Material taking device in chip testing process
By combining the limit component with the rotating shaft linkage design and the buffer component, the problem that existing chip testing devices cannot be compatible with chips of different shapes is solved, realizing rapid switching and adaptive buffering, and improving clamping accuracy and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-08
- Publication Date
- 2026-03-27
AI Technical Summary
Existing chip testing and pick-up devices mostly have fixed gripper structures, which cannot be compatible with chips of different shapes. This leads to frequent replacement of the entire gripper assembly, increasing operational complexity and affecting gripping accuracy.
The design incorporates a limit component and a rotating shaft linkage to enable rapid switching between square and curved clamping plates. Combined with an electric slide rail and a buffer component, adaptive buffering is provided through a hinge rod and a return spring to prevent chip damage.
It enables rapid and adaptable gripping of chips of different shapes, reduces operational complexity, improves gripping accuracy and stability, and avoids chip damage.
Smart Images
Figure CN224046456U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor test especially, relate to a chip test process material taking device. BACKGROUND
[0002] Semiconductor test is the key link throughout the whole process of semiconductor chip design, manufacturing and packaging, aiming at verifying the function, performance and reliability of the chip to meet the design requirements through a series of technical means, avoiding the flow of defective products into the market.
[0003] The material taking device in the semiconductor chip test process is a key equipment for automatically picking up, transferring and placing chips, mainly realizing the docking with test machines, sorting machines and other equipment in the chip test link, ensuring that the chips enter the test process efficiently and accurately.
[0004] However, the existing chip test material taking device has a fixed jaw structure design, which can only adapt to a single shape of semiconductor chip, for example, the traditional square clamp plate cannot stably clamp the round chip, and the special round clamp is difficult to be compatible with the square chip, resulting in the need to frequently replace the overall jaw assembly when the equipment faces the test demand of different shaped chips, which not only increases the operation complexity, but also may affect the clamping accuracy due to disassembly error, therefore, the chip test process material taking device is proposed to solve the above problems. UTILITY MODEL CONTENTS
[0005] In order to make up for the above shortcomings, the utility model provides a chip test process material taking device, aiming at improving the problem that the equipment in the prior art needs to frequently replace the overall jaw assembly when facing the test demand of different shaped chips, which not only increases the operation complexity, but also may affect the clamping accuracy due to disassembly error.
[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: a chip test process material taking device, comprising a fixed seat, the top end of the outer wall of the fixed seat is fixedly connected with a mounting plate, the inner side wall of the fixed seat is rotatably connected with a rotating shaft, the inner wall of the rotating shaft is provided with a limiting component, the surface of the rotating shaft is fixedly connected with two groups of electric sliding rails, the inner side wall of the electric sliding rail is slidably connected with a sliding seat, the surface of the sliding seat is provided with a buffer component;
[0007] The limiting component comprises a pull rod, the inner side wall of the pull rod is hinged with a hinge rod a, one end of the hinge rod a away from the pull rod is hinged with a plug-in block, the plug-in block is provided with two groups, and the two groups of plug-in blocks are elastically connected through a limiting spring.
[0008] As a further description of the above technical scheme:
[0009] The buffer assembly includes a connecting plate, two groups of sliding grooves are formed in the inner side wall of the connecting plate, a sliding block is elastically connected to the inner wall of the connecting plate sliding groove through a reset spring, a hinge rod b is hinged to the surface of the sliding block, a guide rod penetrates and is slidingly connected to the inner side wall of the sliding block, a telescopic rod is fixedly connected to the surface of the connecting plate, and a square clamping plate is fixedly connected to the end of the telescopic rod away from the connecting plate.
[0010] As a further description of the above technical solution:
[0011] The end of the telescopic rod away from the connecting plate is further provided with an arc-shaped clamping plate, and the end of the hinge rod b away from the sliding block is further hinged with an arc-shaped clamping plate.
[0012] As a further description of the above technical solution:
[0013] The pull rod penetrates and is slidingly connected to the inner wall of the one side of the rotating shaft, and the plug penetrates and is slidingly connected to the outer side wall of the rotating shaft.
[0014] As a further description of the above technical solution:
[0015] The inner side wall of the fixing seat is provided with a plug-in groove, and the outer wall of the plug is inserted into the inner wall of the plug-in groove.
[0016] As a further description of the above technical solution:
[0017] One end of the reset spring is fixedly connected to the inner wall of the connecting plate sliding groove, the other end of the reset spring is fixedly connected to the outer wall of the sliding block, and the connecting plate is fixedly connected to the outer side wall of the sliding seat.
[0018] As a further description of the above technical solution:
[0019] The sliding block is slidingly connected to the inner wall of the connecting plate sliding groove, and the guide rod is fixedly connected to the inner wall of the connecting plate sliding groove.
[0020] As a further description of the above technical solution:
[0021] The end of the hinge rod b away from the sliding block is hinged to the inner side wall of the square clamping plate.
[0022] The utility model has the advantages of the following beneficial effects:
[0023] 1、The utility model discloses a linkage design of limiting component and rotating shaft realizes the quick switching of square clamping plate and arc-shaped clamping plate: the rotating shaft can be unlocked by pulling the pull rod outward, and the required clamping jaw direction can be rotated without the aid of tools, thereby solving the cumbersome problem of manual adjustment of the traditional device.
[0024] 2、The utility model discloses, two groups of synchronous drive of electric slide rail's cooperation buffer subassembly, make the clamping plate when clamping chip, reset spring and telescopic rod damping liquid form double buffering, can avoid rigid contact damage chip, can realize self -adaptation buffering through the transmission of articulated rod b. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 The utility model proposes a whole three -dimensional structure schematic diagram of taking material device in chip test process;
[0026] Figure 2 The utility model proposes a rotating shaft partial section structure schematic diagram of taking material device in chip test process;
[0027] Figure 3 The utility model proposes a connecting plate partial section structure schematic diagram of taking material device in chip test process; Figure 2 The utility model proposes a connecting plate partial section structure schematic diagram of taking material device in chip test process;
[0028] Figure 4 The utility model proposes a connecting plate partial section structure schematic diagram of taking material device in chip test process.
[0029] LEGEND:
[0030] 1, fixed seat, 2, mounting plate, 3, rotating shaft, 4, limiting component, 41, pull rod, 42, articulated rod a, 43, insert block, 44, limit spring, 5, electric slide rail, 6, sliding seat, 7, buffer subassembly, 71, connecting plate, 72, reset spring, 73, sliding block, 74, guide rod, 75, articulated rod b, 76, telescopic rod, 8, square clamping plate, 9, arc clamping plate. DETAILED DESCRIPTION
[0031] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the range of protection of the utility model.
[0032] REFERENCE Figures 1-3This utility model provides an embodiment of a chip testing process material handling device, including a fixed base 1. A mounting plate 2 is fixedly connected to the top of the outer wall of the fixed base 1. The surface of the mounting plate 2 has multiple sets of mounting holes, which, together with bolt holes, can be fixed to the robot used in semiconductor processing. By rotating the robot at multiple angles, the entire device can be moved to perform the gripping and feeding operation of the semiconductor chip. A rotating shaft 3 is rotatably connected to the inner side wall of the fixed base 1. A limit component 4 is provided on the inner wall of the rotating shaft 3. Two sets of upper and lower electric slide rails 5 are fixedly connected to the surface of the rotating shaft 3. A sliding seat 6 is slidably connected to the inner side wall of the electric slide rail 5. The electric slide rail 5 is existing technology. The two sets of sliding seats 6 can slide on the inner wall of the electric slide rail 5, thereby driving the buffer component 7 and the square clamping plate 8 to contact the semiconductor chip, thereby gripping and clamping the semiconductor chip. The surface of the sliding seat 6 is provided with a buffer component 7.
[0033] Reference Figure 2 and Figure 3 The limiting component 4 includes a pull rod 41, with a hinge rod a42 hinged to the inner side wall of the pull rod 41. A plug 43 is hinged to the end of the hinge rod a42 away from the pull rod 41. The pull rod 41 passes through and is slidably connected to the inner wall of one side of the rotating shaft 3. When the pull rod 41 is pulled outward, the two sets of hinge rods a42 pull the corresponding plug 43 closer together, thus disengaging it from the slot inside the fixing seat 1, facilitating the rotation of the mounting plate 2. The plug 43 passes through and is slidably connected to the outer side wall of the rotating shaft 3. The inner side wall of 1 has a slot, and the outer wall of the insert 43 is inserted into the inner wall of the slot. The insertion between the two can fix the position of the rotating shaft 3 after it is rotated on the inner wall of the fixed seat 1, so that the square clamp 8 and the arc clamp 9 can be switched, and the clamp can be adjusted according to the shape of the semiconductor chip. There are two sets of insert 43, and the two sets of insert 43 are elastically connected by a limiting spring 44. The function of the limiting spring 44 is to automatically reset the position of the two sets of insert 43 after they are brought together.
[0034] Reference Figure 1 and Figure 4The buffer assembly 7 comprises a connecting plate 71 fixedly connected with the outer side wall of the sliding seat 6, two groups of sliding grooves are formed in the inner side wall of the connecting plate 71, a sliding block 73 is elastically connected with the inner wall of the connecting plate 71 sliding groove through a reset spring 72, one end of the reset spring 72 is fixedly connected with the inner wall of the connecting plate 71 sliding groove, the other end of the reset spring 72 is fixedly connected with the outer wall of the sliding block 73, the reset spring 72 is used for automatically resetting the position of the sliding block 73 after movement, a hinged rod b 75 is hinged to the surface of the sliding block 73, one end of the hinged rod b 75 away from the sliding block 73 is hinged to the inner side wall of the square clamping plate 8, after the square clamping plate 8 contacts the semiconductor chip, the hinged rod b 75 is used for pushing the sliding block 73 to move on the inner wall of the connecting plate 71, and the reset spring 72 is elastically compressed, so that direct steel contact is avoided, and damage to the semiconductor chip is avoided, a guide rod 74 is penetratingly and slidingly connected with the inner side wall of the sliding block 73, the sliding block 73 is slidingly connected with the inner wall of the connecting plate 71 sliding groove, and the guide rod 74 is fixedly connected with the inner wall of the connecting plate 71 sliding groove, the guide rod 74 is used for guiding the movement position of the sliding block 73, the surface of the connecting plate 71 is fixedly connected with a telescopic rod 76, one end of the telescopic rod 76 away from the connecting plate 71 is fixedly connected with the square clamping plate 8, when the square clamping plate 8 contacts the chip, when the hinged rod b 75 pushes the sliding block 73 to move, four groups of telescopic rods 76 are automatically telescopic, and the inside of the telescopic rod 76 is provided with damping liquid.
[0035] Working principle: when it is necessary to switch the square clamping plate 8 and the arc-shaped clamping plate 9 according to the shape of the chip, the pull rod 41 is pulled outwards, the hinged rod a 42 hinged to the inner side wall of the pull rod 41 acts, pulls the two groups of plug blocks 43 to overcome the elastic force of the limiting springs 44 and approach each other, the plug blocks 43 are separated from the insertion grooves in the inner side of the fixed seat 1, at this time, the rotating shaft 3 can freely rotate on the inner wall of the fixed seat 1, drives the electric sliding rail 5, the sliding seat 6 and the clamping plate assembly to rotate, realizes the switching of the square clamping plate 8 and the arc-shaped clamping plate 9, after the rotating shaft 3 is rotated to the appropriate angle, the pull rod 41 is loosened, the limiting springs 44 push the two groups of plug blocks 43 to reset and reinsert the insertion grooves in the inner side of the fixed seat 1, the plug blocks 43 and the insertion grooves are tightly inserted, the rotating shaft 3 is fixed at the current position, the stability of the clamping operation is ensured.
[0036] The electric slide rail 5 drives the sliding seat 6 to slide inwards, and drives the square clamping plate 8 to approach the chip, when the square clamping plate 8 contacts the chip, the continued pressure is pushed to the sliding block 73 in the sliding groove of the connecting plate 71 through the articulated rod b75, the compression reset spring 72 is compressed, the elastic deformation of the reset spring 72 absorbs part of the pressure, and the damping liquid in the telescopic rod 76 provides a buffer resistance, so that the contact force of the square clamping plate 8 and the chip gradually increases, avoiding damage to the chip caused by rigid contact, after the material is taken out, the electric slide rail 5 drives the sliding seat 6 to slide outwards, the reset spring 72 pushes the sliding block 73 to reset, and drives the square clamping plate 8 to return to the initial position.
[0037] Embodiment two:
[0038] With reference to Figure 1 And Figure 2 The telescopic rod 76 is provided with an arc-shaped clamping plate 9 at one end away from the connecting plate 71, and the articulated rod b75 is hinged with an arc-shaped clamping plate 9 at one end away from the sliding block 73, so that the arc-shaped clamping plate 9 can be switched for a circular semiconductor chip, so that the applicability is stronger.
[0039] Working principle: for a circular chip, rotate the arc-shaped clamping plate 9 to the working position through the rotating shaft 3 and fix it. The arc surface of the arc-shaped clamping plate 9 is matched with the profile of the circular chip, under the drive of the electric slide rail 5, the arc-shaped clamping plate 9 embraces the circular chip from both sides, and the buffer effect of the buffer assembly 7 ensures that the chip is evenly stressed during clamping, prevents the chip from being damaged due to excessive local stress, and realizes the wide applicability of different shaped chips.
[0040] Finally, it should be pointed out that: the above only for the preferred embodiments of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, should be included in the protection scope of the present application.
Claims
1. A pick-up device for use in a chip testing process, comprising a holder (1), characterized in that: The top of the outer wall of the fixed seat (1) is fixedly connected with a mounting plate (2), the inner side wall of the fixed seat (1) is rotatably connected with a rotating shaft (3), the inner wall of the rotating shaft (3) is provided with a limiting assembly (4), the surface of the rotating shaft (3) is fixedly connected with two groups of electric sliding rails (5) arranged above and below, the inner side wall of the electric sliding rail (5) is slidably connected with a sliding seat (6), and the surface of the sliding seat (6) is provided with a buffer assembly (7). The limiting assembly (4) comprises a pull rod (41), the inner side wall of the pull rod (41) is hingedly connected with a hinge rod a (42), one end of the hinge rod a (42) away from the pull rod (41) is hingedly connected with a plug-in block (43), and the plug-in block (43) is provided with two groups.
2. The material taking device in a chip testing process according to claim 1, wherein: The buffer assembly (7) comprises a connecting plate (71), two groups of sliding grooves are formed in the inner side wall of the connecting plate (71), the inner wall of the sliding groove of the connecting plate (71) is elastically connected with a sliding block (73) through a reset spring (72), the surface of the sliding block (73) is hingedly connected with a hinge rod b (75), the inner side wall of the sliding block (73) penetrates and is slidably connected with a guide rod (74), the surface of the connecting plate (71) is fixedly connected with a telescopic rod (76), one end of the telescopic rod (76) away from the connecting plate (71) is fixedly connected with a square clamping plate (8).
3. The material taking device in a chip testing process according to claim 2, characterized in that: One end of the telescopic rod (76) away from the connecting plate (71) is also provided with an arc-shaped clamping plate (9), and one end of the hinge rod b (75) away from the sliding block (73) is also hingedly connected with an arc-shaped clamping plate (9).
4. The material taking device in a chip testing process according to claim 1, wherein: The pull rod (41) penetrates and is slidably connected to the inner wall of one side of the rotating shaft (3), and the plug-in block (43) penetrates and is slidably connected to the outer side wall of the rotating shaft (3).
5. The material taking device in a chip testing process according to claim 1, wherein: The inner side wall of the fixed seat (1) is provided with a plug-in groove, and the outer wall of the plug-in block (43) is inserted into the inner wall of the plug-in groove.
6. The material taking device in a chip testing process according to claim 2, characterized in that: One end of the reset spring (72) is fixedly connected to the inner wall of the sliding groove of the connecting plate (71), and the other end of the reset spring (72) is fixedly connected to the outer wall of the sliding block (73).
7. The material taking device in a chip testing process according to claim 2, characterized in that: The sliding block (73) is slidably connected to the inner wall of the sliding groove of the connecting plate (71), and the guide rod (74) is fixedly connected to the inner wall of the sliding groove of the connecting plate (71).
8. The material taking device in a chip testing process according to claim 2, characterized in that: One end of the hinge rod b (75) away from the sliding block (73) is hingedly connected to the inner side wall of the square clamping plate (8).