Forming die for liquid silica gel coated flexible circuit board

By designing a molding die for liquid silicone coating of flexible circuit boards, and utilizing components such as positioning inserts and top pressing structures, the problem of displacement of flexible circuit boards during liquid silicone coating was solved, thereby improving the molding effect and product quality.

CN224044322UActive Publication Date: 2026-03-27ZHONGSHAN JVTECH SILICONE TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

When liquid silicone is used to coat flexible circuit boards, the flexible circuit boards and circuits are prone to displacement, resulting in poor molding results.

Method used

A molding die for liquid silicone coating of flexible circuit boards was designed, including an upper mold assembly and a lower mold assembly. By using components such as positioning inserts, top pressing structures and insert assemblies, the coated structure is reliably fixed during the molding process and does not shift.

Benefits of technology

It achieves reliable fixation of flexible circuit boards and wires, reduces scrap rate, and improves molding effect and product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of dies, and particularly discloses a forming die for a liquid silica gel coated flexible circuit board. Wherein the upper die assembly comprises an upper die plate and an upper die core; the lower die assembly comprises a lower die plate, a lower die core, an insert assembly arranged on the lower die core, an ejection assembly used for ejecting the insert assembly and a positioning insert arranged on the insert assembly and used for fixing a coated structure. In the forming process, the coated structure does not shift, and the forming effect is good.
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Description

TECHNICAL FIELD

[0001] The utility model relates to mould technical field especially a kind of forming mould of liquid silicone rubber coated flexible circuit board. BACKGROUND

[0002] Liquid silicone rubber mould is a tool for forming liquid silicone rubber, through its accurate cavity design, liquid silicone rubber can be molded into a specific shape, widely used in the production of various products.In recording microphone product, flexible circuit board has the problem of poor waterproof performance.In order to solve this problem, liquid silicone rubber is selected to be coated on the outside of flexible circuit board, and the structure such as circuit and plastic part matched with flexible circuit board is coated together, so as to improve the overall waterproof effect and service life of product.However, since the flexible circuit board and circuit to be coated are relatively soft, when directly coated with liquid silicone rubber, the situation that the structure to be coated is displaced easily occurs, resulting in poor molding effect. SUMMARY

[0003] The utility model aims at at least solving one of the technical problems existing in prior art.Therefore, the utility model provides a kind of forming mould of liquid silicone rubber coated flexible circuit board, and the structure is not displaced in molding process, and molding effect is good.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0005] A kind of forming mould of liquid silicone rubber coated flexible circuit board, comprising:

[0006] Upper die assembly, including upper die plate and upper die kernel;

[0007] Lower die assembly, including lower die plate, lower die kernel, insert assembly arranged on the lower die kernel, ejector assembly for lifting the insert assembly and positioning insert block for fixing the structure to be coated arranged on the insert assembly.

[0008] According to some embodiments of the utility model, the positioning insert block includes a first positioning portion for fixing a plastic part, a second positioning portion for fixing a flexible circuit board, and a third positioning portion for fixing a wire.

[0009] According to some embodiments of the utility model, the first positioning portion includes a first fixing block and a second fixing block arranged towards the direction of the plastic part, and a first fastener for fixing the plastic part, the first fixing block and the second fixing block have a fastening hole matched with the first fastener, and the first fastener is inserted into the fastening hole.

[0010] According to some embodiments of the utility model, the second positioning part includes a third fixed block arranged in the opposite direction of the plastic part, the positioning insert block is provided with a first through slot connected with the third fixed block, the first through slot is matched with the flexible circuit board, and the flexible circuit board is connected with the third fixed block through the first through slot.

[0011] According to some embodiments of the utility model, the third fixed block is provided with a first positioning hole for fastening the positioning insert block and the flexible circuit board.

[0012] According to some embodiments of the utility model, the third positioning part is a second through slot arranged on the positioning insert block and matched with the wire shape.

[0013] According to some embodiments of the utility model, the upper die plate is provided with a pressing structure for pressing the insert assembly.

[0014] According to some embodiments of the utility model, the pressing structure includes a pressing rod arranged on the upper die core and abutting against the insert assembly and a spring arranged above the pressing rod, the top end of the spring abuts against the upper die plate, and the bottom end abuts against the pressing rod.

[0015] According to some embodiments of the utility model, the lower die assembly further includes a side forming structure arranged on one side of the insert assembly, the side forming structure includes a forming seat matched with the insert assembly, an inclined guide column arranged on the upper die core and slidably connected with the forming seat, and a pressing block arranged on the upper die plate and slidably connected with the forming seat.

[0016] According to some embodiments of the utility model, the insert assembly includes a first forming insert for forming a semi-finished product and a second forming insert for forming a finished product, and the positioning insert block is arranged on the second forming insert.

[0017] The utility model has at least the following beneficial effects:

[0018] The insert assembly facilitates the installation of the positioning insert block and the covered structure, the positioning insert block can reliably fix the structures such as the flexible circuit board, the wire and the plastic part to be covered by the liquid silicone during the forming process, the structures do not deviate, the forming effect is good, and the waste rate is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic view of one embodiment of the utility model;

[0020] Figure 2 It is a structural schematic view of one embodiment of the utility model; Figure 1 It is an enlarged view of the mark A in the figure;

[0021] Figure 3For an embodiment of the utility model a positioning insert block's structure schematic Figure 1 ;

[0022] Figure 4 For an embodiment of the utility model a positioning insert block's structure schematic Figure 2 ;

[0023] Figure 5 For an embodiment of the utility model a top pressure structure's structure schematic drawing. DETAILED DESCRIPTION

[0024] The utility model provides the following description of reference drawing to help comprehensively understand various embodiments of the utility model as defined in the claim and its equivalents. The description includes various specific details to help understanding, but these details should be regarded as just exemplary. Therefore, those skilled in the art will realize that various changes and modifications can be made to various embodiments described herein without departing from the scope and spirit of the utility model.

[0025] In the description of the utility model, when referring to the orientation description, such as the orientation or position relationship of the indication of up, down, front, back, left, right, etc. based on the orientation or position relationship shown in the drawing, it is just for the convenience of describing the utility model and simplifying the description, and is not to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it can not be understood as the limitation of the utility model.

[0026] It should be understood that when one element (for example, a first element) is "connected" with another element (for example, a second element), the element can be directly connected with another element, or there can be an intermediate element (for example, a third element) between the element and another element.

[0027] The embodiment of the utility model provides a kind of forming mould of liquid silicone rubber coated flexible circuit board, as shown in Figures 1-5 Including:

[0028] Upper die assembly, including upper die plate 101 and upper die 102;

[0029] Lower die assembly, including lower die plate 103, lower die 104, insert assembly 105 arranged on lower die 104, ejection assembly for lifting insert assembly 105 and positioning insert block 201 for fixing the coated structure arranged on insert assembly 105.

[0030] The insert assembly 105 facilitates positioning of the insert 201 and mounting of the covered structure, and an ejection assembly (not shown in the figure) is actually connected to the four corners of the insert assembly 105 for lifting the insert assembly 105 to facilitate product demolding or replacement of the insert assembly 105; the positioning insert 201 is arranged such that the flexible circuit board 5, the wire, and the plastic part 6 and other structures to be covered by liquid silicone are fixed and reliable during the molding process and do not shift, thereby reducing the waste rate. Since the product in the embodiment is U-shaped, the positioning insert 201 is arranged on the upper side and the lower side of the insert assembly 105; the positioning insert 201 can be fixed on the upper die core 102, the lower die core 104, or the insert assembly 105; and the insert assembly 105 can be provided with multiple ones for molding the same process or different processes.

[0031] In some embodiments, as shown in Figures 2-4 The positioning insert 201 includes a first positioning portion 202 for fixing the plastic part 6, a second positioning portion 203 for fixing the flexible circuit board 5, and a third positioning portion 204 for fixing the wire.

[0032] The first positioning portion 202, the second positioning portion 203, and the third positioning portion 204 can be fixed by screw connection, buckle connection, hole or slot fixing, etc., to respectively fix and position the plastic part 6, the flexible circuit board 5, and the wire, and ensure that the positions of the covered structures in the mold are accurate and correct and will not shift due to the flow pressure of the liquid silicone, thereby ensuring the quality of the molded product.

[0033] Further, as shown in Figures 3-4 The first positioning portion 202 includes first and second fixing blocks 205 and 206 arranged towards the plastic part 6 and first fasteners for fixing the plastic part 6, and the first and second fixing blocks 205 and 206 have fastening holes 207 matched with the first fasteners therein, and the first fasteners are inserted into the fastening holes 207.

[0034] Specifically, the first and second fixing blocks 205 and 206 are arranged towards the plastic part 6 and abut against the plastic part 6, and are fixed with the plastic part 6 by the first fasteners (not shown in the figure) such as screws to provide stable support and firm fixation for the plastic part 6 and ensure that the plastic part 6 will not shift or loosen during the molding process. The fastening holes 207 are used for the first fasteners to be inserted into the first and second fixing blocks 205 and 206 and fastenedly connected with the plastic part 6, and the fastening holes 207 are actually through to the other side of the positioning insert 201 for easy installation; further, the shapes and numbers of the first and second fixing blocks 205 and 206 can be adjusted according to the size and shape of the plastic part 6.

[0035] Still further, as shown in Figures 2-4As shown, the second positioning part 203 includes a third fixed block 208 arranged opposite to the plastic part 6. The positioning insert 201 has a first through slot 209 connected with the third fixed block 208, and the first through slot 209 is matched with the flexible circuit board 5, and the flexible circuit board 5 is connected with the third fixed block 208 through the first through slot 209.

[0036] The flexible circuit board 5 has certain flexibility and thinness, and is simply fixed to cause warping. The flexible circuit board 5 can be well positioned by being inserted into the first through slot 209 to prevent warping, ensure firm fixation, and will not be damaged. Then, the third fixed block 208 is connected to realize fixation, ensure the position fixed during the molding process, and will not be displaced, so as to ensure that the liquid silicone can be uniformly coated on the flexible circuit board 5, and improve the molding quality of the product.

[0037] Further, as shown in the drawings, Figures 2-3 the third fixed block 208 is provided with a first positioning hole 210 for tightly fixing the positioning insert 201 and the flexible circuit board 5.

[0038] Specifically, the flexible circuit board 5 has a hole matched with the first positioning hole 210, and a fastener such as a screw can pass through the first positioning hole 210 to fix the flexible circuit board 5 and the positioning insert 201 on the insert assembly 105, the upper die core 102 or the lower die core 104, and further enhance the connection strength between the flexible circuit board 5 and the insert assembly 105. This matching mode ensures that the flexible circuit board 5 will not be displaced or loose during the molding process, so as to ensure that the liquid silicone can be uniformly coated on the flexible circuit board 5, and improve the molding quality of the product.

[0039] Further, as shown in the drawings, Figure 4 the third positioning part 204 is a second through slot 211 arranged on the positioning insert 201 and matched with the wire shape.

[0040] The wire has certain flexibility and thinness, and can be well positioned by being inserted into the second through slot 211 to ensure that the wire is fixed in position during the molding process and will not be displaced. Further, since the wire is extended to connect other external structures, the insert assembly 105 is provided with a third through slot (not shown in the drawings) in communication with the second through slot 211. Through the cooperation of the second through slot 211 and the third through slot, the extended wire can be placed on the insert assembly 105.

[0041] In some embodiments, as shown in the drawings, Figure 5 the upper die plate 101 is provided with a pressing structure 301 for pressing the insert assembly 105.

[0042] The top pressing structure 301 can apply a stable top pressing force to the insert assembly 105, ensuring that the insert assembly 105 does not float and move during the molding process, reducing the formation of defective products caused by the displacement or loosening of the insert assembly 105, and improving the molding precision and product quality.

[0043] Further, as shown in Figure 5 , the top pressing structure 301 includes a top pressing rod 302 arranged on the upper die core 102 and abutting against the insert assembly 105, and a spring 303 arranged above the top pressing rod 302, with the top end of the spring 303 abutting against the upper die plate 101 and the bottom end of the spring 303 abutting against the top pressing rod 302.

[0044] The top pressing rod 302 directly abuts against the insert assembly 105 by the elastic force of the spring 303, which can ensure accurate transmission of the top pressing force, so that the insert assembly 105 does not float and move during the molding process, improving the molding quality.

[0045] In some embodiments, as shown in Figure 1 , the lower die assembly further includes a side forming structure 401 arranged on one side of the insert assembly 105, the side forming structure 401 including a forming seat 402 cooperating with the insert assembly 105, an inclined guide pillar 403 arranged on the upper die core 102 and slidingly connected with the forming seat 402, and a pressing block 404 arranged on the upper die plate 101 and slidingly connected with the forming seat 402.

[0046] Through the forming seat 402 of the side forming structure 401, the outer side wall structure of the silica gel can be formed, and the forming seat 402 facilitates product demolding and reduces the phenomenon of mold sticking. The sliding connection design of the inclined guide pillar 403 and the pressing block 404 can ensure smooth movement of the forming seat 402 during core pulling.

[0047] In some embodiments, as shown in Figure 1 , the insert assembly 105 includes a first forming insert 107 for forming a semi-finished product and a second forming insert 108 for forming a finished product, and the positioning insert block 201 is arranged on the second forming insert 108.

[0048] To further improve the stability of the structure, the first forming insert 107 first produces a silica gel semi-finished product, which has a groove for placing the covered structure, and can further cooperate with the positioning insert 201 to position the flexible circuit board 5. Further, in this embodiment, the ejection assembly lifts the first forming insert 107 and the second forming insert 108, and the first forming insert 107 and the second forming insert 108 can be removed as a whole. The finished product on the second forming insert 108 can be directly demolded, while the semi-finished product on the first forming insert 107 can be installed and placed with the covered structure and positioned by the positioning insert 201 without demolding the semi-finished product. Then, the assembled first forming insert 107 is placed into the position of the second forming insert 108 for further forming, without the need to set two sets of molds, thereby reducing production costs. Since the first forming insert 107 and the second forming insert 108 are interchangeable, i.e., they are the same, further, the first forming insert 107 can be additionally set for positioning and assembly outside during mold forming, thereby improving production efficiency.

[0049] The terms and words used in the above description and claims are not limited to the literal meaning, but are merely used by the applicant to enable a clear and consistent understanding of the present application. Therefore, it should be apparent to those skilled in the art that the description of various embodiments of the present application is provided merely to illustrate, not to limit, the present application as defined by the appended claims and their equivalents.

Claims

1. A molding die for coating flexible circuit boards with liquid silicone, characterized in that, The application relates to a mould assembly for over-moulding a flexible printed circuit board (5) and a wire (4) on a plastic part (6), comprising: an upper mould assembly, comprising an upper mould plate (101) and an upper mould core (102); a lower mould assembly, comprising a lower mould plate (103), a lower mould core (104), an insert assembly (105) arranged on the lower mould core (104), an ejection assembly for ejecting the insert assembly (105), and a positioning insert (201) arranged on the insert assembly (105) and used for fixing the over-moulded structure.

2. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 1, characterized by: The positioning insert (201) comprises a first positioning part (202) used for fixing the plastic part (6), a second positioning part (203) used for fixing the flexible printed circuit board (5), and a third positioning part (204) used for fixing the wire.

3. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 2, characterized by: The first positioning part (202) comprises first and second fixing blocks (205, 206) arranged towards the plastic part (6), and a first fastener used for fixing the plastic part (6), the first and second fixing blocks (205, 206) being provided with fastening holes (207) matched with the first fastener, and the first fastener being inserted into the fastening holes (207).

4. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 2, characterized by: The second positioning part (203) comprises a third fixing block (208) arranged away from the plastic part (6), the positioning insert (201) being provided with a first through groove (209) connected with the third fixing block (208), the first through groove (209) being matched with the flexible printed circuit board (5), and the flexible printed circuit board (5) being connected with the third fixing block (208) by passing through the first through groove (209).

5. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 4, characterized by: The third fixing block (208) is provided with a first positioning hole (210) used for fastening the positioning insert (201) and the flexible printed circuit board (5).

6. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 2, characterized by: The third positioning part (204) is a second through groove (211) arranged on the positioning insert (201) and matched with the shape of the wire.

7. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 1, characterized by: The upper mould plate (101) is provided with a pressing structure (301) used for pressing the insert assembly (105).

8. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 7, characterized by: The pressing structure (301) comprises a pressing rod (302) arranged on the upper mould core (102) and abutting against the insert assembly (105), and a spring (303) arranged above the pressing rod (302), the top end of the spring (303) abutting against the upper mould plate (101), and the bottom end abutting against the pressing rod (302).

9. The molding die for a liquid silicone rubber-coated flexible circuit board according to claim 1, characterized by: The lower mould assembly further comprises a side forming structure (401) arranged on one side of the insert assembly (105), the side forming structure (401) comprising a forming seat (402) matched with the insert assembly (105), an inclined guide pillar (403) arranged on the upper mould core (102) and slidingly connected with the forming seat (402), and a pressing block (404) arranged on the upper mould plate (101) and slidingly connected with the forming seat (402).

10. The molding die for a liquid silicone rubber-coated flexible circuit board according to any one of claims 1 to 9, characterized in that: The insert assembly (105) comprises a first forming insert (107) used for forming a semi-finished product, and a second forming insert (108) used for forming a finished product, and the positioning insert (201) is arranged on the second forming insert (108).