Mute computer with heat dissipation and noise reduction functions
By combining water cooling and air cooling mechanisms with a multi-layered noise reduction system, the problems of low heat dissipation efficiency and serious noise pollution in computers have been solved, achieving efficient heat dissipation and low-noise operation, ensuring the stability of the computer and the user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2026-03-24
AI Technical Summary
Existing technologies suffer from poor heat dissipation efficiency and severe noise pollution in computers, which negatively impact user experience and computer stability, especially in noise-sensitive environments.
The cooling system combines water cooling and air cooling, and incorporates a noise reduction mechanism that uses sound-insulating gaskets, sound-insulating panels, and vibration-damping pads to form a multi-layered noise reduction system, ensuring that the computer maintains low noise and a suitable temperature when running under high load.
It achieves efficient heat dissipation and low-noise operation, ensuring the stability of the computer and the comfort of the user's environment, and reducing the impact of noise interference and temperature on the hardware.
Smart Images

Figure CN224035845U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to computer equipment technical field especially relates to a heat dissipation noise reduction's mute computer. BACKGROUND
[0002] With the continuous development of computer technology, the performance of computer is more and more powerful, but the heat and noise problem generated in the running process is increasingly prominent. For some noise sensitive environment, such as office, library, hospital, etc., the noise generated by computer running will cause interference to people's work and life. At the same time, the temperature is too high to affect the performance and stability of computer, and even shorten the service life of computer hardware.
[0003] The prior art scheme has the following problems in use:
[0004] (1) rely on single heat dissipation equipment to dissipate heat, when the computer runs for a long time under high load, the heat cannot be discharged in time and effectively, which leads to the internal temperature of the computer being too high, and further affects the performance and service life of the computer hardware, and even causes system crash and other failures;
[0005] (2) the fan will produce a large noise and cause obvious vibration in the high-speed running process, which will cause great interference to people's work, study and rest, and reduce the comfort and work efficiency of the environment in the environment with strict noise requirement, such as quiet office, hospital ward, etc.
[0006] In view of the above problems, the utility model provides a heat dissipation noise reduction's mute computer. CONTENT OF UTILITY MODEL
[0007] The utility model aims at solving the problems of low heat dissipation efficiency and serious noise pollution in the prior art, and provides a heat dissipation noise reduction's mute computer.
[0008] In order to achieve the above object, the utility model adopts the following technical scheme: a heat dissipation noise reduction's mute computer, including the case main part, water cooling heat dissipation mechanism, air cooling heat dissipation mechanism, noise reduction mechanism and mainboard mechanism, the four corners of the bottom of the case main part are fixedly connected with anti-skid base, the water cooling heat dissipation mechanism is fixedly connected to both sides in the inside of the case main part, the air cooling heat dissipation mechanism is screwed on the top of the case main part, the noise reduction mechanism is fixedly connected to the inner surface of the case main part, the mainboard mechanism is fixedly connected to the inside of the case main part, the water cooling heat dissipation mechanism includes the cooling water tank fixedly connected to the inner bottom wall of the case main part, one side of the top of the cooling water tank is fixedly connected with the water inlet, the other side of the top of the cooling water tank is fixedly connected with the circulating water pump, the top of the circulating water pump is fixedly connected with the cooling coil, the distal end of the cooling coil is fixedly connected to the inside of the water inlet on the top of the cooling water tank.
[0009] Further, the outer surface of the cooling coil is sleeved with a fixing ring, the top of the fixing ring is fixedly connected to the inner top wall of the case body, and the cooling water tank and the cooling coil are symmetrically arranged on both sides in the case body.
[0010] Further, the air-cooled heat dissipation mechanism comprises a shock-absorbing pad clamped on the top of the case body, the outer surface of the shock-absorbing pad is clamped with a fixing frame, the two sides of the fixing frame are threadedly connected with limiting pieces, and the fixing frame is threadedly connected to the top of the case body through the limiting pieces.
[0011] Further, the inner top wall of the fixing frame is fixedly connected with a servo motor, the output end of the servo motor is fixedly connected with a cooling fan, and the servo motor and the cooling fan are arranged at three equal distances in the fixing frame.
[0012] Further, the noise reduction mechanism comprises a sound-absorbing plate fixedly connected to the inner side wall of the case body, the noise reduction mechanism comprises a sound insulation sealing washer clamped on the outer surface of the case body, and the outer surface of the sound insulation sealing washer is threadedly connected with a sound insulation plate.
[0013] Further, the two sides of the sound insulation plate are threadedly connected with bolts, the sound insulation plate and the sound insulation sealing washer are symmetrically arranged on both sides of the case body, the sound insulation plate is threadedly connected to both sides of the case body through the bolts, and the sound insulation sealing washer is clamped in the inside of the case body and the sound insulation plate.
[0014] Further, the mainboard mechanism comprises a mainboard running device fixedly connected to the inside of the case body, the outer surface of the mainboard running device is threadedly connected with a radiator, the outer surface of the radiator is fixedly connected with a heat sink, the two sides of the radiator are threadedly connected with connecting pieces, and the radiator is threadedly connected to the outer surface of the mainboard running device through the connecting pieces.
[0015] Compared with the prior art, the advantages and positive effects of the utility model lie in:
[0016] 1. In the utility model, through the setting of the cooling coil, the radiator and the cooling fan, the water-cooled heat dissipation mechanism can efficiently absorb a large amount of high heat generated by the core components in the computer during operation by virtue of the precise layout of the cooling coil around the key heating area, the air-cooled heat dissipation mechanism accelerates the air circulation in the case from all directions by using the strong cold wind blown by the cooling fan, and the heat that cannot be completely removed by the water-cooled heat dissipation mechanism is rapidly discharged from the case, so that the overall heat dissipation efficiency is greatly improved, and the internal temperature of the computer can be kept at a suitable low level in a long-time high-load running state, thereby ensuring the stable operation of the system.
[0017] 2. The utility model discloses a sound insulation sealing washer, sound insulation board and shock pad are set up, form a all -round, multilevel noise reduction system, and sound insulation sealing washer is tightly filled the gap between the case main part and sound insulation board, effectively prevents the noise of the case inside to spread to the outside, and the noise diffusion is cut off on the transmission path, and the sound insulation board has strong barrier ability to the noise generated in the case, further weakens the propagation intensity of noise, and the shock pad can reduce the vibration generated in the operation process of parts such as cooling fan, reduces the noise generated due to vibration, and the sound absorption board is installed in the inside wall of the case main part, absorbs and attenuates the residual noise in the case, so that the noise generated when the computer is running is greatly reduced, and a quiet, comfortable working and learning environment is created for the user. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 A three-dimensional structure schematic diagram of the mute computer of heat dissipation and noise reduction is provided for the utility model;
[0019] Figure 2 A structure schematic diagram of the heat dissipation fan in the mute computer of heat dissipation and noise reduction is provided for the utility model;
[0020] Figure 3 A structure schematic diagram of the cooling coil in the mute computer of heat dissipation and noise reduction is provided for the utility model; Figure 2
[0021] Figure 4 A structure schematic diagram of the cooling coil in the mute computer of heat dissipation and noise reduction is provided for the utility model;
[0022] Figure 5 A structure schematic diagram of the cooling coil in the mute computer of heat dissipation and noise reduction is provided for the utility model;
[0023] Figure 6 A structure schematic diagram of the cooling coil in the mute computer of heat dissipation and noise reduction is provided for the utility model; Figure 5
[0024] LEGEND:
[0025] 1, case main part, 2, water cooling heat dissipation mechanism, 21, cooling water tank, 22, water inlet, 23, circulating water pump, 24, cooling coil, 25, fixed ring, 3, air cooling heat dissipation mechanism, 31, shock pad, 32, fixed frame, 33, limiting piece, 34, servo motor, 35, heat dissipation fan, 36, dust screen, 4, noise reduction mechanism, 41, sound absorption board, 42, sound insulation sealing washer, 43, sound insulation board, 44, bolt, 5, mainboard mechanism, 51, mainboard operation equipment, 52, radiator, 53, heat dissipation plate, 54, connecting piece, 6, antiskid base. DETAILED DESCRIPTION
[0026] Please refer toFigures 1-6 The utility model provides a technical scheme: a mute computer of heat dissipation and noise reduction, including case main body 1, water cooling heat dissipation mechanism 2, air cooling heat dissipation mechanism 3, noise reduction mechanism 4 and mainboard mechanism 5, the four corners of case main body 1 bottom fixedly connected with antiskid base 6, water cooling heat dissipation mechanism 2 is fixedly connected in the both sides of case main body 1 inside, air cooling heat dissipation mechanism 3 is screwed on the top of case main body 1, noise reduction mechanism 4 is fixedly connected to the inner surface of case main body 1, and mainboard mechanism 5 is fixedly connected to the inside of case main body 1.
[0027] The water cooling heat dissipation mechanism 2, air cooling heat dissipation mechanism 3, noise reduction mechanism 4 and mainboard mechanism 5 are described in detail below.
[0028] In the embodiment, the water cooling heat dissipation mechanism 2 includes a cooling water tank 21 fixedly connected to the inner bottom wall of the case main body 1. One side of the top of the cooling water tank 21 is fixedly connected with a water inlet 22. The other side of the top of the cooling water tank 21 is fixedly connected with a circulating water pump 23. The top of the circulating water pump 23 is fixedly connected with a cooling coil 24. The distal end of the cooling coil 24 is fixedly connected to the inside of the water inlet 22 on the top of the cooling water tank 21.
[0029] The above components achieve the effect that the cooling coil 24 tightly surrounds the core heat generating components such as CPU and graphics card inside the computer. When the computer runs and generates a large amount of heat, the cooling liquid flows through the cooling coil 24, efficiently absorbs the heat emitted by the core components by using the good heat conduction performance of the cooling coil 24, and then the cooling liquid with heat flows back to the cooling water tank 21.
[0030] Specifically, the outer surface of the cooling coil 24 is sleeved with a fixing ring 25. The top of the fixing ring 25 is fixedly connected to the inner top wall of the case main body 1. The cooling water tank 21 and the cooling coil 24 are symmetrically arranged on both sides inside the case main body 1.
[0031] The above components achieve the effect that the water cooling heat dissipation mechanism 2 can uniformly dissipate heat to each area inside the case main body 1, fully covers the heat sources inside the computer, avoids the occurrence of heat dissipation dead angles, and enables the hardware at different positions in the case to be effectively cooled.
[0032] Specifically, the air cooling heat dissipation mechanism 3 includes a shock-absorbing pad 31 clamped on the top of the case main body 1. The outer surface of the shock-absorbing pad 31 is clamped with a fixed frame 32. The two sides of the fixed frame 32 are threadedly connected with limiting pieces 33. The fixed frame 32 is threadedly connected to the top of the case main body 1 through the limiting pieces 33.
[0033] The above components achieve the effect that the shock-absorbing pad 31 effectively reduces the transmission of vibration generated by the operation of the heat dissipation fan 35 to the case main body 1 by using the excellent shock-absorbing and sound insulation characteristics of silica gel, and reduces the noise caused by vibration from the root, laying the foundation for creating a mute computer environment.
[0034] Specifically, the inner top wall of the fixed frame 32 is fixedly connected with a servo motor 34, the output end of the servo motor 34 is fixedly connected with a cooling fan 35, the servo motor 34 and the cooling fan 35 are arranged at an internal three-equal distance of the fixed frame 32, and the bottom of the fixed frame 32 is fixedly connected with a dust screen 36.
[0035] The effect achieved by the above components is that the dust screen 36 can effectively prevent dust from entering the inside of the case main body 1, avoiding dust accumulation on the surface of computer hardware, which not only hinders hardware heat dissipation, but also may cause circuit short circuit and other faults.
[0036] Specifically, the noise reduction mechanism 4 includes a sound-absorbing plate 41 fixedly connected to the inner side wall of the case main body 1, and includes a sound insulation sealing washer 42 clamped to the outer surface of the case main body 1, and the outer surface of the sound insulation sealing washer 42 is threadedly connected with a sound insulation plate 43.
[0037] The effect achieved by the above components is that the sound insulation sealing washer 42 is made of high-elasticity and high-density sound insulation material, which can tightly fill the small gap between the case main body 1 and the sound insulation plate 43, effectively prevent the internal noise of the case from spreading outward through the gap, and enhance the sound insulation effect.
[0038] Specifically, the sound insulation plate 43 is threadedly connected with a bolt 44 on both sides, the sound insulation plate 43 and the sound insulation sealing washer 42 are symmetrically arranged on both sides of the case main body 1, the sound insulation plate 43 is threadedly connected to both sides of the case main body 1 through the bolt 44, and the sound insulation sealing washer 42 is clamped inside the case main body 1 and the sound insulation plate 43.
[0039] The effect achieved by the above components is that the symmetric arrangement forms a complete sound insulation barrier around the case for the noise reduction mechanism 4, effectively reducing the noise generated by the computer during operation from spreading to the outside, and when the sound insulation plate 43 or the sound insulation sealing washer 42 is damaged during long-term use, the bolt 44 can be easily disassembled to facilitate replacement, ensuring that the noise reduction mechanism 4 is always in the best working condition.
[0040] Specifically, the mainboard mechanism 5 includes a mainboard running device 51 fixedly connected to the inside of the case main body 1, a heat sink 52 threadedly connected to the outer surface of the mainboard running device 51, a heat sink plate 53 fixedly connected to the outer surface of the heat sink 52, and connecting pieces 54 threadedly connected to both sides of the heat sink 52, and the heat sink 52 is threadedly connected to the outer surface of the mainboard running device 51 through the connecting pieces 54.
[0041] The effect achieved by the above components is that the heat sink 52 can quickly absorb the heat generated by the mainboard operating device 51, the heat sink plate 53 is fixed on the outer surface of the heat sink 52, the heat dissipation area is increased, the heat is dissipated to the surrounding air at a faster speed, the working temperature of the mainboard operating device 51 is effectively reduced, and the stable operation of the mainboard is ensured.
[0042] Working principle: when the computer starts running, a large amount of heat is generated by the mainboard operating device 51 and other hardware, at this time, the water cooling heat dissipation mechanism 2 plays a role first, the circulating water pump 23 drives the cooling liquid in the cooling water tank 21 to circulate in the cooling coil 24, the cooling coil 24 absorbs heat around the core heating components, and then the cooling liquid returns to the cooling water tank 21 for cooling and temperature reduction, so as to circulate and take away most of the heat.
[0043] The air cooling heat dissipation mechanism 3 is started at the same time, the servo motor 34 drives the heat dissipation fan 35 to run at a high speed, the cold air blown out accelerates the air circulation in the case, and the heat not completely taken away by the water cooling heat dissipation mechanism 2 is discharged from the case, and the two cooperate to maintain the appropriate temperature in the case.
[0044] When the computer runs and generates noise, the noise reduction mechanism 4 starts to work, the sound absorption plate 41 absorbs the noise in the case, the sound insulation sealing ring 42 fills the gap to prevent the noise from leaking out, and the sound insulation plate 43 further blocks the noise, so that the noise propagation is reduced, and the heat sink 52 and the heat sink plate 53 in the mainboard mechanism 5 are specially used for heat dissipation of the heat generated by the mainboard operating device 51, so as to ensure the stable operation of the mainboard, so that the whole computer realizes efficient heat dissipation and low noise operation, and provides good use experience for users.
Claims
1. A silent computer with heat dissipation and noise reduction, comprising a chassis body (1), a water-cooled heat dissipation mechanism (2), an air-cooled heat dissipation mechanism (3), a noise reduction mechanism (4), and a motherboard mechanism (5), characterized in that: The bottom of the chassis body (1) is fixedly connected with anti-skid bases (6) at four corners, the water-cooling heat dissipation mechanism (2) is fixedly connected to both sides inside the chassis body (1), the air-cooling heat dissipation mechanism (3) is screwedly connected to the top of the chassis body (1), the noise reduction mechanism (4) is fixedly connected to the inner surface of the chassis body (1), the mainboard mechanism (5) is fixedly connected to the inside of the chassis body (1), the water-cooling heat dissipation mechanism (2) comprises a cooling water tank (21) fixedly connected to the inner bottom wall of the chassis body (1), one side of the top of the cooling water tank (21) is fixedly connected with a water inlet (22), the other side of the top of the cooling water tank (21) is fixedly connected with a circulating water pump (23), the top of the circulating water pump (23) is fixedly connected with a cooling coil (24), and the distal end of the cooling coil (24) is fixedly connected to the inside of the water inlet (22) on the top of the cooling water tank (21).
2. The silent computer of claim 1, wherein: The outer surface of the cooling coil (24) is sleeved with a fixing ring (25), the top of the fixing ring (25) is fixedly connected to the inner top wall of the chassis body (1), and the cooling water tank (21) and the cooling coil (24) are symmetrically arranged on both sides inside the chassis body (1).
3. The silent computer of claim 1, wherein: The air-cooling heat dissipation mechanism (3) comprises a damping pad (31) clamped to the top of the chassis body (1), the outer surface of the damping pad (31) is clamped with a fixed frame (32), the two sides of the fixed frame (32) are screwedly connected with limit pieces (33), and the fixed frame (32) is screwedly connected to the top of the chassis body (1) through the limit pieces (33).
4. The silent computer of claim 3, wherein: The inner top wall of the fixed frame (32) is fixedly connected with a servo motor (34), the output end of the servo motor (34) is fixedly connected with a cooling fan (35), and the servo motor (34) and the cooling fan (35) are arranged at three equal distances inside the fixed frame (32).
5. The silent computer of claim 1, wherein: The noise reduction mechanism (4) comprises a sound-absorbing plate (41) fixedly connected to the inner side wall of the chassis body (1), the noise reduction mechanism (4) comprises a sound insulation sealing washer (42) clamped to the outer surface of the chassis body (1), and the outer surface of the sound insulation sealing washer (42) is screwedly connected with a sound insulation plate (43).
6. The silent computer of claim 5, wherein: The two sides of the sound insulation plate (43) are screwedly connected with bolts (44), the sound insulation plate (43) and the sound insulation sealing washer (42) are symmetrically arranged on both sides of the chassis body (1), the sound insulation plate (43) is screwedly connected to both sides of the chassis body (1) through the bolts (44), and the sound insulation sealing washer (42) is clamped inside the chassis body (1) and the sound insulation plate (43).
7. The silent computer of claim 1, wherein: The mainboard mechanism (5) includes a mainboard operation device (51) fixedly connected to the inside of the case main body (1), the outer surface of the mainboard operation device (51) is threadedly connected with a radiator (52), the outer surface of the radiator (52) is fixedly connected with a heat dissipation plate (53), the two sides of the radiator (52) are threadedly connected with connecting pieces (54), and the radiator (52) is threadedly connected to the outer surface of the mainboard operation device (51) through the connecting pieces (54).