Information acquisition board, battery pack and electric equipment
By using a separate structure design for the substrate and the battery cell unit board, the development cost and cycle issues caused by the diversity of equipment specifications are solved, achieving high adaptability and long lifespan of the information acquisition board and reducing maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-03-27
AI Technical Summary
In existing technologies, due to the varying sizes of equipment and the inconsistent number of internal components, information acquisition boards need to be designed in multiple specifications, increasing development costs and time.
The information acquisition board design includes a base plate and multiple cell unit boards. The base plate is equipped with a mounting part, and the cell unit boards can be installed on different mounting parts to accommodate different numbers of unit components. The split structure isolates impact deformation and reduces the probability of damage.
This reduces equipment development costs and time, improves the compatibility and lifespan of information acquisition boards, and reduces maintenance costs.
Smart Images

Figure CN224053189U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit boards, in particular to an information acquisition board, a battery pack and an electrical equipment. BACKGROUND
[0002] The information acquisition board is mainly used for information monitoring of multiple unit components in the device, such as a BMS slave board. The BMS slave board (Battery Management System Slave Board) is a key component in the hierarchical architecture of the battery management system, and usually works cooperatively with the master control board. It is mainly responsible for real-time monitoring, data acquisition and execution of control instructions for multiple single batteries or multiple battery modules in the battery pack.
[0003] In the related art, the sizes of devices are different, and the number of unit components to be monitored inside the device is also different. However, the number of unit components matched by each information acquisition board is constant. In order to meet devices of various specifications, the information acquisition board needs to be designed into multiple specifications, which increases the development cost and development cycle of the device. CONTENT OF THE UTILITY MODEL
[0004] The present application provides an information acquisition board, a battery pack and an electrical equipment, which can reduce the development cost and development cycle of the device.
[0005] In one aspect, the present application provides an information acquisition board, comprising a substrate and a plurality of battery cell unit boards, the substrate is provided with a first interface, a second interface and a plurality of mounting portions, the second interface is connected with the plurality of mounting portions, the plurality of mounting portions are connected with the first interface, the first interface is used for connecting with a control module, and the plurality of second interfaces are used for connecting with a plurality of unit components; at least part of the plurality of battery cell unit boards are selected and installed on different mounting portions and connected with the mounting portions, and the battery cell unit boards are used for information acquisition and processing.
[0006] Advantages: the information acquisition board comprises a substrate and a plurality of battery cell unit boards, and the substrate is provided with a plurality of mounting portions, so as to adapt to different numbers of battery cell unit boards. Therefore, the number of battery cell unit boards can be selected according to the number of unit components inside the device, and the adaptation and compatibility of the information acquisition board to different unit components are improved, so that it is not necessary to design information acquisition boards of multiple specifications, thereby reducing the development cost and development cycle of the device.
[0007] Meanwhile, since the battery cell unit boards are installed on the substrate through the mounting portions, and the substrate is installed inside the device, when the device is subjected to impact and the like, the substrate will be deformed. Since the battery cell unit boards are in a split structure with the substrate, a part of the impact deformation can be isolated, so as to reduce the probability of damage of the battery cell unit boards, thereby improving the service life of the information acquisition board and reducing the maintenance cost.
[0008] In an optional embodiment, the mounting portion is provided with a hollow portion, and the hollow portion is arranged to overlap the cell unit plate.
[0009] In an optional embodiment, the plate body of the cell unit plate is a four-layer single-sided plate or a double-layer double-sided plate; and / or, the base plate is a double-layer single-sided plate.
[0010] In an optional embodiment, a plurality of the mounting portions are arranged at intervals along the first direction of the base plate.
[0011] In an optional embodiment, the cell unit plate is provided with a first connecting portion and a second connecting portion at two ends along a second direction, the second direction intersects the first direction; the mounting portion is provided with a third connecting portion and a fourth connecting portion at two ends along the second direction, the first connecting portion is connected to the third connecting portion, and the second connecting portion is connected to the fourth connecting portion.
[0012] The second interface includes a first connecting end and a second connecting end, the first connecting end is arranged at an end of the base plate along the second direction, close to an end of the third connecting portion, the third connecting portion on each mounting portion is connected to the first connecting end; the second connecting end is arranged at an end of the base plate along the second direction, close to an end of the fourth connecting portion, the fourth connecting portion on each mounting portion is connected to the second connecting end.
[0013] In an optional embodiment, the second interface further includes a third connecting end and a fourth connecting end, the third connecting end and the fourth connecting end are arranged at two ends of the base plate along the first direction.
[0014] The third connecting portion and the fourth connecting portion on the mounting portion close to the third connecting end along the first direction are connected to the third connecting end.
[0015] The third connecting portion and the fourth connecting portion on the mounting portion close to the fourth connecting end along the first direction are connected to the fourth connecting end.
[0016] In an optional embodiment, a communication isolation transformer is arranged between any two adjacent mounting portions; and / or, a communication isolation transformer is arranged at each end of the base plate along the first direction.
[0017] In an alternative embodiment, the first connecting portion and the second connecting portion are each a plurality of spaced-apart stamping holes; and / or, the first connecting end, the second connecting end, the third connecting end and the fourth connecting end are each a gold finger pad; and / or, the first interface is a daisy chain connector; and / or, the substrate is provided with a plurality of fixing holes; and / or, the cell unit board is rectangular in shape, and the corners of the cell unit board are bevelled and rounded; and / or, the cell unit board is an AFE standardised board.
[0018] In a second aspect, the application also provides a battery pack comprising a plurality of battery cells, at least one information acquisition board of the first aspect, and at least one FPC connecting board, one end of the FPC connecting board being configured to connect with at least part of the plurality of battery cells, and the other end of the FPC connecting board being configured to connect with the second interface on the information acquisition board.
[0019] Beneficial effects: because the battery pack comprises the information acquisition board of any one of the embodiments of the first aspect, it has the same technical effects as the information acquisition board, which will not be described here.
[0020] In a third aspect, the application also provides a power consuming device comprising the battery pack of the second aspect, or the information acquisition board of any one of the embodiments of the first aspect.
[0021] Beneficial effects: because the power consuming device comprises the information acquisition board of any one of the embodiments of the first aspect, or the battery pack of the second aspect, it has the same technical effects as the information acquisition board, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the specific embodiments or the related art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the related art description. Obviously, the drawings described below are some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creative effort.
[0023] Figure 1 FIG. 1 is a structural schematic diagram of an information acquisition card according to an embodiment of the application;
[0024] Figure 2 FIG. 2 is a structural schematic diagram of a substrate in an information acquisition card according to an embodiment of the application;
[0025] Figure 3 FIG. 3 is a structural schematic diagram of a cell unit board in an information acquisition card according to an embodiment of the application;
[0026] Figure 4A structure schematic diagram of a substrate in an information acquisition card according to an embodiment of the present application;
[0027] Figure 5 A structure schematic diagram of another information acquisition card according to an embodiment of the present application;
[0028] Figure 6 A structure schematic diagram of still another information acquisition card according to an embodiment of the present application;
[0029] Figure 7 A structure schematic diagram of still another information acquisition card according to an embodiment of the present application;
[0030] Figure 8 A structure schematic diagram of still another information acquisition card according to an embodiment of the present application.
[0031] Explanation of reference signs:
[0032] X, first direction; Y, second direction;
[0033] 1, substrate; 2, cell unit board; 3, FPC connecting board;
[0034] 11, first interface; 12, second interface; 13, mounting portion; 14, communication isolation transformer; 15, fixing hole;
[0035] 121, first connecting end; 122, second connecting end; 123, third connecting end; 124, fourth connecting end;
[0036] 21, first connecting portion; 22, second connecting portion;
[0037] 131, hollow portion; 132, third connecting portion; 133, fourth connecting portion. DETAILED DESCRIPTION
[0038] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below in a clear and complete manner with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0039] In the related art, the information acquisition board is mainly used for information monitoring of multiple unit components in a device, such as a BMS slave board. The BMS slave board (Battery Management System Slave Board) is a key component in the hierarchical architecture of a battery management system, and usually works cooperatively with a master control board, and is mainly responsible for real-time monitoring, data acquisition and execution of control instructions of multiple single batteries or multiple battery modules in a battery pack.
[0040] However, due to the different sizes of the devices, the number of unit components inside the devices is also different, and the number of unit components matched by each information acquisition board is constant. In order to meet various devices of different specifications, the information acquisition board needs to be designed into multiple specifications, which increases the development cost and development cycle of the device.
[0041] Therefore, in order to reduce the development cost and development cycle of the device, the application provides an information acquisition board, a battery pack and a power consumption device.
[0042] The embodiments of the application will be described below in conjunction with Figures 1 to 8 The embodiments of the application will be described below in conjunction with
[0043] According to the embodiments of the application, in one aspect, an information acquisition board is provided, as shown in the drawings, comprising a substrate 1 and a plurality of battery cell unit boards 2. Specifically, the battery cell unit board 2 can be an AFE (Analog Front End, analog front end) standardized board, or other modules capable of data acquisition and processing. The specific scheme is as follows. Figure 1 As shown in the drawings, the substrate 1 is provided with a first interface 11, a second interface 12 and a plurality of mounting portions 13. The second interface 12 is connected to the plurality of mounting portions 13, and the plurality of mounting portions 13 are connected to the first interface 11, i.e. the second interface is connected to the mounting portion 13 through the pre-embedded circuit inside the substrate 1, and the mounting portion 13 is connected to the first interface 11 through the pre-embedded circuit inside the substrate 1. The first interface 11 is used to connect with a control module, which can refer to a master unit. The first interface 11 can also be connected with other information acquisition boards. Specifically, the first interface 11 is a daisy chain connector, which can realize the gating of the battery cell unit board 2. The plurality of second interfaces 12 are used to connect with a plurality of unit components through a FPC connecting plate 3 (Flexible Printed Circuit, flexible printed circuit board). Of course, a wire harness can also be used for connection.
[0044] Figure 1 As shown in the drawings, the substrate 1 is provided with a first interface 11, a second interface 12 and a plurality of mounting portions 13. The second interface 12 is connected to the plurality of mounting portions 13, and the plurality of mounting portions 13 are connected to the first interface 11, i.e. the second interface is connected to the mounting portion 13 through the pre-embedded circuit inside the substrate 1, and the mounting portion 13 is connected to the first interface 11 through the pre-embedded circuit inside the substrate 1. The first interface 11 is used to connect with a control module, which can refer to a master unit. The first interface 11 can also be connected with other information acquisition boards. Specifically, the first interface 11 is a daisy chain connector, which can realize the gating of the battery cell unit board 2. The plurality of second interfaces 12 are used to connect with a plurality of unit components through a FPC connecting plate 3 (Flexible Printed Circuit, flexible printed circuit board). Of course, a wire harness can also be used for connection.
[0045] As shown in the drawings, the substrate 1 is provided with a first interface 11, a second interface 12 and a plurality of mounting portions 13. The second interface 12 is connected to the plurality of mounting portions 13, and the plurality of mounting portions 13 are connected to the first interface 11, i.e. the second interface is connected to the mounting portion 13 through the pre-embedded circuit inside the substrate 1, and the mounting portion 13 is connected to the first interface 11 through the pre-embedded circuit inside the substrate 1. The first interface 11 is used to connect with a control module, which can refer to a master unit. The first interface 11 can also be connected with other information acquisition boards. Specifically, the first interface 11 is a daisy chain connector, which can realize the gating of the battery cell unit board 2. The plurality of second interfaces 12 are used to connect with a plurality of unit components through a FPC connecting plate 3 (Flexible Printed Circuit, flexible printed circuit board). Of course, a wire harness can also be used for connection. Figure 3 Figure 1 As shown in the drawings, the substrate 1 is provided with a first interface 11, a second interface 12 and a plurality of mounting portions 13. The second interface 12 is connected to the plurality of mounting portions 13, and the plurality of mounting portions 13 are connected to the first interface 11, i.e. the second interface is connected to the mounting portion 13 through the pre-embedded circuit inside the substrate 1, and the mounting portion 13 is connected to the first interface 11 through the pre-embedded circuit inside the substrate 1. The first interface 11 is used to connect with a control module, which can refer to a master unit. The first interface 11 can also be connected with other information acquisition boards. Specifically, the first interface 11 is a daisy chain connector, which can realize the gating of the battery cell unit board 2. The plurality of second interfaces 12 are used to connect with a plurality of unit components through a FPC connecting plate 3 (Flexible Printed Circuit, flexible printed circuit board). Of course, a wire harness can also be used for connection. Figure 5 Figure 6 As shown, a plurality of battery cell unit plates 2 can also be installed, wherein the number of battery cell unit plates 2 is determined according to the number of unit components that the substrate 1 needs to monitor.
[0046] For example, one AFE standardized plate is 18 string AFE chips, which can simultaneously monitor the information of no more than 18 battery monomers. If a BMS has three mounting portions 13 on the plate body (equivalent to the substrate 1) of the plate, and the battery pack has 30 battery monomers, then two AFE standardized plates need to be installed on the substrate 1. If the battery pack has 15 battery monomers, then only one AFE standardized plate needs to be installed on the substrate 1.
[0047] For example, as shown in the drawings, Figure 1 As shown, the substrate 1 is uniformly provided with a plurality of fixing holes 15 for connecting and fixing the substrate 1 with other components. The battery cell unit plate 2 is rectangular, and the corners of the battery cell unit plate 2 are bevelled and smoothed.
[0048] In this embodiment, as shown in the drawings, Figure 1 As shown, the information acquisition plate includes the substrate 1 and a plurality of battery cell unit plates 2. The substrate 1 is provided with a plurality of mounting portions 13, so as to be able to adapt to different numbers of battery cell unit plates 2. Therefore, the number of battery cell unit plates 2 can be selected according to the number of unit components inside the equipment, so as to improve the adaptation and compatibility of the information acquisition plate to different unit components, thereby reducing the development cost and development cycle of the equipment.
[0049] At the same time, since the battery cell unit plate 2 is installed on the substrate 1 through the mounting portion 13, and the substrate 1 is installed inside the equipment, when the equipment is subjected to impact and the like, the substrate 1 will be deformed. Since the battery cell unit plate 2 is a split structure with the substrate 1, it can isolate a part of the impact deformation, thereby reducing the probability of damage to the battery cell unit plate 2, improving the service life of the information acquisition plate, and reducing the maintenance cost.
[0050] In one embodiment, as shown in the drawings, Figure 4 As shown, the mounting portion 13 is provided with a hollow portion 131, and the hollow portion 131 is arranged in overlap with the battery cell unit plate 2. Specifically, the shape of the hollow portion 131 can be set according to the circuit arrangement inside the mounting portion 13, and can be any shape such as a square hole, a rectangular hole, a circular hole, etc. The number of hollow portions 131 at one mounting portion 13 can be one or a plurality.
[0051] Specifically, as shown in the drawings, Figure 1 As shown, the battery cell unit plate 2 can be arranged on the hollow portion 131, or at least partially embedded in the hollow portion 131 (in this state, the cross section of the hollow portion 131 is the same as that of the battery cell unit plate 2).
[0052] In this embodiment, the setting of the hollow part 131 can reduce the weight of the substrate 1, thereby realizing the weight reduction of the whole device.
[0053] In a specific embodiment, the plate body of the battery cell unit plate 2 is a four-layer single-sided plate or a double-layer double-sided plate; and / or, the substrate 1 is a double-layer single-sided plate or a double-layer double-sided plate; specifically, when the battery cell unit plate 2 is a four-layer single-sided plate, various types of substrates 1 can be used; and the double-layer double-sided plate needs to be used together with the hollow part 131 on the substrate 1 due to the fact that both sides thereof can be arranged with electronic elements, thereby reducing the overall thickness of the information acquisition plate.
[0054] It should be explained that the four-layer single-sided plate refers to a plate body with four layers of circuits arranged inside, and only one side of the plate body can be arranged with electronic elements; and the double-layer double-sided plate refers to a plate body with two layers of circuits arranged inside, and both sides of the plate body can be arranged with electronic elements.
[0055] Especially, when the substrate 1 is a double-layer single-sided plate and the battery cell unit plate 2 is a double-layer double-sided plate, the cost of the information acquisition plate can be greatly reduced.
[0056] Specifically, the BMS slave plate with three AFE battery cells arranged thereon is also provided with a four-layer single-sided plate, and due to the complex circuits to be arranged, the size of the plate body is 270mm×130mm, and the unit price of the four-layer single-sided plate is about 650 yuan / m 2 , and the cost thereof is (270×130×650) / 1000000=22.8 yuan.
[0057] If the present scheme is adopted, due to the high integration of the AFE standardized plate, the size of the substrate 1 is 270mm×105mm, and the unit price of the double-layer single-sided plate is about 200 yuan / m 2 , and the cost thereof is (270×105×200) / 1000000=10.545 yuan; and the price difference between one information acquisition plate and another is 22.8-10.545=12.255 yuan.
[0058] In one embodiment, as shown in Figure 4 , a plurality of mounting parts 13 are arranged at intervals along the first direction X of the substrate 1, and specifically, the plurality of mounting parts 13 are arranged at intervals along the first direction X of the substrate 1, thereby being able to adapt to the second interface 12 of the circumferential edge of the substrate 1, thereby simplifying the internal circuit arrangement of the substrate 1.
[0059] In a specific embodiment, as shown in Figure 3 , the battery cell unit plate 2 is provided with a first connecting part 21 and a second connecting part 22 at two ends thereof along the second direction Y, and the second direction Y intersects with the first direction X, and is preferably arranged perpendicularly; specifically, the first connecting part 21 and the second connecting part 22 are both provided with a plurality of stamping welding holes arranged at intervals.
[0060] As shown in Figure 4 The mounting portion 13 is provided with a third connecting portion 132 and a fourth connecting portion 133 at both ends along the second direction Y, the first connecting portion 21 is connected with the third connecting portion 132, and the second connecting portion 22 is connected with the fourth connecting portion 133; that is, the mounting portion 13 is provided with the third connecting portion 132 at the position corresponding to the first connecting portion 21, and is provided with the fourth connecting portion 133 at the position corresponding to the second connecting portion 22.
[0061] Specifically, the third connecting portion 132 and the fourth connecting portion 133 are both a plurality of pads arranged at intervals, the plurality of pads are one-to-one corresponding to the stamp welding holes, and can be realized by a stamp hole process secondary SMT (Surface Mount Technology, surface mounting technology). Specifically, the stamp welding hole and the pad are welded by Hotbar welding (i.e. pulse hot bar welding or Hotbar welding).
[0062] As shown in Figure 2 and Figure 7 The second interface 12 includes a first connecting end 121 and a second connecting end 122, the first connecting end 121 is arranged at the end of the substrate 1 along the second direction Y, close to the end of the third connecting portion 132, and the third connecting portion 132 on each mounting portion 13 is connected with the first connecting end 121.
[0063] The second connecting end 122 is arranged at the end of the substrate 1 along the second direction Y, close to the end of the fourth connecting portion 133, and the fourth connecting portion 133 on each mounting portion 13 is connected with the second connecting end 122.
[0064] In a specific use process, the third connecting portion 132 in the mounting portion 13 bears a part of the series in one mounting portion 13, and the fourth connecting portion 133 bears the remaining series, such as an 18-series AFE chip, the third connecting portion 132 can transmit 9-series data, and the fourth connecting portion 133 can transmit the remaining 9-series data.
[0065] In this embodiment, by connecting the first connecting end 121 with the third connecting portion 132 in each mounting portion 13, and connecting the second connecting end with the fourth connecting portion 133 in each mounting portion 13, the circuit arrangement in the substrate 1 can be simplified.
[0066] In a specific embodiment, as shown in Figure 2 and Figure 8 The second interface 12 further includes a third connecting end 123 and a fourth connecting end 124, the third connecting end 123 and the fourth connecting end 124 are arranged at both ends of the substrate 1 along the first direction X.
[0067] The third connecting portion 132 and the fourth connecting portion 133 on the mounting portion 13 close to the third connecting end 123 are connected with the third connecting end 123 along the first direction X; the third connecting portion 132 and the fourth connecting portion 133 on the mounting portion 13 close to the fourth connecting end 124 are connected with the fourth connecting end 124 along the first direction X.
[0068] Specifically, the first connecting end 121, the second connecting end 122, the third connecting end 123 and the fourth connecting end 124 are all gold finger pads.
[0069] In the specific use process, the two FPC connecting plates 3 are connected with the third connecting end 123 and the fourth connecting end 124 respectively, which can realize the use of the cell unit plate 2 at both ends of the substrate 1 along the first direction X, and in combination with the first connecting end 121 and the second connecting end 122, different layout devices can be applied.
[0070] In some embodiments not shown, the second interface 12 has only one, which is connected with all the mounting portions 13.
[0071] In an embodiment, a communication isolation transformer 14 is arranged between any two adjacent mounting portions 13; and / or, a communication isolation transformer 14 is arranged at both ends of the substrate 1 along the first direction X, specifically, the communication isolation transformer 14 improves the stability and reliability of the communication system, thereby ensuring the operation reliability of the cell unit plate 2 at each mounting portion 13.
[0072] According to the embodiments of the present application, in a second aspect, a battery pack is provided, which comprises a plurality of battery monomers, at least one FPC connecting plate 3 and at least one information acquisition plate in any one of the embodiments of the first aspect, one end of the FPC connecting plate 3 is used to be connected with at least part of the plurality of battery monomers, and the other end of the FPC connecting plate 3 is used to be connected with the second interface 12 on the information acquisition plate.
[0073] Specifically, the battery pack can be a battery pack of a new energy carrying tool (such as a new energy vehicle, a drone, etc.).
[0074] In this embodiment, since the battery pack comprises the information acquisition plate in any one of the embodiments of the first aspect, it has the same technical effects as the information acquisition plate, and will not be described here.
[0075] According to the embodiments of the present application, in a third aspect, a power utilization equipment is provided, which comprises the battery pack in the second aspect or the information acquisition plate in any one of the embodiments of the first aspect.
[0076] Specifically, the power utilization equipment can be a battery pack of a new energy carrying tool (such as a new energy vehicle, a drone, etc.), or a storage container, etc.
[0077] In this embodiment, since the electrical equipment comprises the information collection board in any one of the embodiments of the first aspect, or the battery pack in the second aspect, has the same technical effects as the information collection board, and will not be described here.
[0078] Although the embodiments of the present application are described in conjunction with the accompanying drawings, various modifications and changes can be suggested by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and changes are intended to fall within the scope of the appended claims.
Claims
1. An information collection board, characterized by, The application relates to a substrate (1) provided with a first interface (11), a second interface (12) and a plurality of mounting portions (13), the second interface (12) is connected with the plurality of mounting portions (13), the plurality of mounting portions (13) are all connected with the first interface (11), the first interface (11) is used for being connected with a control module, and the plurality of second interfaces (12) are used for being connected with a plurality of unit components. A plurality of battery cell unit plates (2) are selected and mounted on different mounting portions (13) and connected with the mounting portions (13), and the battery cell unit plates (2) are used for information acquisition and processing. The mounting portion (13) is provided with a hollow portion (131) which is arranged in overlap with the battery cell unit plate (2).
2. The information collection pad of claim 1, wherein, The plate body of the battery cell unit plate (2) is a four-layer single-sided plate or a double-layer double-sided plate.
3. The information collection pad of claim 2, wherein, The substrate (1) is a double-layer single-sided plate. The plurality of mounting portions (13) are arranged at intervals along a first direction (X) of the substrate (1).
4. The information collection sheet according to any one of claims 1 to 3, characterized by First and second connecting portions (21) and (22) are arranged at two ends of the battery cell unit plate (2) along a second direction (Y) which intersects the first direction (X).
5. The information collection pad of claim 4, wherein, Third and fourth connecting portions (132) and (133) are arranged at two ends of the mounting portion (13) along the second direction (Y), the first connecting portion (21) is connected with the third connecting portion (132), and the second connecting portion (22) is connected with the fourth connecting portion (133). The second interface (12) comprises first and second connecting ends (121) and (122), the first connecting end (121) is arranged at an end of the substrate (1) along the second direction (Y) and close to an end of the third connecting portion (132), and the third connecting portion (132) on each mounting portion (13) is connected with the first connecting end (121). The second connecting end (122) is arranged at an end of the substrate (1) along the second direction (Y) and close to an end of the fourth connecting portion (133), and the fourth connecting portion (133) on each mounting portion (13) is connected with the second connecting end (122). The second interface (12) further comprises third and fourth connecting ends (123) and (124) which are arranged at two ends of the substrate (1) along the first direction (X).
6. The information collection pad of claim 5, wherein, The third and fourth connecting portions (132) and (133) on the mounting portion (13) close to the third connecting end (123) along the first direction (X) are connected with the third connecting end (123). The third and fourth connecting portions (132) and (133) on the mounting portion (13) close to the fourth connecting end (124) along the first direction (X) are connected with the fourth connecting end (124). 7. The information collection pad of claim 4, wherein, A communication isolation transformer (14) is arranged between any two adjacent mounting portions (13); And / or, the base plate (1) is provided with a communication isolation transformer (14) at both ends along the first direction (X).
8. The information collection pad of claim 6, wherein, The first connecting portion (21) and the second connecting portion (22) are both a plurality of spaced stamp welding holes; The first connecting end (121), the second connecting end (122), the third connecting end (123) and the fourth connecting end (124) are all gold finger pads; And / or, the first interface (11) is a daisy chain plug-in; And / or, the base plate (1) is uniformly provided with a plurality of fixing holes (15); And / or, the battery cell unit plate (2) is rectangular, and the corners of the battery cell unit plate (2) are bevelled and smoothed; And / or, the battery cell unit plate (2) is an AFE standardized plate.
9. A battery pack, characterized by, It comprises: a plurality of battery monomers; at least one information acquisition plate according to any one of claims 1-8; at least one FPC connecting plate (3), one end of the FPC connecting plate (3) is used for connecting at least part of the plurality of battery monomers, and the other end of the FPC connecting plate (3) is used for connecting the second interface (12) on the information acquisition plate.
10. An electric device, characterized by It comprises: the battery pack according to claim 9, or the information acquisition plate according to any one of claims 1-8.