Wafer side surface detection device

Abstract

The utility model relates to a wafer side surface detection device. The wafer side face detection device is used for detecting the edge of a wafer and comprises a rack; the bearing assembly is fixedly arranged on the rack, and the bearing assembly is provided with a bearing hole for bearing a wafer; the moving device is arranged below the bearing hole, the moving device comprises a three-axis translation assembly, a T-axis rotation assembly and an adsorption assembly used for adsorbing wafers, the three-axis translation assembly is installed on the rack, the T-axis rotation assembly is arranged on the three-axis translation assembly, and the adsorption assembly is arranged on the T-axis rotation assembly; the edge detection device comprises an upper edge detection assembly and a lower edge detection assembly, and the upper edge detection assembly and the lower edge detection assembly are oppositely arranged on the rack in the vertical direction; and the electric control device is electrically connected to the movement device and the edge detection device.

Description

[0001] This application claims priority to Chinese Patent Application No. 2024232371396, filed on December 26, 2024, entitled "Wafer Side Inspection Apparatus and Automatic Wafer Inspection Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This utility model relates to the field of wafer inspection equipment technology, and in particular to a wafer side inspection device. Background Technology

[0003] During the wafer manufacturing process, defects such as contaminants, debris, cracks, and delamination can occur at the wafer edge. Some defective wafers flow into the chip fabrication area, resulting in a significant decrease in chip yield. Therefore, in order to improve the product qualification rate, it is currently necessary to use automated optical inspection (AOI) equipment to inspect the wafer edge in a timely manner to detect defective wafers.

[0004] Current automated optical inspection (AOI) equipment faces challenges in wafer edge inspection due to the misalignment between the wafer's center and rotation center. This necessitates the addition of real-time focusing axes to each optical system, resulting in high costs and a complex focusing process. Furthermore, the wafer's edges warp after being attracted, affecting the focusing accuracy of the inspection equipment. Utility Model Content

[0005] Therefore, it is necessary to provide a wafer side inspection device to address the problem of deviation between the wafer center and the rotation center when existing automatic optical inspection equipment performs wafer edge inspection.

[0006] A wafer side inspection device for inspecting the edge of a wafer, comprising:

[0007] frame;

[0008] A receiving assembly, fixed to the frame, having receiving holes for receiving wafers;

[0009] A motion device is disposed below the receiving hole. The motion device includes a three-axis translation component, a T-axis rotation component, and an adsorption component for adsorbing wafers. The three-axis translation component is mounted on the frame, the T-axis rotation component is disposed on the three-axis translation component, and the adsorption component is disposed on the T-axis rotation component.

[0010] An edge detection device, comprising an upper edge detection component and a lower edge detection component, wherein the upper edge detection component and the lower edge detection component are disposed opposite to each other in a vertical direction on the frame; and

[0011] An electronic control device is electrically connected to the motion device and the edge detection device.

[0012] In one embodiment, the edge detection device further includes an upper arc surface detection component, a lower arc surface detection component, and a cylindrical surface detection component. The upper arc surface detection component and the lower arc surface detection component are respectively inclinedly disposed on the upper and lower sides of the cylindrical surface detection component, and the included angle between the upper arc surface detection component and the cylindrical surface detection component is equal to the included angle between the lower arc surface detection component and the cylindrical surface detection component.

[0013] In one embodiment, the upper edge detection component is slidably disposed on the frame; the upper arc surface detection component is slidably disposed on the frame; the cylindrical surface detection component is slidably disposed on the frame; the edge detection device further includes an upper edge focusing component, an upper arc surface focusing component, and a cylindrical surface focusing component, wherein the upper edge focusing component is fixed to the frame and tractably connected to the upper edge detection component; the upper arc surface focusing component is fixed to the frame and tractably connected to the upper arc surface detection component; and the cylindrical surface focusing component is fixed to the frame and tractably connected to the cylindrical surface detection component.

[0014] In one embodiment, the receiving assembly includes a pair of receiving platforms and a plurality of receiving blocks, the receiving platforms being fixed at intervals to the frame to form the receiving hole between the two receiving platforms, the receiving blocks being fixed at intervals to the receiving platforms respectively, and the motion device being disposed between the two receiving platforms.

[0015] In one embodiment, the wafer side inspection device further includes an edge re-judgment device, the edge re-judgment device including a re-judgment component slidably disposed on the rack and located above the receiving hole and a re-judgment focusing component fixed to the rack, the re-judgment focusing component being tractably connected to the re-judgment component.

[0016] In one embodiment, the edge verification device further includes a height sensor disposed below the verification component.

[0017] In one embodiment, the frame includes a support frame and a marble platform fixed to the support frame, wherein the motion device, the receiving component, and the edge detection device are all fixed to the marble platform.

[0018] In one embodiment, the frame further includes a plurality of vibration damping pads spaced apart between the support frame and the marble table. These pads absorb impacts transmitted from the support frame and isolate external vibrations.

[0019] In one embodiment, the wafer side inspection device further includes a light source fixed to the receiving component.

[0020] In one embodiment, the wafer side inspection device further includes an outer cover, the electronic control device being fixed to the outer cover, and the outer cover being detachably connected to the rack.

[0021] The wafer side inspection device of this application can detect the edge image of the upper edge surface of the wafer through the upper edge detection component or the edge image of the lower edge surface of the wafer through the lower edge detection component. Based on the change of the edge image of the wafer in the field of view relative to the center of the field of view of the edge detection component, the difference between the center of the wafer and the rotation center of the T-axis rotation component in the X-axis and Y-axis directions is calculated as the compensation value of the X-axis and Y-axis. Based on the compensation value of the X-axis and Y-axis, the position of the rotation center of the T-axis is adjusted by the three-axis translation component. The device can be calibrated in one step to make the rotation center of the T-axis rotation component coincide with the center of the wafer. This reduces the number of focusing axes in the optical inspection system and simplifies the complex focusing procedure, saves hardware costs, and improves inspection efficiency.

[0022] The wafer side inspection device of this application can calculate the angular position relationship between the Notch mark of the wafer and the T-axis origin; record the edge warping value through a height sensor, establish the coordinate relationship between the rotation angle value and the edge warping value, and use it as the Z-axis height compensation value; when the T-axis rotation component drives the wafer to rotate into the next revolution and rotates to a known angle, the three-axis translation component can retrieve the height compensation value corresponding to the angle. The rotational motion of the T-axis rotation component and the height compensation motion of the three-axis translation component interpolate each other, thereby ensuring that the edge of the wafer is always within the clear imaging range of the edge detection component, improving the detection accuracy and detection efficiency of the wafer side inspection device.

[0023] The wafer side inspection device of this application can record the X-axis position, Y-axis position, Z-axis height of the wafer center during wafer inspection of a certain type of machine, as well as the position information of the upper edge detection component and the upper arc surface detection component. It establishes the XYZ axis of the wafer of a certain type of machine and the position information of the upper edge detection component and the upper arc surface detection component, which facilitates the subsequent switching of wafers of different types of machines. The system can automatically load the information and realize rapid switching of machine types. Attached Figure Description

[0024] Figure 1 A perspective view of an automated wafer inspection device provided in one embodiment of this application;

[0025] Figure 2 A perspective view of a wafer side inspection device provided in one embodiment of this application;

[0026] Figure 3A schematic diagram of the internal structure of a wafer side inspection apparatus according to the above embodiments of this application is shown;

[0027] Figure 4 A schematic diagram of the motion device structure of the wafer side inspection apparatus according to the above embodiments of this application is shown;

[0028] Figure 5 A schematic diagram of the structure of the upper edge detection component and the lower edge detection component of the wafer side inspection apparatus according to the above embodiments of this application is shown;

[0029] Figure 6 A schematic diagram of the structure of the support component of the wafer side inspection apparatus according to the above embodiments of this application is shown;

[0030] Figure 7 A schematic diagram of the edge of a wafer detected by the wafer side inspection apparatus according to the above embodiments of this application is shown;

[0031] Figure 8 A schematic diagram of the structure of the upper arc surface detection component, the lower arc surface detection component, and the cylindrical surface detection component of the wafer side surface inspection apparatus according to the above embodiments of this application is shown.

[0032] Figure 9 A schematic diagram of the edge judgment device of the wafer side inspection apparatus according to the above embodiments of this application is shown.

[0033] Reference numerals: 10. Wafer side inspection device; 11. Frame; 111. Support frame; 112. Marble table; 1121. Table surface; 1122. First column; 1123. Second column; 113. Vibration isolation pad; 12. Receiving assembly; 121. Receiving hole; 122. Receiving platform; 123. Receiving block; 13. Motion device; 131. Three-axis translation assembly; 1311. X-axis translation assembly; 1312. Y-axis translation assembly; 1313. Z-axis translation assembly; 132. T-axis rotation assembly; 133. Adsorption assembly; 14. Edge detection device; 141. Upper edge detection... 142. Lower edge detection component; 143. Upper arc surface detection component; 144. Lower arc surface detection component; 145. Cylindrical surface detection component; 146. Upper edge focusing component; 147. Upper arc surface focusing component; 148. Cylindrical surface focusing component; 15. Electronic control device; 16. Edge re-judgment device; 161. Re-judgment component; 162. Re-judgment focusing component; 163. Height sensor; 17. Light source; 18. Outer cover; 20. Wafer handling equipment; 30. Wafer; 31. Upper edge surface; 32. Lower edge surface; 33. Upper arc surface; 34. Lower arc surface; 35. Cylindrical surface. Detailed Implementation

[0034] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0035] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0040] To address the issue of wafer center-rotation center misalignment in existing automated optical inspection equipment during wafer edge inspection, this application provides a wafer side inspection device. This device can calibrate both the wafer center and rotation center simultaneously, eliminating the need for real-time focusing during inspection. This reduces the number of focusing axes in the optical inspection system, simplifies complex focusing procedures, and saves hardware costs.

[0041] Specifically, please refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 The wafer side inspection device 10 of this application may include a frame 11, a motion device 13, a receiving assembly 12, an edge detection device 14, and an electrical control device 15. The receiving assembly 12 is fixed to the frame 11 and has a receiving hole 121 for receiving the wafer 30.

[0042] The motion device 13 is disposed below the receiving hole 121. The motion device 13 may include a three-axis translation component 131, a T-axis rotation component 132, and an adsorption component 133. The three-axis translation component 131 is mounted on the frame 11, the T-axis rotation component 132 is disposed on the three-axis translation component 131, and the adsorption component 133 is disposed on the T-axis rotation component 132 for adsorbing the wafer 30. When the T-axis rotation component 132 is driven by the three-axis translation component 131 to translate upward along the Z-axis, the adsorption component 133 is driven to translate upward along the Z-axis as well and picks up the wafer 30 from the receiving component 12, raising the wafer 30 to the imaging height of the edge detection device 14. When the T-axis rotation component 132 is driven by the three-axis translation component 131 to translate downward along the Z-axis, the adsorption component 133 is driven to translate downward along the Z-axis as well and places the wafer 30 on the receiving component 12.

[0043] The edge detection device 14 includes an upper edge detection component 141 and a lower edge detection component 142, which are disposed opposite to each other in the vertical direction on the rack 11. The upper edge detection component 141 can detect the upper edge surface 31 of the wafer 30, and the lower edge detection component 142 can detect the lower edge surface 32 of the wafer 30. The electronic control device 15 is electrically connected to the motion device 13 and the edge detection device 14. The electronic control device can control the movement of the motion device 13 according to the change of the edge image of the wafer 30 detected by the edge detection device 14 relative to the center of the edge detection device 14.

[0044] Understandably, after the wafer 30 is loaded, the three-axis translation component 131 can drive the T-axis rotation component 132 to rise along the Z-axis, causing the adsorption component 133 to pick up the wafer 30 from the receiving component 12 to the imaging height of the edge detection device 14; the T-axis rotation component 132 drives the adsorption component 133 to rotate, causing the wafer 30 to start rotating; the edge image of the upper edge surface 31 of the wafer 30 detected by the upper edge detection component 141 or the edge image of the lower edge surface 32 of the wafer 30 detected by the lower edge detection component 142 is used to determine the edge of the wafer 30 in the field of view. The image changes relative to the field of view center of the edge detection component. The differences in the X-axis and Y-axis directions between the center of the wafer 30 and the rotation center of the T-axis rotation component 132 are calculated and used as compensation values ​​for the X-axis and Y-axis. The T-axis rotation component 132 is driven to descend along the Z-axis by the three-axis translation component 131, so that the adsorption component 133 is lowered to a safe position and the wafer 30 is placed back on the receiving component 12. According to the compensation values ​​of the X-axis and Y-axis, the T-axis is translated along the X-axis and Y-axis directions by the three-axis translation component, so that the rotation center of the T-axis rotation component 132 coincides with the center of the wafer 30.

[0045] In this way, by adjusting the position of the rotation center of the T-axis using the three-axis translation component 131, the rotation center of the T-axis rotation component 132 can be calibrated in one go, so that the rotation center of the T-axis rotation component 132 coincides with the center of the wafer 30. This reduces the number of focusing axes in the optical inspection system and simplifies the complex focusing procedure, saves hardware costs, and improves inspection efficiency.

[0046] More specifically, such as Figure 6 As shown, in some embodiments, the three-axis translation assembly 131 may include an X-axis translation assembly, a Y-axis translation assembly, and a Z-axis translation assembly. The X-axis translation assembly is disposed on the frame 11, the Y-axis translation assembly is disposed on the X-axis translation assembly, and the X-axis translation assembly can drive the Y-axis translation assembly to move along the X-axis; the Z-axis translation assembly is disposed on the Y-axis translation assembly, and the Y-axis translation assembly can drive the Z-axis translation assembly to move along the Y-axis; the T-axis rotation assembly 132 is disposed on the Z-axis translation assembly, and the Z-axis translation assembly can drive the T-axis rotation assembly 132 to move along the Z-axis; the adsorption assembly 133 is disposed on the T-axis rotation assembly 132 and is used to adsorb the wafer 30. The T-axis rotation assembly 132 can drive the adsorption assembly 133 to rotate, thereby driving the wafer 30 to rotate, so that the edge detection device 14 can perform cyclic detection on the edge of the wafer 30.

[0047] Furthermore, such as Figure 7 As shown, since there are multiple detection surfaces in the edge region of wafer 30, and the normal angle of each detection surface is different, it is difficult to complete the detection of the edge region of wafer 30 from a single angle during actual inspection. It is necessary to deploy a detection component on each surface, or to move a detection component along the arc surface of the edge of wafer 30 to the normal direction of each edge surface to complete the detection sequentially. Therefore, as... Figure 8 As shown, in some embodiments, this application takes dividing the edge region of wafer 30 into an upper edge surface 31, an upper arc surface 33, a cylindrical surface 35, a lower arc surface 34, and a lower edge surface 32 as an example. The edge detection device 14 of this application may further include an upper arc surface detection component 143, a lower arc surface detection component 144, and a cylindrical surface detection component 145. The upper arc surface detection component 143 and the lower arc surface detection component 144 are respectively inclinedly disposed on the upper and lower sides of the cylindrical surface detection component 145, and the included angle between the upper arc surface detection component 143 and the cylindrical surface detection component 145 is equal to the included angle between the lower arc surface detection component 144 and the cylindrical surface detection component 145. The upper arc surface detection component 143 is used to detect the upper arc surface 33 of wafer 30, the lower arc surface detection component 144 is used to detect the lower arc surface 34 of wafer 30, and the cylindrical surface detection component 145 is used to detect the cylindrical surface 35 of wafer 30. In this way, each detection component detects its corresponding edge surface, thereby enabling more accurate detection of defects on each edge surface of wafer 30 and improving detection accuracy.

[0048] Optionally, in some embodiments, the included angle between the upper arc surface detection component 143 and the cylindrical surface detection component 145 can be implemented in the range of 0° to 43° to adapt to the upper arc surface 33 and the lower arc surface 34 of the wafer 30.

[0049] Furthermore, since a single inspection device can inspect several wafers of different thicknesses, the device needs to meet the requirement of rapid model switching. Therefore, such as Figure 5 and Figure 8 As shown, in some embodiments, the upper edge detection component 141 of this application is slidably disposed on the frame 11; the upper arc surface detection component 143 is slidably disposed on the frame 11; and the cylindrical surface detection component 145 is slidably disposed on the frame 11. The edge detection device 14 further includes an upper edge focusing component 146, an upper arc surface focusing component 147, and a cylindrical surface focusing component 148. The upper edge focusing component 146 is fixed to the frame 11 and is tractably connected to the upper edge detection component 141 for driving the upper edge detection component 141 to slide; the upper arc surface focusing component 147 is fixed to the frame 11 and is tractably connected to the upper arc surface detection component 143 for driving the upper arc surface detection component 143 to slide; and the cylindrical surface focusing component 148 is fixed to the frame 11 and is tractably connected to the cylindrical surface detection component 145 for driving the cylindrical surface detection component 145 to slide. By driving the upper edge detection component 141, the upper arc surface detection component 143, and the cylindrical surface detection component 145 to slide through the upper edge focusing component 146, the upper arc surface focusing component 147, and the cylindrical surface focusing component 148 respectively, the focal length of the upper edge detection component 141, the upper arc surface detection component 143, and the cylindrical surface detection component 145 can be adjusted respectively, so that the upper edge detection component 141, the upper arc surface detection component 143, and the cylindrical surface detection component 145 can acquire clear images.

[0050] Understandably, after the wafer 30 of the new model is loaded, the focal length of each detection component of the edge detection device 14 needs to be adjusted. The specific adjustment steps are as follows: the Z-axis translation component 1313 drives the T-axis rotation component 132 to rise along the Z-axis, so that the adsorption component 133 picks up the wafer 30 from the receiving component 12 to the position where the lower edge detection component 142 and the upper arc surface detection component 143 are clearly imaged, and the Z-axis height is recorded. After the center of the wafer 30 and the rotation center of the T-axis rotation component 132 are calibrated, the Z-axis translation component 1313 drives the T-axis rotation component 132 to rise again along the Z-axis to the recorded Z-axis height, and the X-axis translation component 1311 and the Y-axis translation component 1312 move the wafer 30 to the position where the cylindrical surface detection component 145 is clearly imaged. The wafer 30 is rotated by the T-axis rotation component 132 to verify the imaging of the cylindrical surface detection component 145. If the requirements are met, the X-axis and Y-axis positions are recorded. If the requirements are not met, the difference between the X-axis and Y-axis directions of the T-axis rotation center is calculated by measuring the change of the edge image of the wafer 30 in the field of view of the lower edge detection component 142 relative to the center of the field of view of the lower edge detection component 142. This difference is used as the compensation value for the X-axis and Y-axis. Based on the compensation values ​​for the X-axis and Y-axis, the X-axis translation component 1311 drives the Y-axis translation component 1312, and the Y-axis translation component 1312 drives the Z-axis translation component 1313 to move to the compensated position. The T-axis rotation component 132 then drives the wafer 30 to rotate again until the cylindrical surface detection component 145 has a clear image. The X-axis and Y-axis positions are recorded. The upper edge focusing component 146 drives the upper edge detection component 141 to focus, and the upper arc surface focusing component 147 drives the upper arc surface detection component 143 to focus, so that the upper edge detection component 141 and the upper arc surface detection component 143 can be clearly imaged, and the position information of the upper edge detection component 141 and the upper arc surface detection component 143 can be recorded respectively. In this way, the machine type introduction time can be shortened, the operation process can be simplified, and the ease of use and machine flexibility can be improved. In addition, based on the X-axis position, Y-axis position, Z-axis height, and the position information of the upper edge detection component 141 and the upper arc surface detection component 143 recorded in the above steps, the XYZ axis of the wafer 30 of this machine type and the position information of the upper edge detection component 141 and the upper arc surface detection component 143 can be established, which facilitates the subsequent switching of wafer 30 of this machine type. The system can automatically load and realize rapid machine type switching.

[0051] In particular, since the defects on the upper edge 31 are closest to the region of the internal intact DIE, they have the greatest impact on wafer 30. Therefore, if... Figure 9As shown, in some embodiments, the wafer side inspection device 10 further includes an edge re-judgment device 16. The edge re-judgment device 16 includes a re-judgment component 161 and a re-judgment focusing component 162. The re-judgment component 161 is slidably disposed on the frame 11 and located above the receiving hole 121, and can be used to inspect the upper edge surface 31 of the wafer 30 to avoid the upper edge inspection component 141 missing defects. The re-judgment focusing component 162 is fixed to the frame 11 and is tractably connected to the re-judgment component 161 to drive the re-judgment component 161 to slide. By driving the re-judgment component 161 to slide, the focal length of the re-judgment component 161 can be adjusted, enabling the re-judgment component 161 to acquire a clear image.

[0052] Optionally, such as Figure 9 As shown, in some embodiments, the edge verification device 16 may further include a height sensor 163, which is disposed below the verification component 161 and is used to cooperate with the verification component 161 to detect the warping of the wafer 30.

[0053] Understandably, when calculating the difference in the XY direction between the center of wafer 30 and the rotation center of the T-axis rotation component 132, the angular position relationship between the Notch mark of wafer 30 and the T-axis origin can also be calculated simultaneously. After calibrating the center of wafer 30 and the rotation center of the T-axis rotation component 132, the T-axis rotation component 132 can be raised along the Z-axis by the Z-axis translation component 1313, so that the adsorption component 133 picks up wafer 30 from the receiving component 12 to the imaging height of the edge detection device 14. The wafer 30 is then adjusted to the detection height by the X-axis translation component 1311 and the Y-axis translation component 1312. The wafer 30 is rotated by the T-axis rotation component 132. The edge warping value is recorded by the height sensor 163, establishing a coordinate relationship between the rotation angle and the edge warping value, which serves as the Z-axis height compensation value. When the wafer 30 rotates to the next revolution and reaches a known angle, the Z-axis translation component 1313 retrieves the height compensation value corresponding to that angle. The rotational motion of the T-axis rotation component 132 and the height compensation motion of the Z-axis translation component 1313 interpolate each other, ensuring that the edge of the wafer 30 remains within the clear imaging range of the edge detection component. This improves the detection accuracy and efficiency of the wafer side inspection device 10.

[0054] Optionally, such as Figure 5As shown, in some embodiments, the receiving assembly 12 includes a pair of receiving platforms 122 and a plurality of receiving blocks 123. The receiving platforms 122 are fixed to the frame 11 at intervals to form the receiving hole 121 between the two receiving platforms 122. The receiving blocks 123 are fixed to the receiving platforms 122 at intervals respectively. The translation assembly is disposed between the two receiving platforms 122.

[0055] Optionally, such as Figure 4 As shown, in some embodiments, the frame 11 includes a support frame 111, a marble platform 112 fixed to the support frame 111, and the motion device 13, the receiving component 12, and the edge detection device 14 all fixed to the marble platform 112. The support frame 111 can be made of steel and can provide rigid support for the marble platform 112. Based on the stable physical properties of marble, the marble platform 112 can provide a stable reference surface, ensuring measurement accuracy and providing a highly stable mounting foundation for the motion device 13, the receiving component 12, and the edge detection device 14.

[0056] Preferably, in some embodiments, the marble table 112 may include a tabletop 1121, a first column 1122 and a second column 1123. The first column 1122 and the second column 1123 are respectively fixed to the tabletop 1121 at intervals. The receiving component 12, the translation component and the lower edge detection component 142 are all fixed to the tabletop 1121. The upper edge detection component 141 and the upper edge focusing component 146 are disposed on the first column 1122. The upper arc surface detection component 143, the upper arc surface focusing component 147, the cylindrical surface detection component 145, the cylindrical surface focusing component 148 and the lower arc surface detection component 144 are all disposed on the second column 1123.

[0057] Preferably, such as Figure 4 As shown, in one embodiment, the frame 11 further includes a plurality of vibration damping pads 113, which are spaced apart between the support frame 111 and the marble table 112. These pads absorb impacts transmitted from the support frame 111 and isolate external vibrations.

[0058] Furthermore, such as Figure 6 As shown, in some embodiments, the wafer side inspection apparatus 10 of this application further includes a light source 17, which is fixed to the receiving assembly 12 and is used to provide bright field illumination for the wafer side inspection apparatus 10. The light source 17 can be implemented as a C-type light source.

[0059] Preferably, such as Figure 2As shown, in one embodiment, the wafer side inspection device 10 further includes an outer cover 18, with the electronic control device 15 fixed to the outer cover 18. The outer cover 18 is detachably connected to the frame 11. This configuration allows for a separate design of the outer cover 18 and the frame 11, saving design and assembly time. The electronic control device 15 can be assembled separately to the outer cover 18, while the motion device 13, the receiving assembly 12, and the edge detection device 14 can be assembled outside the outer cover 18. After separate assembly, they can be connected together via connectors for transportation. During field use, the connectors can be removed to isolate the frame 11 from the outer cover 18, thereby avoiding interference from vibration sources such as fan filter units (FFUs) on the outer cover 18 and improving the equipment's vibration resistance.

[0060] Furthermore, such as Figure 1 As shown, this application also provides an automatic wafer inspection device for automatically inspecting wafers 30. The automatic wafer inspection device may include a wafer side inspection device 10 and a wafer handling device 20 as described above. The wafer handling device 20 may include a device body and a robotic arm. The device body is disposed on one side of the wafer side inspection device 10, and the robotic arm is disposed on the device body. It can automatically remove the inspected wafer 30 from the wafer side inspection device 10 or place the wafer 30 to be inspected on the wafer side inspection device 10, thereby realizing automatic inspection of wafers 30.

[0061] Understandably, after completing an edge inspection of wafer 30, the T-axis is lowered by the three-axis translation component 131, and the adsorption component 133 places wafer 30 onto the receiving hole 121 of the receiving component 12. The robotic arm's empty finger extends into the gap between the receiving component 12 and the adsorption component 133 to remove the inspected wafer 30. The robotic arm's material-carrying finger extends into the gap between the receiving component 12 and the adsorption component 133 to place the wafer 30 to be inspected onto the receiving hole 121 of the receiving component 12, thus completing a wafer 30 loading and unloading operation.

[0062] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer side inspection device for inspecting the edge of a wafer, characterized in that, The wafer side surface detection device comprises: a rack; a receiving assembly fixed to the rack, the receiving assembly having a receiving hole for receiving a wafer; a moving device arranged below the receiving hole, the moving device comprising a three-axis translation assembly, a T-axis rotation assembly, and a suction assembly for suctioning the wafer, the three-axis translation assembly being mounted to the rack, the T-axis rotation assembly being arranged on the three-axis translation assembly, and the suction assembly being arranged on the T-axis rotation assembly; an edge detection device comprising an upper edge detection assembly and a lower edge detection assembly, the upper edge detection assembly and the lower edge detection assembly being oppositely arranged on the rack in a vertical direction; and an electric control device electrically connected to the moving device and the edge detection device.

2. The wafer side face inspection apparatus according to claim 1, characterized by The edge detection device further comprises an upper arc surface detection assembly, a lower arc surface detection assembly, and a cylindrical surface detection assembly, the upper arc surface detection assembly and the lower arc surface detection assembly being respectively obliquely arranged on the upper side and the lower side of the cylindrical surface detection assembly, and the included angle between the upper arc surface detection assembly and the cylindrical surface detection assembly being equal to the included angle between the lower arc surface detection assembly and the cylindrical surface detection assembly.

3. The wafer side face inspection apparatus according to claim 2, characterized by The upper edge detection assembly is slidably arranged on the rack; the upper arc surface detection assembly is slidably arranged on the rack; the cylindrical surface detection assembly is slidably arranged on the rack; the edge detection device further comprises an upper edge focusing assembly, an upper arc surface focusing assembly, and a cylindrical surface focusing assembly, the upper edge focusing assembly being fixed to the rack and being drivingly connected to the upper edge detection assembly; the upper arc surface focusing assembly being fixed to the rack and being drivingly connected to the upper arc surface detection assembly; and the cylindrical surface focusing assembly being fixed to the rack and being drivingly connected to the cylindrical surface detection assembly.

4. The wafer side face inspection apparatus according to claim 1, characterized by The receiving assembly comprises a pair of receiving tables and a plurality of receiving blocks, the receiving tables being fixed to the rack at intervals to form the receiving hole between the two receiving tables, and the receiving blocks being fixed to the receiving tables at intervals respectively, and the moving device being arranged between the two receiving tables.

5. The wafer side surface inspection apparatus according to any one of claims 1 to 4, characterized by The wafer side surface detection device further comprises an edge re-judgment device, the edge re-judgment device comprising a re-judgment assembly slidably arranged on the rack above the receiving hole and a re-judgment focusing assembly fixed to the rack, the re-judgment focusing assembly being drivingly connected to the re-judgment assembly.

6. The wafer side face inspection apparatus according to claim 5, wherein The edge re-judgment device further comprises a height measuring sensor arranged below the re-judgment assembly.

7. The wafer side face inspection apparatus according to any one of claims 1 to 4, characterized by The rack comprises a support frame and a marble table fixed to the support frame, and the moving device, the receiving assembly, and the edge detection device are all fixed to the marble table.

8. The wafer side face inspection apparatus according to claim 7, wherein The rack further comprises a plurality of vibration isolation pads arranged at intervals between the support frame and the marble table.

9. The wafer side face inspection apparatus according to any one of claims 1 to 4, characterized by The wafer side surface detection device further comprises a light source fixed to the receiving assembly.

10. The wafer side face inspection apparatus according to any one of claims 1 to 4, characterized by The wafer side surface detection device further comprises an outer cover, and the electric control device is fixed to the outer cover, and the outer cover is detachably connected to the rack.

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