Water purification equipment

Abstract

The utility model relates to water purification equipment. The water purification equipment comprises a shell, a water storage tank, a first heat exchanger, a second heat exchanger and a heat conduction assembly, the water storage tank is arranged in the shell, a first mounting part and a second mounting part are arranged on the side wall of the water storage tank, mounting holes are formed in the first mounting part and the second mounting part, and the heat conduction assembly is connected with the first heat exchanger and the second heat exchanger. And the heat conduction piece penetrates through the mounting hole and extends into the water storage tank. The water purification equipment can improve the refrigeration efficiency of the water purifier.

Description

Technical Field

[0001] This utility model relates to the field of water purifiers, specifically to a water purification device. Background Technology

[0002] A water purifier, also called a water filter or water purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. However, the cooling methods in related technologies are relatively slow, requiring users to wait a considerable amount of time. Utility Model Content

[0003] Therefore, this utility model provides a water purification device. The water purification device can improve the cooling efficiency of a water purifier.

[0004] This utility model provides the following technical solution: a water purification device, comprising: a shell, a water storage tank, a first heat exchanger, a second heat exchanger, and a heat-conducting component;

[0005] The water storage tank is disposed inside the shell. A first mounting part and a second mounting part are provided on the side wall of the water storage tank. Both the first mounting part and the second mounting part are provided with mounting holes. The heat conduction component is connected to the first heat exchanger and the second heat exchanger. The heat conduction component extends into the water storage tank through the mounting holes.

[0006] Furthermore, the heat-conducting component includes: a heat-absorbing element and multiple heat-conducting sheets;

[0007] Multiple heat-conducting sheets are spaced apart on the heat-absorbing element along a first direction. The heat-absorbing element is attached to the first heat exchanger and / or the second heat exchanger. The heat-conducting sheets are used to release heat.

[0008] Furthermore, it also includes: limiting components;

[0009] The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting portion, wherein the limiting portion is disposed on the extension and there is an included angle between the extension and the limiting portion; when the heat-conducting assembly is installed in the mounting hole, the limiting portion is parallel to the heat-conducting sheet.

[0010] Furthermore, it also includes: heat dissipation components;

[0011] Both the first heat exchanger and the second heat exchanger are semiconductor coolers. Each semiconductor cooler includes a heating surface and a cooling surface, and the cooling surface is connected to the heat-conducting component. The heat dissipation component is disposed on the heating surface and is used to dissipate heat from the semiconductor cooler.

[0012] Furthermore, the heat dissipation component includes: heat dissipation fins, a heat-conducting component, and a driving component;

[0013] The heat dissipation fins are disposed on the heat-conducting component, the driving component is disposed on the heat dissipation fins, and the heat-conducting component is disposed on the heating surface.

[0014] Furthermore, the heat dissipation fins include: a plurality of heat dissipation fins, which are spaced apart along the length of the heat-conducting member, and a flow channel is formed between two adjacent heat dissipation fins, and the driving member is used for airflow within the flow channel.

[0015] Furthermore, it also includes: a first baffle and a second baffle;

[0016] The first baffle and the second baffle are spaced apart within the housing along the length direction of the housing, and the first baffle and the second baffle divide the housing into a first cavity, a second cavity, and a mounting cavity;

[0017] The installation cavity is equipped with a filter element, the first cavity is equipped with a booster pump, and the water storage tank is installed in the second cavity.

[0018] Furthermore, it also includes: filter elements and booster pumps;

[0019] The booster pump is connected to the filter element, and the filter element is connected to the water storage tank. The filter element is used to provide purified water to the water storage tank.

[0020] Furthermore, it also includes: vane pumps and level sensors;

[0021] The liquid level sensor is installed inside the water storage tank and is used to detect the liquid level inside the water storage tank. The vane pump is connected to the water storage tank and is used to supply water to the water-using equipment.

[0022] Furthermore, a heat insulation layer is provided in each of the second cavities.

[0023] The aforementioned water purification equipment has a water storage tank inside the casing, and a first mounting part and a second mounting part are provided on the water storage tank. Mounting holes are provided on the first mounting part and the second mounting part. By allowing a heat-conducting component to pass through the mounting holes and extend into the water storage tank, heat can be transferred to the water storage tank through the heat-conducting component after it is connected to the first heat exchanger and the second heat exchanger, thereby cooling the purified water in the water storage tank. Through the first heat exchanger and the second heat exchanger, the cold water preparation efficiency in the water storage tank can be improved, thereby reducing the waiting time required by customers and improving the user experience. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the water purification equipment provided in the embodiment of this utility model;

[0026] Figure 2 This is a schematic diagram of the structure of the heat-conducting component provided in an embodiment of the present utility model;

[0027] Figure 3 A cross-sectional view of a water storage tank provided for an embodiment of this utility model;

[0028] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0029] Figure 5 A schematic diagram of the structure of the water storage tank and heat dissipation assembly provided in the embodiments of this utility model;

[0030] Figure 6 An exploded view of the heat dissipation assembly provided in an embodiment of this utility model;

[0031] Figure 7 This is a schematic diagram of the structure of the heat dissipation fins provided in an embodiment of the present utility model;

[0032] Figure 8 One of the overall structural schematic diagrams of the water purification equipment provided in the embodiments of this utility model;

[0033] Figure 9 This is the second schematic diagram of the overall structure of the water purification equipment provided in this embodiment of the utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Water purification equipment; 10-Shell; 20-Water storage tank; 21-First mounting part; 22-Second mounting part; 23-Mounting hole; 30-First heat exchanger; 40-Second heat exchanger; 41-Semiconductor cooler; 42-Heating surface; 43-Cooling surface; 50-Heat-conducting component; 51-Heat-absorbing component; 52-Heat-conducting fin; 60-Limiting component; 61-Extension; 62-Limiting component; 70-Heat dissipation component; 71-Heat dissipation fin; 72-Heat-conducting component; 73-Driver; 74-Heat dissipation fin; 75-Flow channel; 80-First baffle; 81-Second baffle; 82-First cavity; 83-Second cavity; 84-Mounting cavity; 85-Filter element; 86-Booster pump; 90-Vannel pump; 91-Liquid level sensor; 92-Insulation layer. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0038] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] A water purifier, also called a water filter or water purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. However, the cooling methods in related technologies are relatively slow, requiring users to wait a considerable amount of time.

[0040] Therefore, this embodiment provides a water purification device 100. The water purification device 100 can improve the cooling efficiency of a water purifier.

[0041] Please see Figure 1 A water purification device 100 includes: a shell 10, a water storage tank 20, a first heat exchanger 30, a second heat exchanger 40, and a heat-conducting component 50;

[0042] The water storage tank 20 is disposed inside the housing 10. A first mounting part 21 and a second mounting part 22 are provided on the side wall of the water storage tank 20. Both the first mounting part 21 and the second mounting part 22 are provided with mounting holes 23. The heat conduction component 50 is connected to the first heat exchanger 30 and the second heat exchanger 40. The heat conduction component 50 extends through the mounting holes 23 into the water storage tank 20.

[0043] The aforementioned water purification equipment 100 has a water storage tank 20 inside the housing 10, and a first mounting part 21 and a second mounting part 22 are provided on the water storage tank 20. Mounting holes 23 are provided in the first mounting part 21 and the second mounting part 22. By allowing the heat-conducting component 50 to pass through the mounting holes 23 and extend into the water storage tank 20, when the heat-conducting component 50 is connected to the first heat exchanger 30 and the second heat exchanger 40, heat can be transferred to the water storage tank 20 through the heat-conducting component 50 to cool the purified water in the water storage tank 20. Through the first heat exchanger 30 and the second heat exchanger 40, the cold water preparation efficiency in the water storage tank 20 can be improved, thereby reducing the waiting time required by customers and improving the user experience.

[0044] Understandably, the water storage tank 20 is housed within the shell 10, and a first mounting portion 21 and a second mounting portion 22 are provided on the water storage tank 20. Both the first mounting portion 21 and the second mounting portion 22 are provided with mounting holes 23. The first mounting portion 21 and the second mounting portion 22 can be located on two opposite surfaces, or spaced apart on the water storage tank 20, or spaced apart on two opposite surfaces. The heat-conducting component 50 is located within the mounting holes 23, allowing it to contact the purified water in the water storage tank 20. When the first heat exchanger 30 and the second heat exchanger 40 are cooling, the heat-conducting component 50 can transfer the cooling energy to the water storage tank 20. Thus, the heat-conducting component 50 can directly transfer the cooling energy to the water storage tank 20 and exchange heat with the cold water in the water storage tank 20, thereby improving the heat exchange efficiency of the water storage tank 20.

[0045] Understandably, since the first heat exchanger 30 and the second heat exchanger 40 are located in different positions, when the first heat exchanger and the second heat exchanger are cooling, the cooling capacity generated by the first heat exchanger and the second heat exchanger can heat the pure water in different locations of the water storage tank 20. Furthermore, since the first heat exchanger 30 and the second heat exchanger 40 are cooling simultaneously, more cooling capacity can be generated per unit time. This improves the cooling efficiency of the water storage tank 20 when preparing cold water, thereby reducing the waiting time required by customers and improving the user experience.

[0046] Please see Figure 2In some embodiments, the heat-conducting component 50 includes: a heat-absorbing element 51 and a plurality of heat-conducting sheets 52;

[0047] Multiple heat-conducting sheets 52 are spaced apart on the heat-absorbing element 51 along a first direction. The heat-absorbing element 51 is attached to the first heat exchanger 30 and / or the second heat exchanger 40. The heat-conducting sheets 52 are used to release heat.

[0048] Understandably, the heat-conducting component 50 includes a heat-absorbing element 51 and heat-conducting plates 52. The heat-absorbing element 51 is connected to the heat exchanger and is used to collect the heat generated by the first heat exchanger 30 and the second heat exchanger 40. Multiple heat-conducting plates 52 are spaced apart on the heat-absorbing element 51 and are perpendicular to the heat-absorbing element 51. The heat-conducting plates 52 extend into the water storage tank 20, so that the cold energy on the heat-absorbing element 51 can be transferred to the water storage tank 20 through the heat-conducting component 50. In this way, the cold energy generated by the semiconductor cooler 41 can be transferred to the water storage tank 20 through the heat-absorbing element 51 and the heat-conducting plates 52. The multiple heat-conducting plates 52 can accelerate the efficiency of energy transfer, so that energy can enter the water storage tank 20 faster and more evenly, realize heat exchange, and thus enable the heat-conducting component 50 to conduct heat.

[0049] Please see Figure 3 and Figure 4 In some embodiments, it also includes: a limiting member 60;

[0050] The limiting member 60 is disposed around the outer periphery of the mounting hole 23. The limiting member 60 includes an extension 61 and a limiting part 62, wherein the limiting part 62 is disposed on the extension 61 and there is an included angle between the extension 61 and the limiting part 62; when the heat-conducting component 50 is installed in the mounting hole 23, the limiting part 62 is parallel to the heat-conducting sheet 52.

[0051] Understandably, a limiting member 60 is provided on the outer periphery of the mounting hole 23. The limiting member 60 is used to cooperate with the heat-conducting component 50 to limit the relative position of the heat-conducting component 50 relative to the water storage tank 20. The limiting member 60 includes an extension 61 and a limiting part 62. The extension 61 extends away from the mounting hole 23 (i.e., extends to the outside of the water storage tank 20). The limiting part 62 is disposed on the extension 61. The limiting part 62 can be disposed perpendicularly on the extension 61 or form an angle with the limiting part 62. This allows the limiting part 62 to limit the installation position of the heat-conducting component 50, making the installation of the heat-conducting component 50 more convenient.

[0052] Please see Figure 5 In some embodiments, it further includes: a heat dissipation component 70;

[0053] Both the first heat exchanger 30 and the second heat exchanger 40 are semiconductor coolers 41. Each semiconductor cooler 41 includes a heating surface 42 and a cooling surface 43. The cooling surface 43 is connected to the heat-conducting component 50. The heat dissipation component 70 is disposed on the heating surface 42 and is used to dissipate heat from the semiconductor cooler 41.

[0054] Understandably, when the first heat exchanger 30 and the second heat exchanger 40 are cooling the semiconductor cooler 41, the semiconductor cooler 41 will generate a large amount of heat during cooling. This heat not only affects the efficiency of the semiconductor cooler 41 in generating cooling capacity during operation, but also affects the temperature of the water storage tank 20, causing the internal temperature of the water storage tank 20 to rise. As a result, the cooling efficiency of the pure water in the water storage tank 20 will decrease due to the heat. Therefore, a heat dissipation component 70 is provided on the heating surface 42 of the semiconductor cooler 41 to remove the heat generated by the semiconductor cooler 41 from the heating surface 42. This not only reduces the internal temperature of the casing 10, but also improves the heating efficiency of the semiconductor cooler 41.

[0055] Please see Figure 5 and Figure 6 In some embodiments, the heat dissipation assembly 70 includes: heat dissipation fins 71, heat conduction element 72, and driving element 73;

[0056] The heat dissipation fins 71 are disposed on the heat-conducting component 72, the driving component 73 is disposed on the heat dissipation fins 71, and the heat-conducting component 72 is disposed on the heating surface 42.

[0057] Understandably, the heat dissipation component 70 includes: heat dissipation fins 71, a heat-conducting element 72, and a driving element 73. The heat-conducting element 72 is disposed on the heating surface 42, and the heat dissipation fins 71 are disposed on the heat-conducting element 72. Multiple heat dissipation fins 71 are disposed vertically on the side of the heat-conducting element 72 away from the heating surface 42. In this way, heat can be transferred to the heat dissipation fins 71 through the heat-conducting element 72. Once the heat is conducted to the heat dissipation fins 71, the airflow near the heat dissipation fins 71 can exchange heat with them, thus carrying away the heat from the heat dissipation fins 71 and achieving heat dissipation. A driving element 73 is also disposed on one side of the heat dissipation fins 71. The driving element 73 accelerates the airflow near the heat dissipation fins 71, thereby carrying away the heat from the heat dissipation fins 71 and achieving efficient heat dissipation. Specifically, when the heating surface 42 of the semiconductor cooler 41 generates heat, the heat is transferred to the heat conductor 72, and then to the heat dissipation fins 71. The driving component 73 on the heat dissipation fins 71 can accelerate the airflow near the heat dissipation fins 71, thereby achieving the purpose of cooling the semiconductor cooler 41.

[0058] Please see Figure 6 and Figure 7 In some embodiments, the heat dissipation fins 71 include: a plurality of heat dissipation fins 74, the plurality of heat dissipation fins 74 being spaced apart along the length direction of the heat conductor 72, a flow channel 75 being formed between two adjacent heat dissipation fins 74, and the driving member 73 being used for airflow within the flow channel 75.

[0059] Understandably, the heat dissipation fins 71 include multiple heat sinks 74, which are spaced apart along the length of the heat conductor 72. This creates a flow channel 75 between adjacent heat sinks 74, allowing airflow to pass through. To enable the heat sinks 74 to better receive heat, the heat sink is positioned on the side of the heat dissipation fins 71 away from the thermoelectric cooler 41. This allows the drive unit 73 to drive the airflow near the heat sinks 71 to flow between the two heat sinks 71. When the heat sink drives the airflow, the hot airflow first passes through the heat sinks 74, thus improving the heat dissipation effect of the drive unit 73. This allows the airflow to exchange heat with the heat conductor 72 as much as possible, carrying away the heat on the heat conductor 72 through heat exchange, thereby improving the heat dissipation effect of the heat dissipation assembly 70.

[0060] Please see Figure 8 In some embodiments, it also includes: a first baffle 80 and a second baffle 81;

[0061] The first baffle 80 and the second baffle 81 are spaced apart within the housing 10 along the length direction of the housing 10, and the first baffle 80 and the second baffle 81 divide the housing 10 into a first cavity 82, a second cavity 83, and a mounting cavity 84;

[0062] The installation cavity 84 is equipped with a filter element 85, the first cavity 82 is equipped with a booster pump 86, and the water storage tank 20 is installed in the second cavity 83.

[0063] Understandably, a first baffle 80 and a second baffle 81 are also provided inside the housing 10. The first baffle 80 and the second baffle 81 are spaced apart inside the housing 10. After the first baffle 80 and the second baffle 81 are installed inside the housing 10, the first baffle 80 and the second baffle 81 are parallel. In this way, the first baffle 80 and the second baffle 81 can divide the inside of the housing 10 into a first chamber, a second chamber 83, and an installation cavity 84.

[0064] The mounting cavity 84 has a semi-enclosed structure for installing the filter element 85. The semi-enclosed structure facilitates the installation and removal of the filter element 85. The first cavity 82 and the second cavity 83 are both inside the housing 10. The first cavity 82 is used to install the booster pump 86, and the second cavity 83 is used to install the water storage tank 20. The booster pump 86 is used to pressurize the filter element 85. By pressurizing the water flow through the booster pump 86, the water flow can be filtered through the filter element 85. The filtered water flows into the water storage tank 20 for storage and cooling.

[0065] Please see Figure 8 and Figure 9 In some embodiments, it also includes: filter element 85 and booster pump 86;

[0066] The booster pump 86 is connected to the filter element 85, and the filter element 85 is connected to the water storage tank 20. The filter element 85 is used to provide purified water to the water storage tank 20.

[0067] Understandably, the filter element 85 is installed in the mounting cavity 84, the booster pump 86 is installed in the first cavity 82, and the water storage tank 20 is installed in the second cavity 83. The booster pump 86 is connected to the filter element 85, and the municipal water supply is connected to the booster pump 86. After being pressurized by the booster pump 86, the municipal water supply enters the filter element 85. The purified water filtered by the filter element 85 flows into the water storage tank 20. Then, the semiconductor cooler 41 generates cooling energy to cool the purified water in the water storage tank 20. The user can preset the temperature in the water storage tank 20. When the preset temperature is above 5°C, the semiconductor cooler 41 cools the water storage tank 20. When the preset temperature is below 5°C, the semiconductor cooler 41 stops working or enters the heat preservation mode. When the user needs water, it can be delivered to the water-using equipment through the outlet of the heat storage tank.

[0068] Understandably, the booster pump 86 is used to pressurize the unpurified water because the filter element 85 contains an RO filter element 85 (Reverse Osmosis membrane). The water pressure of the municipal water supply is insufficient to allow the water to pass through the RO filter element 85 during water purification. In order to ensure that the water can pass through the filter element 85 smoothly, the booster pump 86 is set up to ensure that the water can flow into the filter element 85 and at the same time ensure the purification efficiency of the filter element 85.

[0069] Understandably, filter element 85 includes PPC composite filter element 85 and RO filter element 85. When filtering water, the water first passes through the composite filter element 85 for coarse filtration, then through the RO filter element 85 for fine filtration, and then flows out of the filter element 85 through the outlet and into the heating tank. The aforementioned PPC composite filter element 85 is a filter element 85 that combines PP cotton and activated carbon, and the RO filter element 85 is the filter element 85 for reverse osmosis pure water machines.

[0070] Please see Figure 8 In some embodiments, it also includes: a vane pump 90 and a liquid level sensor 91;

[0071] The liquid level sensor 91 is installed inside the water storage tank 20. The liquid level sensor 91 is used to detect the liquid level inside the water storage tank 20. The vane pump 90 is connected to the water storage tank 20 and is used to supply water to water-using equipment.

[0072] Understandably, the vane pump 90 can be installed at any location within the housing 10, such as in the first chamber 82 or the second chamber 83, and the vane pump 90 is connected to the water storage tank 20. In this way, the vane pump 90 can pressurize the purified water in the water storage tank 20 and deliver the pressurized water to the user end to achieve water supply for the water purification equipment 100. Specifically, the hot water in the heat storage tank flows out through the outlet of the heat storage tank and flows to the vane pump 90. After pressurizing the hot water, the vane pump 90 delivers it to the user end for user use. The vane pump 90 can ensure that the installation position of the heat storage tank is not affected by water pressure and can smoothly deliver the hot water in the heat storage tank to the water-using equipment to improve the user experience.

[0073] Understandably, the liquid level sensor 91 is installed inside the heating tank. The liquid level sensor 91 is mainly used to detect the current liquid level in the heating tank. When the liquid level sensor 91 detects the current liquid level in the heating tank, it can send relevant data back to the controller to display the current liquid level of the heating tube. Alternatively, when the liquid level sensor 91 detects the current liquid level in the heating tank, it can send relevant data back to the controller. The controller outputs relevant instructions based on the input data. Specifically, when the liquid level reaches the preset height, the controller controls the water pump to stop working. When the liquid level is low, the controller controls the water pump to replenish liquid into the heating tank.

[0074] Please see Figure 8 In some embodiments, a heat insulation layer 92 is provided inside the second cavity 83.

[0075] Understandably, a heat insulation layer 92 is provided on the side wall of the second cavity 83. The heat insulation layer 92 can isolate the second cavity 83 from the outside temperature. When there is a temperature difference between the inside and outside of the second cavity 83, the heat insulation layer 92 can prevent the energy inside the shell 10 from leaking out, reduce the loss of cold energy in the shell 10, reduce energy waste, and also improve the cooling effect of the water purifier.

[0076] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A water purification device, characterized in that, The application relates to a water purifier, which comprises a shell, a water storage tank, a first heat exchanger, a second heat exchanger and a heat conduction assembly. The water storage tank is arranged in the shell, first and second mounting portions are arranged on the side wall of the water storage tank, mounting holes are arranged in the first and second mounting portions, the heat conduction assembly is connected with the first and second heat exchangers, and the heat conduction assembly extends into the water storage tank through the mounting holes. The heat conduction assembly comprises a heat absorbing part and a plurality of heat conduction fins.

2. The water purification apparatus according to claim 1, characterized by The plurality of heat conduction fins are arranged on the heat absorbing part in a first direction, the heat absorbing part is attached to the first and / or second heat exchanger, and the heat conduction fins are used for releasing heat. Further comprising:

3. The water purification apparatus according to claim 2, characterized by a limiting part; The limiting part is arranged around the outer periphery of the mounting hole, the limiting part comprises an extension part and a limiting part, the limiting part is arranged on the extension part, and an included angle is formed between the extension part and the limiting part; when the heat conduction assembly is mounted in the mounting hole, the limiting part is parallel to the heat conduction fin. Further comprising:

4. The water purification apparatus according to claim 3, characterized by a heat dissipation assembly; The first and second heat exchangers are both semiconductor refrigerators, the semiconductor refrigerator comprises a heating surface and a refrigerating surface, the refrigerating surface is connected with the heat conduction assembly, and the heat dissipation assembly is arranged on the heating surface and used for dissipating heat for the semiconductor refrigerator. The heat dissipation assembly comprises heat dissipation fins, a heat conduction part and a driving part.

5. The water purification apparatus according to claim 4, characterized by The heat dissipation fins are arranged on the heat conduction part, the driving part is arranged on the heat dissipation fins, and the heat conduction part is arranged on the heating surface. The heat dissipation fins comprise a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged in a length direction of the heat conduction part, a flow channel is formed between adjacent two heat dissipation fins, and the driving part is used for airflow flowing in the flow channel.

6. The water purification apparatus according to claim 5, characterized by Further comprising:

7. The water purification apparatus according to claim 5, characterized by a filter core and a booster pump; The booster pump is connected with the filter core, the filter core is connected with the water storage tank, and the filter core is used for providing pure water for the water storage tank. Further comprising:

8. The water purification apparatus according to claim 5, characterized by first and second baffles; The first and second baffles are arranged in the shell in a length direction of the shell, and the first and second baffles divide the shell into a first cavity, a second cavity and a mounting cavity. The mounting cavity is provided with the filter core, the first cavity is provided with the booster pump, and the water storage tank is arranged in the second cavity. Further comprising:

9. The water purification apparatus according to claim 8, characterized by a vane pump and a liquid level sensor; The liquid level sensor is arranged in the water storage tank and used for detecting the liquid level in the water storage tank, and the vane pump is connected with the water storage tank and used for supplying water to a water-using device. The second cavity is provided with a heat insulation layer.

10. The water purification apparatus according to claim 9, characterized by ​

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