Linear cutting device for photovoltaic silicon wafer production

Abstract

The utility model belongs to the technical field of photovoltaic silicon wafer production, and particularly relates to a wire cutting device for photovoltaic silicon wafer production, which comprises a base, a wire cutting mechanism and a length fixing mechanism are arranged on the base, the length fixing mechanism comprises a plurality of fixing plates, and the top side of the base is fixedly connected with the fixing plates. A conveying roller is installed between the two fixing plates in a matched mode through a rotating shaft, motors are installed on the fixing plates located at the head end and the tail end, the output ends of the motors are connected with one end of the rotating shaft, and a bearing base is fixedly connected to the base. When a silicon rod is cut into silicon wafers, the cutting thickness of the silicon wafers can be accurately controlled according to needs by arranging the length control mechanism, the thickness of the silicon wafers cut every time can be ensured to be consistent through accurate adjustment of the length control mechanism, the cutting accuracy and the product quality are improved, and meanwhile the cutting efficiency is improved by accurately controlling the cutting thickness. Material waste caused by uneven thickness can be avoided, and the utilization rate of the silicon material is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic silicon wafer production technical field, concretely is a kind of linear cutting device for photovoltaic silicon wafer production. BACKGROUND

[0002] Photovoltaic silicon wafer is the core raw material of photovoltaic cell wafer, is made by cutting silicon rod into wafer, is the key carrier of solar cell to convert light energy into electrical energy, in the photovoltaic silicon wafer production process, linear cutting is the core technical link.

[0003] The existing linear cutting device for photovoltaic silicon wafer production is mainly composed of workbench, driving roller, driven roller and cutting wire, when cutting silicon rod into silicon wafer, cutting wire forms parallel wire net in the wire slot of driving roller and driven roller, silicon rod is fixed on workbench, and it is contacted with high-speed wire net with uniform speed descending along with feeding system, and the abrasive carried by cutting wire is ground to silicon rod under the action of friction force, and silicon wafer is gradually cut out.

[0004] The existing linear cutting device for photovoltaic silicon wafer production cannot accurately control the cutting thickness of silicon wafer when cutting silicon rod into silicon wafer, which easily leads to uneven thickness of silicon wafer, and uneven thickness easily leads to too thick or too thin silicon wafer, and silicon wafer cannot be used due to too large thickness deviation, causing material waste, therefore, a linear cutting device for photovoltaic silicon wafer production is proposed for the above problems. UTILITY MODEL CONTENT

[0005] In order to make up for the deficiency of prior art, solve the problems proposed in the above background art, the utility model provides a linear cutting device for photovoltaic silicon wafer production.

[0006] The utility model solves its technical problem adopts the technical scheme: a kind of linear cutting device for photovoltaic silicon wafer production of the utility model, including base, linear cutting mechanism and fixed-length mechanism are arranged on the base, the fixed-length mechanism includes fixed plate, the top side of the base is fixedly connected with multiple fixed plates, conveying roller is cooperatively installed between two fixed plates by pivot, motor is installed on the fixed plate located at the first end and the terminal end, the output end of the motor is connected with the one end of pivot, the base is fixedly connected with support seat, the top side of the base is fixedly connected with vertical plate, T-shaped slide rail is arranged between the vertical plate and support seat, movable seat is slidably assembled on the T-shaped slide rail, the top end of the movable seat is fixedly connected with positioning plate, threaded rod is rotatably installed between the support seat and vertical plate, and the threaded rod is set through movable seat, first motor is installed on the vertical plate, the output end of the first motor is connected with the one end of threaded rod, scale mark line is assembled on the outer side wall of T-shaped slide rail, when cutting silicon rod into silicon wafer, in order to accurately control the cutting thickness of silicon wafer, by setting fixed-length mechanism, before cutting, first motor is started first, so that threaded rod rotates, movable seat drives positioning plate to move, and scale mark line is marked, until positioning plate moves to the horizontal distance between cutting line and meets the thickness requirement of silicon wafer, first motor stops operation, the position of positioning plate is fixed at this time, which provides accurate positioning reference for subsequent cutting operation, when silicon rod moves to contact with positioning plate by conveying roller, linear cutting mechanism starts operation, so that the cutting thickness of silicon wafer can be accurately controlled according to requirement, the thickness of silicon wafer is ensured to be consistent by the accurate adjustment of fixed-length mechanism, cutting precision and product quality are improved, and the utilization rate of silicon material is improved by accurately controlling cutting thickness, which can avoid material waste caused by uneven thickness.

[0007] Preferably, two electric push rods are installed on the base, and the two electric push rods are located on the two sides of the support seat respectively, the top end of the two electric push rods is fixedly connected with fixed block, clamping seat is fixedly connected between the two fixed blocks, when cutting silicon rod into silicon wafer, the fixed block drives clamping seat to move down by electric push rod operation, so that silicon wafer can be pressed and limited, and this pressing and limiting not only ensures the stability of silicon rod in the cutting process, but also prevents cutting error caused by silicon rod movement.

[0008] Preferably, the wire cutting mechanism comprises two vertical plates, the base is fixedly connected with the two vertical plates, limit sliding grooves are formed in the two vertical plates, a lifting plate is slidably assembled in the two limit sliding grooves, two mounting plates are fixedly connected to the bottom side of the lifting plate, driven rollers are rotatably installed on the two mounting plates, a second motor is installed on one side wall of the lifting plate, a driving roller is installed on the output end of the second motor, the driving roller and the two driven rollers are sleeved with a cutting wire, pneumatic cylinders are installed at the top ends of the two vertical plates, pneumatic rods are assembled at the acting ends of the two pneumatic cylinders, and the bottom ends of the pneumatic rods are fixedly connected to the lifting plate.

[0009] The utility model has the advantages that:

[0010] When the silicon rod is cut into a silicon wafer, the fixed-length mechanism is arranged, before cutting, the first motor is started first, the threaded rod is rotated, the movable seat drives the positioning plate to move, the scale line is marked, until the positioning plate is moved to the horizontal distance between the cutting wire and meets the thickness requirement of the silicon wafer, the first motor stops working, the position of the positioning plate is fixed, and accurate positioning reference is provided for subsequent cutting operation, when the silicon rod is moved to contact the positioning plate through the conveying roller, the wire cutting mechanism starts working, thereby the cutting thickness of the silicon wafer can be accurately controlled according to the requirement, the fixed-length mechanism is accurately adjusted, the thickness of the silicon wafer can be ensured to be consistent every time, the cutting precision and product quality are improved, the cutting thickness is accurately controlled, material waste caused by uneven thickness can be avoided, and the utilization rate of silicon material is improved. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to the drawings without paying creative labor.

[0012] Figure 1 It is a whole three-dimensional structure schematic diagram of the device;

[0013] Figure 2 It is a partial three-dimensional structure schematic diagram of the device;

[0014] Figure 3 It is a plane display structure schematic diagram of the device;

[0015] Figure 4 Fig. 3 is a schematic view of a three-dimensional structure of a length fixing mechanism;

[0016] Figure 5 Fig. 4 is a schematic view of a three-dimensional structure of a cutting mechanism.

[0017] In the figure: 1, base; 2, fixed plate; 3, rotating shaft; 4, conveying roller; 5, motor; 6, bearing seat; 7, vertical plate; 8, T-shaped slide rail; 9, movable seat; 10, positioning plate; 11, threaded rod; 12, first motor; 13, scale mark; 14, electric push rod; 15, fixed block; 16, clamping seat; 17, vertical plate; 18, limiting slide groove; 19, lifting plate; 20, mounting plate; 21, driven roller; 22, second motor; 23, driving roller; 24, cutting line; 25, pneumatic cylinder. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] Please refer to Figures 1-4As shown, a wire cutting device for photovoltaic silicon wafer production includes a base 1, on which a wire cutting mechanism and a length-fixing mechanism are mounted. The length-fixing mechanism includes a fixed plate 2. Multiple fixed plates 2 are fixedly connected to the top side of the base 1. A conveying roller 4 is installed between two fixed plates 2 via a rotating shaft 3. A motor 5 is mounted on the first and last fixed plates 2, and the output end of the motor 5 is connected to one end of the rotating shaft 3. A support seat 6 is fixedly connected to the base 1, and a vertical plate 7 is fixedly connected to the top side of the base 1. A T-shaped slide rail 8 is provided between the vertical plate 7 and the support seat 6. A movable seat 9 is slidably mounted on the T-shaped slide rail 8. A positioning plate 10 is fixedly connected to the top of the movable seat 9. A threaded rod 11 is rotatably mounted between the support seat 6 and the vertical plate 7, and the threaded rod 11 passes through the movable seat 9. A first motor 12 is mounted on the vertical plate 7, and the output end of the first motor 12 is connected to one end of the threaded rod 11. A scale mark 13 is mounted on the outer wall of the T-shaped slide rail 8. During operation, when the silicon rod is... In order to accurately control the cutting thickness of silicon wafers during the cutting process, a fixed-length mechanism is set up. Before cutting, the first motor 12 is started, which causes the threaded rod 11 to rotate. The movable seat 9 moves on the T-shaped slide rail 8, and the movable seat 9 drives the positioning plate 10 to move, aligning with the scale mark 13. The first motor 12 stops working when the horizontal distance between the positioning plate 10 and the cutting line 24 meets the silicon wafer thickness requirements. At this time, the position of the positioning plate 10 is fixed, providing an accurate positioning reference for subsequent cutting operations. When the silicon rod moves through the conveying roller 4 to contact the positioning plate 10, the wire cutting mechanism starts working. This allows for precise control of the cutting thickness of the silicon wafers as needed. Through the precise adjustment of the fixed-length mechanism, the thickness of the silicon wafers cut each time can be ensured to be consistent, improving cutting accuracy and product quality. At the same time, by precisely controlling the cutting thickness, material waste caused by uneven thickness can be avoided, improving the utilization rate of silicon materials.

[0020] Two electric push rods 14 are installed on the base 1, and the two electric push rods 14 are located on both sides of the support seat 6. The top of each of the two electric push rods 14 is fixedly connected to a fixing block 15, and a clamping seat 16 is fixedly connected between the two fixing blocks 15. During operation, when the silicon rod is cut into silicon wafers, the silicon rod to be cut is first placed on the conveying roller 4, and one end of the silicon rod is placed on the support seat 6. Then, the electric push rods 14 are operated to make the fixing block 15 drive the clamping seat 16 to move down, thereby pressing and limiting the silicon wafer. This pressing and limiting not only ensures the stability of the silicon rod during the cutting process, but also prevents cutting errors caused by the movement of the silicon rod.

[0021] Please see Figure 2 and Figure 5As shown, the wire cutting mechanism includes two vertical plates 17, the base 1 is fixed with two vertical plates 17, two vertical plates 17 are provided with limiting sliding grooves 18, two limiting sliding grooves 18 are matched with sliding assembly of lifting plate 19, the bottom side of lifting plate 19 is fixed with two mounting plates 20, two mounting plates 20 are rotatably installed with driven roller 21, one side wall of lifting plate 19 is provided with second motor 22, the output end of second motor 22 is provided with driving roller 23, driving roller 23 and two driven rollers 21 are matched with cutting wire 24, the top end of two vertical plates 17 is provided with pneumatic cylinder 25, the acting end of two pneumatic cylinders 25 is matched with pneumatic rod, the bottom end of pneumatic rod is fixed on lifting plate 19; When cutting, start pneumatic cylinder 25, make driving roller 23, driven roller 21 and cutting wire 24 move down, at the same time, start second motor 22, make driving roller 23 rotate, the rotation of driving roller 23 drives cutting wire 24 to move at high speed, form the cutting force to silicon rod, cutting wire 24 grinds silicon rod under the action of friction, gradually cut out silicon wafer;

[0022] Working principle: Because the existing wire cutting device for photovoltaic silicon wafer production, when cutting silicon rod into silicon wafer, the cutting thickness of silicon wafer cannot be accurately controlled, which easily leads to uneven thickness of silicon wafer, and uneven thickness easily leads to too thick or too thin silicon wafer, and silicon wafer cannot be used due to too large thickness deviation, causing material waste; Therefore, aiming at the above problems, a wire cutting device for photovoltaic silicon wafer production is provided; When cutting silicon rod into silicon wafer, in order to accurately control the cutting thickness of silicon wafer, by setting length setting mechanism, before cutting, first start first motor 12, make screw rod 11 rotate, movable seat 9 moves on T-shaped slide rail 8, movable seat 9 drives positioning plate 10 to move, mark scale line 13, until positioning plate 10 moves to the horizontal distance between cutting wire 24 meets the thickness requirement of silicon wafer, first motor 12 stops working, at this time, the position of positioning plate 10 is fixed, which provides accurate positioning reference for subsequent cutting operation, so that the cutting thickness of silicon wafer can be accurately controlled according to needs, when silicon rod moves to contact with positioning plate 10 through conveying roller 4, wire cutting mechanism starts working, when cutting, start pneumatic cylinder 25, make driving roller 23, driven roller 21 and cutting wire 24 move down, at the same time, start second motor 22, make driving roller 23 rotate, the rotation of driving roller 23 drives cutting wire 24 to move at high speed, form the cutting force to silicon rod, cutting wire 24 grinds silicon rod under the action of friction, gradually cut out silicon wafer, through accurate adjustment of length setting mechanism, it can ensure that the thickness of silicon wafer cut each time is consistent, improve cutting precision and product quality, at the same time, through accurate control of cutting thickness, material waste caused by uneven thickness can be avoided, improve the utilization rate of silicon material.

[0023] In the description of the specification, the description of the terms "one embodiment", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0024] The basic principle, main features and advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and the description in the specification are only to illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model can also have various changes and improvements, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A wire cutting device for photovoltaic silicon wafer production, characterized in that: The system includes a base (1), on which a wire cutting mechanism and a length-fixing mechanism are provided. The length-fixing mechanism includes a fixing plate (2). Multiple fixing plates (2) are fixedly connected to the top side of the base (1). A conveying roller (4) is installed between two fixing plates (2) through a rotating shaft (3). A motor (5) is installed on the fixing plates (2) at the beginning and end. The output end of the motor (5) is connected to one end of the rotating shaft (3). A support seat (6) is fixedly connected to the base (1). A vertical plate (7) is fixedly connected to the top side of the base (1). The vertical plate (7) is connected to... A T-shaped slide rail (8) is provided between the support seats (6). A movable seat (9) is slidably mounted on the T-shaped slide rail (8). A positioning plate (10) is fixedly connected to the top of the movable seat (9). A threaded rod (11) is rotatably installed between the support seat (6) and the upright plate (7). The threaded rod (11) passes through the movable seat (9). A first motor (12) is installed on the upright plate (7). The output end of the first motor (12) is connected to one end of the threaded rod (11). A scale mark (13) is installed on the outer wall of the T-shaped slide rail (8).

2. The wire cutting device for photovoltaic silicon wafer production according to claim 1, characterized in that: Two electric push rods (14) are installed on the base (1), and the two electric push rods (14) are located on both sides of the support (6). The top of each of the two electric push rods (14) is fixedly connected to a fixing block (15), and a clamping seat (16) is fixedly connected between the two fixing blocks (15).

3. The wire cutting device for photovoltaic silicon wafer production according to claim 1, characterized in that: The wire cutting mechanism includes two vertical plates (17). The base (1) is fixed with two vertical plates (17). Each of the two vertical plates (17) has a limit groove (18). The two limit grooves (18) are slidably fitted with a lifting plate (19).

4. The wire cutting device for photovoltaic silicon wafer production according to claim 3, characterized in that: Two mounting plates (20) are fixedly connected to the bottom side of the lifting plate (19), and driven rollers (21) are rotatably mounted on both mounting plates (20). A second motor (22) is installed on one side wall of the lifting plate (19).

5. The wire cutting device for photovoltaic silicon wafer production according to claim 4, characterized in that: The output end of the second motor (22) is equipped with a drive roller (23), and the drive roller (23) and two driven rollers (21) are fitted with a cutting line (24).

6. The wire cutting device for photovoltaic silicon wafer production according to claim 3, characterized in that: Pneumatic cylinders (25) are installed at the top of both vertical plates (17), and pneumatic rods are mounted on the working ends of both pneumatic cylinders (25). The bottom end of the pneumatic rods is fixed to the lifting plate (19).

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