Hall current sensor and inverter

Abstract

The utility model relates to a Hall current sensor and an inverter. The Hall current sensor comprises a shell which comprises a first bottom wall and a first enclosure wall, and the first enclosure wall is connected to the first bottom wall and surrounds the first bottom wall, so that an accommodating space is defined by the first enclosure wall and the first bottom wall; the magnetic conductive element is arranged in the accommodating space, the inner side of the magnetic conductive element is used for allowing a current-carrying element to pass through, and the magnetic conductive element is provided with an air gap; the Hall element is arranged in the air gap; the shell comprises a first bottom wall and a first enclosure wall, the shell cover comprises a second bottom wall and a second enclosure wall, the second enclosure wall is connected to the first bottom wall and arranged around the first bottom wall, the shell cover is arranged on the shell in a covering mode, the second bottom wall covers the containing space, and the second enclosure wall is located on the outer side of the first enclosure wall and arranged around the first enclosure wall. According to the Hall current sensor, the probability of electric breakdown between the current-carrying element and other components can be effectively reduced, and the structural reliability and the safety performance are improved.

Description

Technical Field

[0001] This application relates to the field of current sensing technology, and in particular to a Hall current sensor and inverter. Background Technology

[0002] Hall effect current sensors can be used in inverters, such as on the DC side, to detect the DC current value. A typical Hall effect current sensor includes a magnetic core and a Hall element housed within the air gap of the core. During detection, current-carrying elements such as wires pass through the space inside the magnetic core. When current flows through the current-carrying elements and generate a magnetic field, the magnetic core can concentrate this magnetic field, allowing the Hall element to more accurately sense the current value. However, in traditional inverters, the current-carrying elements are prone to electrical breakdown with other components, leading to inverter damage. Utility Model Content

[0003] Therefore, it is necessary to provide a Hall current sensor and inverter to address the problem that current-carrying elements are prone to electrical breakdown with other components, which can lead to inverter damage.

[0004] A Hall current sensor, comprising:

[0005] The housing includes a first bottom wall and a first surrounding wall, the first surrounding wall being connected to the first bottom wall and disposed around the first bottom wall to form an accommodating space together with the first bottom wall;

[0006] A magnetically conductive element is disposed within the accommodating space, the inner side of the magnetically conductive element is used for the passage of a current-carrying element, and the magnetically conductive element is provided with an air gap;

[0007] A Hall element is disposed within the air gap; and,

[0008] The shell includes a second bottom wall and a second surrounding wall. The second surrounding wall is connected to and surrounds the first bottom wall. The shell covers the housing. The second bottom wall covers the accommodating space. The second surrounding wall is located outside the first surrounding wall and surrounds the first surrounding wall.

[0009] In the aforementioned Hall current sensor, the second enclosure is located outside and surrounds the first enclosure, forming a double-layer structure. Thus, when other components are located on the side of the second enclosure away from the first enclosure, i.e., on the periphery of the Hall current sensor, and the current-carrying element passes through the inner side of the magnetic element, the creepage path between the current-carrying element and other components located on the periphery of the Hall current sensor needs to bypass the first and second enclosures. The first and second enclosures together increase the creepage distance, effectively reducing the probability of electrical breakdown between the current-carrying element and other components, and improving structural reliability and safety performance.

[0010] In one embodiment, the housing further includes a first inner frame disposed on the first bottom wall and located within the accommodating space. A wire passage is formed in the first inner frame, penetrating the first bottom wall and used for the passage of a current-carrying element. The magnetically conductive element is disposed around the first inner frame on the outside of the first inner frame.

[0011] In one embodiment, the housing further includes a second inner frame disposed on the second bottom wall and located inside the second enclosure wall. The second inner frame is inserted inside the first inner frame, and the inner side of the second inner frame is used for the passage of current-carrying elements.

[0012] In one embodiment, the Hall current sensor further includes a first circuit board disposed within the accommodating space. The first circuit board is located on one side of the magnetic element and opposite to the air gap. The pins of the Hall element protrude from the outside of the magnetic element and are electrically connected to the first circuit board.

[0013] In one embodiment, the housing further includes a mounting groove disposed on the inner side of the first enclosure wall, the mounting groove extending along the first bottom wall in a direction pointing towards the second bottom wall, and the first circuit board being inserted into the mounting groove.

[0014] In one embodiment, a slot is provided on the second bottom wall opposite to the first circuit board, and the Hall current sensor further includes a pin electrically connected to the first circuit board, the pin extending through the slot from the side of the second bottom wall facing away from the first bottom wall.

[0015] In one embodiment, the housing further includes a fixing part and a connector. The fixing part is located on the side of the second enclosure facing away from the first enclosure. The fixing part has a through hole. The connector is located in the through hole and extends out from the side of the second bottom wall facing away from the first bottom wall.

[0016] In one embodiment, the housing is provided with a plurality of slots, which are located at the connection between the first bottom wall and the first surrounding wall and are spaced apart in the circumferential direction of the first bottom wall. The housing also includes a plurality of retaining ribs located on the inner side of the second surrounding wall. The retaining ribs are located at the end of the second surrounding wall away from the second bottom wall and are spaced apart in the circumferential direction of the second bottom wall. The retaining ribs are engaged in the slots one by one.

[0017] An inverter includes a Hall current sensor as described in any of the above embodiments.

[0018] In one embodiment, the inverter further includes a second circuit board and functional devices, both of which are disposed on the second circuit board. The functional devices are located on the side of the second enclosure of the Hall current sensor facing away from the first enclosure. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the Hall current sensor in some embodiments.

[0020] Figure 2 This is a schematic diagram of the Hall current sensor from another angle in some embodiments.

[0021] Figure 3 This is a structural schematic diagram of the Hall current sensor at another angle in some embodiments.

[0022] Figure 4 for Figure 3 The diagram shows a cross-sectional view of the Hall current sensor along the AA direction.

[0023] Figure 5 This is a schematic diagram of the Hall current sensor in some embodiments, omitting the housing.

[0024] Figure 6 This is a schematic diagram of the housing structure in some embodiments.

[0025] Figure 7 This is a schematic diagram of the structure of the housing in some embodiments.

[0026] Figure 8 for Figure 7 The diagram shows the structure of the shell from another angle.

[0027] Figure 9 The diagram shows the structure of the magnetic core, Hall element, and circuit board in some embodiments.

[0028] Figure label:

[0029] 10. Hall current sensor; 11. Housing; 111. First bottom wall; 112. First enclosure wall; 113. Accommodation space; 114. First inner frame; 1141. Wiring channel; 115. Mounting slot; 116. Slot; 12. Magnetic element; 121. Air gap; 13. Hall element; 131. Pin; 14. Housing; 141. Second bottom wall; 1411. Slot; 142. Second enclosure wall; 143. Second inner frame; 144. Fixing part; 1441. Through hole; 145. Connector; 146. Bracket; 15. First circuit board; 16. Pin. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0036] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, Figures 1-3 These are schematic diagrams of the Hall current sensor 10 at different angles in some embodiments. Figure 4 for Figure 3 The diagram shows a cross-sectional view of the Hall current sensor 10 along the AA direction. The Hall current sensor 10 provided in this application includes, but is not limited to, use in inverters, such as on the DC side of an inverter, for detecting the current on the DC side of the inverter. The inverter includes, but is not limited to, a device for converting DC power into AC power of fixed frequency and voltage or frequency and voltage regulation, such as 220V, 50Hz sine wave AC power. The inverter may include current-carrying elements such as wires for input current, and the Hall current sensor 10 is used to sense the current passing through the current-carrying elements.

[0037] In some embodiments, the Hall current sensor 10 includes a housing 11, a magnetic element 12, and a Hall element 13. The housing 11 is, but is not limited to, made of plastic. The housing 11 includes a first bottom wall 111 and a first surrounding wall 112. The first surrounding wall 112 is connected to the first bottom wall 111 and surrounds the first bottom wall 111 to form an accommodating space 113. Thus, the housing 11 can be generally a hollow cuboid structure with an opening on one side. The magnetic element 12 is, but is not limited to, a magnetic core made of silicon steel, permalloy, etc. The magnetic element 12 is disposed within the accommodating space 113, and the inner side of the magnetic element 12 is used for the passage of a current-carrying element. The magnetic element 12 can be generally annular or other shapes that can surround the current-carrying element. An air gap 121 is provided at any position along the circumference of the magnetic element 12, and the Hall element 13 is disposed within the air gap 121 of the magnetic element 12. It is understandable that when the Hall current sensor 10 is used to detect the current of the current-carrying element, the current-carrying element passes through the inside of the magnetic element 12 and is surrounded by the magnetic element 12. When the current-carrying element carries current, it generates a magnetic field. The magnetic element 12 is used to concentrate the magnetic field generated by the current-carrying element. The Hall element 13 detects the current by inducing the Hall potential generated by the magnetic field.

[0038] Furthermore, in some embodiments, the Hall current sensor 10 further includes a housing 14, the material of which is, but is not limited to, plastic. The housing 14 includes a second bottom wall 141 and a second surrounding wall 142. The second surrounding wall 142 is connected to and surrounds the first bottom wall 111. The housing 14 is generally a hollow cuboid structure with an opening on one side. The housing 14 covers the housing 11. The second bottom wall 141 covers the accommodating space 113 to provide protection for the components located within the accommodating space 113. The second surrounding wall 142 is located outside the first surrounding wall 112 and surrounds the first surrounding wall 112.

[0039] When the Hall current sensor 10 is applied in an inverter, the inverter may have a second circuit board and functional devices such as capacitors, inductors, fuses, varistors, and thermistors disposed on the second circuit board. The Hall current sensor 10 is disposed on the second circuit board, and the DC-side current-carrying element of the inverter passes through the inner side of the magnetic element 12 of the Hall current sensor 10. Functional devices on the second circuit board are located on the side of the second enclosure 142 facing away from the first enclosure 112, i.e., on the periphery of the Hall current sensor 10. Therefore, the second enclosure 142 of the Hall current sensor 10 is located outside and surrounds the first enclosure 112, forming a double-layer structure between the first enclosure 112 and the second enclosure 142. The creepage path between the current-carrying element and other components located on the periphery of the Hall current sensor 10 needs to bypass the first enclosure 112 and the second enclosure 142. For example, Figure 4The dashed line shows a portion of one of the creepage paths between the current-carrying element and the functional device. It can be seen that the first enclosure 112 and the second enclosure 142 together increase the creepage distance, effectively reducing the probability of electrical breakdown between the current-carrying element and other components, and improving structural reliability and safety performance.

[0040] Combination Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, the housing 11 further includes a first inner frame 114, which is disposed on the first bottom wall 111 and located within the accommodating space 113. A wiring channel 1141, penetrating the first bottom wall 111 and used for the passage of a current-carrying element, is formed within the first inner frame 114. The magnetically conductive element 12 is disposed around the outside of the first inner frame 114. When the Hall current sensor 10 detects the current of the current-carrying element, the current-carrying element passes through the wiring channel 1141 inside the first inner frame 114. The first inner frame 114 further increases the creepage path between the current-carrying element and the functional devices on the second circuit board, which is beneficial for further improving the safety performance of the Hall current sensor 10 and also for improving the assembly reliability of the magnetically conductive element 12.

[0041] Combination Figure 4 , Figure 7 and Figure 8 As shown, in some embodiments, the housing 14 further includes a second inner frame 143, which is disposed on the second bottom wall 141 and located inside the second enclosure wall 142. The second inner frame 143 is inserted into the inner side of the first inner frame 114, and the inner side of the second inner frame 143 is used for the passage of current-carrying elements. The second inner frame 143 and the first inner frame 114 form a double-layer structure, which helps to further increase the creepage path from the current-carrying elements to the functional devices on the second circuit board, thereby further improving the safety performance of the Hall current sensor 10, and also helps to improve the assembly reliability of the housing 11 and the housing 14. It is understood that the outer side of the first inner frame 114 can abut against the inner side of the second inner frame 143, and the outer side of the first enclosure 112 can abut against the inner side of the second enclosure 142, so as to improve the assembly reliability of the Hall current sensor 10 and provide effective sealing protection for the components in the accommodating space 113. Of course, the first inner frame 114 and the second inner frame 143 can also be spaced apart, and the first enclosure 112 and the second enclosure 142 can also be spaced apart.

[0042] Combination Figure 5 , Figure 6 and Figure 9As shown, in some embodiments, the Hall current sensor 10 further includes a first circuit board 15, on which control and data transmission lines for the Hall element 13 may be provided. The first circuit board 15 is disposed within the accommodating space 113, located on one side of the magnetic element 12 and opposite to the air gap 121. The pins 131 of the Hall element 13 protrude from the outside of the magnetic element 12 and are electrically connected to the first circuit board 15. In some embodiments, the housing 11 further includes a mounting groove 115 disposed inside the first enclosure wall 112. The mounting groove 115 extends along the first bottom wall 111 toward the second bottom wall 141, and the first circuit board 15 is inserted into the mounting groove 115. This improves the assembly reliability of the first circuit board 15 on the housing 11, and makes the extension direction of the first circuit board 15 parallel to the direction from the first bottom wall 111 to the second bottom wall 141. This is beneficial to optimize the layout of each component, so that the first circuit board 15 can be adapted to the arrangement direction of the Hall element 13. For example, multiple pins 131 of the Hall element 13 are arranged sequentially at intervals in the direction from the first bottom wall 111 to the second bottom wall 141, thereby making the connection between the pins 131 of the Hall element 13 and the first circuit board 15 more stable and reliable.

[0043] Combination Figure 2 , Figure 5 and Figure 9 As shown, in some embodiments, a slot 1411 opposite to the first circuit board 15 is provided on the second bottom wall 141. The Hall current sensor 10 also includes a pin 16 electrically connected to the first circuit board 15. The pin 16 can be any suitable conductive material such as metal. The pin 16 extends through the slot 1411 from the side of the second bottom wall 141 facing away from the first bottom wall 111. When the Hall current sensor 10 is disposed on the second circuit board, the pin 16 is electrically connected to the second circuit board to realize communication between the second circuit board, the first circuit board 15 and the Hall element 13, so as to realize the power supply, control and data transmission of the Hall element 13.

[0044] Combination Figure 2 and Figure 4 As shown, in some embodiments, the housing 14 further includes a fixing part 144 and a connector 145. The fixing part 144 is located on the side of the second enclosure 142 facing away from the first enclosure 112, and the fixing part 144 has a through hole 1441. The connector 145 is located in the through hole 1441 and extends out from the side of the second bottom wall 141 facing away from the first bottom wall 111. When the Hall current sensor 10 is mounted on the second circuit board, the connector 145 is soldered to the circuit board to improve the positioning accuracy and assembly reliability of the Hall current sensor 10 on the second circuit board.

[0045] Combination Figure 1 and Figure 8As shown, in some embodiments, the housing 11 is provided with multiple slots 116, and the multiple slots 116 are provided with the connection points of the first bottom wall 111 and the first surrounding wall 112, and are spaced apart in the circumferential direction of the first bottom wall 111. The housing cover 14 also includes multiple retaining ribs 146 provided inside the second surrounding wall 142. The multiple retaining ribs 146 are provided at the end of the second surrounding wall 142 away from the second bottom wall 141 and are spaced apart in the circumferential direction of the second bottom wall 141. The retaining ribs 146 protrude from the side of the second surrounding wall 142 facing the first surrounding wall 112. In the accompanying drawings of this application, the housing 11 is provided with four slots 116 and the housing cover 14 is provided with four retaining ribs 146 as an example. The retaining ribs 146 are correspondingly engaged in the slots 116. The retaining ribs 146 and the slots 116 are detachably engaged, which is beneficial to improving the alignment accuracy and assembly reliability of the housing 11 and the housing cover 14, and at the same time, it is beneficial to reduce the assembly difficulty of the housing 11 and the housing cover 14.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A Hall current sensor, characterized by The Hall current sensor comprises: a shell comprising a first bottom wall and a first surrounding wall connected to the first bottom wall and arranged around the first bottom wall to form a containing space with the first bottom wall; a magnetic conductive element arranged in the containing space, an inner side of the magnetic conductive element being used for passing a current-carrying element, the magnetic conductive element being provided with an air gap; a Hall element arranged in the air gap; and a shell cover comprising a second bottom wall and a second surrounding wall connected to the first bottom wall and arranged around the first bottom wall, the shell cover being arranged on the shell, the second bottom wall covering the containing space, and the second surrounding wall being arranged outside the first surrounding wall. The shell further comprises a first inner frame arranged on the first bottom wall and located in the containing space, a wire passing channel passing through the first bottom wall and used for passing the current-carrying element being formed in the first inner frame, and the magnetic conductive element being arranged around the first inner frame outside the first inner frame.

2. The Hall current sensor according to claim 1, characterized in that The shell cover further comprises a second inner frame arranged on the second bottom wall and located inside the second surrounding wall, the second inner frame being inserted into the first inner frame inside, and an inner side of the second inner frame being used for passing the current-carrying element.

3. The Hall current sensor according to claim 2, characterized in that The Hall current sensor further comprises a first circuit board arranged in the containing space, the first circuit board being located at one side of the magnetic conductive element and opposite to the air gap, and pins of the Hall element protruding outside the magnetic conductive element and electrically connected to the first circuit board.

4. The Hall current sensor of claim 1, wherein, The shell further comprises a mounting groove arranged inside the first surrounding wall, the mounting groove extending along the first bottom wall in a direction pointing to the second bottom wall, and the first circuit board being inserted into the mounting groove.

5. The Hall current sensor according to claim 4, characterized in that The second bottom wall is provided with a slot opposite to the first circuit board, the Hall current sensor further comprises a plug pin electrically connected to the first circuit board, the plug pin extending out of a side of the second bottom wall away from the first bottom wall through the slot.

6. The Hall current sensor of claim 4, wherein, The shell cover further comprises a fixing portion and a connecting piece, the fixing portion being arranged at a side of the second surrounding wall away from the first surrounding wall, the fixing portion being provided with a through hole, and the connecting piece being arranged in the through hole and extending out of the side of the second bottom wall away from the first bottom wall.

7. The Hall current sensor according to any one of claims 1 to 6, characterized in that The shell is provided with a plurality of clamping grooves arranged at connecting portions of the first bottom wall and the first surrounding wall and spaced apart in a circumferential direction of the first bottom wall, and the shell cover further comprises a plurality of clamping ribs arranged inside the second surrounding wall, the clamping ribs being arranged at one end of the second surrounding wall away from the second bottom wall and spaced apart in a circumferential direction of the second bottom wall, and the clamping ribs being correspondingly clamped in the clamping grooves.

8. The Hall current sensor according to any one of claims 1-6, characterized in that, The inverter further comprises a second circuit board and functional devices, the functional devices and the Hall current sensor being arranged on the second circuit board, and the functional devices being located at a side of the second surrounding wall of the Hall current sensor away from the first surrounding wall.

9. An inverter, characterized by The inverter further comprises a second circuit board and functional devices, the functional devices and the Hall current sensor being arranged on the second circuit board, and the functional devices being located at a side of the second surrounding wall of the Hall current sensor away from the first surrounding wall.

10. The inverter of claim 9, wherein, ​

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