Testing tool for testing probe

Abstract

The utility model provides a test tool for testing a probe, and relates to the technical field of wafer testing. A supporting platform used for supporting the clamp is arranged on the top of the supporting frame. The lifting assembly comprises a driving part and a bearing plate connected with the driving part, and the bearing plate is arranged to do lifting motion under driving of the driving part. The crimping assembly is arranged on the bearing plate and comprises a crimping disc used for placing a wafer, and the crimping assembly is arranged to move upwards along with the bearing plate, so that the crimping disc abuts against the PCB, the test probe is in crimping connection with the wafer, and the crimping performance of the test probe is tested. According to the utility model, the test tool for automatically crimping the test probe is designed, the stability of crimping test is improved, before the clamp is formally used, the test tool is used for performing crimping test on the test probe, the unstable and invalid test probes are removed, the aging reliability test of the test probe is performed in advance, and the test efficiency is improved. Therefore, the crimping stability of the test probe is ensured when the clamp is used for testing.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of wafer test, particularly to a test tool for test probe. BACKGROUND

[0002] The existing semiconductor clamp is composed of a clamp and a heat sink assembly. When performing wafer aging test, the measured wafer is placed in the heat sink assembly, and the clamp and the heat sink assembly are combined to form a test cavity. Then the measured wafer is subjected to aging test. The clamp includes a PCB board and a probe plate connected to the PCB board. The probe plate has a plurality of test probes. From the temperature aspect, aging test is divided into high-temperature aging test and normal-temperature aging test. During normal-temperature aging test, the test probes may appear to be stuck and not to rebound. During high-temperature aging test, the test probes may appear to be deformed by heat and not to rebound. The test probes may seriously affect the aging test data of the wafer, and even may damage the measured chip.

[0003] The current test probe inspection method is small-batch manual crimping. The manual crimping has low test efficiency and unstable test effect or result. In addition, the Z-axis level cannot be guaranteed during manual crimping, and the retraction distance of the test probe may also have errors during multiple crimping. For high-temperature test environment, manual test cannot meet the current demand. The probe high-temperature test temperature is 180℃-200℃, which has a great risk of scalding and burning for manual operation. SUMMARY

[0004] An object of the utility model is to provide a test tool for test probe, which solves the technical problem that manual crimping test of the test probe in the prior art leads to unstable test result.

[0005] A further object of the utility model is to avoid the PCB board from falling off.

[0006] In particular, the utility model provides a test tool for test probe, which comprises:

[0007] A support frame has a support platform at the top for supporting a clamp. The clamp includes a PCB board and a probe plate connected below the PCB board. The probe plate has a plurality of test probes.

[0008] A lifting assembly includes a driving member and a bearing plate connected to the driving member. The bearing plate is arranged to perform lifting movement under the driving of the driving member.

[0009] A compression assembly is arranged on the bearing plate and comprises a compression disc for placing a wafer, the compression assembly is arranged to follow the upward movement of the bearing plate so that the compression disc abuts against the PCB plate and the test probe is compressed against the wafer, thereby testing the compression performance of the test probe.

[0010] Optionally, the compression disc is provided with a receiving cavity, and the compression assembly further comprises:

[0011] At least one heating member is arranged in the receiving cavity and used for heating the wafer.

[0012] Optionally, the number of the heating members is plural, and the plural heating members are uniformly arranged in the receiving cavity to uniformly heat the wafer.

[0013] Optionally, the compression assembly further comprises:

[0014] A temperature sensor is arranged in the receiving cavity and used for measuring the temperature of the compression disc.

[0015] Optionally, the lifting assembly further comprises:

[0016] At least one elastic member is arranged vertically between the bearing plate and the driving member, and two ends of each elastic member are connected with the bearing plate and the driving member, respectively.

[0017] Optionally, the lifting assembly further comprises:

[0018] At least one support column is arranged vertically beside the lifting assembly, and each support column is arranged to support the bearing plate when the driving member drives the bearing plate to descend.

[0019] Optionally, the support frame comprises:

[0020] A bottom plate, on which the lifting assembly is arranged;

[0021] A plurality of vertical columns are arranged on opposite sides of the bottom plate, respectively;

[0022] A pair of cross beams are arranged on the top of the vertical columns on opposite sides of the bottom plate and extend along the extension direction of the bottom plate, and each cross beam is provided with a limiting block for limiting the PCB plate and a support platform.

[0023] Optionally, the lifting assembly further comprises:

[0024] A power supply is connected with the driving member, the heating member and the temperature sensor, respectively, for power supply;

[0025] A temperature controller is connected with the heating element and the temperature sensor respectively, and is used for adjusting the target temperature of the heating element according to the actual temperature of the crimping disc obtained by the temperature sensor.

[0026] Optionally, the support frame further comprises:

[0027] At least one reinforcing beam is arranged in a direction perpendicular to the cross beams and connected with the pair of cross beams at two ends.

[0028] Optionally, the support frame further comprises:

[0029] A plurality of elbow clamps are respectively mounted on the stand columns on opposite sides of the bottom plate, and the elbow clamps are arranged to clamp the clamp when the clamp is placed on the support platform.

[0030] The utility model discloses a test tool, which comprises a support frame, a lifting assembly and a crimping assembly. The top of the support frame has a support platform for supporting a clamp. The lifting assembly comprises a driving member and a bearing plate connected with the driving member. The bearing plate is arranged to perform lifting movement under the driving of the driving member. The crimping assembly is arranged on the bearing plate and comprises a crimping disc for placing a wafer. The crimping assembly is arranged to move upward with the bearing plate, so that the crimping disc abuts against a PCB board and the test probe is crimped with the wafer, thereby testing the crimping performance of the test probe. The above technical solution designs a test tool for automatically crimping the test probe, improves the stability of the crimping test, and eliminates unstable test probes and failed test probes by using the test tool to test the test probe before the clamp is formally used, thereby testing the aging reliability of the test probe in advance to ensure the crimping stability of the test probe during the test of the clamp and avoid the failure of the clamp during use, which leads to unstable test data or the disconnection of the measured channel.

[0031] Further, the end of the cross beam of the support frame is provided with a limiting block for limiting the PCB board, thereby avoiding the sliding of the PCB board from the support frame.

[0032] The above and other objects, advantages and features of the present utility model will become more apparent from the following detailed description of some embodiments thereof, when considered in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0033] Some specific embodiments of the present utility model will be described in detail hereinafter with reference to the accompanying drawings in an exemplary and non-restrictive manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that the drawings are not necessarily drawn to scale. In the drawings:

[0034] Figure 1is a schematic structural view of one angle of the test tool according to one embodiment of the present utility model;

[0035] Figure 2 is a schematic front view of the test tool according to one embodiment of the present utility model;

[0036] Figure 3 is a schematic structural view of the clamp placed on the test tool according to one embodiment of the present utility model;

[0037] Figure 4 is a schematic structural view of the crimping assembly and the lifting assembly according to one embodiment of the present utility model;

[0038] Figure 5 is a schematic structural view of the crimping assembly according to one embodiment of the present utility model;

[0039] Figure 6 is a schematic structural view of one angle of the test tool according to one embodiment of the present utility model.

[0040] Reference signs:

[0041] 100-test tool, 200-clamp, 210-PCB board, 220-probe disc, 10-support frame, 11-bottom plate, 12-stand column, 13-cross beam, 131-limiting block, 14-reinforcing beam, 15-fixing block, 20-lifting assembly, 21-driving piece, 22-bearing plate, 23-elastic piece, 30-crimping assembly, 31-crimping disc, 32-heating piece, 33-temperature sensor, 40-elbow clamp, 50-support column, 60-power supply, 70-temperature controller, 80-control card. DETAILED DESCRIPTION

[0042] The embodiments of the present utility model are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present utility model, and cannot be understood as a limitation of the present utility model.

[0043] In the description of the present utility model, it is understood that the orientation or position relationship indicated by the terms "upper", "lower", etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present utility model.

[0044] In the description of the utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain encompassed feature, unless otherwise specifically described, this indicates that other features are not excluded and can further include other features.

[0045] Unless otherwise expressly specified and limited, the terms "connection", "installation" and other terms should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the utility model according to the specific circumstances.

[0046] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the embodiments have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0047] Figure 1 is a schematic structural view of a test tool 100 according to an embodiment of the utility model, Figure 2 is a schematic front view of a test tool 100 according to an embodiment of the utility model, Figure 3 is a schematic structural view of a clamp 200 placed on a test tool 100 according to an embodiment of the utility model, Figure 4 is a schematic structural view of a crimping assembly 30 and a lifting assembly 20 according to an embodiment of the utility model. As Figures 1 to 4 shown, in one specific embodiment, the test tool 100 for testing probes includes a support frame 10, a lifting assembly 20 and a crimping assembly 30, the top of the support frame 10 has a support platform for supporting a clamp 200, the clamp 200 includes a PCB board 210 and a probe disc 220 connected below the PCB board 210, the probe disc 220 has a plurality of test probes. The lifting assembly 20 includes a driving member 21 and a bearing plate 22 connected with the driving member 21, the bearing plate 22 is arranged to perform lifting movement under the driving of the driving member 21. The crimping assembly 30 is arranged on the bearing plate 22, and includes a crimping disc 31 for placing a wafer, the crimping assembly 30 is arranged to move upwardly with the bearing plate 22, so that the crimping disc 31 abuts against the PCB board 210, and the test probes are crimped with the wafer, so as to test the crimping performance of the test probes. Here, the driving member 21 is a pneumatic cylinder, which realizes reciprocating jacking action. The wafer is equivalent to a simulated wafer for testing the contact thickness of the test probe and the measured wafer.

[0048] The embodiment designs a test tool 100 for automatically pressing the test probe, improves the stability of the pressing test, and uses the test tool 100 to press the test probe before the clamp 200 is formally used, so as to eliminate unstable test probes and failed test probes, and perform the aging reliability test of the test probe in advance, so as to ensure the pressing stability of the test probe when the clamp 200 is tested, and avoid the failure of the clamp 200 in the use process, so as to cause unstable test data or the situation that the measured channel is broken.

[0049] When the normal temperature pressing test is performed, the assembled clamp 200 is placed on the support platform of the test tool 100, the normal temperature is not needed to be set, the air cylinder is opened to supply the source, the power supply 60 is connected, the pressing times and the single pressing to-position residence time are set on the software interface, and thus the normal temperature pressing test is completed. Here, the pressing times refer to the times that the pressing disc 31 rises and the clamp 200 is combined. The normal temperature pressing to-position residence time can be set to be greater than or equal to 3 s, and in other embodiments, the normal temperature pressing to-position residence time can also be set according to specific design requirements. During the multiple pressing processes, the measured probe needs to be manually checked at intervals, and a camera can also be added to identify the measured probe.

[0050] Figure 5 is a schematic structural view of a pressing assembly 30 according to an embodiment of the utility model. As shown in Figure 5 , in some embodiments, the pressing disc 31 is provided with a containing cavity, and the pressing assembly 30 further comprises at least one heating piece 32, the heating piece 32 is installed in the containing cavity and is used for heating the wafer. Here, the heating piece 32 can be a heating rod. In other embodiments, the heating piece 32 can also be other heating sources.

[0051] In some embodiments, the number of heating pieces 32 is multiple, and the multiple heating pieces 32 are uniformly arranged in the containing cavity to uniformly heat the wafer. In this embodiment, the number of heating pieces 32 is four, and the four heating pieces 32 are arranged in a square in the pressing disc 31 to uniformly heat the wafer.

[0052] In this embodiment, the heating piece 32 is arranged in the pressing disc 31, so that the test chip can be subjected to high-temperature pressing test, and the heat of the heating piece 32 is transmitted to the wafer through the pressing disc 31, and then transmitted to the measured chip through the wafer.

[0053] In some embodiments, the pressing assembly 30 further comprises a temperature sensor 33, the temperature sensor 33 is installed in the containing cavity and is used for measuring the temperature of the pressing disc 31. Here, the temperature sensor 33 extends to the middle position of the pressing disc 31 to measure the temperature of the middle position of the pressing disc 31, see Figure 5 .

[0054] Figure 6It is a schematic structural view of one angle of the test tool 100 according to one embodiment of the present utility model. Figure 6 As shown in the figure, in some embodiments, the test tool 100 further comprises a power supply 60 and a temperature controller 70, the power supply 60 is connected with the driving member 21, the heating member 32 and the temperature sensor 33 respectively for power supply. The temperature controller 70 is connected with the heating member 32 and the temperature sensor 33 respectively for adjusting the target temperature of the heating member 32 according to the actual temperature of the crimping disc 31 obtained by the temperature sensor 33.

[0055] In some embodiments, the test tool 100 further comprises a control card 80, which is a controller for controlling the cylinder, the heating member 32 and the temperature sensor 33 to ensure that the above-mentioned devices operate in a preset mode.

[0056] When high-temperature crimping test is carried out, the assembled clamp 200 is placed on the support platform of the test tool 100, the gas source of the cylinder is opened, the power supply 60 is connected, the temperature of the temperature controller 70 is set, and the crimping times and the single crimping in-place dwell time are set in the software interface, so that the high-temperature crimping test is completed. The high-temperature crimping in-place dwell time can be set to ≥10s to give the test probe a warming-up time. In other embodiments, the high-temperature crimping in-place dwell time can also be set according to specific design requirements. During the multiple crimping process, the condition of the measured probe needs to be checked manually at intervals, and a camera can also be added to identify the condition of the measured probe.

[0057] In some embodiments, the lifting assembly 20 further comprises at least one elastic member 23, the elastic member 23 is arranged vertically between the bearing plate 22 and the driving member 21, and the two ends of each elastic member 23 are connected with the bearing plate 22 and the driving member 21 respectively. In this embodiment, the number of elastic members 23 is four, and the four elastic members 23 are uniformly arranged on the driving member 21. Here, the elastic member 23 can be a spring.

[0058] In this embodiment, by arranging the elastic member 23, the hard contact between the crimping disc 31 and the PCB board 210 can be avoided, and the PCB board 210 can be prevented from being damaged.

[0059] In some embodiments, the test tool 100 further comprises at least one support column 50, the support column 50 is arranged vertically beside the lifting assembly 20, and each support column 50 is arranged to support the bearing plate 22 when the driving member 21 drives the bearing plate 22 to descend. In this embodiment, the number of support columns 50 is one. In other embodiments, the number of support columns 50 can be determined according to specific design requirements, for example, the size of the bearing plate 22 can be designed according to the size of the bearing plate 22.

[0060] In some embodiments, the support frame 10 comprises a base plate 11, a plurality of columns 12 and a pair of beams 13, and the lifting assembly 20 is installed on the base plate 11. The plurality of columns 12 are respectively installed on opposite sides of the base plate 11. The pair of beams 13 are respectively arranged at the top of the columns 12 on opposite sides of the base plate 11 and arranged along the extension direction of the base plate 11, and the end of each beam 13 is provided with a limiting block 131 for limiting the PCB board 210 and a support platform. Here, the number of columns 12 on opposite sides of the base plate 11 is the same.

[0061] In this embodiment, the end of the beam 13 of the support frame 10 is provided with a limiting block 131 for limiting the PCB board 210, so that the PCB board 210 can be prevented from sliding off the support frame 10. When the clamp 200 is placed on the support frame 10, the front of the clamp 200 is in contact with the limiting block 131.

[0062] In some embodiments, the support frame 10 further comprises at least one reinforcing beam 14, which is arranged in a direction perpendicular to the beam 13 and connected to the pair of beams 13 at both ends. In this embodiment, the reinforcing beam 14 can strengthen the support frame 10.

[0063] In some embodiments, the test tool 100 further comprises a plurality of elbow clamps 40, which are respectively installed on the columns 12 on opposite sides of the base plate 11, and the elbow clamps 40 are arranged to clamp the clamp 200 when the clamp 200 is placed on the support platform. Here, the test tool 100 further comprises a plurality of fixing blocks 15, each of which is installed on the side wall of the column 12, and one elbow clamp 40 is installed on each fixing block 15.

[0064] In this embodiment, during the crimping test, the air cylinder is first controlled to lift up, the crimping disc 31 above the air cylinder rises up and closes the mold with the clamp 200 fixed at the top to crimp the test probe, so as to perform the crimping test on the test probe. When the temperature controller 70 is set to a temperature during the high-temperature crimping test, the temperature resistance test of the test probe can be increased to exclude abnormal spring probes and abnormally deformed test probes. The test tool 100 designed in this embodiment can perform the crimping test offline, exclude unstable test probes, exclude risks in advance, improve work efficiency, avoid repeated disassembly after installation of the equipment, and improve the stability of the clamp 200 after installation of the equipment.

[0065] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail in this article, many other variants or modifications conforming to the principles of the present application can be directly determined or deduced based on the content disclosed in the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variants or modifications.

Claims

1. A test fixture for testing probes, characterized in that, include: A support frame having a support platform at its top for supporting a fixture, the fixture including a PCB board and a probe disk connected below the PCB board, the probe disk having multiple test probes; A lifting assembly includes a driving component and a support plate connected to the driving component, the support plate being configured to move up and down under the drive of the driving component; A crimping assembly is disposed on the carrier plate and includes a crimping pad for placing a wafer. The crimping assembly is configured to move upward with the carrier plate, so that the crimping pad abuts against the PCB board and the test probe is crimped against the wafer, thereby testing the crimping performance of the test probe.

2. The test fixture according to claim 1, characterized in that, The crimping plate has a receiving cavity, and the crimping assembly further includes: At least one heating element is installed within the receiving cavity for heating the wafer.

3. The testing fixture according to claim 2, characterized in that, The number of heating elements is multiple, and the multiple heating elements are evenly arranged in the receiving cavity to uniformly heat the wafer.

4. The testing fixture according to claim 2, characterized in that, The crimping assembly further includes: A temperature sensor is installed inside the receiving cavity to measure the temperature of the pressing plate.

5. The test fixture according to any one of claims 1-4, characterized in that, The lifting assembly also includes: At least one elastic element is arranged vertically between the support plate and the drive element, and the two ends of each elastic element are connected to the support plate and the drive element, respectively.

6. The test fixture according to any one of claims 1-4, characterized in that, Also includes: At least one support column is arranged vertically beside the lifting assembly, and each of the support columns is configured to support the support plate when the drive member lowers the support plate.

7. The test fixture according to claim 4, characterized in that, The support frame includes: The base plate, on which the lifting assembly is mounted; Multiple columns are installed on opposite sides of the base plate; A pair of crossbeams are respectively arranged on the top of the columns on opposite sides of the base plate and along the extension direction of the base plate. Each crossbeam has a limiting block at its end for limiting the PCB board and a supporting platform.

8. The test fixture according to claim 7, characterized in that, Also includes: A power supply is connected to the driving component, the heating component, and the temperature sensor respectively, for supplying power. A thermostat is connected to both the heating element and the temperature sensor, and is used to adjust the target temperature of the heating element according to the actual temperature of the pressing plate obtained by the temperature sensor.

9. The test fixture according to claim 7, characterized in that, The support frame also includes: At least one reinforcing beam is arranged in a direction perpendicular to the crossbeams and its two ends are connected to a pair of the crossbeams.

10. The test fixture according to claim 7, characterized in that, Also includes: Multiple elbow clamps are respectively installed on the columns on opposite sides of the base plate, and the elbow clamps are configured to clamp the clamp when the clamp is placed on the support platform.

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