Accelerated aging test device for semiconductor element

Abstract

The utility model discloses a semiconductor element accelerated aging test device, which relates to the technical field of semiconductor aging test, and comprises a test box, a fixing mechanism, a pull assembly, a support assembly and a fixing assembly, the pull assembly is arranged at the bottom of the inner wall of the test box, and the support assembly is arranged on the fixing mechanism. The supporting assembly and the fixing assembly are installed on the surface of the drawing assembly, and the fixing assembly is arranged on the surface of the supporting assembly. And the drawing assembly comprises a slide rail, a moving plate and a first toothed plate, the slide rail and the first toothed plate are fixedly connected to the bottom of the inner wall of the test box, and the moving plate is slidably connected to the surface of the slide rail. According to the utility model, the semiconductor element can be quickly fixed and disassembled through the fixing mechanism, the pins of the semiconductor element do not need to be fixedly connected and electrified manually, the safety is high, and the semiconductor can be fixed and disassembled in the process of drawing, pulling, taking and placing in the box body.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor aging test technology, and in particular to an accelerated aging test device for semiconductor components. Background Technology

[0002] With the rapid development of electronic technology, semiconductor components, as the core components of various electronic circuits, are constantly being used in various harsh environments. Semiconductor component accelerated aging test devices are used to simulate extreme conditions to make semiconductor components age quickly, thereby evaluating their lifespan and reliability. The working principle includes the control of temperature, humidity, voltage, frequency, etc., and the application scenarios may involve research and development, production, quality control and other links.

[0003] However, in practical applications, there are still some unresolved problems. The following are some common problems of semiconductor component accelerated aging test devices: Existing technologies cannot quickly fix and disassemble semiconductor components. Most of them rely on manual operation of clamping devices to fix and connect the semiconductor component pins and power them on, which is cumbersome and has low safety. It is not possible to fix and disassemble semiconductors by pulling them out of the box, which reduces the testing efficiency. Utility Model Content

[0004] In view of the problems existing in the above-mentioned semiconductor device accelerated aging test device, this utility model is proposed.

[0005] Therefore, the problem to be solved by this utility model is how to solve the problem that semiconductor components cannot be quickly fixed and disassembled, and that most of the time, the semiconductor component pins are fixed and connected by manual operation of clamping devices and then energized, which is cumbersome and has low safety.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a semiconductor device accelerated aging test device, including a test chamber, including a fixing mechanism installed inside the test chamber, including a pull-out assembly, a support assembly, and a fixing assembly. The pull-out assembly is installed at the bottom of the inner wall of the test chamber, the support assembly and the fixing assembly are installed on the surface of the pull-out assembly, and the fixing assembly is disposed on the surface of the support assembly; and the pull-out assembly includes a slide rail, a moving plate, and a first toothed plate. The slide rail and the first toothed plate are fixedly connected to the bottom of the inner wall of the test chamber, and the moving plate is slidably connected to the surface of the slide rail. The support assembly includes a spline tube, a rotating rod, and a guide post. The spline tube is slidably connected to the surface of the moving plate, the upper end of the rotating rod is slidably connected to the inner wall of the spline tube, and the guide post is fixedly connected to the upper end of the rotating rod. The fixing assembly includes a transmission component and a pressing component. The transmission component is disposed on the surface of the moving plate and the rotating rod, and the pressing component is installed on the surface of the transmission component.

[0007] As a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the pull-out assembly further includes a limiting block and a handle. The limiting block is fixedly connected to the top of the slide rail, and the handle is fixedly connected to the surface of the moving plate and located on one side thereon.

[0008] In a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the support assembly further includes a placement plate and a fixing plate. The placement plate is fixedly connected to the top of the spline tube, the fixing plate is fixedly connected to the bottom of the movable plate, and the rotating rod is rotatably connected to the surface of the fixing plate.

[0009] As a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the support assembly further includes a guide hole and a first spring. The guide hole is opened on the surface of the spline tube, the guide post is slidably connected in the guide hole, the first spring is sleeved on the surface of the spline tube, and its two ends are fixedly connected to the top of the moving plate and the bottom of the placement plate, respectively.

[0010] In a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the fixing component further includes a sliding plate and a vertical rod, the sliding plate being slidably connected to the surface of the movable plate, and the vertical rod being fixedly connected to the bottom of the sliding plate.

[0011] In a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the fixing component further includes a second toothed plate and a gear. The second toothed plate is fixedly connected to the lower end of the vertical rod, and the gear is fixedly connected to the lower end of the rotating rod and meshes with the second toothed plate.

[0012] In a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the transmission component includes a fixed rod, a guide frame and a slider. The fixed rod is fixedly connected to the top of the moving plate and to the bottom of the guide frame, and the slider is slidably connected inside the guide frame.

[0013] In a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the transmission component further includes a short rod and a connecting rod. The short rod is fixedly connected to the surface of the slider and located on one side thereon. The connecting rod is fixedly connected to the top of the slide plate and is slidably connected to the short rod.

[0014] In a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the lower pressure component includes a horizontal block, a square rod, and a pressure plate. The horizontal block is fixedly connected to the surface of the slider and located on one side thereon. The square rod is slidably connected to the surface of the horizontal block and fixedly connected to the top of the pressure plate.

[0015] As a preferred embodiment of the semiconductor element accelerated aging test device of this utility model, the lower pressure component further includes a second spring and a conductive sheet. The second spring is sleeved on the surface of the square rod, and its two ends are fixedly connected to the bottom of the horizontal block and the top of the pressure plate, respectively. The conductive sheet is fixedly connected to the bottom of the pressure plate.

[0016] The advantages of this utility model are as follows: This utility model can quickly fix and disassemble semiconductor components through a fixing mechanism, without the need to manually fix and connect the semiconductor component pins and power them on. It is highly safe and can fix and disassemble semiconductors by pulling and placing them in the box. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional structural diagram of an accelerated aging test device for semiconductor components.

[0019] Figure 2 A partial three-dimensional structural diagram of a semiconductor device accelerated aging test apparatus.

[0020] Figure 3 A three-dimensional cross-sectional view of a partial structure of an accelerated aging test device for semiconductor components.

[0021] Figure 4 Accelerated aging test equipment for semiconductor devices Figure 3 Enlarged structural diagram of A in the middle.

[0022] Figure 5 Accelerated aging test equipment for semiconductor devices Figure 3 Enlarged structural diagram of B in the middle.

[0023] Figure 6 A three-dimensional structural diagram of the placement board and spline tube of the accelerated aging test device for semiconductor components.

[0024] In the diagram: 100, Test box; 200, Fixing mechanism; 201, Pull-out assembly; 202, Support assembly; 203, Fixing assembly; 201a, Slide rail; 201b, Moving plate; 201c, First toothed plate; 201d, Limiting block; 201e, Handle; 202a, Spline tube; 202b, Placement plate; 202c, Fixing plate; 202d, Rotating rod; 202e, Guide post; 202f, Guide hole; 202g, First spring; 20 3a. Slide plate; 203b. Vertical rod; 203c. Second toothed plate; 203d. Gear; 203e. Transmission component; 203f. Pressing component; 203e-1. Fixed rod; 203e-2. Guide frame; 203e-3. Slider; 203e-4. Short rod; 203e-5. Connecting rod; 203f-1. Horizontal block; 203f-2. Square rod; 203f-3. Pressure plate; 203f-4. Second spring; 203f-5. Conductive sheet. Detailed Implementation

[0025] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0026] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0028] Example 1

[0029] Reference Figure 1 and Figure 2 This is the first embodiment of the present invention. This embodiment provides a semiconductor device accelerated aging test device. The semiconductor device accelerated aging test device includes a test chamber 100 and a fixing mechanism 200. The test chamber 100 can perform accelerated aging tests on semiconductor devices, and the fixing mechanism 200 can quickly fix and disassemble semiconductor devices.

[0030] Specifically, the pull-out component 201 is installed on the bottom of the inner wall of the test chamber 100, the support component 202 and the fixing component 203 are installed on the surface of the pull-out component 201, and the fixing component 203 is set on the surface of the support component 202.

[0031] The test chamber 100 is an existing semiconductor device for accelerated aging testing. Its internal structure is existing technology, and its working principle is also existing technology, which can be clearly understood by those skilled in the art and will not be described in detail here. The pull-out component 201 can act on the support component 202 and the fixing component 203. During the pull-out process, the fixing of the semiconductor device is released, and during the push-in process, the semiconductor device is fixed. There is no need for manual fixing and unfixing of the semiconductor device. It is simple, convenient, flexible and practical.

[0032] Specifically, slide rail 201a and first toothed plate 201c are fixedly connected to the bottom of the inner wall of test chamber 100, moving plate 201b is slidably connected to the surface of slide rail 201a, support assembly 202 includes spline tube 202a, rotating rod 202d and guide post 202e, spline tube 202a is slidably connected to the surface of moving plate 201b, the upper end of rotating rod 202d is slidably connected to the inner wall of spline tube 202a, and guide post 202e is fixedly connected to the upper end of rotating rod 202d, and fixing assembly 203 includes transmission component 203e and pressing component 203f, transmission component 203e is disposed on the surface of moving plate 201b and rotating rod 202d, and pressing component 203f is installed on the surface of transmission component 203e.

[0033] There are two slide rails 201a, which are fixedly connected to the inner wall of the test box 100 by a support rod. The slide rails 201a guide and limit the moving plate 201b, so that it can only move along the slide rail 201a. The first toothed plate 201c can act on the fixing component 203, thereby driving the support component 202 and the fixing component 203 to run together to complete the fixing or unlocking of the semiconductor component.

[0034] The spline tube 202a passes through the movable plate 201b and is slidably connected to it. The up and down movement of the spline tube 202a can act on the guide post 202e, thereby causing the rotating rod 202d and the guide post 202e to rotate. Similarly, under the action of the rotation of the rotating rod 202d and the guide post 202e, the spline tube 202a can move. Through the transmission component 203e, the pressing component 203f is driven, which can realize the fixing and release of the semiconductor components on the placement plate 202b.

[0035] Example 2

[0036] Reference Figures 2-6 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0037] Specifically, the limiting block 201d is fixedly connected to the top of the slide rail 201a, and the handle 201e is fixedly connected to the surface of the moving plate 201b and located on one side thereon.

[0038] Two limiting blocks 201d are fixedly connected to the top of a slide rail 201a. One of them limits the position of the moving plate 201b when it is pulled out to prevent it from falling off the slide rail 201a. The other limits the moving plate 201b after it is pushed into the test box 100. The moving plate 201b can be moved by pulling the handle 201e.

[0039] The placement plate 202b is fixedly connected to the top of the spline tube 202a, the fixed plate 202c is fixedly connected to the bottom of the movable plate 201b, and the rotating rod 202d is rotatably connected to the surface of the fixed plate 202c.

[0040] The placement plate 202b is made of insulating material. The lower end of the rotating rod 202d is rotatably connected to the bottom of the fixed plate 202c through a bearing. The fixed plate 202c and the bearing fix and support the rotating rod 202d without affecting its rotation.

[0041] A guide hole 202f is formed on the surface of the spline tube 202a, a guide post 202e is slidably connected in the guide hole 202f, a first spring 202g is sleeved on the surface of the spline tube 202a, and its two ends are fixedly connected to the top of the moving plate 201b and the bottom of the placement plate 202b, respectively.

[0042] The guide hole 202f is spiral in shape. When the spline tube 202a moves up and down, the guide hole 202f squeezes the guide post 202e, causing the guide post 202e and the rotating rod 202d to rotate. Similarly, when the guide post 202e and the rotating rod 202d rotate, the spline tube 202a can drive the placement plate 202b to move up and down. After the first spring 202g deforms as it moves down with the placement plate 202b, when the gear 203d is no longer acted upon by the first toothed plate 201c, the placement plate 202b and the spline tube 202a can move up, thereby causing the rotating rod 202d to rotate and drive the transmission component 203e to run.

[0043] The skateboard 203a is slidably connected to the surface of the movable board 201b, and the vertical rod 203b is fixedly connected to the bottom of the skateboard 203a.

[0044] There are two slide plates 203a and two vertical bars 203b. The two slide plates 203a are movably engaged with the surface of the movable plate 201b. The slide plates 203a and the second toothed plate 203c are indirectly connected through the vertical bars 203b. The slide plates 203a are slidably limited on the movable plate 201b, so that the vertical bars 203b and the second toothed plate 203c will not tilt and are guided.

[0045] The second toothed plate 203c is fixedly connected to the lower end of the vertical rod 203b, and the gear 203d is fixedly connected to the lower end of the rotating rod 202d and meshes with the second toothed plate 203c.

[0046] There are two second toothed plates 203c, which are fixedly connected to the lower ends of the two vertical rods 203b respectively. The rotation of the gear 203d can drive the two second toothed plates 203c to move in opposite directions, thereby driving the slide plate 203a to move and act on the transmission component 203e, so as to realize the fixing and unlocking of the semiconductor element by the pressing component 203f.

[0047] The fixed rod 203e-1 is fixedly connected to the top of the movable plate 201b and to the bottom of the guide frame 203e-2, while the slider 203e-3 is slidably connected inside the guide frame 203e-2.

[0048] The guide frame 203e-2 is supported by the fixing rod 203e-1. The slider 203e-3 moves within the guide frame 203e-2, which can drive the pressing member 203f to move closer to or away from the placement plate 202b, thereby fixing and unlocking the semiconductor components on the placement plate 202b.

[0049] The short rod 203e-4 is fixedly connected to the surface of the slider 203e-3 and located on one side thereon. The connecting rod 203e-5 is fixedly connected to the top of the slide plate 203a and is slidably connected to the short rod 203e-4.

[0050] The connecting rod 203e-5 passes through the short rod 203e-4 and is slidably connected to it. The movement of the connecting rod 203e-5 acts on the short rod 203e-4. Since the short rod 203e-4 can move on the surface of the connecting rod 203e-5, the slider 203e-3 and the short rod 203e-4 move along the axial direction of the guide frame 203e-2, causing the pressing member 203f to move obliquely closer to or away from the placement plate 202b.

[0051] The horizontal block 203f-1 is fixedly connected to the surface of the slider 203e-3 and located on one side thereon. The square rod 203f-2 is slidably connected to the surface of the horizontal block 203f-1 and fixedly connected to the top of the pressure plate 203f-3.

[0052] The square rod 203f-2 passes through the horizontal block 203f-1 and is slidably connected to it. The lower pressure plate 203f-3 is made of insulating material. The square rod 203f-2 guides and limits the lower pressure plate 203f-3, so that the lower pressure plate 203f-3 can only move along the direction of the square rod 203f-2.

[0053] The second spring 203f-4 is sleeved on the surface of the square rod 203f-2, and its two ends are fixedly connected to the bottom of the horizontal block 203f-1 and the top of the pressure plate 203f-3 respectively. The conductive sheet 203f-5 is fixedly connected to the bottom of the pressure plate 203f-3.

[0054] The second spring 203f-4 makes the conductive sheet 203f-5 more tightly contact the pins on the semiconductor element, and provides some space when the horizontal block 203f-1 moves down. At the same time, the conductive sheet 203f-5 will not detach from the pins. The conductive sheet 203f-5 is connected to the test components used for testing in the test box 100 through wires. The components are not limited to voltmeters, fixed resistors and ammeters.

[0055] During use, the semiconductor components are subjected to accelerated aging tests through the test chamber 100. After the test is completed, the chamber door is opened, and the handle 201e is pulled outward to move the moving plate 201b, the support assembly 202, and the fixing assembly 203 outward. As the moving gear 203d meshes with the second toothed plate 203c, which is fixed relative to the gear 203d, the gear 203d moves and rotates, thereby causing the rotating rod 202d and the guide post 202e to rotate, which in turn causes the spline tube 202a and the placement plate 202b to move downward, and the first spring 202g to be compressed.

[0056] The rotation of gear 203d causes the two second toothed plates 203c to move in opposite directions, which in turn causes the vertical rod 203b, the sliding plate 203a, and the connecting rod 203e-5 to move. This causes the short rod 203e-4 and the slider 203e-3 to move obliquely upward along the guide frame 203e-2, and the pressing member 203f to move obliquely upward. Under the action of the placement plate 202b moving downward and the pressing member 203f moving obliquely upward, the conductive sheet 203f-5 is detached from the semiconductor element pin surface, realizing the circuit break and improving safety. This facilitates the removal of the semiconductor element. When the semiconductor element is installed and tested, the process is the opposite of the above disassembly steps. The semiconductor element is quickly and efficiently fixed and unlocked by pulling.

[0057] In summary, the fixing mechanism 200 can quickly fix and disassemble semiconductor components without manually fixing and connecting the semiconductor component pins and powering them on. Compared with existing technologies, it is safer and can fix and disassemble semiconductors by pulling them out of the box.

[0058] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A semiconductor device accelerated aging test apparatus comprising a test chamber (100), characterized by: include, A fixing mechanism (200), installed inside the test chamber (100), includes a pull-out assembly (201), a support assembly (202), and a fixing assembly (203). The pull-out assembly (201) is installed on the bottom of the inner wall of the test chamber (100). The support assembly (202) and the fixing assembly (203) are installed on the surface of the pull-out assembly (201), and the fixing assembly (203) is disposed on the surface of the support assembly (202). The pull-out assembly (201) includes a slide rail (201a), a movable plate (201b), and a first toothed plate (201c). The slide rail (201a) and the first toothed plate (201c) are fixedly connected to the bottom of the inner wall of the test chamber (100). The movable plate (201b) is slidably connected to the surface of the slide rail (201a). The support assembly (202) includes a spline tube (202a), a rotating rod (202d), and a guide post (202e). The spline tube (202a) is slidably connected to the bottom of the inner wall of the test chamber (100). The upper end of the rotating rod (202d) is slidably connected to the inner wall of the spline tube (202a) and the guide post (202e) is fixedly connected to the upper end of the rotating rod (202d). The fixing assembly (203) includes a transmission component (203e) and a pressing component (203f). The transmission component (203e) is disposed on the surfaces of the moving plate (201b) and the rotating rod (202d), and the pressing component (203f) is installed on the surface of the transmission component (203e).

2. The semiconductor element accelerated aging test apparatus according to claim 1, wherein The pull-out assembly (201) further includes a limiting block (201d) and a handle (201e). The limiting block (201d) is fixedly connected to the top of the slide rail (201a), and the handle (201e) is fixedly connected to the surface of the movable plate (201b) and located on one side thereon.

3. The semiconductor device accelerated aging test apparatus according to claim 2, wherein: The support assembly (202) further includes a placement plate (202b) and a fixing plate (202c). The placement plate (202b) is fixedly connected to the top of the spline tube (202a), the fixing plate (202c) is fixedly connected to the bottom of the movable plate (201b), and the rotating rod (202d) is rotatably connected to the surface of the fixing plate (202c).

4. The semiconductor element accelerated aging test apparatus according to claim 3, wherein The support assembly (202) further includes a guide hole (202f) and a first spring (202g). The guide hole (202f) is opened on the surface of the spline tube (202a). The guide post (202e) is slidably connected in the guide hole (202f). The first spring (202g) is sleeved on the surface of the spline tube (202a), and its two ends are fixedly connected to the top of the moving plate (201b) and the bottom of the placement plate (202b), respectively.

5. The semiconductor device accelerated aging test apparatus according to claim 1, wherein The fixing component (203) further includes a sliding plate (203a) and a vertical rod (203b), wherein the sliding plate (203a) is slidably connected to the surface of the movable plate (201b), and the vertical rod (203b) is fixedly connected to the bottom of the sliding plate (203a).

6. The semiconductor device accelerated aging test apparatus according to claim 5, wherein: The fixing assembly (203) further comprises a second toothed plate (203c) and a gear (203d), the second toothed plate (203c) is fixedly connected to the lower end of the vertical rod (203b), and the gear (203d) is fixedly connected to the lower end of the rotating rod (202d) and meshes with the second toothed plate (203c).

7. The semiconductor device accelerated aging test apparatus according to claim 5, wherein: The transmission member (203e) comprises a fixed rod (203e-1), a guide frame (203e-2) and a sliding block (203e-3), the fixed rod (203e-1) is fixedly connected to the top of the moving plate (201b) and fixedly connected to the bottom of the guide frame (203e-2), and the sliding block (203e-3) is slidingly connected in the guide frame (203e-2).

8. The semiconductor device accelerated aging test apparatus according to claim 7, wherein: The transmission member (203e) further comprises a short rod (203e-4) and a connecting rod (203e-5), the short rod (203e-4) is fixedly connected to the surface of the sliding block (203e-3) and located at one side thereof, and the connecting rod (203e-5) is fixedly connected to the top of the sliding plate (203a) and slidingly connected with the short rod (203e-4).

9. The semiconductor device accelerated aging test apparatus according to claim 7, wherein: The pressing-down member (203f) comprises a cross block (203f-1), a square rod (203f-2) and a pressing plate (203f-3), the cross block (203f-1) is fixedly connected to the surface of the sliding block (203e-3) and located at one side thereof, the square rod (203f-2) is slidingly connected to the surface of the cross block (203f-1) and fixedly connected to the top of the pressing plate (203f-3).

10. The semiconductor device accelerated aging test apparatus according to claim 9, wherein: The pressing-down member (203f) further comprises a second spring (203f-4) and a conductive sheet (203f-5), the second spring (203f-4) is sleeved on the surface of the square rod (203f-2), and the two ends thereof are fixedly connected with the bottom of the cross block (203f-1) and the top of the pressing plate (203f-3) respectively, and the conductive sheet (203f-5) is fixedly connected to the bottom of the pressing plate (203f-3).

Images