Chip bearing device and chip transportation equipment

Abstract

The utility model provides a chip bearing device and chip transportation equipment, and the chip bearing device comprises a bearing body which comprises at least one accommodation cavity; the accommodating cavity is used for accommodating a chip; the temperature-sensitive bonding layer is positioned in the accommodating cavity; the temperature-sensitive bonding layer is used for fixing the chip; the temperature control unit is located on the bearing body; the temperature control unit is used for adjusting the temperature of the temperature-sensitive adhesive layer to a first temperature range so as to fix the chip; and adjusting the temperature of the temperature-sensitive adhesive layer to a second temperature range to strip the chip, wherein the adhesive force of the temperature-sensitive adhesive layer in the first temperature range is greater than the adhesive force of the temperature-sensitive adhesive layer in the second temperature range.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, and in particular to a chip carrier device and a chip transport equipment. Background Technology

[0002] With the rapid development of integrated circuits, the number of transistors, capacitors, and other components integrated into chips has also increased exponentially, reaching billions. This makes chips susceptible to damage during manufacturing and transportation. Therefore, devices used to carry chips need to secure them for better protection. However, existing chip carriers typically use custom-sized slots or cavities to hold the chips, resulting in high manufacturing costs and difficulty in achieving compatibility with chips of different sizes. Utility Model Content

[0003] This utility model provides a chip carrier device and a chip transport equipment.

[0004] In a first aspect, this utility model provides a chip carrier device, comprising:

[0005] The carrier includes at least one receiving cavity; the receiving cavity is used to receive the chip;

[0006] A temperature-sensitive adhesive layer is located within the receiving cavity; the temperature-sensitive adhesive layer is used to fix the chip.

[0007] A temperature control unit is located on the carrier; the temperature control unit is used to adjust the temperature of the temperature-sensitive adhesive layer to a first temperature range to fix the chip; and to adjust the temperature of the temperature-sensitive adhesive layer to a second temperature range to peel off the chip; wherein the adhesion force of the temperature-sensitive adhesive layer in the first temperature range is greater than the adhesion force of the temperature-sensitive adhesive layer in the second temperature range.

[0008] In some embodiments, the temperature-sensitive adhesive layer comprises a heat-peelable adhesive material, wherein the maximum temperature value of the first temperature range is less than the minimum temperature value of the second temperature range.

[0009] In some embodiments, the temperature control unit includes:

[0010] A temperature detection unit is used to detect the current temperature of the temperature-sensitive adhesive layer.

[0011] A temperature adjustment unit is provided, which is used to adjust the temperature of the temperature-sensitive adhesive layer according to the current temperature.

[0012] In some embodiments, the temperature adjustment unit is specifically used to maintain the temperature of the temperature-sensitive adhesive layer within the second temperature range for a preset period of time based on the real-time current temperature, so as to peel off the chip.

[0013] In some embodiments, the temperature control unit includes a plurality of temperature detection units distributed around the receiving cavity.

[0014] In some embodiments, the chip carrier device further includes:

[0015] A gas delivery unit is used to deliver protective gas into the receiving cavity.

[0016] In some embodiments, the carrier includes a plurality of the receiving cavities, each of the receiving cavities being used to receive different types of the chips.

[0017] Secondly, this utility model provides a chip transport device, including the chip carrier device, the first pickup unit, and the second pickup unit as described in any of the above embodiments;

[0018] The first pickup unit is used to place the chip into the receiving cavity;

[0019] The chip carrier is used to transport the chip;

[0020] The second pickup unit is used to remove the chip from the receiving cavity.

[0021] In some embodiments, the chip transport device further includes:

[0022] The first detection unit is located on the first pickup unit; the first detection unit is used to detect whether the chip is fixed on the temperature-sensitive adhesive layer, and outputs a first detection signal when the chip is not fixed on the temperature-sensitive adhesive layer.

[0023] The temperature control unit is also used to maintain the temperature of the temperature-sensitive adhesive layer within the first temperature range based on the first detection signal.

[0024] In some embodiments, the chip transport device further includes:

[0025] The second detection unit is located on the second pickup unit; the second detection unit is used to detect whether the chip has been peeled off from the temperature-sensitive adhesive layer, and outputs a second detection signal if the chip has not been peeled off from the temperature-sensitive adhesive layer.

[0026] The temperature control unit is also used to maintain the temperature of the temperature-sensitive adhesive layer within the second temperature range based on the second detection signal.

[0027] In the chip carrier device provided by this utility model, a temperature control unit is used to adjust the temperature of the temperature-sensitive adhesive layer to a first temperature range to fix the chip; and to adjust the temperature of the temperature-sensitive adhesive layer to a second temperature range to peel off the chip; the adhesive force of the temperature-sensitive adhesive layer in the first temperature range is greater than the adhesive force of the temperature-sensitive adhesive layer in the second temperature range. Thus, on the one hand, the chip carrier device using a temperature-sensitive adhesive layer to fix the chip does not require customizing the size of the receiving cavity to fit the chip, which helps reduce costs; on the other hand, the temperature-sensitive adhesive layer can adapt to chips of various sizes, exhibiting good compatibility. Attached Figure Description

[0028] Figure 1 A schematic diagram of a chip tray provided by this utility model;

[0029] Figure 2 A schematic diagram of a chip carrier device provided by this utility model;

[0030] Figure 3 A schematic diagram of a temperature-sensitive adhesive layer provided by this utility model;

[0031] Figure 4 A schematic diagram of another chip carrier device provided by this utility model;

[0032] Figure 5 A schematic diagram of a chip transport device provided by this utility model;

[0033] Figure 6 A schematic diagram of another chip transport device provided by this utility model;

[0034] Figures 7a to 7d This utility model provides a schematic diagram of a process for transporting chips using a chip transport device. Detailed Implementation

[0035] To facilitate understanding of this invention, exemplary embodiments of the invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey the scope of the invention to those skilled in the art.

[0036] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced without one or more of these details. In some embodiments, to avoid confusion with the present invention, some technical features well-known in the art are not described; that is, not all features of the actual embodiments, nor well-known functions and structures, may be described herein.

[0037] Generally, terms can be understood at least in part from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or it can be used to describe a combination of features, structures, or characteristics in a plural sense. Similarly, terms such as "a" or "described" can also be understood to convey either a singular or a plural usage, depending at least in part on the context. Additionally, the use of "based on" can be understood to not necessarily convey an exclusive set of factors, and can alternatively allow for the presence of additional factors that are not necessarily explicitly described, also depending at least in part on the context.

[0038] Unless otherwise defined, the terminology used herein is intended only to describe particular embodiments and not to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of said features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0039] To fully understand this utility model, detailed steps and structures will be presented in the following description to illustrate the technical solution of this utility model. Preferred embodiments of this utility model are described in detail below; however, in addition to these detailed descriptions, this utility model may have other embodiments.

[0040] Chip transportation generally falls into two categories: wafer transportation and chip transportation. Wafer transportation involves packing multiple wafers into wafer cassettes for transport, such as Front Opening Unified Pods (FOUPs) and Front Opening Shipping Boxes (FOSBs). Chip transportation occurs after the wafers have been diced and molded, typically using leads and custom molds to secure the chips.

[0041] In some embodiments, chips need to be transported after wafer dicing but before molding, at which point the chip thickness is only 100-200 micrometers, making them very susceptible to damage. For example... Figure 1 The diagram shows an existing chip tray 100, which includes multiple receiving cavities 101, each capable of holding at least one chip 102. However, existing chip trays 100 are typically used for transporting molded chips, and the molding compound provides good protection for the chips, resulting in a gap between the receiving cavity 101 and the chip 102. If an existing chip tray 100 is used to transport unmolded chips (such as bare chips), the chips are extremely susceptible to damage under external forces such as shaking and vibration.

[0042] In some embodiments, chip trays with custom-sized receiving cavities can be used to transport chips before molding, so that the receiving cavity is adapted to the size of the chip, reducing chip shaking and vibration. However, custom receiving cavities require mold making according to the size of the chip, and the mold making cost of a set of molds is high; in addition, different chip trays need to be customized when dealing with chips of different sizes, that is, the compatibility of custom chip trays is poor.

[0043] like Figure 2 As shown, this utility model provides a chip carrier device 200, including: a carrier 210, including at least one receiving cavity 211; the receiving cavity 211 is used to receive a chip 201; a temperature-sensitive adhesive layer 220 is located in the receiving cavity 211; the temperature-sensitive adhesive layer 220 is used to fix the chip 201; a temperature control unit 230 is located on the carrier 210; the temperature control unit 230 is used to adjust the temperature of the temperature-sensitive adhesive layer 220 to a first temperature range to fix the chip 201; and to adjust the temperature of the temperature-sensitive adhesive layer 220 to a second temperature range to peel off the chip 201; wherein, the adhesive force of the temperature-sensitive adhesive layer 220 in the first temperature range is greater than the adhesive force of the temperature-sensitive adhesive layer 220 in the second temperature range.

[0044] In this embodiment, the chip carrier 200 can be used to carry and fix the chip 201, preventing damage to the chip 201. The chip carrier 200 can be applied to scenarios such as chip transportation, chip sorting, and chip testing, and this application does not impose too many limitations. The chip 201 can be a bare die before molding or a chip after molding.

[0045] The carrier 210 includes at least one receiving cavity 211, which can accommodate one or more chips 201. The dimensions of the receiving cavity 211 and the chip 201 do not need to be precisely matched. For example, the receiving cavity 211 can be a groove on the carrier 210. The carrier 210 can be a split design, including a lower housing and an upper cover. The receiving cavity 211 can be located in the lower housing, and the upper cover is used to seal the receiving cavity 211.

[0046] Each receiving cavity 211 is provided with a temperature-sensitive adhesive layer 220, which is used to bond and fix the chip 201. It is understood that the temperature-sensitive adhesive layer 220 has greater adhesive force within a certain temperature range, and less adhesive force within other temperature ranges. The temperature-sensitive adhesive layer 220 may be located on at least one inner wall of the receiving cavity 211. For example, the temperature-sensitive adhesive layer 220 may be located on the bottom wall of the receiving cavity 211; or, for example, the temperature-sensitive adhesive layer 220 may be located on both the bottom wall and side wall of the receiving cavity 211. Exemplarily, the temperature-sensitive adhesive layer 220 may be a heat-peelable adhesive material, i.e., its adhesive force is lower at high temperatures and higher at low temperatures.

[0047] A temperature control unit 230 is disposed on the carrier 210. Exemplarily, the temperature control unit 230 is located within the carrier 210 below the receiving cavity 211. In some embodiments, the temperature control unit 230 may also be disposed outside the carrier 210, in which case the carrier 210 may have a smaller volume. The temperature control unit 230 can be used to adjust the temperature of the temperature-sensitive adhesive layer 220. The temperature control unit 230 can be implemented using components such as a temperature sensor, a heating device, and a cooling device. Specifically, the temperature control unit 230 adjusts the temperature of the temperature-sensitive adhesive layer 220 to a first temperature range, thereby fixing the chip 201; the temperature control unit 230 adjusts the temperature of the temperature-sensitive adhesive layer 220 to a second temperature range, thereby peeling off the chip 201, wherein the adhesive force of the temperature-sensitive adhesive layer 220 in the first temperature range is greater than the adhesive force of the temperature-sensitive adhesive layer 220 in the second temperature range.

[0048] Thus, on the one hand, the chip carrier device 200, which uses the temperature-sensitive adhesive layer 220 to fix the chip 201, does not require custom-sized housing 211 to fit the chip 201, resulting in a simpler structure and lower costs. On the other hand, the temperature-sensitive adhesive layer 220 can accommodate chips 201 of various sizes, offering good compatibility. Understandably, for bare chips before molding, the chip carrier device 200 using the temperature-sensitive adhesive layer 220 and temperature control unit 230 provides better protection and lower costs, making its advantages more pronounced.

[0049] In some embodiments, the temperature-sensitive adhesive layer 220 includes a heat-peelable adhesive material, wherein the maximum temperature value of the first temperature range is less than the minimum temperature value of the second temperature range.

[0050] In this embodiment, the temperature-sensitive adhesive layer 220 may include a heat-peelable adhesive material, which has lower adhesion at high temperatures and higher adhesion at low temperatures. That is, the upper limit of the first temperature range where the adhesion of the temperature-sensitive adhesive layer 220 is higher should be lower than the lower limit of the second temperature range where the adhesion of the temperature-sensitive adhesive layer 220 is lower. For example, the first temperature range may be a temperature range near room temperature, and the second temperature range may be a temperature range near 100°C. The chip 201 is fixed to the temperature-sensitive adhesive layer 220 in the receiving cavity 211 at room temperature for transportation. After transportation, the temperature control unit 230 heats the temperature-sensitive adhesive layer 220 to approximately 100°C and maintains this temperature for a period of time (e.g., 1 minute). At this time, the adhesion of the temperature-sensitive adhesive layer 220 is lower, thereby allowing the chip 201 to peel off from the temperature-sensitive adhesive layer 220.

[0051] In some embodiments, such as Figure 3 As shown, the temperature-sensitive adhesive layer can be a thermally expanded adhesive tape. Specifically, the thermally expanded adhesive tape includes a substrate, a foamed adhesive layer and a pressure-sensitive adhesive layer covering both surfaces of the substrate, and two release film layers covering the foamed adhesive layer and the pressure-sensitive adhesive layer, respectively. The substrate can be a polyester film, such as PET material. The pressure-sensitive adhesive layer is used to fix the thermally expanded adhesive tape in the cavity of the carrier; the foamed adhesive layer is used to fix the chip; the two release film layers are used to protect the foamed adhesive layer and the pressure-sensitive adhesive layer, respectively, to prevent the adhesive properties of the foamed adhesive layer and the pressure-sensitive adhesive layer from failing. It should be noted that when using thermally expanded adhesive tape, the two release film layers need to be removed. For example, the adhesion force of the foamed adhesive layer at room temperature is 4.0 N / 20 mm. During heating to 100°C, the foamed adhesive layer expands, and its adhesion force gradually decreases to 0.07 N / 20 mm.

[0052] In some embodiments, such as Figure 4 As shown, the temperature control unit 230 includes: a temperature detection unit 231, which is used to detect the current temperature of the temperature-sensitive adhesive layer 220; and a temperature adjustment unit 232, which is used to adjust the temperature of the temperature-sensitive adhesive layer 220 according to the current temperature.

[0053] In this embodiment, the temperature control unit 230 may include one or more temperature detection units 231 and one or more temperature adjustment units 232. The temperature detection unit 231 may be implemented using a temperature sensor, and the temperature adjustment unit 232 may be implemented using a control circuit and a heating and / or cooling device. Specifically, one or more temperature detection units 231 may be located near the temperature-sensitive adhesive layer 220 and used to detect the current temperature of the temperature-sensitive adhesive layer 220. The temperature adjustment unit 232 is used to continue heating, cooling, or maintaining the current temperature based on the current temperature, so that the temperature-sensitive adhesive layer 220 is within a suitable temperature range to fix or peel off the chip 201, while preventing damage to the chip 201 due to excessive temperature.

[0054] In some embodiments, the temperature adjustment unit 232 is specifically used to maintain the temperature of the temperature-sensitive adhesive layer 220 within a second temperature range for a preset duration based on the real-time current temperature, so as to peel off the chip 201.

[0055] In this embodiment, before removing the chip 201 from the receiving cavity 211, the temperature regulating unit 232 can maintain the temperature of the temperature-sensitive adhesive layer 220 within a second temperature range for a preset time based on the current temperature detected in real time by the temperature detection unit 231. This reduces the adhesive force of the temperature-sensitive adhesive layer 220 to a sufficiently low level to prevent damage to the chip 201 caused by the excessive adhesive force of the temperature-sensitive adhesive layer 220 during chip removal. It is understood that the preset time can be set according to the adhesive characteristics of the temperature-sensitive adhesive layer 220. For example, the temperature-sensitive adhesive layer 220 can be a thermally expanded adhesive tape. Before removing the chip 201, the temperature regulating unit 232 can heat the temperature-sensitive adhesive layer 220 to a temperature range of approximately 100°C and maintain it for 1 minute based on the current temperature detected in real time by the temperature detection unit 231 to peel off the chip 201.

[0056] In some embodiments, such as Figure 4 As shown, the temperature control unit 230 includes multiple temperature detection units 231, which are distributed around the receiving cavity 211.

[0057] In this embodiment, multiple temperature detection units 231 are distributed around the receiving cavity 211 (e.g., below the bottom wall and side walls of the receiving cavity 211) to more accurately measure the current temperature of the temperature-sensitive adhesive layer 220. For example, the current temperature of the temperature-sensitive adhesive layer 220 can be determined by the average of the temperatures detected by the multiple temperature detection units 231.

[0058] In other embodiments, multiple temperature detection units 231 may also be distributed around the temperature regulating unit 232, such as above or below the temperature regulating unit 232. In this case, the temperature detection units 231 directly measure the temperature of the temperature regulating unit 232, thereby indirectly determining the current temperature of the temperature-sensitive adhesive layer 220.

[0059] It should be noted that the temperature detection unit 231 and the temperature adjustment unit 232 do not necessarily correspond one-to-one. Each temperature adjustment unit 232 can perform temperature control based on the temperature detected by one temperature detection unit 231, or it can perform temperature control based on the temperatures detected by multiple temperature detection units 231. In some embodiments, the chip carrier device 200 may only have one temperature adjustment unit 232, as long as the coverage area of ​​the temperature adjustment unit 232 is large enough.

[0060] In some embodiments, the chip carrier 200 further includes a power supply unit 202, which is disposed on the carrier 210 and used to supply power to the heating device and / or cooling device in the temperature regulation unit 232. Exemplarily, the power supply unit 202 can be a built-in battery or a power interface. The temperature regulation unit 232 can turn the power supply unit 202 on or off based on the current temperature detected in real time by the temperature detection unit 231, i.e., turn the heating device (cooling device) on or off, thereby regulating the temperature of the temperature-sensitive adhesive layer 220.

[0061] In some embodiments, such as Figure 4 As shown, the chip carrier device 200 also includes a gas delivery unit 240, which is used to deliver protective gas to the receiving cavity 211.

[0062] In this embodiment, the gas delivery unit 240 can deliver protective gas to the receiving cavity 211, thereby ensuring that the chip 201 is in a stable environment and preventing the chip 201 from being oxidized. Exemplarily, the protective gas includes, but is not limited to, nitrogen, argon, etc.

[0063] In some embodiments, the carrier 210 can be a split design, including a lower housing 212 and an upper cover 213. The receiving cavity 211 can be located in the lower housing 212, and the upper cover 213 is used to seal the receiving cavity 211. The gas delivery unit 240 can be located in the upper cover 213 and is implemented by a gas delivery pipe and a check valve 241, wherein the check valve 241 is used to prevent leakage of the protective gas in the receiving cavity 211.

[0064] In some embodiments, the carrier includes a plurality of accommodating cavities, each accommodating a different type of chip.

[0065] In this embodiment, the carrier may include multiple cavities, which can be used to distinguish different types of chips, facilitating subsequent chip sorting. It should be noted that each cavity can accommodate multiple chips, and the size and shape of the cavity itself are not used to fix the chips in place.

[0066] In some embodiments, the carrier may have only one receiving cavity, which has a large space and can simultaneously accommodate multiple chips of the same or different sizes.

[0067] like Figure 5 As shown, the present invention also provides a chip transport device 300, including any of the chip carrier devices 200, a first pickup unit 310, and a second pickup unit 320 in the above embodiments; the first pickup unit 310 is used to place the chip 201 into the receiving cavity 211; the chip carrier device 200 is used to transport the chip 201; and the second pickup unit 320 is used to remove the chip 201 from the receiving cavity 211.

[0068] In this embodiment, the chip carrier 200 with a temperature-sensitive adhesive layer 220 is used to transport the chip 201, thus effectively fixing the chip 201 and reducing damage to the chip 201 caused by shaking and vibration. The first pickup unit 310 and the second pickup unit 320 are respectively used to place the chip 201 and remove the chip 201. For example, the first pickup unit 310 and the second pickup unit 320 can pick up the chip 201 by means of a vacuum suction cup, mechanical clamp, etc.

[0069] In some embodiments, such as Figure 6 As shown, the chip transport device 300 further includes: a first detection unit 311 located on the first pickup unit 310; the first detection unit 311 is used to detect whether the chip 201 is fixed on the temperature-sensitive adhesive layer 220, and outputs a first detection signal S1 when the chip 201 is not fixed on the temperature-sensitive adhesive layer 220; the temperature control unit 230 is also used to maintain the temperature of the temperature-sensitive adhesive layer 220 within a first temperature range according to the first detection signal S1.

[0070] In this embodiment, a first detection unit 311 is disposed on a first pickup unit 310. The first detection unit 311 is used to detect whether the chip 201 is fixed on the temperature-sensitive adhesive layer 220. Exemplarily, the first detection unit 311 can be implemented by a pressure sensor and a corresponding control circuit to detect the tension applied to the chip 201, or it can be implemented by an image sensor and a corresponding control circuit through a purely visual method.

[0071] When the chip 201 is not fixed to the temperature-sensitive adhesive layer 220, the first detection unit 311 outputs a first detection signal S1. The temperature control unit 230 responds to the first detection signal S1 and maintains the temperature of the temperature-sensitive adhesive layer 220 within a first temperature range, thereby further improving the adhesion of the temperature-sensitive adhesive layer 220 to fix the chip 201 and reduce the problem of the temperature-sensitive adhesive layer 220 not firmly fixing the chip 201.

[0072] In some embodiments, such as Figure 6 As shown, the chip transport device 300 further includes: a second detection unit 321 located on the second pickup unit 320; the second detection unit 321 is used to detect whether the chip 201 is peeled off from the temperature-sensitive adhesive layer 220, and outputs a second detection signal S2 if the chip 201 is not peeled off from the temperature-sensitive adhesive layer 220; the temperature control unit 230 is also used to maintain the temperature of the temperature-sensitive adhesive layer 220 within a second temperature range according to the second detection signal S2.

[0073] In this embodiment, the second detection unit 321 is disposed on the second pickup unit 320. The second detection unit 321 is used to detect whether the chip 201 has been peeled off from the temperature-sensitive adhesive layer 220. Exemplarily, the second detection unit 321 can be implemented by a pressure sensor and corresponding control circuit to detect the pulling force applied to the chip 201, or it can be implemented by an image sensor and corresponding control circuit through a purely visual method.

[0074] If chip 201 is not peeled off from the temperature-sensitive adhesive layer 220, the second detection unit 311 outputs a second detection signal S2. The temperature control unit 230 responds to the second detection signal S2 and maintains the temperature of the temperature-sensitive adhesive layer 220 within a second temperature range, thereby further reducing the adhesion of the temperature-sensitive adhesive layer 220 to peel off chip 201 and reduce the problem of chip 201 not being completely peeled off from the temperature-sensitive adhesive layer 220.

[0075] like Figures 7a to 7d The diagram shown illustrates a process for transporting chips using the aforementioned chip transport device, as provided by this invention. The description uses the temperature-sensitive adhesive layer 220, which includes a heat-release adhesive material, as an example. Specifically, refer to... Figure 7a Provides chip transport equipment, wherein the receiving cavity 211 of the chip carrier 200 has a temperature-sensitive adhesive layer 220; Reference Figure 7b The first pickup unit 310 places one or more diced chips 201 onto the temperature-sensitive adhesive layer 220 of the receiving cavity 211; Reference Figure 7c The upper cover seals the receiving cavity 211, and a protective gas (such as nitrogen) is filled into the receiving cavity 211 through the gas delivery unit 240, followed by transportation; Reference Figure 7dThe temperature control unit 230 heats the temperature-sensitive adhesive layer 220 to 100°C and holds it for 1 minute. At this time, the adhesion of the temperature-sensitive adhesive layer 220 is greatly reduced. Then, the second pickup unit 320 removes the chip 201 from the receiving cavity 211.

[0076] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of the present invention, the sequence number of the above-described processes does not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention. The sequence numbers of the above-described embodiments of the present invention are merely descriptive and do not represent the superiority or inferiority of the embodiments.

[0077] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A chip carrier device, characterized in that, include: The carrier includes at least one receiving cavity; the receiving cavity is used to receive the chip; A temperature-sensitive adhesive layer is located within the receiving cavity; The temperature-sensitive adhesive layer is used to fix the chip; A temperature control unit is located on the carrier; the temperature control unit is used to adjust the temperature of the temperature-sensitive adhesive layer to a first temperature range to fix the chip. The temperature of the temperature-sensitive adhesive layer is adjusted to a second temperature range to peel off the chip; wherein the adhesion force of the temperature-sensitive adhesive layer in the first temperature range is greater than the adhesion force of the temperature-sensitive adhesive layer in the second temperature range.

2. The chip carrier device according to claim 1, characterized in that, The temperature-sensitive adhesive layer includes a heat-peelable adhesive material, and the maximum temperature value in the first temperature range is less than the minimum temperature value in the second temperature range.

3. The chip carrier device according to claim 1, characterized in that, The temperature control unit includes: A temperature detection unit is used to detect the current temperature of the temperature-sensitive adhesive layer. A temperature adjustment unit is provided, which is used to adjust the temperature of the temperature-sensitive adhesive layer according to the current temperature.

4. The chip carrier device according to claim 3, characterized in that, The temperature adjustment unit is specifically used to maintain the temperature of the temperature-sensitive adhesive layer within the second temperature range for a preset time period based on the real-time current temperature, so as to peel off the chip.

5. The chip carrier device according to claim 3, characterized in that, The temperature control unit includes a plurality of temperature detection units, which are distributed around the receiving cavity.

6. The chip carrier device according to claim 1, characterized in that, The chip carrier device further includes: A gas delivery unit is used to deliver protective gas into the receiving cavity.

7. The chip carrier device according to claim 1, characterized in that, The carrier includes a plurality of the receiving cavities, each of which is used to receive different types of the chips.

8. A chip transport device, characterized in that, Includes the chip carrier device, the first pickup unit, and the second pickup unit as described in any one of claims 1 to 7; The first pickup unit is used to place the chip into the receiving cavity; The chip carrier is used to transport the chip; The second pickup unit is used to remove the chip from the receiving cavity.

9. The chip transport device according to claim 8, characterized in that, The chip transport device also includes: The first detection unit is located on the first pickup unit; the first detection unit is used to detect whether the chip is fixed on the temperature-sensitive adhesive layer, and outputs a first detection signal when the chip is not fixed on the temperature-sensitive adhesive layer. The temperature control unit is also used to maintain the temperature of the temperature-sensitive adhesive layer within the first temperature range based on the first detection signal.

10. The chip transport device according to claim 8, characterized in that, The chip transport device also includes: The second detection unit is located on the second pickup unit; the second detection unit is used to detect whether the chip has been peeled off from the temperature-sensitive adhesive layer, and outputs a second detection signal if the chip has not been peeled off from the temperature-sensitive adhesive layer. The temperature control unit is also used to maintain the temperature of the temperature-sensitive adhesive layer within the second temperature range based on the second detection signal.

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