Gelling-free cover plate assembly and electronic equipment
By fixing the backlight assembly with mechanical clips and combining it with an enhancement layer and a buffer layer, the stability and optical performance issues of traditional cover plate assemblies are solved, achieving a secure connection and temperature feedback function, thereby improving the stability of electronic devices and the display effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-03-24
AI Technical Summary
Traditional cover plate assemblies suffer from problems such as glue aging, insecure backlight assembly, impact on optical performance, and inability to meet multi-functional needs, resulting in poor stability and display quality.
The backlight assembly is secured by mechanical clips, and the hardness of the glass substrate is enhanced by zirconium oxide, silicon nitride and tungsten carbide layers. A temperature-sensitive color-changing ink layer is used to provide temperature feedback, and an aerogel buffer layer is set between the backlight assembly and the glass substrate.
It achieves a robust connection between the backlight assembly and the glass substrate, enhancing stability and durability, providing temperature feedback to ensure display quality and optical performance, and adapting to multifunctional needs.
Smart Images

Figure CN224037397U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of electronic device structure, and particularly relates to a glue-free cover plate assembly fixed by mechanical buckling instead of traditional optical glue bonding and an electronic device. BACKGROUND
[0002] With the rapid development of smart phones, tablets and other portable electronic devices, the quality and performance requirements of cover plate assemblies are increasingly improved. The traditional cover plate assembly structure usually relies on optical glue, foam glue and other materials to fix the glass substrate and backlight assembly. This design has certain shortcomings in practical application.
[0003] Glue aging problem: optical glue, foam glue and other bonding materials are easily affected by environmental factors such as temperature and humidity during long-term use, and are prone to aging, embrittlement or falling off, which leads to a decrease in the stability of the cover plate assembly, and even causes the display screen to loosen or break.
[0004] Insecure fixation of backlight assembly: in the traditional design, the connection between the backlight assembly and the glass substrate relies on adhesive, which results in insufficient bonding between the backlight assembly and the substrate, especially under conditions such as vibration and impact, which easily causes loosening or displacement, thereby affecting the display effect and the reliability of the module.
[0005] Optical performance impact: due to the use of glue or foam glue in traditional technology, these materials may affect the transmission of light, resulting in unsatisfactory performance of the cover plate assembly in terms of brightness uniformity, color restoration, etc.
[0006] Inability to adapt to multi-functional requirements: in the traditional cover plate assembly, most of them only focus on display functions, and lack sufficient consideration of temperature change response, surface wear resistance and corrosion resistance, etc., which leads to a significant reduction in the service life and display effect of the device in some specific environments.
[0007] Therefore, how to provide a more stable, durable and glue-free fixed cover plate assembly has become a technical problem to be solved. SUMMARY
[0008] The purpose of the present application is to solve the problems in the prior art and provide a glue-free cover plate assembly fixed by mechanical buckling instead of traditional optical glue bonding and an electronic device.
[0009] To solve the above technical problems, the technical method adopted by the present application is as follows: the present application discloses a glue-free cover plate assembly, which comprises a glass substrate and a backlight assembly, characterized in that: along the thickness direction of the glass substrate, recesses are arranged on both sides of the glass substrate and extend into the glass substrate; the backlight assembly is mechanically fixed with the recesses by buckling and is arranged below the glass substrate.
[0010] The front surface of the glass substrate is sequentially provided with a zirconium oxide layer, a silicon nitride layer and a tungsten carbide layer, and the back surface frame area is provided with a temperature-sensitive color-changing ink layer.
[0011] Further, the groove depth is 1.5-2.5mm, and the width is 0.8-1.2mm.
[0012] Further, the reserved distance between the upper and lower surfaces of the groove and the upper and lower surfaces of the glass substrate is greater than or equal to 1mm.
[0013] Further, the temperature-sensitive color-changing ink layer is coated with an aluminum oxide protective layer.
[0014] Further, the thickness of the zirconium oxide layer is 20-30nm, the thickness of the silicon nitride layer is 8-12nm, and the thickness of the tungsten carbide layer is 10-15nm.
[0015] Further, the thickness of the temperature-sensitive color-changing ink layer is 10-15 microns, and the thickness of the aluminum oxide protective layer is 6-10 microns.
[0016] Further, an aerogel buffer layer is arranged between the backlight assembly and the glass substrate.
[0017] Further, the buckle is made of elastic titanium alloy material, the thickness of the buckle arm is 0.3-0.5mm, the width is 1.5-2mm, and the buckle end is provided with a barb structure.
[0018] The application also discloses an electronic device comprising any of the above glue-free cover plate assemblies, and a touch screen and circuit assembly integrated on the glue-free cover plate assembly.
[0019] Further, the electronic device is a smart phone or a tablet computer, and the inside of the shell is provided with a limiting groove matched with the buckle.
[0020] Beneficial effects:
[0021] 1. Compared with the prior art, the mechanical fixation of the metal buckle and the glass substrate avoids the aging problem of glue, and improves the stability and durability of the cover plate assembly. The buckle can ensure the firm connection of the backlight assembly and the glass substrate, and can remain stable even under vibration or impact.
[0022] 2. The arrangement of the zirconium oxide layer, the silicon nitride layer and the tungsten carbide layer improves the hardness, wear resistance and chemical stability of the glass substrate, effectively reduces the surface scratches, and ensures good display effect and long-term optical performance.
[0023] 3. The temperature-sensitive color-changing ink layer provides visual feedback function of temperature change, so that the user can intuitively understand the temperature change of the device, and avoid damage of the device caused by overheating or overcooling. Attached Figure Description
[0024] Figure 1 This is an overall schematic diagram of the glue-free cover plate assembly in this invention;
[0025] Figure 2 This is a partial cross-sectional schematic diagram of the glass substrate in the glue-free cover plate assembly of the present invention. Detailed Implementation
[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0027] Example 1: A glue-free cover plate assembly
[0028] This embodiment provides a glue-free cover plate assembly, comprising a glass substrate 1 and a backlight assembly 2. Grooves 11 are provided on both sides of the glass substrate 1, and the backlight assembly 2 is mechanically fixed to the grooves 11 by clips 3.
[0029] Preferably, the glass substrate 1 is made of 3-5 mm thick tempered glass, tempered glass, or other materials with high strength and good durability. The groove 11 has a depth of 1.5-2.5 mm and a width of 0.8-1.2 mm, and a distance of at least 1 mm is reserved between the upper and lower surfaces of the groove and the upper and lower surfaces of the glass substrate. The backlight assembly 2 is disposed below the glass substrate 1.
[0030] A zirconium oxide layer 12, a silicon nitride layer 13, and a tungsten carbide layer 14 are sequentially disposed on the front side of the glass substrate 1. Preferably, the thicknesses of these coating layers are 20-30 nanometers for the zirconium oxide layer, 8-12 nanometers for the silicon nitride layer, and 10-15 nanometers for the tungsten carbide layer, respectively, thereby enhancing the hardness, wear resistance, and chemical stability of the glass substrate.
[0031] A thermochromic ink layer 15 is provided on the back frame area. This ink layer changes color according to temperature changes, providing a temperature indication function. In addition, preferably, an aluminum oxide protective layer 16 is coated on the thermochromic ink layer 15 to protect the ink layer from scratches or abrasion.
[0032] To enhance stability and shock resistance, an aerogel buffer layer is provided between the backlight assembly 2 and the glass substrate 1. The aerogel buffer layer effectively improves the vibration resistance of the cover assembly, reduces the impact of external impacts on the display effect, and ensures the stability of the cover assembly in harsh environments.
[0033] The backlight assembly is located behind the glass substrate and includes an LED light source, a light guide plate, and an optical film layer to provide uniform illumination for the display panel below.
[0034] Preferably, the fixing of the backlight assembly 2 adopts a buckle 3 made of elastic titanium alloy material, the thickness of the buckle arm is 0.3-0.5 mm, the width is 1.5-2 mm, and the end is provided with a barb structure to ensure the firmness of the buckle.
[0035] Embodiment 2: An electronic device
[0036] The embodiment provides an electronic device, which comprises the glue-free cover plate assembly of embodiment 1 and is integrated with a touch screen and a circuit assembly. The electronic device is a smart phone or a tablet computer, and a limiting groove matched with the buckle 3 is arranged on the inner side of the device shell to fix the cover plate assembly.
[0037] Preferably, the cover plate assembly can support multi-point touch operation, and the touch function is closely combined with the display function, thereby improving the user experience of the device.
[0038] In the embodiment, the backlight assembly of the cover plate assembly can automatically adjust the brightness according to the change of ambient light, thereby optimizing the display effect. Meanwhile, the temperature indication function provided by the temperature-sensitive color-changing ink layer can help the user monitor the temperature change of the device, thereby ensuring the stable operation of the device in a high-temperature or low-temperature environment.
[0039] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A cover plate assembly without glue, comprising a glass substrate (1) and a backlight assembly (2), characterized in that: Grooves (11) are arranged on both sides of the glass substrate (1) and extend into the glass substrate (1) along the thickness direction of the glass substrate (1); the backlight assembly (2) is arranged below the glass substrate (1) and is mechanically fixed to the grooves (11) by buckles (3); The front surface of the glass substrate (1) is sequentially provided with a zirconium oxide layer (12), a silicon nitride layer (13) and a tungsten carbide layer (14), and the back surface frame area is provided with a thermochromic ink layer (15).
2. The glueless cover plate assembly of claim 1, wherein: The depth of the groove (11) is 1.5-2.5 mm, and the width is 0.8-1.2 mm.
3. The glueless cover plate assembly of claim 2, wherein: The upper and lower surfaces of the groove (11) are spaced apart from the upper and lower surfaces of the glass substrate (1) by a reserved distance of ≥1 mm.
4. The glueless cover plate assembly of claim 1, wherein: The thermochromic ink layer (15) is coated with an aluminum oxide protective layer (16).
5. The no-glass cover plate assembly of claim 1, wherein: The thickness of the zirconium oxide layer is 20-30 nm, the thickness of the silicon nitride layer is 8-12 nm, and the thickness of the tungsten carbide layer is 10-15 nm.
6. The no-glass cover plate assembly of claim 4, wherein: The thickness of the thermochromic ink layer (15) is 10-15 microns, and the thickness of the aluminum oxide protective layer (16) is 6-10 microns.
7. The frameless cover plate assembly of any one of claims 1-6, wherein: An aerogel buffer layer is arranged between the backlight assembly (2) and the glass substrate (1).
8. The glueless cover plate assembly of claim 7, wherein: The buckle (3) is made of elastic titanium alloy, the thickness of the buckle arm is 0.3-0.5 mm, the width is 1.5-2 mm, and the end of the buckle (3) is provided with a barb structure.
9. An electronic device, comprising: The electronic device is a smart phone or a tablet computer, and a limiting groove matched with the buckle (3) is arranged on the inner side of the shell of the electronic device.
10. The electronic device of claim 9, wherein: The electronic device is a smart phone or a tablet computer, and a limiting groove matched with the buckle (3) is arranged on the inner side of the shell of the electronic device.