressive stress, which is beneficial to improving the stability and comfort of the earphone 100 during the wearing state. In some embodiments, when the mechanism module 10 is configured in a circular, elliptical, or other shape, the connecting surface may also refer to the arcuate side surface of the mechanism module 10.

[0044] It should be noted that the terms "first," "second," "third," etc., used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined by terms such as "first," "second," "third," etc., may explicitly or implicitly include at least one of those features. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] It is understood that the movement module 10 can also be worn directly or through other means, and can even be connected and cooperated with other structures in conjunction with the hook structure 20 to achieve wearing. Therefore, the functionality of the movement module 10 is not limited to the embodiments listed in this application. In some embodiments, the hook structure 20 can be omitted or replaced with other structures.

[0046] Furthermore, when the wearing method of the mechanism module 10 changes, the way the mechanism module 10 cooperates with the ear 200 may also change. However, in some embodiments, this does not necessarily lead to changes in the internal structure, overall construction, or external structure of the mechanism module 10. Even in some embodiments, terms related to location, such as lower side (LS), upper side (US), and rear side (RS), may not necessarily correspond to the ear 200. Of course, in some embodiments, terms such as connection end (CE) may simply be terms related to location and do not necessarily imply that they include a specific function.

[0047] Furthermore, when the wearing method of the movement module 10 changes, the movement module 10 can be worn without cooperating with the hook structure 20 or other structures at the connection end CE.

[0048] Please see Figure 6 and Figure 7 , Figure 6 yes Figure 1 A cross-sectional view of the headphone 100 along line VI-VI in some embodiments. Figure 7 yes Figure 1 The middle earphone 100 is shown in a cross-sectional view along line VII-VII in some embodiments. The core module 10 includes a core housing 11, a speaker assembly 12, and a main control circuit board 13. The core housing 11 can be connected to the hook structure 20. The core housing 11 may have a mounting space 101 for mounting the speaker assembly 12 and the main control circuit board 13, and other electronic components may also be mounted, which will not be described in detail here. The speaker assembly 12 and the main control circuit board 13 may be disposed within the core housing 11, for example, the mounting space 101. The main control circuit board 13 can be electrically connected to the speaker assembly 12 for controlling the operation of the speaker assembly 12. It is understood that the core housing 11 serves as the outer housing of the core module 10, and thus the aforementioned inner surface IS, outer surface OS, and connecting surfaces (e.g., lower surface LS, upper surface US, and rear surface RS, etc.) of the core module 10 are all formed on the core housing 11, serving as the outer surface of the core housing 11. The aforementioned length direction Y can be defined as the direction in which the movement housing 11 approaches or moves away from the back of the head when worn; the width direction Z can be defined as the direction in which the movement housing 11 approaches or moves away from the top of the head when worn; and the thickness direction X can be defined as the direction in which the movement housing 11 faces or moves away from the user's ear when worn. In some embodiments, the length direction Y can be defined as the direction from the connecting end of the movement housing 11 to the free end of the movement module 10, and the thickness direction X can be defined as the direction in which the movement housing 11 faces or moves away from the user's ear when worn.

[0049] The movement housing 11 may include a first housing 111 and a second housing 112 that are snapped together along the thickness direction X to form a mounting space 101. In the wearing state, the first housing 111 is closer to the ear 200 than the second housing 112. A parting surface 102 is provided between the first housing 111 and the second housing 112 to simplify the structure of the movement housing 11 and reduce manufacturing costs. Of course, the movement housing 11 may also have other structural forms and is not limited to the embodiments listed in this application.

[0050] In some embodiments, the housing 11 may be provided with a first sound outlet 1101 and a second sound outlet 1102 communicating with the mounting space 101. The first sound outlet 1101 and the second sound outlet 1102 may respectively cooperate with the speaker assembly 12, so that the sound waves generated by the speaker assembly 12 can propagate through the first sound outlet 1101 and the second sound outlet 1102 respectively. The first sound outlet 1101 and the second sound outlet 1102 may not be connected. Providing two sound outlets can improve the listening experience of the speaker assembly 12 and avoid sound wave interference between multiple speakers.

[0051] Please see Figure 8 , Figure 8 yes Figure 6 The diagram shows the structure of the first housing 111 in some embodiments. In some embodiments, the first sound outlet 1101 and / or the second sound outlet 1102 can be disposed on the first housing 111. For example, the first sound outlet 1101 and the second sound outlet 1102 can both be disposed on the bottom wall 1111 of the first housing 111. In some embodiments, the bottom wall 1111 can be disposed corresponding to the inner surface IS of the mechanism module 10. When the mechanism module 10 is inserted into the concha 2002, since the concha 2002 has a certain volume and depth, after the free end FE is inserted into the concha 2002, the portion of the inner surface IS corresponding to the bottom wall 1111 of the mechanism housing 11 can have a certain distance from the concha 2002. Furthermore, in the wearing state, the mechanism housing 11 and the concha 2002 can cooperate to form an auxiliary cavity communicating with the external auditory canal 2001, and the first sound outlet 1101 and the second sound outlet 1102 will be at least partially located in the auxiliary cavity. Furthermore, when worn, the sound waves generated by the speaker assembly 12 and propagated through the first sound outlet 1101 and the second sound outlet 1102 are restricted by the auxiliary cavity. That is, the auxiliary cavity can concentrate the sound waves, allowing more sound waves to propagate into the external auditory canal 2001, thereby improving the volume and sound quality of the sound heard by the user in the near field, which is beneficial to improving the acoustic effect of the headphones 100.

[0052] In some embodiments, the first sound outlet 1101 and the second sound outlet 1102 are both closer to the free end FE than to the connecting end CE, so that the first sound outlet 1101 and the second sound outlet 1102 are closer to the external auditory canal 2001 when worn. In some embodiments, since the mechanism module 10 can be configured not to block the external auditory canal 2001 when worn, the auxiliary cavity can be semi-open.

[0053] In some implementations, the first housing 111 includes a first sidewall 1112 extending from the edge of the bottom wall 1111 toward the side near the second housing 112. The first sound outlet 1101 and / or the second sound outlet 1102 may not be provided on the bottom wall 1111, but may be provided on the side of the first sidewall 1112 corresponding to the lower side surface LS, or may be provided at the corner between the first sidewall 1112 and the bottom wall 1111, or even on other parts of the movement housing 11, such as the inner side surface IS, the lower side surface LS, or the corner between the inner side surface IS and the lower side surface LS.

[0054] Please see Figure 7 and Figure 8 The first housing 111 can be made of plastic, or it can be a structure composed of or composite of multiple materials, or of course, it can be a housing structure made of other materials. In some embodiments, a pressure relief hole 1103 and / or a tuning hole 1104 can be provided on the first sidewall 1112, that is, a pressure relief hole 1103 and / or a tuning hole 1104 can be provided on the upper side US or the lower side LS corresponding to the movement housing 11. Further, a sound-absorbing mesh and / or a protective steel mesh can be provided at the pressure relief hole 1103 and / or the tuning hole 1104.

[0055] It is understood that acoustic holes such as the pressure relief hole 1103 and the tuning hole 1104 can be adjusted according to the needs of those skilled in the art and are disposed on the housing 11, such as the first housing 111. For example, the pressure relief hole 1103 and the tuning hole 1104 can be disposed on the first housing 111 at a position that mates with the speaker assembly 12, and are not limited to the positions listed herein. For example, the pressure relief hole 1103 and the tuning hole 1104 can be disposed on the first sidewall 1112 at a position that mates with the speaker assembly 12, and are not limited to the positions listed herein. For example, the pressure relief hole 1103 and the tuning hole 1104 can be disposed on opposite sides of the first sidewall 1112 along the width direction Z.

[0056] Furthermore, since the first sound outlet 1101, the pressure relief hole 1103, and the tuning hole 1104 can all be located on the first housing 111, the structure of the first housing 111 is simplified, which helps to reduce processing costs. In addition, since the pressure relief hole 1103 and the tuning hole 1104 are respectively located on opposite sides of the first sidewall 1112 along the width direction Z, the parting surface 102 can be symmetrically arranged about a reference surface perpendicular to the width direction Z, which helps to improve the appearance quality of the movement module 10.

[0057] Furthermore, the acoustic apertures are not limited to the pressure relief aperture 1103 and the tuning aperture 1104, but may also include other acoustic apertures that mate with the speaker assembly 12. In some embodiments, at least one of the pressure relief aperture 1103 and the tuning aperture 1104 may be omitted.

[0058] Please see Figure 6 The second housing 112 can be a plastic part, or a structure composed of or composite of multiple materials, or a housing structure made of other materials. The parting surface 102 between the second housing 112 and the first housing 111, for example, the first sidewall 1112, extends or bends towards the side where the first housing 111 is located in a direction near the free end FE. The second housing 112 may include a top wall 1121 disposed opposite to the first housing 111, for example, the bottom wall 1111, and a second sidewall 1122 connected to the top wall 1121 and engaging with the first housing 111, for example, the first sidewall 1112.

[0059] Understandably, due to the configuration of the second sidewall 1122, the free end FE is tapered in the direction away from the connecting end CE, which makes it easier to fit the user's ear contour and improve the wearing experience.

[0060] Please see Figure 6 and Figure 7The speaker assembly 12 generates sound waves upon being powered on, and these waves propagate through a first sound outlet 1101 and / or a second sound outlet 1102 to be transmitted into the external auditory canal 2001. The speaker assembly 12 can be coupled to a main control circuit board 13 to allow operation under its control. The speaker assembly 12 may include a first speaker 121 and a second speaker 122 disposed within the housing 11, for example, the mounting space 101. The first speaker 121 and the second speaker 122 can be coupled to the main control circuit board 13 respectively to allow operation under its control. The sound waves generated by the first speaker 121 propagate through the first sound outlet 1101. The sound waves generated by the second speaker 122 propagate through the second sound outlet 1102. In some embodiments, the sound waves generated by the first speaker 121 may also propagate out through acoustic holes such as the pressure relief hole 1103 and the tuning hole 1104. Of course, it is also possible for only one of the pressure relief hole 1103 or the tuning hole 1104 to cooperate with the first speaker 121.

[0061] Please see Figure 6 and Figure 7 The first speaker 121 can be fixed inside the housing 11, and the axial direction of the first speaker 121 can be arranged along the thickness direction X. In some embodiments, the first speaker 121 can be fixed on the first housing 111, for example, the bottom wall 1111, or it can be fixed on the first side wall 1112 or other parts of the housing 11.

[0062] In some embodiments, the first speaker 121 is arranged in a strip-shaped structure to match the housing 11, such as the mounting space 101. That is, the first speaker 121 can be extended in the direction from the connecting end CE to the free end FE, so as to facilitate the placement of a sufficiently large first speaker 121 in the housing 11, such as the mounting space 101, thereby enhancing the sound volume generated by the headphones 100, optimizing the arrangement, and improving space utilization.

[0063] Please see Figure 7 The first loudspeaker 121 may include a first diaphragm 1211 for vibrating to produce sound, and may also include a first magnetic circuit system for driving the first diaphragm 1211 to vibrate and produce sound, and a support member for carrying the first diaphragm 1211 and the first magnetic circuit system. Within the scope of understanding of those skilled in the art, the technical principle of the first magnetic circuit system driving the first diaphragm 1211 to vibrate and produce sound will not be described in detail.

[0064] The first loudspeaker 121 is fitted within the housing 11 (e.g., within the mounting space 101) and forms a first front cavity 1201 on the front side of the first diaphragm 1211 and a first rear cavity 1202 on the rear side of the first diaphragm 1211. The front side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 facing away from the first magnetic circuit system, and the rear side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 facing the first magnetic circuit system. In some embodiments, the first front cavity 1201 is located on the side of the first loudspeaker 121 facing the inner surface IS of the housing 11, for example, the side facing the bottom wall 1111 of the first housing 111, and the first rear cavity 1202 is located on the side of the first loudspeaker 121 facing away from the inner surface IS, for example, the side facing away from the bottom wall 1111 of the first housing 111. In some embodiments, the first front cavity 1201 may be connected to the first sound outlet 1101, so that the sound waves generated by the first speaker 121 can propagate through the first sound outlet 1101.

[0065] Please see Figure 9 , Figure 9 This is a circuit diagram of the speaker assembly 12 in some embodiments of this application. The speaker assembly 12 may have a first terminal 1301 and a second terminal 1302 that are electrically connected to the main control circuit board 13. The first speaker 121 may be connected in series between the first terminal 1301 and the second terminal 1302, and thus can emit sound under the control of the main control circuit board 13. In some embodiments, the speaker assembly 12 may further include a low-pass crossover 1303 connected in series between the first terminal 1301 and the second terminal 1302 of the first speaker 121, so as to achieve low-pass filtering through the low-pass crossover 1303, so that the first speaker 121 only receives lower frequency electrical signals (the low-pass crossover 1303 divides the audio drive signal to generate the electrical signal input to the first speaker 121; of course, when the low-pass crossover 1303 does not divide the audio drive signal, the audio drive signal is the electrical signal input to the first speaker 121), thereby the first speaker 121 outputs more lower frequency sound. In some embodiments, the audio drive signal is provided by the main control circuit board 13, and the low-pass crossover 1303 can perform first-order frequency division on the audio drive signal provided by the main control circuit board 13 to the first speaker 121 to reduce circuit complexity. In some embodiments, the low-pass crossover 1303 may include a frequency division inductor L. The number of frequency division inductors L may be at least one, in which case the low-pass crossover 1303 can perform frequency division on the audio drive signal provided by the main control circuit board 13 to the first speaker 121.

[0066] In this application, the low-pass divider 1303 can be a first-order divider or a multi-order divider. In some embodiments of this application, the low-pass divider 1303 is a first-order divider, that is, the low-pass divider 1303 includes a dividing inductor L. This makes the design of the low-pass divider 1303 simpler and less costly. Furthermore, when selecting the number of dividing inductors L, since the number of first-order dividing inductors L is less, the space occupied on the chassis housing 11, such as the mounting space 101, is reduced, making the chassis module 10 smaller. When cooperating with the main control circuit board 13, the requirements for the main control circuit board 13 can be reduced, making the main control circuit board 13 smaller.

[0067] In some embodiments, the audio drive signal provided by the main control circuit board 13 can be directly transmitted to the first speaker 121. That is, the audio drive signal can be directly input to the first speaker 121 without frequency division processing. In some embodiments, the frequency range of the audio drive signal can be the same as the operating frequency range of the first speaker 121.

[0068] In some embodiments, the main control circuit board 13 includes a drive circuit 132, which is connected to the first speaker 121 and the second speaker 122 to drive the first speaker 121 and the second speaker 122 to operate. In some embodiments, the drive circuit 132 may include a digital-to-analog converter circuit 1321, which is connected to the first speaker 121 and the second speaker 122. This single digital-to-analog converter circuit 1321 enables simultaneous driving of the first speaker 121 and the second speaker 122. That is, the drive circuit 132 can simultaneously input the same audio drive signal to both the first speaker 121 and the second speaker 122 to drive them to operate.

[0069] The second speaker 122 is disposed within the mounting space 101 of the housing 11. Please refer to [link / reference]. Figure 6 and Figure 7 The second speaker 122 can be fixed to the first housing 111, such as the bottom wall 1111, in which case the axial direction of the second speaker 122 can be along the thickness direction X. In some embodiments, the second speaker 122 can be located inside the first front cavity 1201 of the first speaker 121, in which case the axial direction of the first speaker 121 and the axial direction of the second speaker 122 are parallel. In other embodiments, the second speaker 122 can also be fixed to the first side wall 1112 or other parts of the housing 11, and the axial direction of the second speaker 122 can also be intersected with the thickness direction X.

[0070] In some embodiments, the second speaker 122 can be embedded in the inner wall of the housing 11. For example, a groove can be formed on the inner wall of the housing 11 to accommodate the second speaker 122, thereby achieving the embedded configuration of the second speaker 122. Please refer to [link to relevant documentation]. Figure 7 The recess for accommodating the second speaker 122 can be formed on the bottom wall 1111 of the first housing 111. In this case, when worn, the second speaker 122 is located on the inner wall of the corresponding inner side IS of the aforementioned mechanism module 10, and the second speaker 122 is closer to the user's ear. Alternatively, the recess for accommodating the second speaker 122 can be formed on the lower side or the inner wall of each connecting surface of the aforementioned mechanism module 10 to adapt to different wearing scenarios and bring a better listening experience to the user.

[0071] Please see Figure 7 The second loudspeaker 122 may include a second diaphragm 1221 for vibrating to produce sound, a second magnetic circuit system 1222 for driving the second diaphragm 1221 to produce sound, and a loudspeaker housing 1223 for supporting and mounting the second diaphragm 1221 and the second magnetic circuit system 1222. To the extent understood by those skilled in the art, the technical principle of the second magnetic circuit system 1222 driving the second diaphragm 1221 to vibrate and produce sound will not be described in detail.

[0072] The second speaker 122 is located within the housing 11 (e.g., mounting space 101) and mates with the housing 11. The front side of the second diaphragm 1221 of the second speaker 122 mates with the housing 11 to form a second front cavity 1203, and the rear side of the second diaphragm 1221 mates with the speaker housing 1223 to form a second rear cavity 1204. The front side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing away from the second magnetic circuit system 1222, and the rear side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing the second magnetic circuit system 1222. When the second speaker 122 is located on the inner wall of the corresponding inner side IS of the housing module 10, the second front cavity 1203 is located on the side of the second speaker 122 facing the inner side IS, and the second rear cavity 1204 is located on the side of the second speaker 122 facing away from the inner side IS.

[0073] The second front cavity 1203 can communicate with the second sound outlet 1102, allowing sound waves generated by the second speaker 122 to propagate through the second sound outlet 1102. In some embodiments, the housing 11 may include a structure such as an isolation plate disposed between the second speaker 122 and the first speaker 121 to isolate the cavity coupled to the first speaker 121 and the cavity coupled to the second speaker 122, such that the first sound outlet 1101 communicates only with the first front cavity 1201, and the second sound outlet 1102 communicates only with the second front cavity 1203. In some embodiments, the second speaker 122 may be farther from the connection end CE than from the free end FE, in order to cooperate with the second sound outlet 1102.

[0074] In some embodiments, the speaker housing 1223 is a housing structure distinct from the mechanism housing 11, allowing for flexible mounting of the second speaker 122 on the mechanism module 10. In some embodiments, the speaker housing 1223 includes a support member carrying the second diaphragm 1221 and the second magnetic circuit system 1222, and a cover connecting to the mechanism housing 11 to fix the second speaker 122. The cover has a sound passage hole communicating with the second sound outlet hole 1102. In some embodiments, the speaker housing 1223 only includes the support member carrying the second diaphragm 1221 and the second magnetic circuit system 1222, and is connected to the mechanism housing 11 via the support member to fix the second speaker 122.

[0075] The frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122. In some embodiments, the frequency range of the sound output by the first speaker 121 may be entirely smaller than the frequency range of the sound output by the second speaker 122. In other embodiments, the frequency ranges of the sound output by the first speaker 121 and the second speaker 122 partially overlap, and the maximum frequency of the sound output by the first speaker is lower than the maximum frequency of the sound output by the second speaker, such that the frequency band of the sound output by the second speaker 122 may be partially larger than the frequency band of the sound output by the first speaker 121.

[0076] In some embodiments, the frequency range of the sound output by the first speaker 121 may include 20Hz-5kHz, and the frequency range of the sound output by the second speaker 122 may include 5kHz-20kHz. In some embodiments, the frequency range of the sound output by the first speaker 121 and the frequency range of the sound output by the second speaker 122 may have different standards based on actual conditions. For example, the frequency range of the sound output by the first speaker 121 may also refer to a frequency range not higher than 1kHz, such as 1Hz-1kHz, 100Hz-800Hz, etc.

[0077] In some embodiments, the frequency range of the sound output by the first speaker 121 may be a low-frequency band or a mid-low-frequency band, and the frequency range of the sound output by the second speaker 122 may be a high-frequency band or a mid-high-frequency band. Furthermore, the first speaker 121 may be referred to as a low-frequency speaker, and the second speaker 122 may be referred to as a high-frequency speaker. The low-frequency band may be at least a portion of a frequency band generally from 20Hz to 500Hz, or at least a portion of a frequency band generally from 20Hz to 3kHz; the high-frequency band may be at least a portion of a frequency band generally from 5kHz to 20kHz, or at least a portion of a frequency band from 6kHz to 16kHz. The mid-frequency band may lie between the low-frequency band and the high-frequency band, and may also partially overlap with the low-frequency and / or high-frequency portions. Furthermore, the mid-low-frequency band may be a combination of the low-frequency band and the mid-frequency band, and the mid-high-frequency band may be a combination of the mid-frequency band and the high-frequency band.

[0078] It is understandable that the frequency band distinctions mentioned above are merely examples to provide a general range. The definitions of these frequency bands can vary depending on different industries, application scenarios, and classification standards. For instance, in some application scenarios, the low-frequency band refers to the band roughly between 20Hz and 80Hz, the mid-low-frequency band can refer to the band roughly between 80Hz and 160Hz, the mid-frequency band can refer to the band roughly between 160Hz and 1280Hz, the mid-high-frequency band can refer to the band roughly between 1280Hz and 2560Hz, and the high-frequency band can refer to the band roughly between 2560Hz and 120kHz.

[0079] In some embodiments, the main control circuit board 13 can provide the same audio drive signal to the first speaker 121 and the second speaker 122. In other words, the frequencies of the electrical signals received by the first speaker 121 and the second speaker 122 can be the same. In this case, the second diaphragm 1221 of the second speaker 122 can vibrate under an electrical signal with a frequency band not higher than 200Hz. If the first speaker 121 is the aforementioned low-frequency speaker and the second speaker 122 is the aforementioned high-frequency speaker, the frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122. That is, the sound output effect of the first speaker 121 at lower frequencies is better, and the sound output effect of the second speaker 122 at higher frequencies is better.

[0080] In some embodiments, on a reference plane perpendicular to the axial direction of the first speaker 121, the orthographic projection of the second speaker 122 on the reference plane at least partially overlaps with the orthographic projection of the first speaker 121 on the reference plane. In some embodiments, on a reference plane perpendicular to the axial direction of the first speaker 121, the orthographic projection of the second speaker 122 on the reference plane completely overlaps with the orthographic projection of the first speaker 121 on the reference plane, optimizing the arrangement and improving space utilization. In some embodiments, the axial direction of the first speaker 121 may be the vibration direction of the first diaphragm 1211. In some embodiments, the axial direction of the second speaker 122 may point towards the first speaker 121. In some embodiments, the axial direction of the second speaker 122 may be parallel to the axial direction of the first speaker 121, that is, the angle between the axial direction of the second speaker 122 and the axial direction of the first speaker 121 may be 0°.

[0081] It is understood that the positional relationship and cooperation between the second speaker 122 and the first speaker 121, as well as their respective positional relationship and cooperation with the housing 11, can be adjusted and changed, and are not limited to the embodiments listed herein.

[0082] Please see Figure 7The main control circuit board 13 can provide audio drive signals to the second speaker 122, so that the second diaphragm 1221 of the second speaker 122 can vibrate under electrical signals in a frequency band not higher than 200Hz. When the second speaker 122 is the aforementioned high-frequency speaker, the sound output effect of the second speaker 122 is better in the higher frequency band, but performs poorly in the lower frequency band, which will cause the second diaphragm 1221 of the second speaker 122 to vibrate under electrical signals in a frequency band not higher than 200Hz, resulting in distortion.

[0083] Please see Figure 9 The second speaker 122 can be connected in series between the first terminal 1301 and the second terminal 1302, and can then emit sound under the control of the main control circuit board 13. In some embodiments, the speaker assembly 12 may further include a high-pass crossover 1304 connected in series with the second speaker 122 between the first terminal 1301 and the second terminal 1302 to achieve high-pass filtering. In some embodiments, the first terminal 1301 and the second terminal 1302 cooperate to receive the audio drive signal from the main control circuit board 13, and the high-pass crossover 1304 can divide the audio drive signal to generate an electrical signal received by the second speaker 122. This allows the electrical signal received by the second speaker 122 to be attenuated in the frequency band below the crossover point, and attenuates the sound pressure level of the sound output by the second speaker 122 in the low-frequency band, thereby improving the distortion phenomenon that exists in the low-frequency band (e.g., below 200Hz, e.g., 50-100Hz) of the sound output by the second speaker 122.

[0084] In some embodiments, the crossover point of the high-pass crossover 1304 for dividing the audio drive signal can be no lower than 6kHz, so that the sound pressure level of the second speaker 122 output sound can be attenuated at least below 6kHz, and the second speaker 122 can obtain good acoustic output performance in the frequency band above 6kHz. In some embodiments, the crossover point of the high-pass crossover 1304 for dividing the audio drive signal can be no lower than 8kHz. In some embodiments, the crossover point can be 8kHz. Since the sound output performance of the first speaker 121 is poor in the higher frequency band, the second speaker 122 can compensate for the sound pressure level in the frequency band above 8kHz. In some embodiments, the crossover point of the high-pass crossover 1304 for dividing the audio drive signal can be no higher than 9kHz, to avoid affecting the sound output of the second speaker 122 in the higher frequency band, thereby ensuring the sound output capability of the headphones across the entire frequency band.

[0085] In some embodiments, the crossover point is set such that the sound pressure level of the second speaker 122 output sound in the low-frequency range (e.g., below 200Hz, e.g., 50-100Hz) is attenuated by no less than 20dB, thereby mitigating the distortion phenomenon that occurs in the lower frequency range of the second speaker 122 output sound. In some embodiments, the crossover point is set such that the sound pressure level of the second speaker 122 output sound in the low-frequency range (e.g., below 200Hz, e.g., 50-100Hz) is attenuated by no less than 30dB, thereby mitigating the distortion phenomenon that occurs in the lower frequency range of the second speaker 122 output sound.

[0086] In some embodiments, the crossover point can be set near the resonant frequency of the second speaker 122, which can attenuate the electrical signals received by the second speaker 122 below the crossover point, thereby improving the distortion phenomenon of the output of the second speaker 122 in the low-frequency range (e.g., below 200Hz). In some embodiments, the ratio of the resonant frequency of the second speaker 122 to the crossover point is between 0.75 and 1.25. In some embodiments, the ratio of the resonant frequency of the second speaker 122 to the crossover point is between 0.9 and 1.1.

[0087] In some embodiments, the resonant frequency of the second speaker 122 may be not lower than 6kHz, and the second diaphragm 1221 may vibrate under an electrical signal in the frequency band of at least 1kHz-20kHz. In some embodiments, the resonant frequency of the second speaker 122 may be between 6kHz and 9kHz.

[0088] In some embodiments, the aforementioned high-pass crossover 1304 can be used to perform first-order frequency division processing on the audio drive signal of the main control circuit board 13 to reduce circuit complexity and improve the distortion phenomenon in the low-frequency range of the second speaker 122. In this case, the high-pass crossover 1304 may include a dividing capacitor C, and the number of dividing capacitor C is one. This configuration reduces the occupation of the chassis housing 11, such as the mounting space 101, making the chassis module 10 smaller. When used with the main control circuit board 13, it reduces the requirements on the main control circuit board 13, making the main control circuit board 13 smaller. It is understood that in other embodiments of this application, the high-pass crossover 1304 can also be a multi-order crossover, which can be used to perform multi-order frequency division processing on the audio drive signal of the main control circuit board 13 to achieve better low-frequency filtering and further improve the distortion phenomenon in the low-frequency range of the second speaker 122.

[0089] Please see Figure 10 , Figure 10This diagram illustrates the crossover effect of the second speaker 122 under different crossover processing conditions when adjusting the high-pass crossover 1304 in some embodiments of this application. Curve A represents the electrical signal curve received by the second speaker 122 without the high-pass crossover 1304, i.e., the audio drive signal curve. Curves B, C, D, and E represent the electrical signal curves received by the second speaker 122 after first-order crossover using the high-pass crossover 1304. In curve B, the capacitance of the crossover capacitor C of the high-pass crossover 1304 is 2μF; in curve C, it is 4.6μF; in curve D, it is 10μF; in curve E, it is 22μF; and curve F represents the electrical signal curve received by the second speaker 122 after second-order crossover using the high-pass crossover 1304.

[0090] Please refer to Figure 10 Around 200Hz, the frequency response amplitude corresponding to curve A is approximately -62dB, curve B is approximately -101dB, curve C is approximately -98dB, curve D is approximately -92dB, and curve E is approximately -85dB. That is, compared to curve A (representing the signal without frequency division), the amplitude of the signal components below 200Hz in the electrical signal corresponding to curve B is attenuated by approximately 39dB, in curve C by approximately 36dB, in curve D by approximately 30dB, and in curve E by approximately 23dB. In other words, compared to the audio drive signal without frequency division (corresponding to curve A), the amplitude attenuation of the signal components below 200Hz in the electrical signals after frequency division using a capacitor (corresponding to curves B, C, D, and E) is significantly greater. In this way, the low-frequency components in the electrical signal received by the second speaker 122 are effectively suppressed, and the electrical signal after frequency division processing can effectively reduce the distortion phenomenon when the second speaker 122 outputs sound.

[0091] In some embodiments, the capacitance value of the frequency divider capacitor C can correspond to a theoretical frequency division point:

[0092]

[0093] Where f is the crossover frequency, z is the rated impedance of the second speaker 122, and C is the capacitance of the crossover capacitor C. It can be understood that when there are multiple crossover capacitors, the capacitance C calculated by formula (1) is the equivalent capacitance value of the multiple crossover capacitors.

[0094] Because the second speaker 122 contains a magnetic circuit system and a coil, the coil acts as an inductor in the circuit, affecting the crossover point and causing a deviation between the actual and theoretical crossover points. For example... Figure 10 As shown, the actual crossover point corresponding to curve B (i.e., the frequency corresponding to the maximum point Mb of curve B) is around 15kHz, the actual crossover point corresponding to curve C (i.e., the frequency corresponding to the maximum point Mc of curve C) is around 8kHz, the actual crossover point corresponding to curve D (i.e., the frequency corresponding to the maximum point Md of curve D) is around 3.4kHz, and the actual crossover point corresponding to curve E (i.e., the frequency corresponding to the maximum point Me of curve E) is around 1.5kHz. Combining formula (1) with curves C, D, and E, it can be seen that the actual crossover point is negatively correlated with the capacitance value of the crossover capacitor.

[0095] Please see Figure 10 The attenuation of curve F is also significant in the higher frequency range (e.g., above 8kHz), corresponding to a greater attenuation of the higher frequency signal components in the electrical signal obtained from the second-order frequency division, affecting the normal output of the second speaker 122 in the higher frequency range. Furthermore, using two crossover capacitors would complicate the structure of the main control circuit board 13, thereby increasing the manufacturing cost and size of the final headphone 100. In summary, for the sake of simplifying the circuit and reducing system complexity, and to ensure the normal output of the second speaker 122 in the higher frequency range, the high-pass crossover 1304 can use a first-order crossover, meaning that the number of crossover capacitors connected in series with the second speaker 122 can be only one.

[0096] In some embodiments, if only one crossover capacitor is connected in series with the second speaker 122, the capacitance value of the crossover capacitor can range from 4.2μF to 5.2μF to improve the crossover effect while ensuring normal output of the second speaker 122 in the higher frequency range. In some embodiments, to further improve the crossover effect while ensuring normal output of the second speaker 122 in the higher frequency range, the capacitance value of the crossover capacitor can range from 4.4μF to 5.0μF. In some embodiments, to further improve the crossover effect while ensuring normal output of the second speaker 122 in the higher frequency range, the capacitance value of the crossover capacitor can range from 4.5μF to 4.8μF.

[0097] In some embodiments, the second rear cavity 1204 of the second speaker 122 is in a closed state and is not connected to the outside. This will cause an imbalance of air pressure between the second front cavity 1203 and the second rear cavity 1204, which will also cause the sound output by the second speaker 122 to distort at lower frequencies (e.g., below 200Hz, such as 50-100Hz).

[0098] Please see Figure 11 , Figure 11 for Figure 7 A schematic diagram of the structure of the second speaker 122 in some other embodiments. The speaker housing 1223 of the second speaker 122 is provided with a communication hole 1205 connecting the second rear cavity 1204 and the outside of the second speaker 122, so as to alleviate the phenomenon of air pressure imbalance between the second front cavity 1203 and the second rear cavity 1204 caused by the closure of the second rear cavity 1204, thereby improving the distortion phenomenon of the second speaker 122 outputting sound in the lower frequency range (e.g., below 200Hz, e.g., 50-100Hz) caused by air pressure imbalance.

[0099] In some embodiments, the connecting hole 1205 penetrates the speaker housing 1223 to communicate with the second rear cavity 1204. For example, the connecting hole 1205 can penetrate the support frame of the speaker housing 1223 and communicate with the second rear cavity 1204, with the support frame located on the side of the speaker housing 1223 away from the second front cavity 1203. If the second speaker 122 is disposed in the first front cavity 1201 of the first speaker, the connecting hole 1205 can connect the first front cavity 1201 and the second rear cavity 1204. Since the second speaker 122 outputs a high frequency range of sound, and the high-frequency sound waves have a sharp directional characteristic, when the first front cavity 1201 and the second rear cavity 1204 are connected, the sound waves radiated from the second rear cavity 1204 through the connecting hole 1205 rarely radiate back to the second front cavity 1203. Therefore, the arrangement of the connecting hole 1205 will not affect the sound waves output by the first speaker 121, thereby improving the distortion phenomenon of the second speaker 122 without affecting the acoustic performance of the first speaker 121.

[0100] In some embodiments, please refer to Figure 12 , Figure 12 for Figure 11 A partial structural schematic diagram of the central mechanism module 10 in some other embodiments. The connecting hole 1205 can also penetrate the second magnetic circuit system 1222 and extend towards the second diaphragm 1221, so that the second magnetic circuit system 1222 surrounds the connecting hole 1205, making the connecting hole 1205 connected to the second rear cavity 1204, which more directly alleviates the air pressure imbalance between the second front cavity 1203 and the second rear cavity 1204, improves the function of the second rear cavity 1204, and thus improves the distortion phenomenon.

[0101] In some embodiments, the acoustic resistance at the connecting hole 1205 can be 5×10. 8 Pa·s / m⁻¹.3×10⁻¹ 9Pa·s / m, to avoid excessively low acoustic impedance leading to increased radiated sound pressure in the second rear cavity 1204, which would cause the sound waves radiated from the first front cavity 1201 of the first speaker 121 to superimpose with the sound waves radiated from the second rear cavity 1204 of the second speaker 122, resulting in extremely complex sound wave phases at the acoustic aperture location, affecting the listening effect. Simultaneously, to prevent excessively high acoustic impedance from failing to balance the air pressure on the front and rear sides of the second diaphragm 1221 (i.e., the air pressure between the second front cavity 1203 and the second rear cavity 1204), thus preventing distortion problems. In some embodiments, the second speaker 122 may be provided with an acoustic barrier mesh 1226 within the connecting hole 1205 to improve the acoustic impedance at the connecting hole 1205 and ensure the sensitivity of the second speaker 122.

[0102] In some embodiments, the aperture of the connecting hole 1205 can be in the range of 0.8mm-1.2mm, which reduces the impact of an excessively small connecting hole 1205 on airtightness, while also reducing the impact of an excessively large connecting hole 1205 on the sensitivity of the second speaker 122. In some scenarios, limiting the aperture of the connecting hole 1205 can also reduce the manufacturing difficulty.

[0103] In some embodiments, the connecting hole 1205 may be centrally located relative to the second speaker 122, such as the second diaphragm 1221, in the radial direction. Here, the radial direction may be perpendicular to the axial direction of the second speaker 122, i.e., perpendicular to the vibration direction of the second diaphragm 1221. Central location means that the distance between the axis of the connecting hole 1205 and the axis of the second speaker 122, such as the second diaphragm 1221, in the radial direction is less than 10% of the length of the second speaker 122, such as the second diaphragm 1221.

[0104] In some embodiments, the connecting hole 1205 may not connect the second rear cavity 1204 and the first front cavity 1201, but may directly connect to an acoustic hole, such as a pressure relief hole 1103, provided on the movement housing 11. High-frequency sound waves are radiated directly through the acoustic hole, such as the pressure relief hole 1103, thereby further reducing the influence of the sound waves radiated by the second rear cavity 1204 on the sound waves radiated by the first front cavity 1201. In some embodiments, the aforementioned acoustic hole communicating with the connecting hole 1205 may be part of the first sound outlet hole 1101, or part of an acoustic hole, such as a pressure relief hole 1103, that connects to the first rear cavity 1202, or an independent acoustic hole distinct from the aforementioned other acoustic holes. In this case, please refer to... Figure 12 The connecting hole 1205 can be connected to the aforementioned acoustic hole through the connecting pipe 123 to increase the sound path difference of the sound wave radiated by the second rear cavity 1204, attenuate the radiated sound wave, avoid sound leakage, and avoid affecting the user's auditory experience.

[0105] Understandably, the connection port 1205 can improve the distortion phenomenon that exists in the low-frequency range (e.g., below 200Hz, such as 50-100Hz) of the second speaker 122's sound output. Furthermore, the connection port 1205 can work in conjunction with the high-pass crossover 1304 to improve the aforementioned distortion. Of course, the high-pass crossover 1304 can also be omitted, and the distortion can be improved solely through the connection port 1205. Additionally, when the connection port 1205 and the high-pass crossover 1304 work together, the specific settings of both can be adjusted according to specific circumstances.

[0106] Please see Figure 9 The main control circuit board 13 may be equipped with a drive circuit 132 to drive the speaker components 12, such as the first speaker 121 and the second speaker 122. Furthermore, the drive circuit 132 may mainly consist of a digital-to-analog converter circuit 1321, and may also include a power amplifier circuit, a processor, etc. The specific method of using the digital-to-analog converter circuit 1321 and other circuits to form the drive circuit 132 will not be elaborated here.

[0107] The drive circuit 132 can be electrically connected to terminals such as the first terminal 1301 and the second terminal 1302, and other terminals, to achieve electrical connection with speaker assemblies 12, such as the first speaker 121 and the second speaker 122, to drive the speaker assemblies 121 and the second speaker 122. Specifically, a low-pass crossover 1303, such as a crossover inductor L, can be disposed between the drive circuit 132 and the first speaker 121. A high-pass crossover 1304, such as a capacitor C, can be disposed between the drive circuit 132 and the second speaker 122.

[0108] In some embodiments, the driving circuit 132 can drive the first speaker 121 and the second speaker 122 simultaneously using only one digital-to-analog converter circuit 1321. That is, the driving circuit 132 can input the same audio driving signal to the first speaker 121 and the second speaker 122.

[0109] Understandably, the earphone 100 may also include electronic components such as batteries, sensors, and antennas to ensure the normal operation of the earphone 100. These electronic components may be set in the core module 10 and / or hook structure 20 as needed, which will not be elaborated here.

[0110] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0111] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0112] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0113] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An earphone, characterized by, The earphone comprises a core module and a hook structure, the hook structure is connected with the core module, the core module has a connecting end and a free end, the connecting end is connected with the hook structure, and the free end is not connected with the hook structure. The core module comprises a core shell, a first loudspeaker and a second loudspeaker, the core shell is used for accommodating the first loudspeaker and the second loudspeaker, the frequency band of the sound output by the first loudspeaker is at least partially lower than the frequency band of the sound output by the second loudspeaker, the core shell is provided with a first sound outlet and a second sound outlet, the first loudspeaker is arranged to output sound through the first sound outlet, and the second loudspeaker is arranged to output sound through the second sound outlet. In the wearing state, the core module is located at the front side of the ear, at least part of the hook structure is located at the rear side of the ear, the free end extends into the concha cavity of the ear, the core module cooperates with the concha cavity to form an auxiliary cavity without blocking the external auditory canal, the auxiliary cavity is in communication with the external auditory canal, and the first sound outlet and the second sound outlet are at least partially located in the auxiliary cavity.

2. The earphone of claim 1, wherein, In the wearing state, the free end abuts against the concha cavity.

3. The earphone of claim 1, wherein The core module has an inner side surface. In the wearing state, the inner side surface is located on the side of the core module facing the ear. The core shell is provided with a bottom wall corresponding to the inner side surface, and the first sound outlet and the second sound outlet are arranged on the bottom wall. In the wearing state, a part of the bottom wall corresponding to the inner side surface has a certain spacing from the concha cavity.

4. The earphone of claim 1, wherein The first sound outlet is arranged on the periphery of the second sound outlet along the circumferential direction of the second sound outlet and is partially located on the side of the second sound outlet close to the free end.

5. The earphone according to any one of claims 1-4, characterized in that, The first loudspeaker cooperates with the core shell to form a first front cavity on the front side of a first diaphragm of the first loudspeaker, the first front cavity is in communication with the first sound outlet, and the second loudspeaker is arranged in the first front cavity.

6. The earphone of claim 5, wherein, A groove is arranged on the inner wall of the core shell, the groove is recessed in the direction away from the first loudspeaker, and is used for accommodating the second loudspeaker.

7. The earphone of claim 5, wherein The second loudspeaker comprises a second diaphragm and a loudspeaker shell, the second diaphragm cooperates with the loudspeaker shell and the core shell to form a second front cavity and a second rear cavity, the second front cavity and the second rear cavity are located on the two sides of the second diaphragm, the second front cavity is in communication with the second sound outlet, and the first front cavity and the second front cavity are isolated from each other.

8. The earphone of claim 7, wherein, The second loudspeaker is further provided with a communication hole, the communication hole communicates the second rear cavity and the first front cavity.

9. The earphone of claim 8, wherein, The second loudspeaker is also provided with a second magnetic circuit system, the communication hole penetrates through the second magnetic circuit system, and the aperture of the communication hole is 0.8mm-1.2mm.

10. The earphone of claim 5, wherein, On a reference surface perpendicular to the axial direction of the first loudspeaker, the orthographic projection of the second loudspeaker at least partially overlaps the orthographic projection of the first loudspeaker, and the axial direction of the second loudspeaker points to the first loudspeaker.

Images