Flexible display screen and electronic equipment

Abstract

The utility model provides a flexible display screen and electronic equipment. The flexible display screen comprises a display control chip; the flexible display panel is provided with a chip bonding area, and the display control chip is electrically connected with the flexible display panel through the chip bonding area; the supporting layer covers the peripheral area of the chip bonding area in the flexible display panel and is used for supporting the peripheral area, and the peripheral edge of the peripheral area is located outside the orthographic projection of the display control chip on the flexible display panel. The flexible display screen has relatively high compressive strength, and is beneficial for avoiding a poor display condition caused by fracture of a layer structure in a surrounding area of a chip bonding area in the flexible display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a flexible display screen and an electronic device. Background Technology

[0002] As electronic devices increasingly demand higher space utilization, flexible displays have become widely used. However, without a glass cover for protection, flexible displays are vulnerable to stress from pressure, impacts, and other factors. This stress can cause deformation of the internal structure and circuit breakage, leading to display defects such as bright lines, pixel failure, and growing dark spots (GDS).

[0003] Therefore, improving the compressive strength of flexible displays has become an urgent problem to be solved. Utility Model Content

[0004] This application provides a flexible display screen and an electronic device. The flexible display screen has high compressive strength, which helps to reduce or even avoid the occurrence of display defects in the flexible display screen.

[0005] In a first aspect, a flexible display screen is provided, comprising: a display control chip; a flexible display panel, wherein a chip bonding area is provided, and the display control chip is electrically connected to the flexible display panel through the chip bonding area; and a support layer covering the area surrounding the chip bonding area in the flexible display panel, wherein the outer edge of the surrounding area is located outside the orthographic projection of the display control chip on the flexible display panel.

[0006] In the above embodiments, the area surrounding the chip bonding region in the flexible display panel is covered with a support layer, which provides support for the area surrounding the chip bonding region and improves the compressive strength of the flexible display panel and the flexible display screen. When the flexible display screen is subjected to compression or impact, this embodiment helps to reduce or even avoid the film layer in the area surrounding the chip bonding region of the flexible display panel from breaking under stress, thereby helping to avoid display defects caused by the film layer breaking.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, the support layer includes a cured ACF adhesive layer that covers the chip bonding area and the surrounding area. The cured ACF adhesive layer is used to support the chip bonding area and the surrounding area, and to realize the electrical connection between the flexible display panel and the display control chip.

[0008] Through the above implementation method, the cured ACF adhesive layer serves as a support layer, providing support for the area surrounding the chip bonding region. This can improve the compressive strength of the flexible display panel and flexible display screen, and help avoid film layer breakage in the surrounding area, which could lead to display defects.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the cured ACF adhesive layer includes a first curing region and a second curing region; the first curing region is located within the orthographic projection of the display control chip, and the second curing region is the area surrounding the first curing region; wherein the material of the first curing region includes a high-temperature curing component, and the material of the second curing region includes a room-temperature curing component.

[0010] ACF containing high-temperature curing components can be cured after hot pressing to form the first curing zone; ACF containing room-temperature curing components can be cured in a normal temperature and pressure environment to form the second curing zone. The first and second curing zones can provide support for the area surrounding the chip bonding region, improving the compressive strength of flexible display panels and flexible displays.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the materials of both the first curing zone and the second curing zone include a high-temperature curing component and a room-temperature curing component.

[0012] By altering the composition of ACF, it is possible to obtain an ACF that can cure at both high temperatures and room temperatures. Using this ACF for bonding display control chips and flexible display panels, a cured ACF adhesive layer can be obtained as a support layer, providing support to the area surrounding the chip bonding region and improving the compressive strength of the flexible display panel and flexible display layer.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the dimension of the second curing region in the direction parallel to the flexible display panel is 0.2 mm to 0.5 mm, and / or the thickness of the second curing region is 1 μm to 10 μm.

[0014] Incompletely cured ACF has a certain degree of fluidity and can flow and extend to form a larger second cured zone, further improving the compressive strength of the flexible display screen.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the elastic modulus of the first curing region and the second curing region is 2 GPa to 3 GPa.

[0016] The first and second curing zones of the cured ACF adhesive layer have high structural strength, which can provide support for the surrounding area of ​​the chip bonding area, thereby improving the compressive strength of the flexible display screen.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the support layer includes an organic overlay layer that covers the area surrounding the chip bonding region.

[0018] Through the above embodiments, the area surrounding the chip bonding area in the flexible display panel is covered by an organic coating layer. This organic coating layer can not only improve the surface flatness of the flexible display panel, but also provide support and protection for the surrounding area, thereby improving the compressive strength of the flexible display panel and the flexible display screen.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, an organic overlay layer is provided with a conductive channel, the conductive channel being connected to the chip bonding area of ​​the flexible display panel, and the conductive channel containing a conductive medium for electrically connecting the display control chip and the chip bonding area of ​​the flexible display panel.

[0020] This implementation method enables a stable electrical connection between the display control chip and the flexible display panel.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, a cured ACF adhesive layer is further provided between the conductive channel and the display control chip. The cured ACF adhesive layer is used to electrically connect the conductive medium in the conductive channel and the display control chip.

[0022] The cured ACF adhesive layer, together with the organic capping layer, provides support to the area surrounding the chip bonding region, which can further improve the compressive strength of the flexible display panel and flexible display screen, and help avoid display defects caused by film breakage in the surrounding area.

[0023] In conjunction with the first aspect, in some implementations of the first aspect, the orthographic projection of the cured ACF adhesive layer onto the organic capping layer is larger than the cross-section of the conductive channel in the organic capping layer.

[0024] Through the above implementation method, the cured ACF adhesive layer can completely cover the conductive channel 309, achieving a more reliable electrical connection, and the area located outside the conductive channel can further effectively support the flexible display panel, thereby further improving the pressure resistance of the flexible display panel and the flexible display screen.

[0025] In conjunction with the first aspect, in some implementations of the first aspect, the material of the cured ACF adhesive layer includes a high-temperature curing component and a room-temperature curing component.

[0026] In conjunction with the first aspect, in some implementations of the first aspect, the flexible display panel includes a gate metal layer, and the chip bonding region is located in the gate metal layer.

[0027] The chip bonding region can be an area in the gate metal layer exposed on the surface of the flexible display panel, which is used for electrical connection with the display control chip.

[0028] In conjunction with the first aspect, in some implementations of the first aspect, in the region surrounding the chip bonding region, at least one organic layer and at least one inorganic layer are stacked on the outer side of the gate metal layer, and the outermost layer of the surrounding region is an inorganic capping layer.

[0029] In conjunction with the first aspect, in some implementations of the first aspect, at least one organic layer and at least one inorganic layer stacked together form a first stepped surface at one end facing the display control chip, an inorganic cover layer covers the first stepped surface to form a second stepped surface, one side surface of the support layer is attached to the second stepped surface, and the other side surface of the support layer is planar.

[0030] The support layer can make the surface of the area surrounding the chip bonding area flat, so that the surface is subjected to more uniform stress, which helps to prevent the inorganic covering layer in the surrounding area from breaking due to local stress concentration.

[0031] In a second aspect, an electronic device is provided, including a flexible display screen as described in the first aspect or various implementations thereof. Attached Figure Description

[0032] Figure 1 This is a cross-sectional structural diagram of a flexible display screen provided in an embodiment of this application.

[0033] Figure 2 This is a cross-sectional structural diagram of another flexible display screen provided in an embodiment of this application.

[0034] Figure 3 This is a cross-sectional structural diagram of another flexible display screen provided in an embodiment of this application.

[0035] Figure 4 This is a schematic diagram of a display control chip bonding according to an embodiment of this application.

[0036] Figure 5 This is a schematic diagram of the component composition of an ACF provided in an embodiment of this application.

[0037] Figure 6 This is a schematic diagram of another display control chip bonding method provided in an embodiment of this application.

[0038] Figure 7 This is a cross-sectional structural diagram of another flexible display screen provided in an embodiment of this application.

[0039] Figure 8 yes Figure 7 A schematic diagram of the molding process of a flexible display screen.

[0040] Figure 9 yes Figure 7 A schematic diagram of the molding process of a flexible display screen.

[0041] Figure 10 yes Figure 7 A schematic diagram of the molding process of a flexible display screen.

[0042] Figure 11 yes Figure 7 A schematic diagram of the molding process of a flexible display screen.

[0043] Figure 12 This is a schematic diagram of the experimental setup for the two-point bending test provided in the embodiments of this application.

[0044] Figure 13 This is a schematic diagram of the simulation results of the two-point bending test provided in the embodiments of this application. Detailed Implementation

[0045] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0046] In the description of this application, it should be noted that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0047] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0048] The directional terms used in the embodiments of this application, such as "up," "down," "left," "right," "inner," and "outer," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. Furthermore, unless otherwise stated in this application, "multiple" refers to two or more. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0049] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0050] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0051] This application provides a flexible display screen that can be applied to electronic devices to achieve a light-emitting display function.

[0052] Figure 1 This is a schematic cross-sectional structural diagram of a flexible display screen provided in an embodiment of this application. Figure 1 As shown, the flexible display screen may include a display control chip 1, an anisotropic conductive film (ACF), and a flexible display panel 3. The chip is typically manufactured as an integrated circuit (IC); therefore, the chip in this application can also be simply referred to as an IC. Optionally, the flexible display panel may be, for example, an organic light-emitting flexible display panel.

[0053] The display control chip 1 can be electrically connected to the flexible display panel 3 through the ACF adhesive layer 2, thereby controlling the display of the flexible display panel 3. To achieve the electrical connection function, the surface of the display control chip 1 can be provided with IC metal bumps (IC bumps) 12. The IC bump 12 is a metallic conductive protrusion that is directly or indirectly connected to the pads of the display control chip 1, and can provide an interface for the display control chip 1 to electrically interconnect with external devices.

[0054] ACF can cure at high temperatures, meaning that after undergoing processes such as heating, pressurizing, heat preservation, cooling, and depressurization, ACF can cure to form ACF adhesive layer 2. The high-temperature cured ACF adhesive layer 2 possesses both electrical conductivity and adhesive properties.

[0055] The flexible display panel 3 may include a flexible substrate layer 301, an inorganic insulating layer 302, a gate metal layer 303, a passivation layer (PVX) 304, a planarization layer (PLN) 306, an inorganic capping layer (TLD) 307, and an organic capping layer (OC) 308 stacked sequentially. Figure 1 The stacked structure of the flexible display panel 3 shown in the following embodiments is for illustrative purposes only and is not intended to limit the scope of the application. The flexible display panel 3 may have additional film layers (e.g., source / drain metal layers) added, and / or some film layers removed, based on the embodiments shown in the figures. This application does not limit the specific stacked structure of the flexible display panel 3.

[0056] The following is about Figure 1 The main membrane structure shown is introduced below.

[0057] The flexible substrate layer 301 and the inorganic insulating layer 302 can be stacked alternately multiple times. The flexible substrate layer 301 is typically made of organic materials such as polyimide (PI) and is used to form the insulating substrate of the flexible display panel, serving as a dielectric isolation and protection function. The inorganic insulating layer 302 is typically made of silicon oxide and is used to form an insulating layer to prevent external static electricity from affecting the internal circuitry.

[0058] The gate metal layer 303 can be a conductive metal and can be used to transmit the gate signals of the display pixels in the flexible display panel 3.

[0059] The inorganic capping layer 307 is made of silicon nitride compound and is exposed on the surface of the flexible display panel 3 in the region surrounding the chip bonding area. Due to the influence of the internal film structure of the flexible display panel 3, such as the PLN layer 306 and PVX layer 304, a portion of the inorganic capping layer 307 in the region surrounding the chip bonding area has a stepped surface. Furthermore, the inorganic capping layer 307 has relatively weak structural strength and is at risk of fracture under a tensile stress of approximately 4‰.

[0060] The organic cover layer 308 can be made of organic materials such as polyethylene glycol terephthalate (PET), PI, or polyurethane (PU). The organic cover layer 308 can make the surface of the flexible display panel 3 flat and protect the inorganic cover layer 307.

[0061] In some related technologies, the IC bump 12 in the display control chip 1 is electrically connected to and relatively fixed to the flexible display panel 3 through a high-temperature curing process of ACF, achieving conductive bonding between the display control chip 1 and the flexible display panel 3. In some examples, conductive bonding is also called bonding or die bonding. The area in the flexible display panel 3 that is bonded to the display control chip 1 can be called the die bonding area.

[0062] In some embodiments, the chip bonding region in the flexible display panel 3 may be located in the gate metal layer 303. For this purpose, a portion of the film structure in the flexible display panel 3 is removed, exposing a portion of the gate metal layer 303 to the surface of the flexible display panel 3, i.e., the chip bonding region in the flexible display panel 3 is exposed to the surface.

[0063] During the bonding process between the display control chip 1 and the flexible display panel 3 via ACF hot pressing, both temperature and pressure are conducted to the ACF through the display control chip 1. Therefore, after hot pressing, only the ACF located directly below the display control chip 1 can solidify, forming a relatively hard first solidified area 21. The first solidified area 21 is located within the orthographic projection of the display control chip 1, covers the chip bonding area, and enables electrical connection between the display control chip 1 and the flexible display panel 3.

[0064] The ACF covering the area surrounding the chip bonding region is not hot-pressed, forming a non-cured area 22. The distance between the outer periphery of the non-cured area 22 and the display control chip 1 is usually less than or equal to 0.2 mm. Because it has not been cured by hot pressing, it is soft and has a low elastic modulus, and cannot effectively protect the inorganic coating layer in the area surrounding the chip bonding region it covers.

[0065] In addition, in order to ensure a stable conductive connection between the display control chip 1 and the organic flexible display panel 3 and to prevent the organic material particles in the organic cover layer 308 from affecting the conductive particles in the ACF, a gap is provided between the organic cover layer 308 and the ACF. This gap causes a portion of the inorganic cover layer 307 located around the ACF in the flexible display panel 3 to be exposed on the surface.

[0066] Because flexible display devices typically lack a glass cover for surface protection, their compressive strength is relatively weak, especially when subjected to external forces at the IC location (i.e., Figure 1When subjected to compression or impact at position A (as shown in the diagram), the inorganic cover layer 307 around the conductive connection point between the flexible display panel 3 and the display control chip 1 typically experiences tensile stress greater than 4‰, resulting in significant deformation and a high risk of breakage. Furthermore, the breakage of the inorganic cover layer 307 will cause the breakage of other underlying layers, ultimately leading to the breakage of the circuitry in the gate metal layer 303, resulting in various display defects. Figure 1 The C region shown is the area where fracture may occur.

[0067] Based on the above problems, this application proposes a flexible display screen with high compressive strength, which can reduce or even avoid display defects caused by external impacts.

[0068] like Figure 2 As shown in the figure, a flexible display screen provided in this application embodiment includes: a display control chip 1, a flexible display panel 3, and a support layer 4. The flexible display panel 3 is provided with a chip bonding region 31, and the display control chip 1 is electrically connected to the flexible display panel 3 through the chip bonding region 31. The support layer 4 covers the surrounding region 32 of the chip bonding region 31 in the flexible display panel 3, and is used to support the surrounding region 32. The outer edge of the surrounding region 32 is located outside the orthographic projection of the display control chip 1 onto the flexible display panel 3.

[0069] The chip bonding region 31 can be a metal layer region in the flexible display panel 3 that is electrically connected to the display control chip 1. The surrounding region 32 of the chip bonding region can be a surface region in the flexible display panel 3 located around the chip bonding region, and the outermost layer in this surrounding surface region can be an inorganic cover layer.

[0070] In some examples, the difference d4 between the outer edge of the surrounding area 32 and the outer edge of the chip bonding area 31 in a direction parallel to the flexible display panel 3 is between 0.2 mm and 0.5 mm.

[0071] In some examples, where an organic cover layer is also provided on the outermost layer of the flexible display panel 3, the surrounding area 32 can be the area between the chip bonding area 31 and the organic cover layer.

[0072] In the above embodiments, the area surrounding the chip bonding region in the flexible display panel 3 is covered with a support layer, which provides support for the area surrounding the chip bonding region and improves the compressive strength of the flexible display panel 3 and the flexible display screen. When the flexible display screen is subjected to compression or impact, this embodiment helps to reduce or even avoid the film layer in the area surrounding the chip bonding region of the flexible display panel 3 from breaking under stress, thereby helping to avoid display defects caused by the film layer breaking.

[0073] Optionally, the flexible display panel 3 includes a gate metal layer, and the aforementioned chip bonding region 31 may be located within the gate metal layer. That is, the chip bonding region 31 is the area in the gate metal layer exposed on the surface of the flexible display panel 3.

[0074] Figure 3 This is a cross-sectional structural diagram of a flexible display screen provided in an embodiment of this application.

[0075] like Figure 3 As shown, a portion of the gate metal layer 303 in the flexible display panel 3 can be located on the surface of the flexible display panel 3. This portion corresponds to the display control chip 1 and serves as a chip bonding region for bonding with the display control chip. In the region surrounding this chip bonding region, at least one organic layer and at least one inorganic layer are stacked on the outer side of the gate metal layer 303, and the outermost layer of this surrounding region is an inorganic capping layer 307.

[0076] Optionally, at least one organic layer and at least one inorganic layer stacked together form a first stepped surface 311 at one end facing the display control chip 1, and an inorganic cover layer 307 covers the first stepped surface 311 to form a second stepped surface 312. One side surface of the support layer 4 is attached to the second stepped surface 312, and the other side surface of the support layer 4 is a plane.

[0077] The support layer 4 can cover the second stepped surface 312 of the inorganic cover layer 307, making the surface of the area surrounding the chip bonding area in the flexible display screen smooth. Through the above implementation, the surface of the area surrounding the chip bonding area is subjected to more uniform stress, which helps to prevent the inorganic cover layer 307 in the surrounding area from breaking due to local stress concentration.

[0078] Optionally, such as Figure 3 As shown in this embodiment, the cured ACF adhesive layer 2 can serve as a support layer. The cured ACF adhesive layer 2 can cover the chip bonding area and the surrounding area, supporting the chip bonding area and the surrounding area, and enabling electrical connection between the flexible display panel 3 and the display control chip 1.

[0079] Through the above embodiments, the cured ACF adhesive layer 2 can bond the display control chip 1 and the flexible display panel 3, while also serving as a support layer 4 to provide support for the surrounding area of ​​the bonding region. Based on this, the cured ACF adhesive layer 2 not only achieves electrical connection between the display control chip 1 and the flexible display panel 3, but also improves the compressive strength of the flexible display panel 3 and the flexible display screen.

[0080] Optionally, see [link to relevant documentation] Figure 3As shown, the cured ACF adhesive layer 2 includes a first curing region 21 and a second curing region 23. The first curing region 21 is located within the orthographic projection of the display control chip 1, and the second curing region 23 is the area surrounding the first curing region 21. The material of the first curing region 21 includes a high-temperature curing component, and the material of the second curing region 23 includes a room-temperature curing component.

[0081] In the above embodiment, the first curing region 21 can be located between the gate metal layer 303 and the display control chip 1, and is covered by the orthographic projection of the display control chip 1. The first curing region 21 can cover the chip bonding area and electrically connect the gate metal layer 303 and the display control chip 1.

[0082] Figure 4 A schematic diagram of the curing of an ACF adhesive layer provided in an embodiment of this application is shown.

[0083] like Figure 4 As shown, the ACF containing the high-temperature curing component 202 is cured at high temperature to form a first cured area 21, which fixes the display control chip 1 and the flexible display panel 3 relative to each other and forms a conductive path between the display control chip 1 and the flexible display panel 3. The ACF containing the room-temperature curing component 204 can be cured at room temperature to form a second cured area 23, which covers the inorganic cover layer 307 on the surface of the flexible display panel 3 to provide support.

[0084] Optionally, during the IC bonding process of the display control chip 1, the display control chip 1 can be heated and pressurized, and the ACF in the front projection area of ​​the display control chip 1 will be cured by heat and pressure to form the first cured area 21 mentioned above.

[0085] The room-temperature curing ACF can be cured at room temperature, for example, under room-temperature humidity conditions, to form the aforementioned second curing region 23. The room-temperature curing time can be relatively long; for example, the formation of the second curing region 23 can require 1 to 3 days. During the room-temperature curing process, the ACF can maintain its fluidity. Fluid ACF can flow and extend outwards before the room-temperature curing process is complete, climbing and leveling along the stepped surface surrounding the chip bonding area. After the room-temperature curing process is completed, the ACF can form a larger, flat support layer surface.

[0086] Return to reference Figure 3 In one possible scenario, the flowing ACF can come into contact with other film structures (such as organic cover layer 308) on the surface of the flexible display panel 3. After curing at room temperature, the first curing area 21, the second curing area 23 and the film structure together form a protection for the area surrounding the chip bonding area.

[0087] In some embodiments, the first curing zone and the second curing zone can be made of two different ACF materials. After coating with the two ACF materials, they can be cured by different curing processes.

[0088] Alternatively, in other embodiments, the first curing area and the second curing area may also use the same ACF material. After coating with the same ACF material, different areas are cured by two different curing methods.

[0089] Figure 5 This is a schematic component composition diagram of an ACF provided in an embodiment of this application. For example... Figure 5 As shown, the ACF may include conductive particles 201, resin 203, high-temperature curing component 202, and room-temperature curing component 204. The conductive particles 201 are uniformly distributed in the resin 203. Figure 5 The shapes of the components shown are for distinction only and do not represent the actual structure of the component as shown in the figure, nor do they limit the scope of protection of this application.

[0090] The conductive particles 201 can be metal particles or polymer plastic spheres coated with metal, etc., and should have good particle size uniformity and sphericity. The particle size of the conductive particles 201 is approximately 3µm to 5µm. Common materials for conductive particles 201 include, but are not limited to, nickel, gold, nickel-plated gold, silver, tin alloys, and polymer plastic spheres with nickel / gold plating.

[0091] Resin 203 has heat resistance, insulation, moisture resistance and adhesive properties, which can fix the display control chip and the flexible display panel relative to each other, and provide a certain amount of pressure to maintain the contact area between the IC bump and the gate metal layer and the conductive particles.

[0092] High-temperature curing component 202, also known as high-temperature curing agent or high-temperature crosslinking agent, such as acid anhydrides and aromatic polyamines, enables ACF to cure under high temperature and high pressure conditions.

[0093] The room temperature curing component 204, also known as a room temperature curing agent, such as aliphatic polyamines and alicyclic polyamines, enables ACF to cure under normal temperature and pressure conditions.

[0094] By changing the addition ratio of the above components, ACF with different curing properties, electrical conductivity, etc., can be obtained.

[0095] In using the same Figure 5 After the ACF material shown is cured, Figure 6 A schematic diagram of the bonding of the display control chip provided in an embodiment of this application is shown. Figure 6 As shown, the materials of the first curing zone 21 and the second curing zone 23 may both include a high-temperature curing component 202 and a room-temperature curing component 204.

[0096] Optionally, return to reference Figure 3 The dimension d5 of the second curing area 23 in the direction parallel to the flexible display panel 3 can be 0.2 mm to 0.5 mm, and / or the thickness d6 of the second curing area 23 can be 1 μm to 10 μm.

[0097] Optionally, if the surface of the flexible display panel 3 has a stepped surface, the ACF that has not completed the room temperature curing process can climb and level along the second stepped surface 312 of the flexible display panel 3. Therefore, the thickness d6 at each position in the second curing area 23 can be different, and the thickness d6 can vary in the range of 1um to 10um.

[0098] Optionally, the elastic modulus of the first curing region 21 and the second curing region 23 can be from 2 GPa to 3 GPa.

[0099] The elastic modulus of the uncured ACF can be from 1 MPa to 2 MPa. After curing, the ACF adhesive layer 2 includes a first curing region 21 and a second curing region 23 with higher elastic modulus. It forms a support layer for the flexible display panel 3 in the area around the chip bonding area, so that the flexible display has better compressive strength and helps to avoid poor display of the flexible display due to the film layer in the surrounding area breaking.

[0100] Figure 7 This illustration shows a cross-sectional structural diagram of another flexible display screen provided in an embodiment of this application.

[0101] like Figure 7 As shown, the support layer 4 includes an organic capping layer 308, which covers the area surrounding the chip bonding region.

[0102] In this manner, the area surrounding the chip bonding region of the flexible display panel 3 is covered with an organic capping layer 308. This organic capping layer 308 not only improves the surface flatness of the flexible display panel 3, but also has high support strength, providing protection for the flexible display panel and thus improving the compressive strength of the flexible display panel 3 and the flexible display screen.

[0103] Optionally, the organic cover layer 308 is provided with a conductive channel 309, which is connected to the chip bonding area of ​​the flexible display panel 3. The conductive channel 309 contains a conductive medium for electrically connecting the chip bonding area of ​​the display control chip 1. The conductive medium can be, for example, a metal medium. Optionally, the material of the metal medium can be the same as the material of the metal layer in the flexible display panel 3.

[0104] When the chip bonding region is located in the gate metal layer 303, the conductive channel 309 is located between the gate metal layer 303 and the display control chip 1, which can extend the gate metal layer 303 along the stacking direction of the flexible display panel 3 to the surface of the organic cover layer 308, thereby realizing a stable electrical connection between the display control chip 1 and the flexible display panel 3.

[0105] Optionally, such as Figure 7 As shown, a cured ACF adhesive layer 5 is also provided between the conductive channel 309 and the display control chip 1. The cured ACF adhesive layer 5 is used to electrically connect the conductive medium in the conductive channel 309 and the display control chip 1.

[0106] Optionally, the orthographic projection of the cured ACF adhesive layer 5 onto the organic capping layer 308 is larger than the cross-section of the conductive channel 309 in the organic capping layer 308. In this embodiment, the cured ACF adhesive layer 5 not only completely covers the conductive channel 309, achieving a more reliable electrical connection, but the area surrounding the conductive channel 309 can further effectively support the flexible display panel 3, thereby further improving the compressive strength of the flexible display panel 3 and the flexible display screen.

[0107] Optionally, the cured ACF adhesive layer 5 can be cured at high temperature. Alternatively, the cured ACF adhesive layer 5 can also be compatible with both high-temperature curing and room-temperature curing.

[0108] When the ACF is compatible with both high-temperature curing and room-temperature curing, the cured ACF adhesive layer 5 may include a first curing region 51 and a second curing region 52. The first curing region 51 is located within the orthographic projection of the display control chip 1, and the second curing region 52 is located around the first curing region 51. For the relevant technical solutions of the cured ACF adhesive layer 5 in this embodiment, please refer to the above text. Figures 3 to 6 The relevant descriptions of the embodiments shown will not be repeated here.

[0109] Regarding the above text Figure 7 The flexible display screen of the embodiment shown, Figures 8 to 11 A schematic diagram of one manufacturing process for the flexible display screen is shown.

[0110] Figure 8 This is a schematic cross-sectional view of the flexible display panel 3 before it is bonded to the display control chip. In this view, a portion of the gate metal layer 303 in the flexible display panel 3 is exposed on the surface of the flexible display panel 3 to facilitate bonding with the display control chip, forming a chip bonding area. Apart from the chip bonding area, the surface of the flexible display panel 3 can be an inorganic capping layer 307, which may have a second stepped surface 312.

[0111] Figure 9This is a schematic cross-sectional view of a flexible display panel 3 that has an organic overlay layer 308 but is not bonded to the display control chip. Figure 8 Based on the structure shown, an organic capping layer 308 can be coated on the chip bonding area and the surrounding area of ​​the flexible display panel 3, wherein the upper surface of the organic capping layer 308 is planar. Optionally, the organic capping layer 308 can cover the entire surface of the flexible display panel 3. The organic capping layer 308 can provide protection for the structurally weak inorganic capping layer 307, reducing the possibility of the inorganic capping layer 307 breaking when the flexible display is subjected to pressure.

[0112] Figure 10 This is a schematic cross-sectional view of a flexible display panel 3 with conductive channels 309 provided in the organic capping layer 308. The conductive channels 309 can be obtained in the organic capping layer 308 by etching processes or the like.

[0113] In the direction parallel to the flexible display panel 3, the width d1 of the conductive channel 309 typically does not exceed the width of the display control chip. For example, the width of the display control chip is... Figure 7 As shown in the figure, the width d1 of the conductive channel 309 can be between 4 / 5*d3 and d3.

[0114] Figure 11 This is a schematic cross-sectional view of a flexible display panel 3 containing a conductive medium in a conductive channel 309. The conductive medium can be deposited into the conductive channel 309 using processes such as sputtering. The conductive medium in the conductive channel 309 can be a conductive metal, a metal alloy, or other conductive material.

[0115] Through the above embodiments, the gate metal layer 303 can be extended to the surface of the organic capping layer 308, providing a flat bonding surface for the subsequent bonding between the display control chip and the flexible display panel 3. Furthermore, this method can also avoid the material of the organic capping layer 308 interfering with the bonding process, enabling stable conductive bonding between the display control chip and the flexible display panel 3.

[0116] exist Figure 11 Based on the structure shown, ACF can be further coated on the conductive channel 309 and bonded to the display control chip. This ACF can be cured at high temperature and room temperature to form a structure like... Figure 7The first curing region 51 and the second curing region 52 shown enable conductive bonding between the display control chip and the flexible display panel, and also provide support for the flexible display panel. In some embodiments, if an organic cover layer 308 already exists on the surface of the flexible display panel 3, it can be applied by scraping to extend the organic cover layer 308 to the chip bonding area and the surrounding area. This scraping process is simple to operate, extends the existing organic cover layer 308, and simplifies the manufacturing process of the flexible display screen.

[0117] In some embodiments, if the organic capping layer 308 is not provided on the surface of the flexible display panel 3, the organic capping layer 308 can also be formed on the chip bonding area and the surrounding area of ​​the flexible display panel 3 by vapor deposition or printing. Based on the flexible display screen provided in the above embodiments, a two-point bending (2PB) test can be performed on it to determine the maximum strain of the inorganic capping layer in the flexible display panel under different test conditions.

[0118] Figure 12 A schematic diagram of a test apparatus for a two-point bending test provided in an embodiment of this application is shown. Figure 12 As shown, the two-point bending test refers to supporting the two ends of the flexible display sample 1201 under test on support blocks 1204 on the fixed plate 1202 and the movable plate 1203 respectively, so that the flexible display sample 1201 is in a bent and folded state. The plate spacing d2 (the distance between the fixed plate 1202 and the movable plate 1203) is changed, and the maximum strain of the inorganic coating layer in the flexible display sample 1201 under different plate spacings is measured, that is, the strain of the inorganic coating layer at the bending vertex P. Strain refers to the local relative deformation of an object under the action of external force and non-uniform temperature field, that is, in the two-point bending test, the inorganic coating layer is deformed by the pressure applied by the two plates, and the degree of deformation is called strain.

[0119] The experiment yielded the following results: Figure 13 The simulation results are shown in the diagram. Figure 13 In the diagram, the horizontal axis represents the plate spacing, and the vertical axis represents the maximum strain of the inorganic capping layer. Scheme 1 can be based on this application. Figure 1 The flexible display screen structure provided in the application; Scheme 2 can be the flexible display screen structure provided in this application. Figure 3 The flexible display screen structure provided in the application; Scheme 3 can be the flexible display screen structure provided in this application. Figure 7 The flexible display screen structure solution provided by China.

[0120] like Figure 13As shown, under the same conditions, the maximum strain of the inorganic coating layer in Schemes 2 and 3 is always less than that in Scheme 1. When the plate spacing is 3mm, corresponding to a folding radius of 1.5mm for the flexible display sample, the strain of the inorganic coating layer in Scheme 1 is 0.44%, in Scheme 2 it is 0.17%, and in Scheme 3 it is 0.18%. This means that Schemes 2 and 3 can reduce the deformation of the inorganic coating layer in the flexible display panel under the same stress conditions, making the strain of the inorganic coating layer less than its elongation at break, which helps reduce the risk of breakage of the inorganic coating layer.

[0121] Elongation at break refers to the ratio of the maximum deformation of a material to its original length when subjected to external force until fracture. The lower the elongation at break, the greater the brittleness of the material, and the easier it is to fracture under the same strain.

[0122] In summary, the flexible display screen provided in this application embodiment can reduce the risk of breakage of the inorganic cover layer, thereby helping to reduce or even avoid display defects caused by film layer breakage.

[0123] This application also provides an electronic device, which may include the flexible display screen in any of the above embodiments.

[0124] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0125] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A flexible display screen, characterized by include: Display control chip; A flexible display panel having a chip bonding area, wherein the display control chip is electrically connected to the flexible display panel through the chip bonding area; A support layer covers the area surrounding the chip bonding area in the flexible display panel, and is used to support the surrounding area. The outer edge of the surrounding area is located outside the orthographic projection of the display control chip on the flexible display panel.

2. The flexible display screen of claim 1, wherein, The support layer includes a cured ACF adhesive layer that covers the chip bonding area and the surrounding area. The cured ACF adhesive layer supports the chip bonding area and the surrounding area and enables electrical connection between the flexible display panel and the display control chip.

3. The flexible display screen of claim 2, wherein, The cured ACF adhesive layer includes a first cured area and a second cured area. The first cured area is located within the orthographic projection of the display control chip, and the second cured area is the area surrounding the first cured area. The first curing zone includes a high-temperature curing agent, and the second curing zone includes a room-temperature curing agent.

4. The flexible display screen of claim 3, wherein, The second cured area has a dimension of 0.2 mm to 0.5 mm in the direction parallel to the flexible display panel, and / or the thickness of the second cured area is 1 μm to 10 μm.

5. The flexible display screen of claim 3, wherein, The elastic modulus of the first cured region and the second cured region is 2 GPa to 3 GPa.

6. The flexible display screen of claim 1, wherein, The support layer includes an organic capping layer that covers the area surrounding the chip bonding region.

7. The flexible display screen of claim 6, wherein, The organic overlay layer has conductive channels that are connected to the chip bonding area of ​​the flexible display panel. The conductive channels contain conductive media that are used to electrically connect the display control chip to the chip bonding area.

8. The flexible display screen of claim 7, wherein, A cured ACF adhesive layer is also provided between the conductive channel and the display control chip. The cured ACF adhesive layer is used to electrically connect the conductive medium in the conductive channel and the display control chip.

9. The flexible display screen of claim 8, wherein, The orthographic projection of the cured ACF adhesive layer onto the organic capping layer is larger than the cross-section of the conductive channel in the organic capping layer.

10. The flexible display screen according to any one of claims 1 to 9, wherein, The flexible display panel includes a gate metal layer, and the chip bonding area is located in the gate metal layer.

11. The flexible display screen of claim 10, wherein, In the region surrounding the chip bonding region, at least one organic layer and at least one inorganic layer are stacked on the outer side of the gate metal layer, and the outermost layer of the surrounding region is an inorganic capping layer.

12. The flexible display screen of claim 11, wherein, The at least one organic layer and the at least one inorganic layer stacked together form a first stepped surface at one end facing the display control chip. The inorganic cover layer covers the first stepped surface to form a second stepped surface. One side surface of the support layer is attached to the second stepped surface, and the other side surface of the support layer is planar.

13. An electronic device, comprising: Including the flexible display screen as described in any one of claims 1 to 12.

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