Substrate structure of lead frame

Abstract

The utility model discloses a substrate structure of a lead frame, which comprises at least two lead frame base bands and a frame, the frame is positioned on the periphery of all the lead frame base bands, and the outer edge of each lead frame base band is respectively connected with the inner edge of the frame through a connecting part. The two sides of the frame are respectively provided with a hanging hole used for being connected with a hanging tool in a hanging mode and a plate body positioning hole used for being aligned with a film body positioning hole of a dry film for positioning. According to the utility model, the structure is novel, the design is reasonable, the problem that the positioning deviation is large when films are coated twice can be solved through the design of the independent frame and the positioning holes, and the hanging holes on the frame also facilitate the hanging connection of the substrate and a hanger, so that the electroplating operation of the substrate is facilitated. In addition, a plurality of full-page lead frame base bands are adopted, so that the number of electroplated products can be increased, and the production efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of lead frame, more particularly to a kind of lead frame's substrate structure. BACKGROUND

[0002] Lead frame as the chip carrier of integrated circuit is a kind of key structural member that realizes the electrical connection of chip internal circuit lead-out end and external lead by means of bonding material, forms electrical circuit, it plays the bridge role of connection with external wire, and most of semiconductor integrated blocks need to use lead frame, it is important basic material in electronic information industry.However, in the existing lead frame electroplating product, most products can only be carried out single side FULL NIPDAU electroplating or AG electroplating, so that the existing lead frame material belt layout design cannot solve the problem of large positioning deviation when the above two films exist, which causes the problem of great influence on electroplating precision. SUMMARY

[0003] The utility model aims at overcoming the above-mentioned defects in the prior art, providing a kind of lead frame's substrate structure that the problem of large positioning deviation when the above two films exist can be solved by adopting separate frame plus hanging hole and plate body positioning hole design.

[0004] To achieve the above object, the utility model provides a kind of lead frame's substrate structure, including at least two lead frame base strips and frame, the frame is located at the periphery of all lead frame base strips, and the outer edge of each lead frame base strip is connected with the inner edge of frame by connecting portion respectively, and the both sides of frame are respectively provided with the hanging hole for being hung with hanger and the plate body positioning hole for the alignment positioning of dry film body.

[0005] As preferred, the lead frame base strip and frame are etched from a copper substrate by etching process.

[0006] As preferred, the lead frame base strips are arranged in parallel, and a gap is arranged between the two adjacent lead frame base strips.

[0007] As preferred, the connecting portion is arranged at the outer edge of the left and right sides of each lead frame base strip.

[0008] As preferred, a first metal plating layer is electroplated on the electroplating area of the first surface of each lead frame base strip, and a second metal plating layer is electroplated on the electroplating area of the second surface of each lead frame base strip.

[0009] As preferred, the first metal plating layer includes copper plating layer and silver plating layer, and the copper plating layer is located between the lead frame base strip and silver plating layer.

[0010] Preferably, the second metal plating layer comprises a nickel-palladium-gold layer.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] 1、 the utility model discloses novel structure, reasonable in design is equipped with at least two lead frame baseband and frame, and the hanging hole and the plate body positioning hole are set respectively on both sides of the frame, and its can solve the problem of big positioning deviation that appears when the film is positioned twice through the design of separate frame and positioning hole, in addition, the hanging hole on the frame also facilitates the baseplate and the hanger to be hung, and the baseplate is convenient for electroplating operation.

[0013] 2、 the utility model discloses whole edition multiple lead frame baseband, compared with the traditional single lead frame baseband single electroplating, it can increase the quantity of electroplating products, and greatly improves production efficiency.

[0014] 3、 the frame of the application is needed to be separated from the lead frame baseband in the subsequent processing of the lead frame, and the damage in the positioning and electroplating of the baseplate only occurs on the frame, and does not affect the lead frame baseband, thereby improving the production quality of products. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 It is the structural schematic diagram of the lead frame substrate provided by the utility model embodiment;

[0017] Figure 2 It is Figure 1 the enlarged view of the part A in

[0018] Figure 3 It is the actual photograph of the lead frame substrate provided by the utility model embodiment;

[0019] Figure 4 It is the combined positioning schematic diagram of the lead frame substrate and dry film provided by the utility model embodiment;

[0020] Figure 5 It is the electroplating schematic diagram of the first surface of the single lead frame provided by the utility model embodiment;

[0021] Figure 6 It is the electroplating schematic diagram of the second surface of the single lead frame provided by the utility model embodiment. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] Please refer to Figure 1 and Figure 3 The embodiments of the present application provide a substrate structure of a lead frame, which comprises at least two lead frame substrate strips 1 and a frame 2. The various components of the embodiments will be described in detail below with reference to the drawings.

[0024] In the actual manufacture, the lead frame substrate strip 1 and the frame 2 can be etched from a copper substrate by an etching process.

[0025] As shown in Figure 1 and Figure 2 , all the lead frame substrate strips 1 are arranged in parallel, and a gap is arranged between the two adjacent lead frame substrate strips 1. The frame 2 is located at the periphery of all the lead frame substrate strips 1, and the outer edges of each lead frame substrate strip 1 are connected to the inner edges of the frame 2 through the connecting portions 5 respectively.

[0026] Preferably, the connecting portions 5 can be arranged at the left and right outer edges of each lead frame substrate strip 1.

[0027] As shown in Figure 1 , the frame 2 is provided with a hanging hole 3 on each side for hanging with a hanger and a plate positioning hole 4 for aligning and positioning the film body positioning hole of the dry film.

[0028] It should be noted that the hanger and the dry film (also known as mask film) are devices commonly used in electroplating and film loading, and the present patent does not involve the structural improvement of the hanger and the dry film.

[0029] As shown in Figure 4 , during processing, the substrate can be placed between two dry films 10, and the plate positioning hole 4 on the frame 2 can be aligned and positioned with the film body positioning hole on the dry film 10 through the positioning needle 11.

[0030] As shown in Figure 5 , the first surface of each lead frame substrate strip 1 can be electroplated with a first metal plating layer 6 in the electroplated area. Preferably, the first metal plating layer 6 can be arranged as a copper plating layer + a silver plating layer, and the copper plating layer is located between the lead frame substrate strip and the silver plating layer.

[0031] AsFigure 6 As shown in the drawings, the second surface of each lead frame base strip 1 can also be plated with a second metal plating layer 7 on the plating area. Preferably, the second metal plating layer 7 can be a nickel-palladium-gold layer.

[0032] Of course, the two metal plating layers can also be plated with other metals according to actual needs, and are not limited to the embodiments.

[0033] In summary, the utility model has novel structure and reasonable design, and can solve the problem of large positioning deviation during the previous two times of film positioning through the design of separate frames and positioning holes. The hanging holes on the frame also facilitate the hanging of the substrate and the hanger, and facilitate the electroplating operation of the substrate. In addition, the utility model adopts a whole plate with multiple lead frame base strips, which can increase the number of electroplated products and greatly improve the production efficiency.

[0034] The above embodiments are the preferred embodiments of the utility model, but the embodiments of the utility model are not limited to the above embodiments, and any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the utility model should be equivalent replacement methods, and are all included in the protection scope of the utility model.

Claims

1. A base plate structure of a lead frame, characterized by: The lead frame base strip and the frame are etched from a copper substrate.

2. The substrate structure of claim 1, wherein: The lead frame base strips are arranged in parallel and are separated by a gap.

3. The substrate structure of claim 1, wherein: The connecting part is arranged on the left and right outer edges of each lead frame base strip.

4. The substrate structure of claim 1, wherein: The first metal plating layer includes a copper plating layer and a silver plating layer, and the copper plating layer is arranged between the lead frame base strip and the silver plating layer.

5. The substrate structure of any one of claims 1 to 4, wherein: The second metal plating layer includes a nickel-palladium-gold layer.

6. The substrate structure of claim 5, wherein: ​ 7. The substrate structure of claim 5, wherein: ​

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