Device for monitoring suction state of chip in real time

Abstract

The utility model relates to the technical field of chip detection, in particular to a device for monitoring the suction state of a chip in real time, which comprises a light source module, a camera and a distance regulator, the light source module and the camera are arranged in the monitoring box, the distance adjuster is located below the monitoring box, and the distance adjuster is used for adjusting the positions of the monitoring box in the X-axis direction and the Z-axis direction; the monitoring box is arranged on one side of the to-be-detected area on the operation platform. The light source module and the camera are arranged on one side of the to-be-detected area of the working platform, so that the distance between the suction nozzle assembly and the chip when the suction nozzle assembly sucks the chip is effectively monitored, and the chip damage caused by too tight contact between the suction nozzle assembly and the chip is avoided; by arranging the distance adjuster, the accuracy of the position of the camera is ensured, the distance between the suction nozzle assembly and the chip is accurately recognized, the adjustable state of the position of the camera relative to the position of the chip is achieved, and debugging of different product models is compatible.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a device for real-time monitoring of chip acquisition status. Background Technology

[0002] In modern semiconductor manufacturing, chip testing and end-face inspection are crucial steps in ensuring product quality and performance. During this process, the accuracy and stability of precisely controlling the contact position between the nozzle and the chip in the testing equipment are paramount. Traditional testing methods heavily rely on external microscopes for real-time observation of the nozzle-chip contact position, which not only increases equipment complexity but also limits operational flexibility. External microscopes require precise alignment and are susceptible to environmental interference (such as vibration and temperature changes) during use, leading to poor observation results and often requiring frequent adjustments by operators. This significantly extends the testing cycle and reduces work efficiency.

[0003] Existing chip testing equipment only equips the testing end (the position where the chip has been picked up from the test end) with a camera component to monitor the state of the nozzle picking up the chip. However, there is a lack of corresponding visual monitoring methods at the test end (the position where the nozzle first contacts and picks up the chip). This design flaw makes it difficult to accurately control the relative position between the nozzle and the chip at the test end. Especially when the nozzle approaches and attempts to pick up the chip, due to the lack of real-time feedback, the nozzle often misjudges the distance and makes excessive contact with the chip surface, leaving indentations on the chip. This can potentially cause minor damage to the internal structure of the chip, thereby affecting its performance and reliability.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Utility Model Content

[0005] The technical problem this invention aims to solve is that existing chip testing equipment lacks visual monitoring methods at the test end, resulting in excessively tight contact between the nozzle and the chip, which may affect the chip's performance and reliability.

[0006] The present invention adopts the following technical solution:

[0007] On one hand, this utility model provides a device for real-time monitoring of chip acquisition status, including: a light source module 1, a camera 2, and a distance adjuster 3; the light source module 1 and the camera 2 are disposed inside a monitoring box 4, and the distance adjuster 3 is located below the monitoring box 4, and the distance adjuster 3 is used to adjust the position of the monitoring box 4 in the X-axis direction and the Z-axis direction;

[0008] The monitoring box 4 is disposed on the working platform 5, and the working platform 5 is provided with a suction component 6. The monitoring box 4 is disposed on one side of the test area 50 on the working platform 5, and the monitoring box 4 is used to monitor the status of the suction component 6 in the test area 50.

[0009] Preferably, the work platform 5 is provided with a test area 50 and a detection area 51. The test area 50 and the detection area 51 are respectively located near the two ends of the work platform 5. The test area 50 is used to place the chip to be tested, and the detection area 51 is used to detect the chip. The camera 2 is used to monitor the state of the chip being picked up by the suction component 6 in the test area 50.

[0010] Preferably, the working platform 5 is provided with an mounting plate 52, which is located on one side of the area to be tested 50, and the distance adjuster 3 is installed on the mounting plate 52.

[0011] Preferably, the device for monitoring the chip's acquisition status in real time further includes a fixing bracket 7, which has at least two mounting holes 70, and the fixing bracket 7 is bolted to the mounting plate 52 through the mounting holes 70.

[0012] Preferably, the distance adjuster 3 includes an X-axis adjuster 30 and a Z-axis adjuster 31. The X-axis adjuster 30 is used to adjust the position of the monitoring box 4 in the horizontal direction perpendicular to the mounting plate 52, and the Z-axis adjuster 31 is used to adjust the position of the monitoring box 4 in the longitudinal direction of the mounting plate 52.

[0013] Preferably, the X-axis adjuster 30 includes a first adjustment knob 300, and the Z-axis adjuster 31 includes a second adjustment knob 310. The first adjustment knob 300 and the second adjustment knob 310 are used to manually adjust the position of the monitoring box 4.

[0014] Preferably, the suction assembly 6 includes a suction nozzle 60 and a crane beam 61. The crane beam 61 is installed on the working platform 5, and there are two suction nozzles 60, which are respectively arranged near the two sides of the crane beam 61.

[0015] Preferably, the overhead crane beam 61 includes a rotating unit 62 and a mounting arm 63. The rotating unit 62 is fixedly connected to the working platform 5. The mounting arm 63 is disposed on the top of the rotating unit 62. The suction nozzles 60 are respectively disposed on both sides of the mounting arm 63. The rotating unit 62 is used to drive the mounting arm 63 to rotate so that the suction nozzles 60 transfer the chip in the test area 50 on the working platform 5 to the detection area 51 and pick up the chip in the detection area 51 into the external container.

[0016] Preferably, the adjustable brightness range of the light source module 1 is 0-255.

[0017] Preferably, there are two light source modules 1, and the two light source modules 1 are respectively disposed on both sides of the camera 2.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting the light source module 1 and the camera 2 on one side of the test area 50 of the working platform 5, the distance between the suction component 6 and the chip when suctioning the chip can be effectively monitored, avoiding chip damage caused by the suction component 6 being in too close contact with the chip; at the same time, a distance adjuster 3 is set below the monitoring box 4 where the camera 2 and the light source module 1 are placed, and the position of the camera 2 can be moved by the distance adjuster 3, so that the distance between the suction component 6 and the chip can be identified by the camera 2, realizing the adjustable state of the position of the camera 2 relative to the position of the chip, and compatible with the debugging of different product models. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly described below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0020] Figure 1 This is a front view of a device for real-time monitoring of chip acquisition status provided in an embodiment of this utility model;

[0021] Figure 2 This is a schematic diagram of the operating platform of a device for real-time monitoring of chip acquisition status provided in an embodiment of this utility model;

[0022] Figure 3 This is a side view of a device for real-time monitoring of chip acquisition status provided in an embodiment of this utility model;

[0023] Figure 4 This is a top view of a device for real-time monitoring of chip acquisition status provided in an embodiment of this utility model;

[0024] Figure 5 This is a schematic diagram of a distance adjuster for a device for real-time monitoring of chip absorption status provided in an embodiment of this utility model;

[0025] Figure 6 This is a schematic diagram of the suction component of a device for real-time monitoring of chip suction status provided in an embodiment of this utility model;

[0026] Figure 7This is a schematic diagram of the nozzle of a device for real-time monitoring of chip picking status provided in this embodiment of the present invention, which picks up a chip.

[0027] The attached figures are labeled as follows:

[0028] 1-Light source module, 2-Camera, 3-Distance adjuster, 30-X-axis adjuster, 300-First adjustment knob, 31-Z-axis adjuster, 310-Second adjustment knob, 4-Monitoring box, 5-Working platform, 50-Test area, 51-Detection area, 52-Mounting plate, 6-Suction assembly, 60-Suction nozzle, 61-Heavy crane beam, 62-Rotating unit, 63-Mounting arm, 7-Fixed bracket, 70-Mounting hole. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0031] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0032] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0033] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling" or "wireless connection." The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0034] In the description of this utility model, the expression "A and / or B" (where A and B are used to formally represent specific features) will be involved. The corresponding expression includes the following three combinations: only A, only B, and a combination of A and B.

[0035] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the specified value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the specified quantity (i.e., the limitations of the measurement system).

[0036] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0037] Example 1:

[0038] Embodiment 1 of this utility model provides a device for real-time monitoring of the chip acquisition status, such as... Figure 1As shown, the system includes: a light source module 1, a camera 2, and a distance adjuster 3. The light source module 1 and the camera 2 are housed within a monitoring box 4. The distance adjuster 3 is located below the monitoring box 4 and is used to adjust the position of the monitoring box 4 along the X and Z axes. The camera 2 can be a high-magnification telephoto camera. To provide good illumination for the camera 2, two light source modules 1 are used, one on each side of the camera 2. The adjustable brightness range of each light source module 1 is 0-255, where 0 is the lowest brightness and 255 is the highest. The two light source modules 1 provide good illumination, effectively improving the image quality of the camera 2. Simultaneously, the main function of the distance adjuster 3 is to adjust the position of the camera 2, further enhancing its image quality and improving the system's recognition accuracy.

[0039] like Figure 2 As shown, the monitoring box 4 is mounted on the work platform 5, which is equipped with a suction component 6. The monitoring box 4 is positioned on one side of the test area 50 on the work platform 5, and is used to monitor the state of the suction component 6 in suctioning the chip in the test area 50. The test area 50 is the area where the chip to be tested is placed.

[0040] By setting a light source module 1 and a camera 2 on one side of the test area 50 of the work platform 5, the distance between the pick-up component 6 and the chip when picking up the chip can be effectively monitored, avoiding chip damage caused by excessive contact between the pick-up component 6 and the chip; at the same time, a distance adjuster 3 is set below the monitoring box 4 where the camera 2 and the light source module 1 are placed. The position of the camera 2 can be moved by the distance adjuster 3, thereby identifying the distance between the pick-up component 6 and the chip through the camera 2, realizing the adjustable state of the position of the camera 2 relative to the chip position, and being compatible with the debugging of different product models.

[0041] The above solution mentions that the operating platform 5 is provided with an area for placing the chip under test, such as... Figure 1 and Figure 2 As shown, specifically, the work platform 5 includes a test area 50 and a detection area 51, respectively located near both ends of the work platform 5. The test area 50 is used to place the chip to be tested, and the detection area 51 is used to detect the chip. The camera 2 is used to monitor the state of the suction component 6 in the test area 50 suctioning the chip. In practical applications, a detection device is already provided on one side of the detection area 51 for detecting the chip, and it can also monitor the distance between the suction nozzle 60 and the chip, which is not shown in the accompanying drawings of this embodiment.

[0042] For mounting the monitoring box 4 and the distance adjuster 3, a mounting plate 52 is provided on the working platform 5. The mounting plate 52 is located on one side of the area to be measured 50, and the distance adjuster 3 is mounted on the mounting plate 52. Specifically, as shown... Figure 1 and Figure 3 As shown, the device for monitoring the chip's acquisition status in real time also includes a fixing bracket 7, which has at least two mounting holes 70. The fixing bracket 7 is bolted to the mounting plate 52 through the mounting holes 70.

[0043] In the above scheme, the distance adjuster 3 is used to adjust the position of the monitoring box 4 in the X-axis and Z-axis directions. To improve the imaging quality of the camera 2, such as... Figure 4 and Figure 5 As shown, the distance adjuster 3 includes an X-axis adjuster 30 and a Z-axis adjuster 31. The X-axis adjuster 30 is used to adjust the position of the monitoring box 4 perpendicular to the lateral direction of the mounting plate 52 (i.e., Figure 5 The Z-axis adjuster 31 is used to adjust the position of the monitoring box 4 in the longitudinal direction of the mounting plate 52 (i.e., in the X direction). Figure 5 (Z-direction in the text). Specifically, the X-axis adjuster 30 and the Z-axis adjuster 31 are used to fine-tune the position of the monitoring box 4. The X-axis adjuster 30 includes a first adjusting knob 300, and the Z-axis adjuster 31 includes a second adjusting knob 310. The first adjusting knob 300 and the second adjusting knob 310 are used to manually adjust the position of the monitoring box 4. The first adjusting knob 300 and the second adjusting knob 310 are provided with anti-slip threads for easy rotation. The X-axis adjuster 30 and the Z-axis adjuster 31 are mechanical structures well known to those skilled in the art and will not be described in detail here. For example, position adjustment can be achieved through a lead screw structure.

[0044] During the operation of the suction component 6, since the test area 50 and the detection area 51 are respectively located near the two ends of the working platform 5, and the suction component 6 is a rotatable component, after the chip is picked up in the test area 50, the chip is moved to the detection area 51 for detection by rotating the suction component 6. After the chip detection is completed, the chip is picked up from the detection area 51, and the suction component 6 rotates to place the detected chip into an external container. Based on this, as... Figure 6As shown, the suction assembly 6 includes suction nozzles 60 and a crane beam 61. The crane beam 61 is mounted on the work platform 5. There are two suction nozzles 60, respectively positioned near both sides of the crane beam 61. To enable the suction assembly 6 to rotate, the crane beam 61 includes a rotating unit 62 and a mounting arm 63. The rotating unit 62 is fixedly connected to the work platform 5. The mounting arm 63 is located at the top of the rotating unit 62. The suction nozzles 60 are respectively located on both sides of the mounting arm 63. The rotating unit 62 drives the mounting arm 63 to rotate, so that the suction nozzles 60 transfer the chip in the test area 50 on the work platform 5 to the detection area 51, and then suction the chip in the detection area 51 into an external container. Figure 7 The diagram shows the suction nozzle 60 picking up the chip. The rotating unit 62 also has a conventional structure. For example, the rotating unit 62 may include a support member and a motor mounted on the support member. The support member is mounted on the work platform 5, and the output shaft of the motor is fixedly connected to the mounting arm 63, driving the motor to rotate. The rotating unit 62 can also be implemented using other structures, which are not specifically limited here.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for monitoring the state of chip suction in real time, characterized in that, The device for monitoring the state of chip suction in real time comprises a light source module (1), a camera (2) and a distance adjuster (3); the light source module (1) and the camera (2) are arranged in a monitoring box (4), and the distance adjuster (3) is arranged below the monitoring box (4); the distance adjuster (3) is used for adjusting the position of the monitoring box (4) in the X-axis direction and the Z-axis direction. The monitoring box (4) is arranged on a work platform (5), and a suction assembly (6) is arranged on the work platform (5); the monitoring box (4) is arranged on one side of a to-be-tested area (50) of the work platform (5), and the monitoring box (4) is used for monitoring the state of the suction assembly (6) in the to-be-tested area (50) for sucking a chip. The work platform (5) is provided with the to-be-tested area (50) and a detection area (51); the to-be-tested area (50) and the detection area (51) are arranged close to two ends of the work platform (5) respectively; the to-be-tested area (50) is used for placing a to-be-tested chip; the detection area (51) is used for detecting a chip; and the camera (2) is used for monitoring the state of the suction assembly (6) in the to-be-tested area (50) for sucking a chip.

2. The apparatus for monitoring chip aspiration in real time according to claim 1, wherein, The work platform (5) is provided with a mounting plate (52); the mounting plate (52) is arranged on one side of the to-be-tested area (50); and the distance adjuster (3) is mounted on the mounting plate (52).

3. The apparatus for monitoring chip aspiration in real time of claim 2, wherein, The device for monitoring the state of chip suction in real time further comprises a fixing support (7); at least two mounting holes (70) are arranged on the fixing support (7); and the fixing support (7) is bolt-connected with the mounting plate (52) through the mounting holes (70).

4. The apparatus for monitoring chip aspiration in real time according to claim 3, wherein, The distance adjuster (3) comprises an X-axis adjuster (30) and a Z-axis adjuster (31); the X-axis adjuster (30) is used for adjusting the position of the monitoring box (4) in the transverse direction perpendicular to the mounting plate (52); and the Z-axis adjuster (31) is used for adjusting the position of the monitoring box (4) in the longitudinal direction of the mounting plate (52).

5. The apparatus for monitoring chip aspiration in real time of claim 3, wherein, The X-axis adjuster (30) comprises a first adjusting knob (300); the Z-axis adjuster (31) comprises a second adjusting knob (310); and the first adjusting knob (300) and the second adjusting knob (310) are used for manually adjusting the position of the monitoring box (4).

6. The apparatus for monitoring chip aspiration in real time according to claim 5, wherein, The suction assembly (6) comprises a suction nozzle (60) and a trolley cross beam (61); the trolley cross beam (61) is mounted on the work platform (5); and the number of the suction nozzles (60) is two, which are arranged close to two sides of the trolley cross beam (61) respectively.

7. The apparatus for monitoring chip aspiration in real time of claim 1, wherein, ​ 8. The apparatus for monitoring chip aspiration in real time according to claim 7, wherein, The crown block crossbeam (61) comprises a rotating unit (62) and a mounting arm (63), the rotating unit (62) is fixedly connected with the operation platform (5), the mounting arm (63) is arranged at the top of the rotating unit (62), the suction nozzles (60) are respectively arranged on the two sides of the mounting arm (63), and the rotating unit (62) is used for driving the mounting arm (63) to rotate, so that the suction nozzles (60) transfer the chips in the to-be-tested area (50) on the operation platform (5) to the detection area (51), and the chips in the detection area (51) are sucked into an external container.

9. The apparatus for monitoring the state of chip suction in real time according to any one of claims 1-8, characterized in that, The adjustable brightness range of the light source module (1) is 0-255.

10. The apparatus for monitoring chip aspiration in real time according to any one of claims 1-8, wherein, The number of the light source modules (1) is two, and the two light source modules (1) are arranged on the two sides of the camera (2).

Images