Heat dissipation system for laser beauty instrument and semiconductor laser hair removal instrument thereof

Through innovative design of the volute cooling fan, heat dissipation shroud, and heat sink fins, combined with a mini-bar laser and heat pipe radiator, the problems of appearance integrity and heat dissipation efficiency of laser beauty devices are solved, achieving more efficient heat dissipation and better hair removal results.

CN223987912UActive Publication Date: 2026-03-13WUXI UNIMED LASER SCI & TECH LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

The design of the heat dissipation system in existing laser beauty devices compromises the integrity of the product's appearance. Furthermore, as the size of laser products decreases, the design of the heat dissipation holes affects the appearance. Therefore, it is necessary to optimize the heat dissipation system to improve both the appearance integrity and heat dissipation efficiency.

Method used

The design incorporates a volute cooling fan and a heat sink fin, allowing the air inlet and outlet to be placed adjacent to each other in the same area. A laser module is formed by connecting mini-bar lasers in series, and combined with a heat pipe radiator and a semiconductor cooler, the heat dissipation path and beam distribution are optimized.

Benefits of technology

It improves the overall appearance of the laser beauty device, while also enhancing heat dissipation and hair removal efficiency, providing a larger beam coverage area and a skin cooling effect, thus enhancing the user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a heat dissipation system for a laser beauty instrument and a semiconductor laser hair removal instrument thereof, and the heat dissipation system for the laser beauty instrument comprises a volute heat dissipation fan and a heat dissipation fan cover, the volute cooling fan sucks air from the axial direction of the fan, and the air is blown out along the tangential direction of the volute after being accelerated by the fan; a heat dissipation fan cover is arranged on the air outlet side of the volute heat dissipation fan; a heat sink for heat dissipation of the laser is embedded in a cover cavity of the heat dissipation fan cover; a semiconductor laser hair removal instrument is provided with a shell, and a control assembly, a laser assembly and a heat dissipation assembly are installed in the shell. The heat dissipation assembly comprises a volute heat dissipation fan and a heat dissipation fan cover, and the heat sink of the laser assembly is located in the heat dissipation fan cover. According to the utility model, aiming at a miniaturized laser beauty instrument product, a heat dissipation system is optimized, so that heat generated when the beauty instrument works can be dissipated in a centralized and efficient manner. According to the semiconductor laser hair removal instrument, the laser module formed by connecting mini-bar lasers in series is adopted, and the size is reduced.
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Description

Technical Field

[0001] This utility model relates to a heat dissipation system used in laser beauty devices, and a semiconductor laser hair removal device using the heat dissipation system, belonging to the field of laser medical aesthetics. Background Technology

[0002] A laser beauty device is a device that uses the concentrated heat of a laser beam to treat the skin. Each laser beauty device contains a laser component, which generates heat during operation and needs to be dissipated promptly. This is typically achieved using a heat sink, or finned heat sink. To achieve efficient heat dissipation, a cooling fan is often installed next to the heat sink. The fan draws in outside air and blows it over the fins to dissipate the heat, as seen in the handheld home laser beauty device with Chinese patent publication number CN111557731A. To facilitate airflow, air inlets and outlets are typically created on the device's casing, aligned with the working direction of the cooling fan. These inlets and outlets are usually located on either side of the casing, forming an airflow channel, with the heat sink fins and cooling fan positioned in the middle. This necessitates at least two openings on the casing, which often compromise the product's aesthetic appearance.

[0003] As laser products develop, their size becomes smaller and smaller, which in turn allows laser beauty devices to be made smaller as well. However, the use of two openings in the casing still affects the product's appearance. Therefore, for increasingly compact laser beauty devices, the internal heat dissipation system needs to be redesigned to reduce the area of ​​openings and concentrate them in a centralized manner to improve the product's overall appearance. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation system for a laser beauty device and its semiconductor laser hair removal device. Firstly, the heat dissipation system is optimized by utilizing a volute-shaped cooling fan and a heat dissipation shroud, combined with a heat sink finned radiator. Air is drawn in, turned 180 degrees, and then blown out, allowing the air inlet and outlet on the casing to be arranged adjacently in the same area, thus optimizing the casing's appearance and improving its overall integrity. Simultaneously, by incorporating a laser module formed by series-connected mini-bar lasers, the semiconductor laser hair removal device is redesigned, reducing its size while achieving a larger laser beam / spot area, thereby improving hair removal efficiency.

[0005] To achieve the above-mentioned utility model objectives, the first aspect of this utility model provides a heat dissipation system for a laser beauty instrument, including a volute heat dissipation fan and a heat dissipation shroud;

[0006] The volute cooling fan draws in air along the fan's axis, accelerates the air, and then blows it out along the tangential direction of the volute.

[0007] A cooling shroud is provided on the exhaust side of the volute cooling fan;

[0008] The air intake side of the heat dissipation shroud, which is also the air outlet side of the volute cooling fan, is sealed off to form a shroud cavity.

[0009] The other sides of the hood are open, forming an air inlet side, an air outlet side, and a windproof side opposite to the air inlet side;

[0010] The heat sink for laser heat dissipation is embedded in the cavity of the heat dissipation shroud, and the fins of the heat sink are perpendicular to the air inlet side and air outlet side of the heat dissipation shroud.

[0011] One side of the ventilation channel between the fins of the heat sink is connected to the air inlet side of the heat dissipation shroud, and the other side of the ventilation channel between the fins of the heat sink is connected to the air outlet side of the heat dissipation shroud.

[0012] A heat spreader plate is provided at one end of the heat sink fins; the heat spreader plate is a closed plate.

[0013] The heat spreader is located on the windproof side of the heat dissipation shroud and is set directly opposite the air inlet side of the heat dissipation shroud. The heat spreader closes one side of the shroud cavity.

[0014] The housing is provided with an air inlet and an air outlet; the air inlet and air outlet are arranged adjacent to each other and located in the same area of ​​the housing;

[0015] The air intake vents of the casing are connected to the air intake side of the volute cooling fan;

[0016] The air outlet of the casing is connected to the air outlet side of the heat dissipation shroud.

[0017] As a further improvement of this utility model, a heat pipe radiator is also provided, wherein the heat dissipation fins of the heat pipe radiator extend to the heat dissipation shroud.

[0018] The heat dissipation fin assembly is located inside the heat dissipation shroud, or the heat dissipation fin assembly is located outside the heat dissipation shroud;

[0019] The fin ventilation channels of the heat dissipation fin assembly are connected to the fin ventilation channels of the heat sink.

[0020] In a second aspect, this utility model provides a semiconductor laser hair removal device, which has a housing and a control component, a laser component, and a heat dissipation component installed inside the housing;

[0021] The heat dissipation components include a volute cooling fan and a heat dissipation shroud. The heat sink of the laser component is located inside the heat dissipation shroud, which constitutes the heat dissipation system for the laser beauty device as described above.

[0022] The laser in the laser assembly, the fan of the volute cooling fan, and the control components are connected.

[0023] As a further improvement of this utility model, the laser assembly includes a laser module formed by connecting several mini-bar lasers in series.

[0024] A single mini-bar laser has n emission points, arranged along the X-axis.

[0025] m mini-bar lasers are arranged along the Y-axis; the X-axis is orthogonal to the Y-axis;

[0026] The laser module generates an n×m output matrix;

[0027] The laser module has wires on both sides that are connected to the control component 2;

[0028] All mini-bar lasers are soldered onto an aluminum nitride substrate, which is connected to a heat spreader, which in turn is connected to a heat sink.

[0029] As a further improvement of this utility model, the light-emitting side of the laser module is provided with a light guide component, which includes a long rectangular light guide.

[0030] Furthermore, a light-diffusing glass is placed between the long rectangular light guide and the mini-bar laser.

[0031] Furthermore, one end of the long rectangular light guide is installed via a bracket, and the light-diffusing glass is embedded within the bracket;

[0032] The bracket is fixed to the heat spreader.

[0033] Furthermore, a cooling component is provided on the long rectangular light guide, and the cooling component includes a semiconductor cooler;

[0034] The cooling surface of the semiconductor cooler is attached to the surface of the long rectangular light guide, and the semiconductor cooler is connected to the control components;

[0035] The other side of the semiconductor cooler is the heating surface, which is connected to the heat pipe radiator;

[0036] The heat pipe of the heat pipe radiator is equipped with a heat dissipation fin assembly at the end of the heat pipe, which extends to the heat dissipation shroud, thus forming the heat dissipation system for laser beauty devices as described above.

[0037] Furthermore, the heating surface of the semiconductor cooler is installed inside a diffusion support, and the heat-absorbing part of the heat pipe of the heat pipe radiator is embedded inside the diffusion support.

[0038] The diffuser support is equipped with a cover plate, which presses the heat absorption part tightly inside the diffuser support.

[0039] The heat pipes extend towards the heat dissipation shroud.

[0040] Furthermore, a flexible circuit board module is provided at the working end of the long rectangular light guide;

[0041] The flexible circuit board module integrates a skin color recognition sensor, a skin contact detection device, and LED lights.

[0042] The heat dissipation system for laser beauty instruments of this utility model concentrates the two major heat sources inside the laser beauty instrument, and the heat dissipation air duct is simple and unobstructed. In addition, by combining the volute heat dissipation fan and heat dissipation shroud, the air inlet and air outlet on the shell are controlled to be only one each, and are set on the same side and adjacent to each other, thereby ensuring the integrity of the product appearance.

[0043] This novel semiconductor laser hair removal device comprises multiple mini-bar lasers connected in series to form a laser module, creating a light output matrix. Further processing via a rectangular light guide achieves a flat-top light source with uniform energy distribution. Using a specific wavelength of semiconductor laser, it penetrates the skin surface to reach the hair follicle at the root of the hair. The light energy is absorbed and converted into heat energy, destroying the hair follicle tissue and preventing hair regrowth without damaging surrounding tissue. During operation, the device can detect skin tone in real time and adjust the laser intensity for better hair removal results. This semiconductor laser hair removal device uses a single button for function switching. Attached Figure Description

[0044] Figure 1 The overall structural shape of the semiconductor laser hair removal device of this utility model Figure 1 ;

[0045] Figure 2 The overall structural shape of the laser hair removal device of this utility model Figure 2 ;

[0046] Figure 3 This is a schematic diagram of the internal structure of the semiconductor laser hair removal device of this utility model;

[0047] Figure 4 The overall structure of the laser system of this utility model Figure 1 ;

[0048] Figure 5 The overall structure of the laser system of this utility model Figure 2 ;

[0049] Figure 6 This is a schematic diagram of the overall internal structure of the heat dissipation system of the laser system of this utility model;

[0050] Figure 7 This is a front sectional view of the overall heat dissipation system of the laser system of this utility model;

[0051] Figure 8This is a schematic diagram of the overall structure of the air guide device of the heat dissipation system of this utility model;

[0052] Figure 9 A schematic diagram of the structure of the heat dissipation system of this utility model with a set of heat sinks installed in the air guide device;

[0053] Figure 10 A schematic diagram of the structure of the heat dissipation system of this utility model with two sets of heat sinks installed in the air guide device;

[0054] Figure 11 This is a schematic diagram of the core structure of the laser system of this utility model;

[0055] Figure 12 This is an internal schematic diagram of the core structure of the laser system of this utility model;

[0056] Figure 13 This is a main sectional view of the core structure of the laser system of this utility model;

[0057] Figure 14 This is a schematic diagram of the overall structure of the optical path system of the laser system of this utility model;

[0058] Figure 15 This is a schematic diagram of the overall internal structure of the optical path system of the laser system of this utility model;

[0059] Figure 16 This is a schematic diagram of the overall structure of the laser in the laser system of this utility model. Detailed Implementation

[0060] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0061] like Figure 1 , Figure 2 The diagram shown is a schematic representation of the overall structure of the semiconductor laser hair removal device of this invention. Further details regarding the internal structure can be found in the attached diagram. Figure 3 The semiconductor laser hair removal device of this utility model has a long strip structure and is equipped with a housing 1. The housing 1 is equipped with a control component 2, a laser component 3, a light guide component 4, a cooling component 5, and a heat dissipation component 6.

[0062] The housing 1 is equipped with a button 11 for starting and controlling the laser hair removal device of this utility model.

[0063] The housing 1 is provided with an air inlet 12 and an air outlet 13, which are used to work with the heat dissipation component 6. External air is drawn into the housing 1 through the air inlet 12, and then the laser component 3 and the cooling component 5 are cooled. The hot air is then discharged through the air outlet 13.

[0064] One improvement of this utility model is that it provides a heat dissipation system for laser beauty devices, which is installed in a semiconductor laser hair removal device product such as this utility model.

[0065] The laser beauty device contains a laser component 3, which contains a heat sink 35, i.e., a finned heat sink. The heat sink 35 is installed in the heat dissipation component 6, which provides efficient cooling through airflow.

[0066] In this invention, the heat dissipation component 6 employs a volute cooling fan 61. The volute cooling fan 61 draws in air through its axial opening, accelerates the air, and then directs it outwards along the tangential direction of the volute. A heat dissipation shroud 62 is provided on the exhaust side of the volute cooling fan 61. The heat dissipation shroud 62 is preferably a rectangular shroud. The air inlet side of the heat dissipation shroud 62 is the exhaust side of the volute cooling fan 61. The three sides adjacent to the air inlet side of the heat dissipation shroud 62 are closed, forming a cavity. The other three sides of the cavity are open, namely the air inlet side, the air outlet side, and the wind-blocking side opposite to the air inlet side. The heat dissipation shroud 62 can also be of other shapes. In particular, since the open surface itself has no shape limitation, and the closed surface is only used for wind blocking, it is sufficient as long as there is an air inlet side, an air outlet side, and a wind-blocking side in a relatively enclosed space. The heat sink 35 is embedded in the heat dissipation shroud 62, and the fins of the heat sink 35 are vertical. The air is directly opposite the air inlet and outlet sides of the heat sink 62, allowing air to be blown into the ventilation channel between the fins of the heat sink 35 via the air inlet side, and then blown out via the air outlet side. One side of the ventilation channel between the fins of the heat sink 35 is connected to the air inlet side of the heat sink 62, and the other side is connected to the air outlet side of the heat sink 62. One end of the fins of the heat sink 35 is provided with a heat spreader 34, which is a closed plate that absorbs heat on one side and transfers it to the fins of the heat sink 35 for heat dissipation after heat spread by itself. The heat spreader 34 is set directly opposite the air inlet side of the heat sink 62, that is, it is located on the windproof side of the heat sink 62. Therefore, the air blown out by the volute cooling fan 61 is blown into the heat sink 62 and cuts into the ventilation channel between the fins of the heat sink 35, carrying away the heat on the fins. The air is blocked by the heat spreader 34 and changes direction, blowing out longitudinally along the ventilation channel between the fins. Figure 6 , Figure 7 As shown, air enters through the air inlet 12 on the housing 1, is turned 90 degrees by the volute cooling fan 61, and is blown into the cooling shroud 62. While carrying away the heat from the fins of the heat sink 35 inside the cooling shroud 62, it is blocked by the heat spreader 34 and then turned 90 degrees again. After turning 180 degrees relative to the air inlet direction, it is blown outward and blown out of the housing 1 through the air outlet 13. Thus, the air inlet 12 and the air outlet 13 on the housing 1 can be arranged adjacent to each other and located in the same area of ​​the housing 1.

[0067] As a laser beauty device, it generally includes a cooling component 5 to generate cooling energy and simultaneously apply a cooling compress to the skin during laser treatment, providing a cooling sensation and preventing heat burns or irritation during the laser treatment process. The cooling component 5 typically uses a thermoelectric cooler (TEC), with its cooling surface attached to the cooling conductor to transfer cooling energy to the working end for skin cooling. The heating surface requires a separate heat sink to dissipate heat. To improve heat dissipation efficiency, a heat pipe heat sink is used. The heat-absorbing part 53 of the heat pipe is installed at the thermoelectric cooler 51, while the heat dissipation part of the heat pipe forms a heat dissipation fin assembly 55 that extends to the heat dissipation component 6 area, specifically located on the air outlet side of the heat sink 35. The fin ventilation channel of the heat dissipation fin assembly 55 is interconnected with the fin ventilation channel of the heat sink 35, and the fin ventilation channel of the heat dissipation fin assembly 55 is located between the air outlet side of the heat dissipation shroud 62 and the air outlet 13. Figure 6 , Figure 7 As shown, after the air is blown over the heat sink 35 and out through the air outlet 13, it is further blown into the fin ventilation channel of the heat dissipation fin assembly 55, further carrying away the heat of the heat dissipation fin assembly 55, and finally blown out of the shell 1 through the air outlet 13.

[0068] Using a heat sink 35, the heat sink can be directly attached to the laser via a heat spreader 34 for efficient heat dissipation. Using a heat pipe radiator, the heat absorption part 53 of the heat pipe can be positioned relatively far from the heat dissipation fin assembly 55 as required, and installed close to the semiconductor cooler 51. Finally, the fins of the heat sink 35 and the heat dissipation fin assembly 55 of the heat pipe radiator are stacked and installed, so that the ventilation channels of the two sets of fins are connected. The cooling air generated by a volute cooling fan 61 can blow through the two sets of radiators at the same time to dissipate heat from both sets of radiators, thereby improving the heat dissipation efficiency.

[0069] Another improvement of this invention is that a laser module formed by connecting mini-bar lasers in series is used to form a semiconductor laser hair removal device.

[0070] Laser component 3, specifically as follows Figure 16 As shown, a laser module is formed by connecting several mini-bar lasers 31 in series; each mini-bar laser 31 has multiple light-emitting points, and the several mini-bar lasers 31 are arranged at equal intervals; the n light-emitting points of a single mini-bar laser are arranged along the X-axis; the m mini-bar lasers are arranged along the Y-axis; the X-axis and Y-axis are orthogonal; when the laser module is powered on and working simultaneously, an n×m light-emitting matrix is ​​formed.

[0071] The laser module has wires 32 on both sides, which are connected to the control component 2 to supply power to the mini-bar laser 31 so that it can emit light.

[0072] All mini-bar lasers 31 are simultaneously welded onto an aluminum nitride substrate 33, and then bonded to a heat spreader 34 with thermally conductive silver paste. The heat spreader 34 is connected to a heat sink 35. The heat generated by the mini-bar lasers 31 during operation is absorbed by the heat spreader 34 and dispersed to the surrounding area, and then transferred to the fins of the heat sink 35 on the other side. Combined with the heat dissipation system, efficient heat dissipation is achieved to ensure the ambient temperature and output power of the laser module during operation.

[0073] The laser module, composed of mini-bar laser 31, has a light guide component 4 on its light-emitting side. The light guide component 4 mainly includes a long rectangular light guide 41, which is a long rectangular body made of sapphire glass or quartz glass. It can shape the n×m light output matrix emitted by the laser module to achieve a flat-top light source with uniform output energy distribution, so that the laser can act on the skin hair follicles to a deeper depth, with better effect and better comfort.

[0074] Furthermore, a homogenizing glass 42 is provided between the elongated rectangular light guide 41 and the mini-bar laser 31. The homogenizing glass 42 first homogenizes the output beam matrix, so that the beam entering the elongated rectangular light guide 41 is diffused and shaped. At the same time, the homogenizing glass 42 can also isolate the heat of the mini-bar laser 31 during operation, preventing the elongated rectangular light guide 41 from being directly close to it and heated.

[0075] like Figure 14 , Figure 15 As shown, one end of the long rectangular light guide 41 is installed through the bracket 43, and the uniform light glass 42 is also embedded in the bracket 43. The bracket 43 is also fixed on the heat spreader 34, so that the position and distance of the long rectangular light guide 41 and the uniform light glass 42 relative to the laser module composed of the mini-bar laser 31 are fixed, thereby finally obtaining a stable and reliable laser beam matrix output.

[0076] The other end of the long rectangular light guide 41 is installed on the end opening of the housing 1 to form the working end 411.

[0077] Because the elongated rectangular light guide 41 is in direct contact with the skin, a cooling component 5 is also provided on the elongated rectangular light guide 41 to alleviate the burning sensation on the skin during laser hair removal. Figure 11 , Figure 12 , Figure 13As shown, the cooling component 5 includes a semiconductor cooler 51. The cooling surface of the semiconductor cooler 51 is attached to the surface of the elongated rectangular light guide 41 and is positioned close to the working end 411. The semiconductor cooler 51 is connected to the control component 2. After being powered on, it generates cooling on the cooling surface and transfers it to the elongated rectangular light guide 41 to cool it. This not only counteracts the heat generated and radiated to the elongated rectangular light guide 41 when the mini-bar laser 31 is working, but more importantly, it reduces the temperature of the elongated rectangular light guide 41, so that when the working end 411 comes into contact with the skin, it continuously provides a cool sensation to the skin, eliminating the burning sensation and providing a better hair removal experience.

[0078] The other side of the cooling surface of the semiconductor cooler 51 is the heating surface. The heating surface is installed in the diffusion bracket 52. The heat absorption part 53 of the heat pipe of the heat pipe radiator is embedded in the diffusion bracket 52, and the heat absorption part 53 is pressed into the diffusion bracket 52 by the cover plate 54. The heat pipe extends to the heat dissipation shroud 62 and is provided with heat dissipation fins 55 to conduct the heat generated by the semiconductor cooler 51 during operation into the heat dissipation system for efficient heat dissipation to ensure the stable operation of the semiconductor cooler 51.

[0079] like Figure 1 , Figure 4 As shown, a flexible printed circuit board module 26 (FPC) is provided at the working end 411 of the long rectangular light guide 41. The module integrates a skin color recognition sensor, a skin contact detection device, LED lights, etc., to control the working process of the semiconductor laser hair removal device of this utility model.

[0080] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A heat dissipation system for a laser cosmetic device, characterized in that, The volute heat dissipation fan and the heat dissipation fan cover are included. The volute heat dissipation fan sucks air from the axial direction of the fan, and the air is accelerated by the fan and blown out along the tangent direction of the volute. The heat dissipation fan cover is arranged on the air outlet side of the volute heat dissipation fan. The air inlet side of the heat dissipation fan cover, that is, the air outlet side of the volute heat dissipation fan, is closed to the face connected with the air inlet side of the heat dissipation fan cover, forming a cover cavity. The other faces of the cover cavity are open, respectively forming an air inlet side, an air outlet side, and a wind blocking side opposite to the air inlet side. The heat sink for laser heat dissipation is embedded in the cover cavity of the heat dissipation fan cover, and the fins of the heat sink are perpendicular to the air inlet side and the air outlet side of the heat dissipation fan cover. One side of the fin-to-fin air passage of the heat sink is connected with the air inlet side of the heat dissipation fan cover, and the other side of the fin-to-fin air passage of the heat sink is connected with the air outlet side of the heat dissipation fan cover. One end of the fins of the heat sink is provided with a heat spreading plate, and the heat spreading plate is a closed plate. The heat spreading plate is located on the wind blocking side of the heat dissipation fan cover and is arranged opposite to the air inlet side of the heat dissipation fan cover, and the heat spreading plate closes one side of the cover cavity. The housing is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are arranged adjacent to each other and located in the same region of the housing. The air inlet hole of the housing is connected with the air inlet side of the volute heat dissipation fan. The air outlet hole of the housing is connected with the air outlet side of the heat dissipation fan cover.

2. The heat dissipation system for laser cosmetic instrument according to claim 1, wherein, The heat dissipation fin group of the heat pipe radiator extends to the heat dissipation fan cover. The heat dissipation fin group is located in the heat dissipation fan cover, or the heat dissipation fin group is located outside the heat dissipation fan cover. The fin-to-fin air passage of the heat dissipation fin group is connected with the fin-to-fin air passage of the heat sink.

3. A semiconductor laser hair removal device, characterized in that The housing is provided with a control assembly, a laser assembly, and a heat dissipation assembly. The heat dissipation assembly includes a volute heat dissipation fan and a heat dissipation fan cover, and the heat sink of the laser assembly is located in the heat dissipation fan cover, that is, the heat dissipation system for the laser beauty instrument as claimed in claim 1 is formed. The laser of the laser assembly and the fan of the volute heat dissipation fan are connected with the control assembly.

4. The semiconductor laser hair removal device according to claim 3, wherein the semiconductor laser hair removal device is a semiconductor laser hair removal device for home use. The laser assembly includes a laser module formed by a plurality of mini-bar lasers connected in series. Each mini-bar laser has n light emitting points and is arranged along the X-axis direction. m mini-bar lasers are arranged along the Y-axis direction, and the X-axis and the Y-axis are perpendicular to each other. The laser module generates an n×m light emitting matrix. The laser module is provided with lead wires on both sides and is connected with the control assembly. All the mini-bar lasers are welded on an aluminum nitride substrate, the aluminum nitride substrate is connected with the heat spreading plate, and the heat spreading plate is connected with the heat sink.

5. The semiconductor laser hair removal device according to claim 4, wherein the semiconductor laser hair removal device is a semiconductor laser hair removal device for home use. The light emitting side of the laser module is provided with a light guide assembly, and the light guide assembly includes a long strip-shaped light guide.

6. The semiconductor laser hair removal device of claim 5, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 810 nm. Uniform light glass is arranged between the long strip-shaped light guide and the mini-bar laser.

7. The semiconductor laser hair removal device of claim 6, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 800 nm. One end of the long strip-shaped light guide is mounted through a bracket, and the uniform light glass is embedded in the bracket. The bracket is fixed on the heat spreading plate.

8. The semiconductor laser hair removal device of claim 5, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 810 nm. A refrigeration assembly is arranged on the long strip-shaped light guide, and the refrigeration assembly includes a semiconductor refrigerator. The refrigeration surface of the semiconductor refrigerator is attached to the surface of the long strip-shaped light guide, and the semiconductor refrigerator is connected with the control assembly. The other surface of the semiconductor refrigerator is a heating surface, and the heating surface is connected with the heat pipe radiator. The heat pipe of the heat pipe radiator is provided with a heat dissipation fin group at the end, and the heat dissipation fin group extends to the heat dissipation fan cover, that is, the heat dissipation system for the laser beauty instrument as claimed in claim 2 is formed.

9. The semiconductor laser hair removal device of claim 8, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 800 nm. The heat generating surface of the semiconductor refrigerator is installed in a diffusion support, and the heat absorption part of the heat pipe of the heat pipe radiator is embedded in the diffusion support; A cover plate is arranged on the diffusion support, and the cover plate presses the heat absorption part in the diffusion support; The heat pipe extends to the side of the heat dissipation fan cover.

10. The semiconductor laser hair removal device of claim 5, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 810 nm. A flexible circuit board module is arranged at the working end of the long rectangular light guide; The flexible circuit board module is integrated with a skin color recognition sensor, a skin contact detection device and an LED light.

Citation Information

Patent Citations

  • Handheld household laser cosmetic instrument

    CN111557731A