Laser processing equipment

Abstract

The utility model provides laser processing equipment. The laser processing equipment comprises a fixed platform, a moving platform and a laser device. The moving platform is connected to the fixed platform and comprises a moving assembly and a machining table, the moving assembly is used for driving the machining table to move at least along a first shaft, and the machining table is used for bearing workpieces. The laser device is detachably connected to the fixed platform and comprises a laser and a galvanometer assembly, and the galvanometer assembly is used for receiving a laser beam output by the laser and driving the laser beam to move at least along a second axis; laser output by the laser device can be projected to a workpiece located on the machining table, and the second shaft is not parallel to the first shaft. When the laser device is connected to the fixed table, the laser device and the moving platform can form a complete laser machining device, multi-axis machining is achieved through mutual cooperation of the moving assembly and the galvanometer assembly, and the machining breadth is enlarged. After the laser device is separated from the fixed platform, the laser device can be used as a standard module very flexibly, conveniently and independently.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, specifically relating to laser processing equipment. Background Technology

[0002] Laser processing equipment is widely favored by users because the laser head does not directly contact the workpiece, thus minimizing damage. Furthermore, the high energy and small spot size of the laser result in high processing efficiency. Galvanometer-type laser processing equipment, however, has a smaller processing area and cannot handle larger workpieces. Utility Model Content

[0003] In view of this, this application provides a laser processing apparatus, the laser processing apparatus comprising:

[0004] Fixed platform;

[0005] A motion platform is connected to the fixed platform. The motion platform includes a motion component and a processing table disposed on the motion component. The motion component is used to drive the processing table to move at least along a first axis. The processing table is used to carry a workpiece.

[0006] A laser device is detachably connected to the fixed platform. The laser device includes a laser and a galvanometer assembly. The galvanometer assembly is used to receive the laser beam output by the laser and drive the laser beam to move at least along a second axis. The laser output by the laser device can be projected onto a workpiece located on the processing table. The second axis is not parallel to the first axis.

[0007] The fixed platform includes a bracket and a support platform connected to the bracket. The moving platform is located on the bracket and on the side of the support platform facing the bracket. The laser device is detachably connected to the side of the support platform away from the bracket. The support platform has a first through hole, which is opposite to the laser device, so that the laser output by the laser device is projected onto the workpiece located on the processing table through the first through hole.

[0008] The laser device includes a base, a frame connected to the base, and a laser head connected to the frame. The laser head includes a laser and a galvanometer assembly. The base is detachably connected to the support platform. The base has a second through hole that communicates with the first through hole. The laser head is opposite to the second through hole.

[0009] The laser device further includes a base plate, which is disposed in the second through hole and detachably connected to the base. The base plate is used to support the workpiece.

[0010] The base is provided with a first connecting part, and the support platform is provided with a second connecting part. The first connecting part and the second connecting part cooperate to make the base detachably connected to the support platform.

[0011] The first connecting portion includes a first connecting hole, the second connecting portion includes a second connecting hole, and the laser processing equipment further includes a fastener that passes through the first connecting hole and the second connecting hole and connects the base and the support platform; or,

[0012] The first connecting part includes one of a buckle and a slot, and the second connecting part includes the other of a buckle and a slot; or,

[0013] The first connecting portion includes a first magnetic portion, and the second connecting portion includes a second magnetic portion. The first magnetic portion and the second magnetic portion are magnetically attracted to each other.

[0014] The laser device further includes a first buffer member, which is disposed on the side of the base near the support platform and abuts against the support platform; and / or,

[0015] The wall of the first through hole and / or the wall of the second through hole are provided with a second buffer; and / or,

[0016] The diameter of the second through hole is larger than the diameter of the first through hole.

[0017] Wherein, the motion component is used to drive the processing table to move along the first axis and the third axis, the third axis being parallel to the second axis; and / or,

[0018] The galvanometer assembly is used to drive the laser beam to move along the second and fourth axes, with the fourth axis being parallel to the first axis.

[0019] The motion component includes a single-axis motion component or a dual-axis motion component, and the galvanometer assembly includes a single-axis galvanometer or a dual-axis galvanometer.

[0020] When the motion assembly includes a dual-axis motion component, the motion assembly includes an X-axis motion component and a Y-axis motion component. The X-axis motion component is connected to the fixed platform, the Y-axis motion component is slidably connected to the X-axis motion component, and the processing table is slidably connected to the Y-axis motion component. The X-axis motion component is used to drive the Y-axis motion component and the processing table to move along the X-axis direction, and the Y-axis motion component is used to drive the processing table to move along the Y-axis direction.

[0021] When the galvanometer assembly includes a dual-axis galvanometer, the galvanometer assembly includes a U-axis galvanometer and a V-axis galvanometer. The U-axis galvanometer can deflect the laser beam emitted by the laser along the U-axis direction, and the V-axis galvanometer can deflect the laser output by the U-axis galvanometer along the V-axis direction.

[0022] The motion platform further includes a first controller, which is electrically connected to the motion component and used to control the motion component. The laser device further includes a second controller, which is electrically connected to the galvanometer assembly and used to control the galvanometer assembly. The first controller and the second controller are connected by wired or wireless communication.

[0023] Alternatively, the laser processing equipment may further include a third controller, which is electrically connected to the motion component and the galvanometer assembly to control the motion component and the galvanometer assembly.

[0024] The laser processing equipment provided in this application includes a laser device detachably connected to a fixed platform, and a galvanometer assembly within the laser device that allows the laser output to be moved. When the laser device is connected to the fixed platform, it can form a complete laser processing device with a motion platform. The workpiece can be placed on the processing table of the motion platform, and multi-axis processing is achieved through the cooperation of the motion assembly and the galvanometer assembly. Simultaneously, because the motion assembly can move the workpiece, the processing area can be expanded. When the laser device is separated from the fixed platform, it can still support the workpiece, and the laser output can also be moved under the control of the galvanometer assembly. Therefore, the laser device can be used flexibly and conveniently as a standard module.

[0025] In summary, the laser device, as an independent module, can perform laser processing independently, and its size is smaller than that of the overall laser processing equipment. When the laser device is connected to a fixed platform, it can also be used in conjunction with a moving platform to expand the processing area. Therefore, the laser processing equipment provided in this application can switch between a single laser device and a combination of a laser device and a moving platform, satisfying both the need for portability of a small laser processing system and the need for large-format processing. Thus, this application can expand the processing area without adding a field lens, thereby avoiding the problems associated with large field lenses, such as high cost, large size, and low edge processing accuracy. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0027] Figure 1 This is a three-dimensional structural diagram of a laser processing device according to one embodiment of this application.

[0028] Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the laser processing equipment from another perspective.

[0029] Figure 3 for Figure 1 The image shows a side view of the laser processing equipment.

[0030] Figure 4 for Figure 1 The diagram shows the three-dimensional structure of the laser processing equipment after the housing has been removed.

[0031] Figure 5 for Figure 1 The exploded view of the laser processing equipment shown.

[0032] Figure 6 This is a three-dimensional structural diagram of the motion platform in one embodiment of this application.

[0033] Figure 7 for Figure 6 The exploded view of the motion platform shown.

[0034] Figure 8 This is a three-dimensional structural diagram of the laser device in one embodiment of this application.

[0035] Figure 9 for Figure 8 An exploded view of the laser device shown.

[0036] Figure 10 for Figure 1 A schematic cross-sectional view of the laser processing equipment shown.

[0037] Figure 11 for Figure 10 A magnified view of a portion of the laser processing equipment shown.

[0038] Figure 12 As described in one embodiment of this application Figure 11 The diagram shows a workpiece placed on a processing table in a laser processing device.

[0039] Figure 13 In another embodiment of this application Figure 11 The diagram shows a workpiece placed on a processing table in a laser processing device.

[0040] Label Explanation:

[0041] Laser processing equipment - 1, workpiece - 2, fixed platform - 10, support platform - 11, first through hole - 110, second connecting part - 111, second connecting hole - 1110, bracket - 12, receiving space - 120, support member - 121, base plate - 122, motion platform - 20, motion component - 21, processing table - 22, X-axis motion component - 23, fixing member - 231, X-axis guide rail - 232, X-axis slider - 233, first motor - 234, first position sensor - 235, Y-axis motion component - 24, Y-axis guide rail - 242, Y-axis slider - 243, second motor - 244. Second position sensor-245, cable chain-25, guide component-26, guide groove-260, laser device-30, galvanometer assembly-31, housing-32, grip-321, protective shell-322, U-axis galvanometer-33, third motor-331, U-axis reflector-332, V-axis galvanometer-34, fourth motor-341, V-axis reflector-342, base-35, second through hole-350, stepped structure-351, first connecting part-352, first connecting hole-3520, frame-36, base plate-37, first buffer component-38, second buffer component-39, laser head-40. Detailed Implementation

[0042] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

[0043] In view of this, in order to solve the above problems, this application provides a laser processing device, which please refer to. Figures 1 to 5 , Figure 1 This is a three-dimensional structural diagram of a laser processing device according to one embodiment of this application. Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the laser processing equipment from another perspective. Figure 3 for Figure 1 The image shows a side view of the laser processing equipment. Figure 4 for Figure 1 The diagram shows the three-dimensional structure of the laser processing equipment after the housing has been removed. Figure 5 for Figure 1 The exploded view of the laser processing equipment shown.

[0044] The laser processing equipment 1 provided in this embodiment includes a fixed platform 10, a motion platform 20, and a laser device 30. The motion platform 20 is connected to the fixed platform 10 and includes a processing table 22 disposed on a motion assembly 21. The motion assembly 21 drives the processing table 22 to move at least along a first axis, and the processing table 22 is used to carry a workpiece. The laser device 30 is detachably connected to the fixed platform 10 and includes a laser and a galvanometer assembly 31. The galvanometer assembly 31 receives the laser beam output by the laser and drives the laser beam to move at least along a second axis. The laser output by the laser device 30 can be projected onto the workpiece located on the processing table 22, and the second axis is not parallel to the first axis.

[0045] Laser processing equipment 1 can emit laser light towards a workpiece, and the laser and workpiece can move relative to each other, thereby changing the position of the laser on the workpiece. By utilizing the interaction between the laser and the workpiece, various processing operations can be performed on the workpiece, such as laser cutting, laser engraving, and laser welding. Therefore, depending on the processing method, laser processing equipment 1 can be laser cutting equipment, laser welding equipment, laser engraving equipment, etc.

[0046] The laser processing equipment 1 provided in this embodiment includes a fixed platform 10, a motion platform 20, and a laser device 30. The fixed platform 10 is mainly used to support other components of the laser processing equipment 1, such as the motion platform 20 and the laser device 30, providing a mounting base for these components. The motion platform 20 can be mounted and connected to the fixed platform 10. The motion platform 20 includes a processing table 22 and a motion component 21. The processing table 22 can be used to carry workpieces, and the motion component 21 can be connected to the processing table 22. When the motion component 21 moves, it can drive the processing table 22 to move, thereby moving the workpiece.

[0047] Specifically, the motion component 21 is used to drive the machining table 22 to move at least along a first axis, wherein the first axis includes, but is not limited to, at least one of the X-axis and Y-axis. For example, the motion component 21 can drive the machining table 22 to perform single-axis movement along the X-axis or Y-axis, or the motion component 21 can also drive the machining table 22 to perform dual-axis movement along both the X-axis and Y-axis simultaneously. The X-axis and Y-axis referred to in this embodiment and hereinafter are for reference only. Figure 1 The X-axis and Y-axis directions are shown. The specific structure of the motion component 21 is not limited in this embodiment, as long as the motion component 21 can drive the processing table 22 to move. In other embodiments, the motion component can also drive the processing table 22 to move along the Z-axis direction.

[0048] The laser device 30 includes a laser and a galvanometer assembly 31. The laser outputs laser light, which passes through the galvanometer assembly 31. The galvanometer assembly 31 receives the laser light output from the laser. The galvanometer assembly 31 itself is movable, and its movement alters the laser's optical path, thus changing the position of the laser beam on the workpiece and causing the laser to move. Specifically, the galvanometer assembly 31 drives the laser beam to move at least along a second axis, which includes, but is not limited to, at least one of the U-axis and V-axis. For example, the galvanometer assembly 31 can drive the laser beam to move along either the U-axis or the V-axis in a single-axis motion, or it can drive the laser beam to move along both the U-axis and the V-axis in a dual-axis motion. The U-axis and V-axis referred to in this embodiment and hereinafter are for further reference. Figure 9 The U-axis direction and V-axis direction are shown.

[0049] It is worth noting that the first axis and the second axis are not parallel, that is, the first axis and the second axis intersect at an angle, or the first axis and the second axis are perpendicular to each other, which facilitates multi-axis linkage machining.

[0050] In some embodiments, the motion component 21 is used to drive the processing stage 22 to move along a first axis and a third axis, the third axis being parallel to the second axis; and / or, the galvanometer component 31 is used to drive the laser beam to move along a second axis and a fourth axis, the fourth axis being parallel to the first axis.

[0051] The specific structure of the galvanometer assembly 31 is not limited in this embodiment, as long as the galvanometer assembly 31 can drive the laser to move. Simultaneously, the laser device 30 itself can also support the workpiece. Therefore, the laser device 30, as an independent module, is a complete product capable of independently performing laser processing. The workpiece is placed on the laser device 30, and the laser, under the control of the galvanometer assembly 31, can move to process the workpiece.

[0052] In related technologies, a laser device can be used alone to control the movement of the laser through a galvanometer assembly for laser processing. However, when using a laser device alone, the processing area is usually small due to various limitations. For example, when the galvanometer assembly includes a galvanometer, the laser device is a galvanometer laser processing system, and the processing area of ​​this system is determined by the galvanometer. To increase the processing area, a larger galvanometer must be selected, but a large galvanometer brings problems such as high cost, large size, and low edge processing accuracy.

[0053] Based on this, the laser processing equipment 1 provided in this embodiment allows the laser device 30 to be detachably connected to the fixed platform 10. The connection scheme between the laser device 30 and the fixed platform 10 is not limited in this embodiment, but will be described in detail later. When the laser device 30 is separated from the fixed platform 10, it can still support the workpiece, and the laser output from the laser can move under the control of the galvanometer assembly 31, thus allowing laser processing of different positions of the workpiece. Therefore, the laser device 30 can be used flexibly and conveniently as a standard module independently; in other words, the laser device 30 can be used independently without the motion platform 20 and is easy to carry.

[0054] When the laser device 30 is connected to the fixed stage, it can form a complete laser processing equipment 1 with the motion platform 20. The workpiece can be placed on the processing table 22 of the motion platform 20, and the laser output from the laser device 30 can be projected onto the workpiece located on the processing table 22. Multi-axis processing is achieved through the cooperation of the motion component 21 and the galvanometer component 31. At the same time, since the motion component 21 can drive the workpiece to move, the processing area can be expanded.

[0055] In summary, the laser device 30, as an independent module, is a complete product capable of independent laser processing, and its overall size is smaller than that of the laser processing equipment 1. When the laser device 30 is connected to the fixed platform 10, it can also cooperate with the motion platform 20 to expand the processing area. Therefore, the laser processing equipment 1 provided in this embodiment can switch between using a single laser device 30 and using the laser device 30 in conjunction with the motion platform 20, satisfying both the need for portability of a small laser processing system and the need for large-format processing. Furthermore, this embodiment expands the processing area without the need for additional field lenses, thus avoiding the problems associated with large field lenses, such as high cost, large size, and low edge processing accuracy.

[0056] Compared to related technologies that integrate the galvanometer assembly and motion assembly into a single, large-scale device that is difficult to move, this embodiment makes the laser device 30 a standard module, which can be used very flexibly and can be selected according to the user's needs.

[0057] In some embodiments, the motion platform 20 further includes a first controller (not shown), which is electrically connected to the motion component 21 and used to control the motion component 21. The laser device 30 further includes a second controller (not shown), which is electrically connected to the galvanometer assembly 31 and used to control the galvanometer assembly 31. The first controller and the second controller can be connected via wired or wireless communication.

[0058] The first controller can be used to control the motion parameters of the motion component 21, and the second controller can be used to control the motion parameters of the galvanometer component 31. The first controller and the second controller are not independent of each other, but can communicate via wired means such as data cable, network cable, bus, etc., or via wireless means such as WiFi, Bluetooth, etc., to realize the communication connection between the first controller and the second controller, thereby controlling the coordination state of the motion component 21 and the galvanometer component 31 and ensuring the synchronous control of the motion of the motion component 21 and the galvanometer component 31.

[0059] For example, the motion component 21 and the galvanometer component 31 can work simultaneously, thereby causing the processing table 22 and the laser to move simultaneously. When the laser device 30 is connected to the fixed platform 10, the workpiece is placed on the processing table 22. The movement of the processing table 22 is controlled by the motion component 21, and the movement of the laser is controlled by the galvanometer component 31. In this embodiment, the first controller can send a synchronous control command to the second controller while controlling the movement of the motion component 21, so that the second controller can synchronously control the galvanometer component 31 to also move, enabling the motion component 21 and the galvanometer component 31 to work simultaneously, thereby causing the processing table 22 and the laser to move simultaneously. This achieves multi-axis linkage, where the laser moves synchronously while the workpiece moves. This embodiment can integrate the advantages of the motion component 21 and the galvanometer component 31, expanding the processing area, increasing processing speed, improving processing accuracy, and reducing splicing errors.

[0060] Of course, in other embodiments, the motion component 21 and the galvanometer component 31 can also work at different times. For example, when the first controller controls the motion component 21, it does not send control commands to the second controller at the same time, but sends control commands after a certain period of time, so that the second controller controls the galvanometer component 31 to move. This allows the motion component 21 to work first, causing the processing table 22 to move first. When the workpiece is moved to the preset position, the motion component 21 stops working, and then the galvanometer component 31 starts working, controlling the laser movement to achieve processing at the preset position. When the processing at the preset position is completed, the galvanometer component 31 stops working, and the motion component 21 starts working again to move the workpiece to the next position, and the above steps are repeated until the workpiece is processed.

[0061] In some embodiments, the laser processing equipment further includes a third controller (not shown), which is electrically connected to the motion component 21 and the galvanometer assembly 31 to control the motion component 21 and the galvanometer assembly 31. The third controller can control the movement of the motion component 21 and the galvanometer assembly 31 based on processing commands to achieve coordination between them. The third controller may have an interface connecting the motion component 21 and the galvanometer assembly 31 to control them through the interface.

[0062] Please refer to this as well. Figures 6 to 9 , Figure 6 This is a three-dimensional structural diagram of the motion platform in one embodiment of this application. Figure 7 for Figure 6 The exploded view of the motion platform shown. Figure 8 This is a three-dimensional structural diagram of the laser device in one embodiment of this application. Figure 9 for Figure 8 An exploded view of the laser device is shown. In this embodiment, the motion component 21 includes a single-axis motion component or a dual-axis motion component, and the galvanometer assembly 31 includes a single-axis galvanometer or a dual-axis galvanometer.

[0063] The motion components of motion assembly 21 include an X-axis motion component 23 and a Y-axis motion component 24. The X-axis motion component 23 drives the machining table 22 along the X-axis direction, and the Y-axis motion component 24 drives the machining table 22 to move along the Y-axis direction. In this embodiment, motion assembly 21 may include a single-axis motion component or a dual-axis motion component. In other words, motion assembly 21 may include only the X-axis motion component 23 or the Y-axis motion component 24, or motion assembly 21 may include both the X-axis motion component 23 and the Y-axis motion component 24.

[0064] The galvanometer assembly 31 includes a U-axis galvanometer 33 and a V-axis galvanometer 34. The U-axis galvanometer 33 deflects the laser along the U-axis, thereby moving the laser along the Y-axis. The V-axis galvanometer 34 deflects the laser along the V-axis, thereby moving the laser along the X-axis. In this embodiment, the galvanometer assembly 31 may include a single-axis galvanometer or a dual-axis galvanometer. In other words, the galvanometer assembly 31 may include only the U-axis galvanometer 33 or the V-axis galvanometer 34, or the galvanometer assembly 31 may include both the U-axis galvanometer 33 and the V-axis galvanometer 34.

[0065] In summary, through the various combinations described above, this embodiment can achieve the following combinations: a single-axis galvanometer with a single-axis moving component, a single-axis galvanometer with a dual-axis moving component, a dual-axis galvanometer with a single-axis moving component, or a dual-axis galvanometer with a dual-axis moving component; and so on. The specific combination method chosen can be selected based on the actual situation.

[0066] In this embodiment, when the motion component 21 includes a dual-axis motion component, the motion component 21 includes an X-axis motion component 23 and a Y-axis motion component 24. The X-axis motion component 23 is connected to the fixed platform 10, the Y-axis motion component 24 is slidably connected to the X-axis motion component 23, and the processing table 22 is slidably connected to the Y-axis motion component 24. The X-axis motion component 23 is used to drive the Y-axis motion component 24 and the processing table 22 to move along the X-axis direction, and the Y-axis motion component 24 is used to drive the processing table 22 to move along the Y-axis direction.

[0067] The motion assembly 21 consists of an X-axis motion component 23 and a Y-axis motion component 24. The X-axis motion component 23 is fixedly connected to the fixed platform 10, and the Y-axis motion component 24 is slidably connected to the X-axis motion component 23, meaning the Y-axis motion component 24 can slide relative to the X-axis motion component 23. The X-axis motion component 23 can drive the Y-axis motion component 24 to move along the X-axis direction. At this time, the X-axis motion component 23 and the Y-axis motion component 24 can form a cross shape, which can be called a cross platform. The machining table 22 is slidably connected to the Y-axis motion component 24, so when the Y-axis motion component 24 moves along the X-axis direction, it can synchronously drive the machining table 22 to move along the X-axis direction as well. Furthermore, the Y-axis motion component 24 can also drive the machining table 22 to move along the Y-axis direction. Therefore, with the cooperation of the X-axis motion component 23 and the Y-axis motion component 24, the machining table 22 can achieve two-axis planar motion in both the X-axis and Y-axis directions.

[0068] It is worth noting that the X-axis direction is Figure 1 and Figure 6 The direction indicated by the X-axis is [missing information], and the direction of the Y-axis is [missing information]. Figure 1 and Figure 6 The direction indicated by the Y-axis, and the direction of the Z-axis mentioned below. Figure 1 and Figure 6 The direction indicated by the Z-axis.

[0069] In summary, this embodiment enables the machining table 22 to move along both the X-axis and Y-axis directions through the cooperation of the X-axis motion component 23 and the Y-axis motion component 24, thereby increasing the movement range of the machining table 22 and further increasing the machining area of ​​the workpiece. Of course, in other embodiments, the motion component 21 may also include a Z-axis platform, or the Y-axis motion component 24 may be connected to the fixed platform 10, the X-axis motion component 23 may be slidably connected to the Y-axis motion component 24, and the machining table 22 may be connected to the X-axis motion component 23.

[0070] Optionally, the X-axis motion component 23 includes a fixing member 231, an X-axis guide rail 232, an X-axis slider 233, and a first motor 234; the Y-axis motion component 24 includes a Y-axis guide rail 242, a Y-axis slider 243, and a second motor 244. The fixing member 231 connects the X-axis guide rail 232 to the fixed platform 10, thereby fixing the X-axis guide rail 232 to the fixed platform 10. The first motor 234 and the X-axis slider 233 are mounted on the X-axis guide rail 232, and the first motor 234 is connected to the X-axis slider 233. The first motor 234 can drive the X-axis slider 233 to move along the X-axis direction in the X-axis guide rail 232.

[0071] The Y-axis guide rail 242 is connected to the X-axis slider 233. Therefore, when the X-axis slider 233 moves along the X-axis direction, it drives the Y-axis guide rail 242 to move along the X-axis direction as well. The second motor 244 and the Y-axis slider 243 are mounted on the Y-axis guide rail 242, and the second motor 244 is connected to the Y-axis slider 243. The second motor 244 can drive the Y-axis slider 243 to move along the Y-axis direction within the Y-axis guide rail 242. The Y-axis slider 243 is connected to the machining table 22. When the Y-axis guide rail 242 moves along the X-axis direction, it drives the Y-axis slider 243 and the machining table 22 to move along the X-axis direction. When the Y-axis slider 243 moves along the Y-axis direction, it drives the machining table 22 to move along the Y-axis direction, ultimately causing the machining table 22 to move within the XY plane.

[0072] Optionally, the X-axis motion component 23 further includes a first position sensor 235 connected to the X-axis guide rail 232. The first position sensor 235 is used to detect the position of the X-axis slider 233 to obtain the position of the machining table 22 in the X-axis direction. The Y-axis motion component 24 further includes a second position sensor 245 connected to the Y-axis guide rail 242. The second position sensor 245 is used to detect the position of the Y-axis slider 243 to obtain the position of the machining table 22 in the Y-axis direction. The position information of the machining table 22 can be obtained through the first position sensor 235 and the second position sensor 245.

[0073] Optionally, the motion component 21 further includes a cable chain 25, one end of which is connected to the fixed platform 10, and the other end is connected to the Y-axis guide rail 242. Since the X-axis motion component 23 is connected to the fixed platform 10, the position of the first motor 234 will not change, nor will the position of the wire connected to the first motor 234. However, the Y-axis motion component 24 will move along the X-axis direction on the X-axis motion component 23, causing the second motor 244 to move as well, and thus the wire connected to the second motor 244 will also move. In this embodiment, the other end of the cable chain 25 can be connected to the Y-axis guide rail 242, and the wire of the second motor 244 can be placed inside the cable chain 25 to protect the wire.

[0074] Alternatively, the motion component 21 may further include a guide 26 connected to the fixed platform 10. The guide 26 has a guide groove 260, and one end of the cable chain 25 is connected to the guide 26 and disposed within the guide groove 260. The guide 26 can guide the cable chain 25 and prevent the cable chain 25 from deviating during movement.

[0075] In this embodiment, when the galvanometer assembly 31 includes a dual-axis galvanometer, the galvanometer assembly 31 includes a U-axis galvanometer 33 and a V-axis galvanometer 34. The U-axis galvanometer 33 can deflect the laser beam emitted by the laser along the U-axis direction, and the V-axis galvanometer 34 can deflect the laser output by the U-axis galvanometer along the V-axis direction.

[0076] The laser device 30 may further include a housing 32, with at least a portion of the galvanometer assembly 31 and the laser itself housed within the housing 32. The housing 32 protects the galvanometer assembly 31 and the laser, and the laser output from the laser passes through the galvanometer assembly 31 before being emitted from the housing 32. Optionally, the housing 32 may also include a grip 321, allowing the user to hold the laser device 30 and use it as a standalone product.

[0077] The galvanometer assembly 31 consists of a U-axis galvanometer 33 and a V-axis galvanometer 34. Both the U-axis and V-axis galvanometers 33 and 34 can reflect laser light and rotate along their respective axes of rotation. Specifically, the U-axis galvanometer 33 can deflect along the U-axis. When laser light strikes the U-axis galvanometer 33 and it rotates, the emitted laser light can move along the Y-axis. Optionally, the axis of rotation of the U-axis galvanometer 33 has a certain angle with the X-axis; in other words, the U-axis galvanometer 33 is not parallel to the X-axis but is tilted along the Z-axis, thereby enabling miniaturization of the galvanometer assembly 31.

[0078] The V-axis galvanometer 34 can deflect along the V-axis direction. When the laser reflected by the U-axis galvanometer 33 reaches the V-axis galvanometer 34 and the V-axis galvanometer 34 rotates, the emitted laser can move along the X-axis direction, ultimately moving the laser along the XY plane. Optionally, the V-axis galvanometer 34 is arranged parallel to the Y-axis direction. Since the U-axis galvanometer 33 and the V-axis galvanometer 34 only need to rotate a small angle to make the laser move a large distance in the XY plane, the laser's movement speed is relatively fast. However, due to the influence of the light outlet size of the housing 32 and the limitations of the U-axis galvanometer 33 and the V-axis galvanometer 34, the processing area is relatively small.

[0079] In summary, this embodiment enables the laser to move along both the X and Y axes through the cooperation of the U-axis galvanometer 33 and the V-axis galvanometer 34, thereby improving the processing speed. Of course, in other embodiments, the galvanometer assembly 31 may also include other galvanometers, or the laser may first be emitted to the V-axis galvanometer 34, and then reflected before being emitted to the U-axis galvanometer 33.

[0080] Optionally, the laser device 30 may also include a protective housing 322, in which the U-axis galvanometer 33 and the V-axis galvanometer 34 are both installed, so as to realize the installation and protection of the U-axis galvanometer 33 and the V-axis galvanometer 34.

[0081] Optionally, the U-axis galvanometer 33 includes a third motor 331 and a U-axis reflector 332. The third motor 331 is connected to the U-axis reflector 332 and is used to drive the U-axis reflector 332 to rotate along the X-axis. The V-axis galvanometer 34 includes a fourth motor 341 and a V-axis reflector 342. The fourth motor 341 is connected to the V-axis reflector 342 and is used to drive the V-axis reflector 342 to rotate along the Y-axis. Therefore, the laser device 30 can also be referred to as a galvanometer system.

[0082] The laser processing equipment 1 provided in this embodiment has a galvanometer system that is a complete product that can be used independently. By adding a set of cross-shaped XY axis motion components 21, four-axis linkage can be achieved together with the galvanometer system, thereby expanding the processing area of ​​the galvanometer system. It is a four-axis linkage processing platform that can quickly switch between two-axis and four-axis modes.

[0083] Please refer to this again. Figure 1 and Figure 3 In this embodiment, the fixed platform 10 includes a bracket 12 and a support platform 11 connected to the bracket 12. The moving platform 20 is disposed on the bracket 12 and located on the side of the support platform 11 facing the bracket 12. The laser device 30 is detachably connected to the side of the support platform 11 away from the bracket 12. The support platform 11 is provided with a first through hole 110, which is opposite to the laser device 30, so that the laser output by the laser device 30 is projected onto the workpiece located on the processing table 22 through the first through hole 110.

[0084] The fixed platform 10 consists of a support platform 11 and a bracket 12, which can be an integral or separate structure. The support platform 11 is mainly used to support and connect the laser device 30. The bracket 12 is mainly used to support the support platform 11. The bracket 12 may include multiple support members 121 and a base plate 122. The opposite ends of the multiple support members 121 are respectively connected to the support platform 11 and the base plate 122. The support platform 11, the multiple support members 121, and the base plate 122 can be arranged to form a receiving space 120. At least a portion of the motion component 21 is disposed within the receiving space 120, and the motion component 21 is fixed to the base plate 122. Furthermore, the processing table 22 is also disposed within the receiving space 120 and on the side where the support platform 11 connects to the bracket 12. In other words, both the motion component 21 and the processing table 22 are disposed below the support platform 11.

[0085] The laser device 30 is located on the other side of the support platform 11, meaning it can be positioned above the support platform 11 and detachably connected to it. The specific method of detachable connection between the laser device 30 and the support platform 11 will be described in detail below. Furthermore, a first through hole 110 can be formed in the support platform 11 to expose the processing table 22 below. By aligning the first through hole 110 with the laser device 30, the laser output from the laser device 30 can be projected through the first through hole 110 onto the workpiece located on the processing table 22, thereby processing the workpiece. In other embodiments, an opening can also be formed in the support platform 11 to expose the processing table 22.

[0086] In summary, by positioning the motion platform 20 and the laser device 30 on opposite sides of the support platform 11, the support 12 can better accommodate the motion platform 20, reducing the overall size and simplifying the structure. Furthermore, the laser device 30 can be easily detached and connected. Specifically, the laser device 30 can be detached from the support platform 11 for independent use, and when connected to the support platform 11, it can be used in conjunction with the motion platform 20.

[0087] Please refer to this as well. Figure 1 , Figure 8 and Figure 9 In this embodiment, the laser device 30 includes a base 35, a frame 36 connected to the base 35, and a laser head 40 connected to the frame 36. The laser head 40 includes a laser and a galvanometer assembly 31. The base 35 is detachably connected to the support platform 11. The base 35 is provided with a second through hole 350 that communicates with the first through hole 110. The laser head 40 is opposite to the second through hole 350.

[0088] In addition to the aforementioned components, the laser device 30 may also include a base 35, a frame 36, and a laser head 40, with the frame 36 connected to the base 35. Optionally, the base 35 and the frame 36 are arranged perpendicularly to each other; for example, the base 35 is horizontal and the frame 36 is vertical. In this embodiment, the base 35 can be detachably connected to the support platform 11. The specific connection method between the base 35 and the support platform 11 will be described later in this application. Simultaneously, the laser head 40, composed of the laser and the galvanometer assembly 31, is connected to the frame 36 via the housing 32. The laser beam is ultimately emitted from the housing 32 and projected onto the base 35. The base 35 has a second through hole 350 communicating with the first through hole 110. With the laser head 40 facing the second through hole 350, the laser output from the laser device 30 can sequentially pass through the second through hole 350 and the first through hole 110 and be projected onto the workpiece located on the processing table 22, thereby processing the workpiece.

[0089] In addition, the base 35 can also support the workpiece. In other words, when the laser device 30 is separated from the fixed platform 10 and used alone, the workpiece can be placed on the base 35. At this time, the workpiece is fixed and can be moved by the galvanometer assembly 31 to process the workpiece.

[0090] In summary, the frame 36 can be used to install the laser and galvanometer assembly 31. The base 35 not only facilitates the detachable connection between the laser device 30 and the fixed platform 10, but also allows the base 35 to support the workpiece, thereby enabling the laser device 30 to process the workpiece independently.

[0091] Optionally, the laser and galvanometer assembly 31 can slide relative to the frame 36, that is, the laser and galvanometer assembly 31 can slide along the Z-axis, thereby bringing the laser and galvanometer assembly 31 closer to the base 35 and the processing table 22 or away from the base 35 and the processing table 22. The position of the laser focus can be adjusted by adjusting the height of the laser and galvanometer assembly 31, further improving the processing accuracy.

[0092] Please refer to this as well. Figure 10 and Figure 11 , Figure 10 for Figure 1 A schematic cross-sectional view of the laser processing equipment shown. Figure 11 for Figure 10 The diagram shows a partial enlarged view of the laser processing equipment. In this embodiment, the diameter of the second through hole 350 is larger than the diameter of the first through hole 110. In other words, the second through hole 350 is larger than the first through hole 110, which facilitates the full exposure of the first through hole 110 when the base 35 is installed, preventing the base 35 from blocking the first through hole 110 and thus reducing the processing area of ​​the laser.

[0093] In this embodiment, the laser device 30 also includes a base plate 37, which is disposed in the second through hole 350 and detachably connected to the base 35. The base plate 37 is used to support the workpiece.

[0094] In addition to the aforementioned components, the laser device 30 may also include a base plate 37. The base plate 37 can be disposed within the second through hole 350 to fill the second through hole 350, and the base plate 37 can also be detachably connected to the base 35. When the laser device 30 is used alone, the base plate 37 can be disposed within the second through hole 350 and connected to the base 35, thus filling the second through hole 350 of the base 35. The workpiece can then be supported on the base plate 37 and the base 35, improving the workpiece support effect. When the laser device 30 is connected to the fixed platform 10 and used in conjunction with the moving platform 20, the base plate 37 can be detached to expose the second through hole 350, allowing the laser to pass through the second through hole 350 and the first through hole 110 and be projected onto the processing table 22.

[0095] Optionally, when the base plate 37 is located in the second through hole 350 and connected to the base 35, the support surface of the base plate 37 is flush with the support surface of the base 35, which can better support the workpiece.

[0096] In this embodiment, the wall of the second through hole 350 is provided with a stepped structure 351, and the bottom plate 37 can abut against the stepped surface of the stepped structure 351.

[0097] In this embodiment, a stepped structure 351 can be provided on the wall of the second through hole 350, so that the base plate 37 can abut against the stepped surface of the stepped structure 351, thereby improving the support effect of the base plate 37 and facilitating the installation and disassembly of the base plate 37. Optionally, the base plate 37 can be bonded, snapped, or threaded to the stepped structure 351, thereby further improving the connection performance between the base plate 37 and the stepped structure 351.

[0098] In this embodiment, the base 35 is provided with a first connecting part 352, and the support platform 11 is provided with a second connecting part 111. The first connecting part 352 and the second connecting part 111 cooperate to make the base 35 detachably connected to the support platform 11.

[0099] A first connecting part 352 can be provided on the base 35, and a second connecting part 111 can be provided on the support platform 11. When the first connecting part 352 is connected to the second connecting part 111, the base 35 can be connected to the support platform 11. When the first connecting part 352 and the second connecting part 111 are separated, the base 35 is separated from the support platform 11, that is, the laser device 30 is separated from the fixed platform 10. In summary, the base 35 and the support platform 11 can be quickly connected through the cooperation of the first connecting part 352 and the second connecting part 111.

[0100] The first connecting part 352 and the second connecting part 111 can be quick-connect structures such as threaded connection structures, snap-fit ​​structures, and magnetic attraction structures. In some embodiments, the first connecting part 352 includes a first connecting hole 3520, the second connecting part 111 includes a second connecting hole 1110, and the laser processing equipment 1 also includes a fastener that passes through the first connecting hole 3520 and the second connecting hole 1110 and connects the base 35 and the support platform 11.

[0101] By creating a first connecting hole 3520 on the base 35 and a second connecting hole 1110 on the support platform 11, and using fasteners inserted into the first connecting hole 3520 and the second connecting hole 1110, the base 35 is threadedly connected to the support platform 11 through the mutual engagement of the external thread of the fastener with the internal threads of the first connecting hole 3520 and the second connecting hole 1110. When the laser device 30 is disassembled, it is only necessary to remove the fasteners from the first connecting hole 3520 and the second connecting hole 1110 to separate the base 35 from the support platform 11, making installation and disassembly simple.

[0102] In some embodiments, when the first connecting portion 352 and the second connecting portion 111 adopt a snap-fit ​​structure, the first connecting portion 352 includes one of a snap-fit ​​and a slot, and the second connecting portion 111 includes the other of a snap-fit ​​and a slot. The base 35 can be connected to the support platform 11 by engaging the snap-fit ​​within the slot. The base 35 can be separated from the support platform 11 by removing the snap-fit ​​from the slot, making installation and disassembly simple.

[0103] In some embodiments, when the first connecting portion 352 and the second connecting portion 111 are in the form of a magnetic structure, the first connecting portion 352 includes a first magnetic portion, and the second connecting portion 111 includes a second magnetic portion, and the first magnetic portion and the second magnetic portion are magnetically attracted to each other. When the base 35 is close to the support platform 11, the first magnetic portion and the second magnetic portion are magnetically attracted to each other, thereby connecting the base 35 to the support platform 11. When disassembling, only a certain pulling force is required to separate the base 35 from the support platform 11, making installation and disassembly simple. The first magnetic portion and the second magnetic portion can be either a magnet and a metal that can be attracted by a magnet, or both can be magnets but with opposite magnetic properties.

[0104] In this embodiment, the laser device 30 further includes a first buffer 38, which is disposed on the side of the base 35 near the support platform 11 and abuts against the support platform 11.

[0105] In addition to the aforementioned components, the laser device 30 may also include a first buffer member 38. The first buffer member 38 is an elastic component that provides cushioning. The first buffer member 38 can be located on the side of the base 35 near the support platform 11, i.e., below the base 35. Thus, when the laser device 30 is used alone, the first buffer member 38 can abut against the ground, tabletop, wall, etc., providing good cushioning. When the laser device 30 is connected to the fixed platform 10, the first buffer member 38 abuts against the support platform 11. At this time, when the base 35 is connected to the support platform 11 via the first connecting part 352 and the second connecting part 111, the first buffer member 38 can prevent rigid contact between the base 35 and the support platform 11, thus preventing collisions between the base 35 and the support member.

[0106] Furthermore, the projection of the first buffer 38 on the support platform 11 and the projection of the first connecting portion 352 on the support platform 11 can be spaced apart. In other words, the first connecting portion 352, for example, the first connecting hole 3520, is horizontally offset from the first buffer 38. Thus, when the first connecting portion 352 and the second connecting portion 111 cooperate, it will not affect the first buffer 38. For example, when a fastener passes through the first connecting hole 3520, it will not penetrate the first buffer 38 and will not damage the first buffer 38.

[0107] Optionally, there are two first buffer members 38, which are located at opposite ends of the bottom surface of the base 35.

[0108] Please refer to Figure 12 , Figure 12 As described in one embodiment of this application Figure 11 The diagram shows a workpiece placed on a processing table in a laser processing device. In this embodiment, there is a gap between the processing table 22 and the support table 11, and the gap is greater than a preset value, so that the workpiece 2 is placed on one side of the support table 11.

[0109] As can be seen from the above, the processing table 22 is located below the support table 11. This embodiment firstly allows for a certain gap between the processing table 22 and the support table 11 (e.g., Figure 12 As shown in Figure L, this avoids friction between the processing table 22 and the support table 11, improving the movement efficiency of the processing table 22. Furthermore, this embodiment allows the gap to be greater than a preset value, which can be understood as the maximum thickness of the workpiece 2. For example, the maximum thickness of different types of workpieces 2 can be 10cm, so the preset value is 10cm. This gap being greater than the preset value allows the workpiece 2 to be positioned entirely on one side of the support table 11, i.e., below the support table 11. When the workpiece 2 moves synchronously under the movement of the processing table 22, it is not limited by the dimensions of the first through hole 110 and the second through hole 350, further increasing the processing area.

[0110] In this embodiment, the motion component 21 is used to move the workpiece 2 supported on the processing table 22. When the workpiece 2 does not correspond to the first through hole 110, the laser stops outputting laser.

[0111] As can be seen from the above, the motion component 21 can drive the processing table 22 and the workpiece 2 supported on the processing table 22 to move below the support table 11. At this time, the laser can process the part of the workpiece 2 that corresponds to the first through hole 110 and protrudes from the first through hole 110. This embodiment can ensure that when the workpiece 2 does not correspond to the first through hole 110, in other words, when the workpiece 2 moves outside the first through hole 110, there is no workpiece 2 in the first through hole 110, and the projection of the workpiece 2 on the base 35 is spaced apart from the first through hole 110, the laser stops outputting laser light, thereby preventing the laser from shining through the first through hole 110 onto the processing table 22 or the motion component 21 below the processing table 22.

[0112] Please refer to Figure 13 , Figure 13 In another embodiment of this application Figure 11The diagram shows a workpiece placed on a processing table in a laser processing device. In this embodiment, there is a gap between the processing table 22 and the support table 11, and the gap is not greater than a preset value, so that part of the workpiece 2 is placed in the first through hole 110; the hole wall of the first through hole 110 and / or the hole wall of the second through hole 350 are provided with a second buffer 39, and the workpiece 2 can abut against the second buffer 39.

[0113] As can be seen from the above, the processing table 22 is located below the support table 11. This embodiment firstly allows for a certain gap between the processing table 22 and the support table 11 (e.g., Figure 13 As shown in Figure L, this avoids friction between the processing table 22 and the support table 11, improving the movement efficiency of the processing table 22. Furthermore, this embodiment ensures that the gap is no greater than a preset value, which can be understood as the maximum thickness of the workpiece 2. For example, the maximum thickness of different types of workpieces 2 can be 10cm, so the preset value is 10cm. Therefore, when processing workpieces 2 that are relatively small in length and width, for example, smaller than the length and width of the first through hole 110, but have a relatively thick thickness, a portion of the workpiece 2 can be placed within the first through hole 110, allowing the laser processing equipment 1 to also process such workpieces 2.

[0114] Based on this, this embodiment may also provide a second buffer 39 on the wall of the first through hole 110 and / or the wall of the second through hole 350. For example, the second buffer 39 may be provided on the wall of the first through hole 110, or on the wall of the second through hole 350, or simultaneously on the walls of both the first through hole 110 and the second through hole 350. This embodiment is only illustrated by providing the second buffer 39 on the wall of the first through hole 110. When the workpiece 2 moves, the workpiece 2 may come into contact with the walls of the first through hole 110 and / or the second through hole 350. The provision of the second buffer 39 can prevent the workpiece 2 from rigidly contacting the base 35 and / or the support platform 11, thus avoiding mutual collision.

[0115] In this embodiment, when the workpiece 2 abuts against the second buffer 39, the motion component 21 stops working. Controlling the motion component 21 to stop working firstly prevents the processing table 22 from continuously moving, but the workpiece 2 remains stationary due to its contact with the second buffer 39, causing relative movement between the workpiece 2 and the processing table 22, thereby preventing the workpiece 2 from falling off the processing table 22. Furthermore, if the motion component 21 continues to work while the workpiece 2 remains stationary when it abuts against the second buffer 39, it will affect the software algorithm, thereby affecting the position of the laser beam on the workpiece 2 and reducing processing accuracy.

[0116] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0117] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. Moreover, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0118] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0119] The foregoing has provided a detailed description of the embodiments of this application, elucidating and explaining the principles and implementation methods of this application. These descriptions are merely for the purpose of aiding understanding the method and core ideas of this application. However, the content of this specification should not be construed as a limitation of this application. Those skilled in the art can make various modifications and variations to this application without departing from its spirit and scope. These modifications and variations fall within the scope of the claims of this application and their equivalents.

Claims

1. A laser processing apparatus characterized by comprising: The laser processing equipment comprises: a fixed platform; a moving platform connected to the fixed platform, the moving platform comprising a moving assembly and a processing table arranged on the moving assembly, the moving assembly being configured to drive the processing table to move at least along a first axis, and the processing table being configured to carry a workpiece; a laser device detachably connected to the fixed platform, the laser device comprising a laser and a galvanometer assembly, the galvanometer assembly being configured to receive a laser beam output by the laser and drive the laser beam to move at least along a second axis, and the laser device being configured to project the laser output by the laser device onto the workpiece on the processing table, the second axis being non-parallel to the first axis.

2. The laser processing apparatus according to claim 1, wherein The fixed platform comprises a support and a bearing table connected to the support, the moving platform is arranged on the support and located on a side of the bearing table facing the support, the laser device is detachably connected to a side of the bearing table away from the support, and the bearing table is provided with a first through hole or opening, the first through hole / opening being opposite to the laser device so that the laser output by the laser device is projected onto the workpiece on the processing table through the first through hole / opening.

3. The laser processing apparatus according to claim 2, wherein The laser device comprises a base, a frame connected to the base, and a laser head connected to the frame, the bearing table is provided with a first through hole, the laser head comprises the laser and the galvanometer assembly, the base is detachably connected to the bearing table, the base is provided with a second through hole communicating with the first through hole, and the laser head is opposite to the second through hole.

4. The laser processing apparatus according to claim 3, wherein The laser device further comprises a bottom plate arranged in the second through hole and detachably connected to the base, and the bottom plate is configured to carry the workpiece.

5. The laser processing apparatus according to claim 3, wherein The base is provided with a first connecting portion, the bearing table is provided with a second connecting portion, and the first connecting portion cooperates with the second connecting portion so that the base is detachably connected to the bearing table.

6. The laser processing apparatus according to claim 5, wherein The first connecting portion comprises a first connecting hole, the second connecting portion comprises a second connecting hole, the laser processing equipment further comprises a fastener, the fastener passes through the first connecting hole and the second connecting hole and connects the base and the bearing table; or The first connecting portion comprises one of a buckle and a clamping groove, the second connecting portion comprises the other of the buckle and the clamping groove; or The first connecting portion comprises a first magnetic portion, the second connecting portion comprises a second magnetic portion, and the first magnetic portion and the second magnetic portion can be magnetically attracted to each other.

7. The laser processing apparatus according to claim 3, wherein The laser device further comprises a first buffer arranged on a side of the base close to the bearing table, and the first buffer abuts against the bearing table; and / or The hole wall of the first through hole and / or the hole wall of the second through hole is provided with a second buffer; and / or The hole diameter of the second through hole is greater than the hole diameter of the first through hole.

8. The laser processing apparatus according to any one of claims 1 to 7, wherein The moving assembly is configured to drive the processing table to move along the first axis and a third axis, and the third axis is parallel to the second axis; and / or The galvanometer assembly is configured to drive the laser beam to move along the second axis and a fourth axis, and the fourth axis is parallel to the first axis.

9. The laser processing apparatus according to any one of claims 1 to 7, wherein The motion assembly comprises an X-axis motion component and a Y-axis motion component, the X-axis motion component is connected to the fixed platform, the Y-axis motion component is slidingly connected to the X-axis motion component, and the processing table is slidingly connected to the Y-axis motion component; the X-axis motion component is used to drive the Y-axis motion component and the processing table to move along the X-axis direction; and the Y-axis motion component is used to drive the processing table to move along the Y-axis direction.

10. The laser processing apparatus according to any one of claims 1 to 7, wherein The galvanometer assembly comprises a U-axis galvanometer and a V-axis galvanometer; the U-axis galvanometer can deflect the laser beam emitted by the laser along the U-axis direction; and the V-axis galvanometer can deflect the laser output by the U-axis galvanometer along the V-axis direction.

11. The laser processing apparatus according to any one of claims 1 to 7, wherein The motion platform further comprises a first controller, the first controller is electrically connected to the motion assembly and is used to control the motion assembly; the laser device further comprises a second controller, the second controller is electrically connected to the galvanometer assembly and is used to control the galvanometer assembly; and the first controller and the second controller are connected in wired communication or wireless communication; Alternatively, the laser processing equipment further comprises a third controller, the third controller is electrically connected to the motion assembly and the galvanometer assembly to control the motion assembly and the galvanometer assembly.

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