Expansion card hard disk support and electronic equipment
By weaving a 0.15mm~0.25mm metal wire mesh structure onto the network card cover and adding a tin alloy copper layer, the problem of low opening rate of the network card cover is solved, achieving efficient server heat dissipation and improving equipment stability and performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-02
- Publication Date
- 2026-03-10
AI Technical Summary
In existing technologies, network card baffles are limited by material thickness of 0.8 to 1 mm and stamping process, resulting in low opening ratio and low heat dissipation efficiency, which affects device stability and performance, especially under high power consumption conditions.
Metal wires with a diameter of 0.15mm to 0.25mm are woven into a mesh structure to form a mesh card baffle, which significantly improves the open area ratio to nearly 90%, and enhances thermal conductivity and welding stability through tin alloy layer and copper layer.
With airflow pressure loss reduced by more than 80% and airflow capacity significantly improved, the server's internal cooling fans can achieve the same or better cooling effect at lower speeds, resulting in a significant improvement in overall heat dissipation performance.
Smart Images
Figure CN223986312U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of server technology, and more specifically, to an expansion card hard drive bracket and electronic device. Background Technology
[0002] In the current field of computer network hardware, network interface cards (NICs), as indispensable data transmission interfaces for servers and computing devices, bear the ever-increasing data traffic and computing power demands. The NIC shield, as a key component, is typically manufactured using metal stamping technology to provide structural support, electrical isolation, and protection. Ventilation holes, optical module cage openings, and indicator light openings designed on the shield serve functional implementation and thermal management.
[0003] However, existing network interface card (NIC) baffles are limited by material thickness requirements of 0.8 to 1 mm and stamping processes. The metal connections between openings must maintain a width of at least 0.8 mm, resulting in an opening ratio of only about 55%. Furthermore, the baffle is located at the end of the server's airflow path, receiving air preheated to 50 to 55°C, making heat dissipation a significant challenge. Especially when NIC power consumption rises to 75W or higher, the inefficient heat dissipation mechanism directly impacts device stability and performance potential. Utility Model Content
[0004] This application provides an expansion card hard drive bracket and electronic device to solve the problem of low opening ratio and low heat dissipation efficiency caused by the limitation of material thickness of 0.8 to 1 mm and stamping process in the network card baffle structure of the prior art.
[0005] This application provides an expansion card hard drive bracket, including a hard drive bracket body and a network card bracket structure disposed on the hard drive bracket body. The network card bracket structure includes:
[0006] The network card baffle body has multiple ventilation holes, which together form a ventilation area.
[0007] A mesh structure is installed in the ventilation area to cover it;
[0008] The mesh structure is made of woven metal wires with a diameter between 0.15mm and 0.25mm. The mesh structure includes multiple mesh ventilation sections to introduce airflow from inside the server into the expansion card hard drive bracket and then exhaust it from the expansion card hard drive bracket.
[0009] Furthermore, the metal wire includes a metal wire body and a tin alloy layer formed on the outside of the metal wire body; and / or, a copper layer is formed on the outer surface of the network card baffle body.
[0010] Furthermore, the metal wire is made of either stainless steel or copper.
[0011] Furthermore, the mesh structure is fixedly connected to the network card baffle body.
[0012] Furthermore, the mesh structure is welded to the network card baffle body.
[0013] Furthermore, a connection area is formed at the edge of the mesh structure, which is used to fit at least a portion of the network card baffle body to fix the mesh structure to the network card baffle body.
[0014] Furthermore, the mesh ventilation section is at least one of ventilation round holes or ventilation rectangular holes.
[0015] Furthermore, when the mesh ventilation section is a circular ventilation hole, the diameter of the mesh ventilation section is less than or equal to 3mm.
[0016] Furthermore, when the mesh ventilation section is a rectangular ventilation hole, the length of the diagonal of the mesh ventilation section is less than or equal to 3mm.
[0017] According to another aspect of this application, this application also provides an electronic device including an expansion card hard drive bracket, which is the expansion card hard drive bracket described above.
[0018] This application utilizes a mesh structure woven from metal wires with a diameter of 0.15mm to 0.25mm, increasing the open area ratio of the network card baffle to nearly 90%. Compared to the 55% open area ratio of traditional baffles, airflow pressure loss is reduced by more than 80%, significantly enhancing the airflow capacity of the network card baffle structure and thus providing a more effective cooling effect for the expansion card hard drive bracket. The substantial increase in open area ratio reduces energy loss when airflow passes through the network card baffle structure, allowing the server's internal cooling fans to achieve the same or better cooling effect at lower speeds. Attached Figure Description
[0019] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This illustration shows a schematic diagram of a network card baffle structure in the prior art according to an embodiment of this application;
[0021] Figure 2 This application shows a schematic diagram of the overall structure of the hard drive bracket body according to an embodiment of the present application;
[0022] Figure 3 A front view of the network card cover body according to an embodiment of this application is shown;
[0023] Figure 4 A schematic diagram of the mesh structure according to an embodiment of this application is shown;
[0024] Figure 5 A schematic diagram of the network card baffle structure according to an embodiment of this application is shown.
[0025] The above figures include the following reference numerals:
[0026] 1. Hard drive bracket body; 2. Network card baffle structure; 21. Network card baffle body; 22. Ventilation hole; 23. Mesh structure; 231. Mesh ventilation section; 232. Connection area. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0028] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.
[0029] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0030] In the current field of computer network hardware, network interface cards (NICs), as indispensable data transmission interfaces for servers and computing devices, bear the ever-increasing data traffic and computing power demands. The NIC shield, as a key component, is typically manufactured using metal stamping technology to provide structural support, electrical isolation, and protection. Ventilation holes, optical module cage openings, and indicator light openings designed on the shield serve functional implementation and thermal management.
[0031] However, existing network interface card (NIC) baffles are limited by material thickness requirements of 0.8 to 1 mm and stamping processes. The metal connections between openings must maintain a width of at least 0.8 mm, resulting in an opening ratio of only about 55%. Furthermore, the baffle is located at the end of the server's airflow path, receiving air preheated to 50 to 55°C, making heat dissipation a significant challenge. Especially when NIC power consumption rises to 75W or higher, the inefficient heat dissipation mechanism directly impacts device stability and performance potential.
[0032] Example 1
[0033] To address the aforementioned technical problems, Embodiment 1 of this application first provides an expansion card hard drive bracket, including a hard drive bracket body 1 and a network card baffle structure 2 disposed on the hard drive bracket body 1. The network card baffle structure 2 includes:
[0034] The network card baffle body 21 has multiple ventilation holes 22, which together form a ventilation area.
[0035] The mesh structure 23 is installed in the ventilation area to cover the ventilation area;
[0036] The mesh structure 23 is woven from metal wires with a diameter between 0.15mm and 0.25mm. The mesh structure 23 includes multiple mesh ventilation sections 231 to introduce airflow inside the server into the expansion card hard drive bracket and exhaust it through the expansion card hard drive bracket.
[0037] like Figure 1 The diagram shown is a structural schematic of the hard drive bracket body 1 in the prior art. Figure 1 As can be seen, in the prior art, the thickness of the gap between two adjacent holes is at least 0.8 mm. Figure 4 and Figure 5 The diagram below shows the structure of the hard drive bracket body 1 in this embodiment. As can be seen, this embodiment mainly adopts a mesh structure 23, which reduces the distance between two adjacent mesh ventilation sections 231 to between 0.15mm and 0.25mm. In this way, more mesh ventilation sections 231 can be opened on the network card baffle body 21. The hard drive bracket body 1 in this embodiment is formed by first opening multiple ventilation holes 22 on the network card baffle body 21, and then covering the ventilation holes 22 with a mesh structure 23 to form the network card baffle structure 2.
[0038] like Figures 1 to 5As shown in Embodiment 1 of this application, the core of the expansion card hard drive bracket is the optimized network card baffle structure 2. This structural design significantly improves ventilation efficiency. By utilizing a mesh structure 23 woven from metal wires with a diameter of 0.15mm to 0.25mm, the opening ratio is increased to nearly 90%. Compared to the 55% opening ratio of traditional baffles, airflow pressure loss is reduced by more than 80%, greatly enhancing the airflow capacity of the network card baffle structure 2, thereby providing a more effective cooling effect for the expansion card hard drive bracket. The significant increase in the opening ratio reduces energy loss when airflow passes through the network card baffle structure 2, allowing the server's internal cooling fan to achieve the same or better cooling effect at a lower speed.
[0039] Furthermore, the metal wire includes a metal wire body and a tin alloy layer formed on the outside of the metal wire body.
[0040] The addition of the tin alloy layer significantly improves the thermal conductivity of the metal wire, facilitating faster heat conduction from the network card baffle body 21 to the mesh structure 23, and then dissipating it into the external environment through the mesh structure 23. This effectively reduces the operating temperature of the network card baffle structure 2. The tin alloy layer on the surface of the metal wire body optimizes the welding process, ensuring a strong connection between the mesh structure 23 and the network card baffle body 21, improving the structural strength and durability of the entire network card baffle structure 2, and reducing the risk of damage under vibration and shock environments.
[0041] The uniform coverage of the tin alloy layer improves the flatness of the metal wire surface, enhances corrosion resistance, and extends the service life of the mesh structure 23, maintaining its functionality and aesthetics even in harsh environments with high humidity or high salt spray.
[0042] Furthermore, a copper layer is formed on the outer surface of the network card baffle body 21.
[0043] The high thermal conductivity of the copper layer significantly enhances the thermal conductivity of the network card baffle body 21, enabling heat to be transferred more quickly from the high thermal density area to the metal wire, and then dissipated through the mesh ventilation section 231, effectively improving the overall heat dissipation performance of the network card baffle structure 2.
[0044] The addition of the copper layer optimizes the electrical connection between the network card baffle structure 2 and the server's internal grounding system, ensuring good electrostatic protection and preventing potential damage to the network card baffle structure 2 and its surrounding electronic components by electrostatic discharge, thereby improving the overall reliability of the system.
[0045] The presence of the copper layer improves the material properties during the welding process, making the welding between the metal wire and the network card baffle body 21 more stable, improving the durability and consistency of the welding point, and reducing the risk of structural failure due to poor welding.
[0046] Meanwhile, the copper layer provides a protective film to prevent the network card baffle body 21 from being corroded in humid, high-temperature or chemically corrosive environments, thus extending the service life of the network card baffle body 21 and maintaining its stable function under various harsh conditions.
[0047] Furthermore, the metal wire is made of either stainless steel or copper.
[0048] Both stainless steel and copper have excellent thermal conductivity, which can effectively accelerate the conduction of heat from the network card to the outside environment, thereby improving the heat dissipation efficiency of the entire expansion card hard drive bracket. In particular, copper's high thermal conductivity allows it to respond more quickly to changes in heat sources, while stainless steel exhibits consistently stable performance under high-temperature environments.
[0049] The mechanical strength and corrosion resistance of stainless steel ensure the structural integrity and long service life of the metal wire in complex environments. Although copper is relatively soft, its good ductility and toughness under normal working conditions are sufficient to meet structural requirements, making it particularly suitable for applications requiring good electrical conductivity.
[0050] Furthermore, the mesh structure 23 is fixedly connected to the network card baffle body 21.
[0051] Furthermore, the mesh structure 23 is welded to the network card baffle body 21.
[0052] Welding, as a connection method, can ensure a firm bond between the mesh structure 23 and the network card baffle body 21, significantly enhancing the overall structural strength of the network card baffle body 21. Even when the network device is subjected to vibration or impact, it can maintain its integrity and functionality, reducing the performance degradation and failure risk caused by loose or broken connections.
[0053] The welding fixation ensures the precise alignment of the mesh ventilation section 231, which helps optimize the airflow path and ensures that the airflow can pass through the mesh ventilation section 231 without obstruction, effectively reducing flow resistance and improving heat dissipation efficiency. This is especially important in server environments with high power consumption and high heat load.
[0054] Furthermore, a connection area 232 is formed at the edge of the mesh structure 23. The connection area 232 is used to fit at least a portion of the network card baffle body 21 to fix the mesh structure 23 onto the network card baffle body 21.
[0055] The connection area 232 ensures precise alignment between the mesh structure 23 and the network card bracket body 21, optimizing the airflow channel layout, reducing airflow turbulence, and thus improving heat dissipation efficiency. Secondly, welding provides a robust physical connection, enhancing the rigidity and durability of the overall structure. Even when subjected to vibration or external impact during server operation, it maintains structural integrity, reducing the failure rate caused by unstable connections. Furthermore, the welded metal connection points further enhance electrical conductivity and improve electrostatic discharge protection, ensuring the stability of the network card bracket body 21 during high-speed data transmission. In addition, the combination of the connection area 232 and welding simplifies the assembly process, reduces production costs, improves production efficiency, and facilitates mass production and maintenance.
[0056] Furthermore, the mesh ventilation section 231 is at least one of a ventilation round hole or a ventilation rectangular hole.
[0057] Furthermore, when the mesh ventilation section 231 is a ventilation hole, the diameter of the mesh ventilation section 231 is less than or equal to 3mm.
[0058] Furthermore, when the mesh ventilation section 231 is a rectangular ventilation hole, the length of the diagonal of the mesh ventilation section 231 is less than or equal to 3mm.
[0059] Furthermore, in Embodiment 1 of this application, the mesh ventilation section 231 of the mesh structure 23 is designed as at least one of a circular or rectangular ventilation hole, with strict control over the hole diameter. When it is a circular hole, the diameter does not exceed 3mm. This effectively meets the stringent standards for fire resistance and electrostatic discharge protection, significantly reducing the risk of flame spread and electrostatic damage, and improving the safety of the network card. Secondly, the diverse selection of circular and rectangular holes allows designers to flexibly adjust the arrangement and shape of the holes according to actual airflow requirements and space constraints, thereby optimizing airflow distribution and improving heat dissipation efficiency. Furthermore, the hole diameter design of less than or equal to 3mm, combined with the high opening ratio of the metal wire, maximizes the ventilation area while ensuring fire resistance and electrostatic discharge protection, significantly reducing airflow resistance and improving the heat exchange performance of the network card baffle body 21, which helps maintain a stable operating temperature in high-performance computing environments.
[0060] Example 2
[0061] This application also provides an electronic device, which includes an expansion card hard drive bracket, wherein the expansion card hard drive bracket is the aforementioned expansion card hard drive bracket.
[0062] The above provides a detailed description of the expansion card hard drive bracket and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. An extended card hard disk support, comprising a hard disk support body (1), and a network card baffle structure (2) arranged on the hard disk support body (1), characterized in that, The network card baffle structure (2) comprises: a network card baffle body (21) having a plurality of ventilation holes (22) formed thereon, the plurality of ventilation holes (22) collectively forming a ventilation area; a mesh structure (23) disposed at the ventilation area to cover the ventilation area; wherein the mesh structure (23) is woven by metal wires, the diameter of the metal wires is between 0.15mm and 0.25mm, and the mesh structure (23) comprises a plurality of mesh ventilation portions (231) to introduce airflow inside a server into the extended card hard drive bracket and discharge the airflow by the extended card hard drive bracket.
2. The extended card hard disk holder according to claim 1, wherein, The metal wires comprise a metal wire body and a tin alloy layer formed on the outside of the metal wire body; and / or the outer surface of the network card baffle body (21) is formed with a copper layer.
3. The extended card hard disk holder of claim 1, wherein, The metal wire material is any one of stainless steel or copper.
4. The extended card hard disk holder of claim 1, wherein, The mesh structure (23) is fixedly connected with the network card baffle body (21).
5. The extended card hard disk holder of claim 4, wherein, The mesh structure (23) is welded with the network card baffle body (21).
6. The extended card hard disk holder of claim 4, wherein, The mesh structure (23) is formed with a connecting area (232) at the edge thereof, the connecting area (232) is used to fit at least part of the network card baffle body (21) to fix the mesh structure (23) on the network card baffle body (21).
7. The extended card hard disk holder of claim 1, wherein, The mesh ventilation portion (231) is at least one of a ventilation circular hole or a ventilation rectangular hole.
8. The extended card hard disk holder of claim 7, wherein, When the mesh ventilation portion (231) is the ventilation circular hole, the diameter of the mesh ventilation portion (231) is less than or equal to 3mm.
9. The extended card hard disk holder of claim 7, wherein, When the mesh ventilation portion (231) is the ventilation rectangular hole, the length of the diagonal line of the mesh ventilation portion (231) is less than or equal to 3mm.
10. An electronic device comprising an expansion card hard disk holder, characterized in that, The extended card hard drive bracket is any one of the extended card hard drive brackets in claims 1 to 9.