LED lamp bead and display module

Abstract

The utility model discloses an LED lamp bead and a display module, the LED lamp bead comprises a base and an LED chip, the base is provided with a plurality of supports, and the supports comprise a red light anode pin frame, a green light anode pin frame, a blue light anode pin frame, a yellow light anode pin frame and a common cathode pin frame; the LED chips are arranged on the bracket, and the LED chips comprise a red light chip, a green light chip, a blue light chip and a yellow light chip; two electrodes of the red light chip are electrically connected with the red light anode pin frame and the common cathode pin frame respectively, two electrodes of the green light chip are electrically connected with the green light anode pin frame and the common cathode pin frame respectively, and two electrodes of the blue light chip are electrically connected with the blue light anode pin frame and the common cathode pin frame respectively. And two electrodes of the yellow light chip are electrically connected with the yellow light anode pin frame and the common cathode pin frame respectively. The LED lamp bead provided by the utility model is low in power consumption and high in displayed color purity.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED packaging technical field especially relates to a LED lamp pearl and display module. BACKGROUND

[0002] LED display screen is used to display various information such as text, graphics, images, animation, video, video signal by the display mode of controlling semiconductor light emitting diode. It integrates microelectronic technology, computer technology, information processing, has the advantages of bright color, wide dynamic range, high brightness, high definition, low working voltage, small power consumption, long life, impact resistance and stable and reliable working.

[0003] LED display screen is spliced by PCB module, the front of PCB module is pasted by a LED lamp pearl, and the definition, picture delicate degree, minimum power consumption of LED display screen are determined by LED lamp pearl. The display effect of traditional RGB LED lamp pearl is not delicate enough, especially the color purity is not high when displaying black and yellow, in addition, RGB needs to be lit simultaneously when displaying white, the power consumption is large, and the color gamut and saturation are poor. UTILITARIAN CONTENT

[0004] The technical problem to be solved by the utility model lies in providing a LED lamp pearl and display module, the power consumption of LED lamp pearl is small and the display color purity is high.

[0005] In order to solve the above problem, the utility model discloses a LED lamp pearl, including base and LED chip, the base is equipped with a plurality of supports, the support includes red light anode pin frame, green light anode pin frame, blue light anode pin frame, yellow light anode pin frame and common cathode pin frame;

[0006] The LED chip is arranged on the support, and the LED chip includes a red light chip, a green light chip, a blue light chip and a yellow light chip;

[0007] Two electrodes of the red light chip are electrically connected with the red light anode pin frame and the common cathode pin frame respectively, two electrodes of the green light chip are electrically connected with the green light anode pin frame and the common cathode pin frame respectively, two electrodes of the blue light chip are electrically connected with the blue light anode pin frame and the common cathode pin frame respectively, and two electrodes of the yellow light chip are electrically connected with the yellow light anode pin frame and the common cathode pin frame respectively.

[0008] As the improvement of the above technical scheme, each support includes a die bonding part and a pin part, the die bonding part is arranged on the front face of the base, the lower end of the die bonding part penetrates through the side wall of the base downward and is bent to form the pin part abutting against the back face of the base, and the LED chip is electrically connected with the die bonding part.

[0009] As the improvement of the above technical scheme, the fixed crystal part of the common cathode pin frame is a cross-shaped structure, and the fixed crystal parts of the red, green, blue and yellow anode pin frames are respectively arranged at the upper left corner, the upper right corner, the lower right corner and the lower left corner of the fixed crystal part of the common cathode pin frame.

[0010] As the improvement of the above technical scheme, the fixed crystal part of the common cathode pin frame comprises a first fixed crystal part, a second fixed crystal part, a third fixed crystal part and a fourth fixed crystal part, the first fixed crystal part is located between the fixed crystal part of the yellow anode pin frame and the fixed crystal part of the red anode pin frame, the second fixed crystal part is located between the fixed crystal part of the red anode pin frame and the fixed crystal part of the green anode pin frame, the third fixed crystal part is located between the fixed crystal part of the green anode pin frame and the fixed crystal part of the blue anode pin frame, and the fourth fixed crystal part is located between the fixed crystal part of the blue anode pin frame and the fixed crystal part of the yellow anode pin frame.

[0011] As the improvement of the above technical scheme, the fixed crystal parts of the red, green, blue and yellow anode pin frames are the same in structure and are centrally symmetrically distributed.

[0012] As the improvement of the above technical scheme, the red, green, blue and yellow chips are respectively arranged on the first, second, third and fourth fixed crystal parts.

[0013] As the improvement of the above technical scheme, the red chip is a vertical red chip, the green chip is a positive green chip, the blue chip is a positive blue chip, and the yellow chip is a positive yellow chip.

[0014] As the improvement of the above technical scheme, one electrode of the red chip is fixed to the fixed crystal part of the common cathode pin frame and is electrically connected with the fixed crystal part of the common cathode pin frame, and the other electrode is electrically connected with the fixed crystal part of the red anode pin frame through a bonding wire;

[0015] The two electrodes of the green chip are respectively electrically connected with the fixed crystal part of the common cathode pin frame and the fixed crystal part of the green anode pin frame through bonding wires;

[0016] The two electrodes of the blue chip are respectively electrically connected with the fixed crystal part of the common cathode pin frame and the fixed crystal part of the blue anode pin frame through bonding wires;

[0017] The two electrodes of the yellow chip are respectively electrically connected with the fixed crystal part of the common cathode pin frame and the fixed crystal part of the yellow anode pin frame through bonding wires.

[0018] As the improvement of the above technical scheme, the base is provided with a bowl cup, and the LED chip is arranged in the bowl cup.

[0019] The bowl cup is provided with encapsulation glue, and the encapsulation glue is arranged in the bowl cup and covers at least the LED chip.

[0020] Correspondingly, the utility model discloses a display module, the display module includes a plurality of above-mentioned LED lamp pearl.

[0021] The utility model discloses, has following beneficial effect:

[0022] The LED lamp pearl provided by the utility model realizes high-purity display of black, yellow and gold through the lighting of red light chips, green light chips, blue light chips and yellow light chips, realizes the separate control and lighting of four color chips of the LED lamp pearl through the setting of the five pin frames, and finally realizes low-power consumption and high-color purity display of the LED lamp pearl. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is the overhead structure schematic diagram of prior art RGB LED lamp pearl;

[0024] Figure 2 It is the overhead structure schematic diagram of LED lamp pearl provided by the utility model embodiment;

[0025] Figure 3 It is the bottom structure schematic diagram of LED lamp pearl provided by the utility model embodiment;

[0026] Figure 4 It is the section structure schematic diagram of LED lamp pearl provided by the utility model embodiment. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the utility model is further described in detail below.

[0028] See Figure 1 , Figure 1The top view structural schematic diagram of the traditional RGB LED lamp bead is shown in FIG. 1, and the support of the traditional RGB LED lamp bead includes a red cathode pin support 11', a green cathode pin support 12', a blue cathode pin support 13' and a common anode pin support 14', the red cathode pin support 11' and the green cathode pin support 12' are arranged on the left side of the common anode pin support 14', the blue cathode pin support 13' is arranged on the upper right corner of the common anode pin support 14', and a red chip 21', a green chip 22' and a blue chip 23' are arranged in a straight line on the common anode pin support 14'. With the packaging structure, the area of the common anode pin support 14' for die bonding is small, the distance between the red chip 21', the green chip 22' and the blue chip 23' is short, which is not conducive to heat dissipation of the lamp bead, and it is difficult to realize high-purity yellow and gold display of the red chip 21', the green chip 22' and the blue chip 23', and in addition, when white color is displayed, the red chip 21', the green chip 22' and the blue chip 23' need to be lit at the same time according to a certain proportion, and the required power is high.

[0029] Referring to Figures 2-4 The utility model provides a kind of LED packaging lamp bead, including base 1 and LED chip 2, base 1 is equipped with multiple supports, and the support includes red anode pin support 11, green anode pin support 12, blue anode pin support 13, yellow anode pin support 14 and common cathode pin support 15;

[0030] LED chip is arranged on support 1, and LED chip 2 includes red chip 21, green chip 22, blue chip 23 and yellow chip 24.

[0031] Among them, the two electrodes of red chip 21 are electrically connected with red anode pin support 11 and common cathode pin support 15 respectively, the two electrodes of green chip 22 are electrically connected with green anode pin support 12 and common cathode pin support 15 respectively, the two electrodes of blue chip 23 are electrically connected with blue anode pin support 13 and common cathode pin support 15 respectively, and the two electrodes of yellow chip 24 are electrically connected with yellow anode pin support 14 and common cathode pin support 15 respectively.

[0032] Compared with the traditional RGB LED lamp bead, the utility model embodiment provides a kind of RGBY LED lamp bead, high-purity display of black, yellow and gold is realized by the lighting of red chip, green chip, blue chip and yellow chip, the separate control and respectively lighting of four color chips of LED lamp bead are realized by the setting of five pin supports, and finally, low-power, high-color purity display of LED lamp bead is realized.

[0033] Specifically, each of the support frames comprises a die-bonding portion 16 and a pin portion 17, the die-bonding portion 16 is arranged on the front surface of the base 1, the lower end of the die-bonding portion 12 penetrates through the side wall of the base 1 downwardly and is bent to form the pin portion 17 abutting against the back surface of the base 1, and the LED chip is electrically connected with the die-bonding portion 16. The pin portion 17 can realize the separate lighting of different chips, and is also beneficial to the subsequent welding.

[0034] In order to better arrange the red light chip, the green light chip, the blue light chip and the yellow light chip, the die-bonding portion of the common cathode pin frame 15 is in a cross-shaped structure, the die-bonding portion of the red light anode pin frame 11, the die-bonding portion of the green light anode pin frame 12, the die-bonding portion of the blue light anode pin frame 13 and the die-bonding portion of the yellow light anode pin frame 14 are respectively arranged at the upper left corner, the upper right corner, the lower right corner and the lower left corner of the die-bonding portion of the common cathode pin frame 15.

[0035] In a preferred embodiment, the die-bonding portion of the common cathode pin frame 15 comprises a first die-bonding portion 151, a second die-bonding portion 152, a third die-bonding portion 153 and a fourth die-bonding portion 154, the first die-bonding portion 151 is located between the die-bonding portion of the yellow light anode pin frame 14 and the die-bonding portion of the red light anode pin frame 11, the second die-bonding portion 152 is located between the die-bonding portion of the red light anode pin frame 11 and the die-bonding portion of the green light anode pin frame 12, the third die-bonding portion 153 is located between the die-bonding portion of the green light anode pin frame 12 and the die-bonding portion of the blue light anode pin frame 13, and the fourth die-bonding portion 154 is located between the die-bonding portion of the blue light anode pin frame 13 and the die-bonding portion of the yellow light anode pin frame 14. It can be understood that the common cathode pin frame 15 is divided into the first die-bonding portion 151, the second die-bonding portion 152, the third die-bonding portion 153 and the fourth die-bonding portion 154 to provide the die-bonding area for the light emitting chips, increase the area of the die-bonding area, and the light emitting chips do not need to be arranged in a smaller die-bonding area, thereby improving the heat dissipation performance.

[0036] In a preferred embodiment, the die-bonding portion of the red light anode pin frame 11, the die-bonding portion of the green light anode pin frame 12, the die-bonding portion of the blue light anode pin frame 13 and the die-bonding portion of the yellow light anode pin frame 14 have the same structure and are centrally symmetrically distributed, thereby improving the preparation efficiency.

[0037] In an embodiment, the red light chip 21, the green light chip 22, the blue light chip 23 and the yellow light chip 24 are respectively arranged on the first die bonding part 151, the second die bonding part 152, the third die bonding part 153 and the fourth die bonding part 154. That is, the red light chip 21, the green light chip 22, the blue light chip 23 and the yellow light chip 24 are respectively arranged on the four corners of the die bonding parts of the common cathode pin frame 15, on the one hand, the distance between the common cathode pin frame 15 and the other four pin frames can be shortened, thereby shortening the length of the bonding wires connecting the LED chips and the corresponding pin frames, on the other hand, the distance between the red light chip 21, the green light chip 22, the blue light chip 23 and the yellow light chip 24 is increased, which can improve the heat dissipation capacity and ensure the reliability of the packaging structure.

[0038] In an embodiment, the red light chip 21 is a vertical red light chip, the green light chip 22 is a normal mounted green light chip, the blue light chip 23 is a normal mounted blue light chip, and the yellow light chip 24 is a normal mounted yellow light chip. Specifically, one electrode of the red light chip 21 is fixed on the die bonding part of the common cathode pin frame 15 and is electrically connected with the die bonding part of the common cathode pin frame 15, and the other electrode is electrically connected with the die bonding part of the red light anode pin frame 11 through a bonding wire. Specifically, the red light chip 21 is fixed on the die bonding part of the common cathode pin frame 15 through silver glue, the red light chip 21 realizes conduction with the die bonding part of the common cathode pin frame 15 through the silver glue, and then is connected with the die bonding part of the red light anode pin frame 11 through a bonding wire and realizes electrical connection with the outside through the pin part of the red light anode pin frame 11, thereby reducing the bonding wires required for conduction of the red light anode pin frame 11 and the common cathode pin frame 15. The two electrodes of the green light chip 22 are respectively electrically connected with the die bonding part of the green light anode pin frame 12 and the die bonding part of the common cathode pin frame 15 through bonding wires. The two electrodes of the blue light chip 23 are respectively electrically connected with the die bonding part of the blue light anode pin frame 13 and the die bonding part of the common cathode pin frame 15 through bonding wires. The two electrodes of the yellow light chip 24 are respectively electrically connected with the die bonding part of the yellow light anode pin frame 14 and the die bonding part of the common cathode pin frame 15 through bonding wires. That is, the common cathode pin frame 15 is the common electrode of the red light chip 21, the green light chip 22, the blue light chip 23 and the yellow light chip 24, and correspondingly, the functional pins of the red light anode pin frame 11, the green light anode pin frame 12, the blue light anode pin frame 13 and the yellow light anode pin frame 14 are the red light anode, the green light anode, the blue light anode and the yellow light anode, so only by controlling the conduction of the red light anode pin frame 11, the green light anode pin frame 12, the blue light anode pin frame 13 and the yellow light anode pin frame 14, the lighting of the red light chip 21, the green light chip 22, the blue light chip 23 and the yellow light chip 24 can be controlled individually.

[0039] In one embodiment, the base 1 is provided with a bowl cup 4, and the LED chip 2 is arranged in the bowl cup 4; the bowl cup 4 is provided with a packaging glue 3, and the packaging glue 3 is arranged in the bowl cup 4 and covers at least the LED chip 2.

[0040] In addition, the utility model also provides a kind of packaging method of LED, for forming the LED packaging structure described above, comprising the following steps:

[0041] (1) a plurality of LED chips are fixed on the common cathode pin frame respectively;

[0042] Specifically, in one embodiment, the red light chip, the green light chip, the blue light chip and the yellow light chip are fixed on the first die bonding part, the second die bonding part, the third die bonding part and the fourth die bonding part respectively, the red light chip is a vertical red light chip, the green light chip is a positive green light chip, the blue light chip is a positive blue light chip, and the yellow light chip is a positive yellow light chip. Among them, the negative electrode of the red light chip is fixed on the first die bonding part by silver glue, and the green light chip, the blue light chip and the yellow light chip are fixed on the second die bonding part, the third die bonding part and the fourth die bonding part respectively by insulating glue.

[0043] (2) two electrodes of a plurality of LED chips are respectively electrically connected with corresponding supports;

[0044] Specifically, in one embodiment, the positive electrode of the red light chip is electrically connected with the red anode pin frame by bonding wire, the negative electrode of the green light chip and the common cathode pin frame are electrically connected by bonding wire, the positive electrode is electrically connected with the green anode pin frame, the negative electrode of the blue light chip and the common cathode pin frame are electrically connected by bonding wire, the positive electrode is electrically connected with the blue anode pin frame, the negative electrode of the yellow light chip and the common cathode pin frame are electrically connected by bonding wire, and the positive electrode is electrically connected with the yellow anode pin frame.

[0045] (3) injecting packaging glue in the bowl cup to obtain LED lamp beads.

[0046] Specifically, the material of the packaging glue can be epoxy packaging glue, silicone packaging glue, polyurethane packaging glue or ultraviolet light curing packaging glue, etc., without specific limitation.

[0047] The above is the preferred embodiment of the utility model, it should be pointed out that, for ordinary skilled person in the art, without departing from the principle of the utility model, can make a number of improvements and refinements, these improvements and refinements also be regarded as the protection scope of the utility model.

Claims

1. An LED lamp bead, characterized in that, It includes a base and an LED chip. The base is provided with multiple supports, including red anode pin supports, green anode pin supports, blue anode pin supports, yellow anode pin supports and common cathode pin supports. The LED chip is disposed on the bracket, and the LED chip includes a red light chip, a green light chip, a blue light chip and a yellow light chip; The two electrodes of the red light chip are electrically connected to the red anode pin frame and the common cathode pin frame, respectively. The two electrodes of the green light chip are electrically connected to the green anode pin frame and the common cathode pin frame, respectively. The two electrodes of the blue light chip are electrically connected to the blue anode pin frame and the common cathode pin frame, respectively. The two electrodes of the yellow light chip are electrically connected to the yellow anode pin frame and the common cathode pin frame, respectively.

2. The LED lamp bead as described in claim 1, characterized in that, Each of the brackets includes a die bonding portion and a lead portion. The die bonding portion is located on the front side of the base. The lower end of the die bonding portion extends downward through the side wall of the base and is bent to form a lead portion that abuts against the back side of the base. The LED chip is electrically connected to the die bonding portion.

3. The LED lamp bead as described in claim 1, characterized in that, The die-bonding section of the common cathode pin holder has a cross-shaped structure. The die-bonding sections of the red anode pin holder, green anode pin holder, blue anode pin holder, and yellow anode pin holder are respectively located at the upper left, upper right, lower right, and lower left corners of the die-bonding section of the common cathode pin holder.

4. The LED lamp bead as described in claim 1, characterized in that, The die-bonding section of the common cathode lead frame includes a first die-bonding section, a second die-bonding section, a third die-bonding section, and a fourth die-bonding section. The first die-bonding section is located between the die-bonding sections of the yellow anode lead frame and the red anode lead frame. The second die-bonding section is located between the die-bonding sections of the red anode lead frame and the green anode lead frame. The third die-bonding section is located between the die-bonding sections of the green anode lead frame and the blue anode lead frame. The fourth die-bonding section is located between the die-bonding sections of the blue anode lead frame and the yellow anode lead frame.

5. The LED lamp bead as described in claim 3, characterized in that, The die-bonding sections of the red anode pin holder, green anode pin holder, blue anode pin holder, and yellow anode pin holder have the same structure and are centrally symmetrically distributed.

6. The LED lamp bead as described in claim 4, characterized in that, The red light chip, green light chip, blue light chip and yellow light chip are respectively disposed on the first die bonding section, the second die bonding section, the third die bonding section and the fourth die bonding section.

7. The LED lamp bead as described in claim 1, characterized in that, The red light chip is a vertical red light chip, the green light chip is a vertically mounted green light chip, the blue light chip is a vertically mounted blue light chip, and the yellow light chip is a vertically mounted yellow light chip.

8. The LED lamp bead as described in claim 7, characterized in that, One electrode of the red light chip is fixed to the die-bonding part of the common cathode pin frame and electrically connected to the die-bonding part of the common cathode pin frame, and the other electrode is electrically connected to the die-bonding part of the red light anode pin frame through a bonding wire. The two electrodes of the green light chip are electrically connected to the die-bonding part of the common cathode lead frame and the die-bonding part of the green anode lead frame via bonding wires, respectively. The two electrodes of the blue light chip are electrically connected to the die-bonding part of the common cathode lead frame and the die-bonding part of the blue light anode lead frame via bonding wires, respectively. The two electrodes of the yellow light chip are electrically connected to the die-bonding part of the common cathode lead frame and the die-bonding part of the yellow light anode lead frame via bonding wires, respectively.

9. The LED lamp bead as described in claim 1, characterized in that, The base is provided with a bowl, and the LED chip is disposed inside the bowl; The bowl is filled with encapsulating adhesive, which is disposed inside the bowl and at least covers the LED chip.

10. A display module, characterized in that, The display module includes a plurality of LED beads as described in any one of claims 1 to 9.

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