Top heat insulation XPS insulation board for high-rise building

Abstract

The utility model discloses a top heat insulation XPS insulation board for a high-rise building, and relates to the field of XPS insulation boards. The thermal insulation board comprises a thermal insulation board body, a bottom mortar layer is laid below the thermal insulation board body, a top mortar layer is laid above the thermal insulation board body, a plurality of connecting mechanisms are arranged on the thermal insulation board body, and fixing rods penetrate through the bottom mortar layer, the thermal insulation board body and the top mortar layer through the connecting mechanisms. The whole thermal insulation layer forms a stable integral structure, the fixed plate and the bottom mortar layer are embedded and fixed, the bottom stability of the connecting mechanism is ensured, meanwhile, the movable plate is clamped with the clamping groove in the fixed rod through the clamping piece and is embedded and fixed with the top mortar layer, the construction process is simplified, and the construction efficiency is improved. In addition, the traditional anchor bolt fixing and steel wire mesh laying process is replaced, in this way, material loss is reduced, the laying construction convenience of the heat preservation plate is improved, and the whole heat preservation layer is more efficient and firmer to install.

Description

Technical Field

[0001] This utility model relates to the field of XPS insulation boards, specifically an XPS insulation board for roof insulation of high-rise buildings. Background Technology

[0002] Using XPS insulation boards for roof insulation in high-rise buildings is an efficient and reliable insulation solution. XPS insulation boards are an ideal choice for high-rise building insulation due to their excellent thermal insulation performance, strong waterproof and moisture-proof capabilities, high compressive strength, lightweight and easy construction characteristics, as well as good durability and environmental recyclability. Using XPS insulation boards can effectively improve building energy efficiency, protect the roof structure, beautify the environment, and reduce noise.

[0003] During the construction of existing XPS roof insulation boards, a layer of wire mesh structure is usually laid on top of the insulation layer and covered with mortar. This operation can improve the overall structure stability of the insulation layer formed by splicing multiple insulation boards. However, in practice, laying the wire mesh layer takes a lot of time and has the disadvantages of being difficult to lay and consuming a lot of materials, which reduces the construction efficiency of the roof insulation layer. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a roof insulation XPS insulation board for high-rise buildings, so as to solve the technical problems of long time, high difficulty and high material consumption in the construction of roof XPS insulation board.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a top thermal insulation XPS insulation board for high-rise buildings, comprising an insulation board, a bottom mortar layer laid below the insulation board, a top mortar layer laid above the insulation board, and a plurality of connecting mechanisms provided on the insulation board for reinforcing connection of the bottom mortar layer, the insulation board, and the top mortar layer. Each connecting mechanism includes a fixing rod, a fixing plate fixedly connected to the bottom end of the fixing rod, and a movable plate engaged with the outer periphery of the top end of the fixing rod.

[0006] By adopting the above technical solution, this embodiment effectively improves the top thermal insulation performance of high-rise buildings, reduces energy consumption, and improves living comfort by setting insulation boards as the main thermal insulation material. At the same time, the bottom mortar layer and the top mortar layer are laid on the top and bottom of the insulation board, respectively, which enhances the bonding force between the insulation board and the building base and upper structure, and improves the stability of the overall structure.

[0007] Furthermore, the fixing plate is embedded and fixed within the bottom mortar layer, and the movable plate is embedded and fixed within the top mortar layer.

[0008] By adopting the above technical solution, it is ensured that the connecting mechanism can be stably installed under the insulation board, effectively preventing the insulation layer from shifting or falling off due to external forces.

[0009] Furthermore, a slot is provided on the upper outer side of the fixing rod, and a through groove is provided on one side of the fixing rod opposite to the slot.

[0010] By adopting the above technical solution, a locking space is provided for the movable plate, which can be firmly installed on the top of the fixed rod, thereby enhancing the overall stability of the connection mechanism.

[0011] Furthermore, a through hole is provided at the central axis of the movable plate, and a guide surface is formed at the end of the fixed rod near the movable plate.

[0012] By adopting the above technical solution, the through hole provides a channel for the fixed rod to pass through, making it easier to install the connecting mechanism on the insulation board. At the same time, the guide surface formed near the end of the fixed rod near the movable plate provides guidance for the installation of the movable plate, allowing the movable plate to be more smoothly engaged with the fixed rod, thus improving the installation efficiency and accuracy of the connecting mechanism.

[0013] Furthermore, a card is fixedly installed inside the through hole, and the fixing rod engages with the movable plate through the card and the slot.

[0014] By adopting the above technical solution, a reliable connection point is provided for the engagement between the movable plate and the fixed rod, which enhances the overall stability of the connection mechanism. The tight fit between the card and the slot ensures that the movable plate will not easily fall off or shift when subjected to external force, thereby improving the compressive strength and safety of the insulation layer.

[0015] Furthermore, the surface of the insulation board has several grooves at equal intervals, and a waterproof layer is laid between the bottom mortar layer and the building base layer.

[0016] By adopting the above technical solution, the adhesion between the insulation board and the mortar layer is enhanced, allowing the insulation layer to be more firmly bonded to the building base, improving the overall structural stability. The grooves also allow the mortar to better penetrate into the gaps of the insulation board, forming a tighter connection and enhancing the thermal insulation and waterproof performance of the insulation layer.

[0017] In summary, the present invention has the following main advantages:

[0018] This utility model utilizes a connecting mechanism where a fixing rod penetrates the bottom mortar layer, the insulation board, and the top mortar layer, forming a stable overall structure for the entire insulation layer. The fixing plate is embedded and fixed within the bottom mortar layer, ensuring the stability of the bottom of the connecting mechanism. Simultaneously, the movable plate engages with the slot on the fixing rod via a clip and is embedded and fixed within the top mortar layer. This not only simplifies the construction process but also replaces the traditional anchor bolt fixing and wire mesh laying process. This method not only reduces material waste but also improves the ease of laying the insulation board, making the installation of the entire insulation layer more efficient and stable. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the arrangement structure of the connecting mechanism of this utility model;

[0022] Figure 4 This is an exploded structural diagram of the connecting mechanism of this utility model.

[0023] In the diagram: 1. Insulation board; 2. Bottom mortar layer; 3. Waterproof layer; 4. Top mortar layer; 5. Connecting mechanism; 501. Fixing rod; 502. Slot; 503. Through slot; 504. Guide surface; 505. Fixing plate; 506. Movable plate; 507. Through hole; 508. Card; 6. Groove. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0025] Example 1:

[0026] XPS insulation board for roof insulation in high-rise buildings, such as Figure 1-4As shown, the structure includes an insulation board 1, a bottom mortar layer 2 laid beneath the insulation board 1, and a top mortar layer 4 laid above the insulation board 1. Several connecting mechanisms 5 are provided on the insulation board 1 for reinforcing the connection between the bottom mortar layer 2, the insulation board 1, and the top mortar layer 4. Each connecting mechanism 5 includes a fixing rod 501, with a fixing plate 505 fixedly connected to the bottom end of the fixing rod 501 and a movable plate 506 engaged with the outer periphery of the top end of the fixing rod 501. This embodiment effectively improves the thermal insulation performance of high-rise buildings by using the insulation board 1 as the primary insulation material. The top insulation performance reduces energy consumption and improves living comfort. At the same time, the bottom mortar layer 2 and the top mortar layer 4 are laid on the top and bottom of the insulation board 1, respectively, which enhances the adhesion between the insulation board and the base layer and the upper structure, and improves the stability of the overall structure. In particular, the design of the connecting mechanism 5, through the cooperation of the fixing rod 501, the fixing plate 505 and the movable plate 506, realizes a firm connection between the bottom mortar layer 2, the insulation board 1 and the top mortar layer 4, further improving the structural safety and durability of the insulation layer.

[0027] See Figure 1 , Figure 2 , Figure 3 , Figure 4 The fixed plate 505 is embedded and fixed to the bottom mortar layer 2, and the movable plate 506 is embedded and fixed to the top mortar layer 4. This ensures that the connecting mechanism 5 can be stably installed under the insulation board 1, effectively preventing the insulation layer from shifting or falling off due to external forces. At the same time, the embedded fixing of the movable plate 506 to the top mortar layer 4 not only enhances the connection strength between the top mortar layer 4 and the insulation board 1, but also allows the entire insulation layer to distribute pressure more evenly when subjected to external forces, improving the compressive strength and stability of the insulation layer. This embedded fixing design makes the installation of the insulation layer more secure and reliable, and extends its service life.

[0028] See Figure 4 A slot 502 is provided on the upper outer side of the fixing rod 501, and a through groove 503 is provided on one side of the fixing rod 501 opposite to the slot 502. This provides space for the movable plate 506 to engage, allowing the movable plate 506 to be firmly installed on the top of the fixing rod 501, thus enhancing the overall stability of the connecting mechanism 5. At the same time, the through groove 503 facilitates the adjustment of the position of the movable plate 506 during installation, making the installation of the connecting mechanism 5 more flexible and convenient. This combination of slot 502 and through groove 503 not only improves the installation efficiency of the connecting mechanism 5, but also ensures that the insulation layer can withstand pressure more stably when subjected to external forces, thereby improving the overall performance of the insulation layer.

[0029] See Figure 4A through hole 507 is provided at the central axis of the movable plate 506, and a guide surface 504 is formed at the end of the fixing rod 501 near the movable plate 506. The through hole 507 provides a channel for the fixing rod 501 to pass through, so that the connecting mechanism 5 can be installed on the insulation board 1 more conveniently. At the same time, the guide surface 504 formed at the end of the fixing rod 501 near the movable plate 506 provides guidance for the installation of the movable plate 506, so that the movable plate 506 can be more smoothly engaged with the fixing rod 501, improving the installation efficiency and accuracy of the connecting mechanism 5. This design combination of through hole 507 and guide surface 504 not only simplifies the installation process of the connecting mechanism 5, but also enhances the overall stability and durability of the insulation layer.

[0030] See Figure 3 , Figure 4 A card 508 is fixedly installed on the inner side of the through hole 507. The fixing rod 501 engages with the movable plate 506 through the card 508 and the slot 502, providing a reliable connection point for the engagement between the movable plate 506 and the fixing rod 501, thus enhancing the overall stability of the connecting mechanism 5. The tight fit between the card 508 and the slot 502 ensures that the movable plate 506 will not easily fall off or shift when subjected to external force, improving the compressive strength and safety of the insulation layer. At the same time, this engaging connection method also makes the installation of the connecting mechanism 5 simpler and faster, reducing construction difficulty and cost.

[0031] Example 2:

[0032] See Figure 1 , Figure 2 , Figure 3 The insulation board 1 has several grooves 6 evenly spaced on its surface. A waterproof layer 3 is laid between the bottom mortar layer 2 and the building base layer, which enhances the adhesion between the insulation board and the mortar layer, allowing the insulation layer to be more firmly attached to the building base layer and improving the overall structural stability. The presence of the grooves 6 also allows the mortar to better penetrate into the gaps of the insulation board, forming a tighter connection and enhancing the thermal insulation and waterproof performance of the insulation layer. At the same time, the waterproof layer 3 laid between the bottom mortar layer 2 and the building base layer effectively prevents moisture from penetrating into the insulation layer and other parts, protecting the insulation board and the building from moisture damage and extending the service life of the insulation layer.

[0033] The implementation principle of this embodiment is as follows: Insulation board 1 serves as the main insulation material, with a bottom mortar layer 2 laid beneath it to enhance adhesion to the building substrate. A waterproof layer 3 is installed between the bottom mortar layer 2 and the building substrate to prevent moisture penetration. A top mortar layer 4 is laid on top of the insulation board 1 to further improve the stability of the insulation layer. To reinforce the connection between the bottom mortar layer 2, the insulation board 1, and the top mortar layer 4, a connecting mechanism 5 is specially designed. The connecting mechanism 5 consists of a fixed rod 501, a fixed plate 505, and a movable plate. Composed of components such as 506, the fixing rod 501 penetrates the bottom mortar layer 2, the insulation board 1, and the top mortar layer 4. The fixing plate 505 is embedded and fixed in the bottom mortar layer 2. The movable plate 506 engages with the slot 502 on the fixing rod 501 through the card 508 and is embedded and fixed in the top mortar layer 4, thus forming a stable overall structure. This can replace the traditional process of anchor bolt fixing and wire mesh laying, reduce material waste, improve the ease of construction of the insulation board, and ensure the structural stability and heat insulation performance of the insulation layer.

[0034] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A top thermal insulation XPS board for high-rise buildings, characterized by: The application relates to a heat insulation board (1), a bottom mortar layer (2) is laid under the heat insulation board (1), a top mortar layer (4) is laid above the heat insulation board (1), a plurality of connecting mechanisms (5) are arranged on the heat insulation board (1) and used for reinforcing connection of the bottom mortar layer (2), the heat insulation board (1) and the top mortar layer (4), the connecting mechanism (5) comprises a fixing rod (501), a fixing plate (505) is fixedly connected to the bottom end of the fixing rod (501), and a movable plate (506) is clamped and connected to the outer periphery of the top end of the fixing rod (501).

2. The top thermal insulation XPS board for high-rise buildings according to claim 1, characterized in that: The fixing plate (505) is inlaidly fixed to the bottom mortar layer (2), and the movable plate (506) is inlaidly fixed to the top mortar layer (4).

3. The top thermal insulation XPS board for high-rise buildings according to claim 1, characterized in that: A clamping groove (502) is formed on the outer side of the fixing rod (501), and a through groove (503) is formed on one side of the fixing rod (501) and opposite to the clamping groove (502).

4. The top thermal insulation XPS board for high-rise buildings according to claim 1, characterized in that: A through hole (507) is formed at the central axis of the movable plate (506), and a guide surface (504) is formed on one end of the fixing rod (501) close to the movable plate (506).

5. The top thermal insulation XPS board for high-rise buildings according to claim 4, characterized in that: A clamping piece (508) is fixedly arranged on the inner side of the through hole (507), and the fixing rod (501) is clamped with the movable plate (506) through the clamping piece (508) and the clamping groove (502).

6. The top thermal insulation XPS board for high-rise buildings according to claim 1, characterized in that: A plurality of grooves (6) are equidistantly formed on the surface of the heat insulation board (1), and a waterproof layer (3) is laid between the bottom mortar layer (2) and a house base layer.

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