Lead frame resistant to stacking inclination

Abstract

The utility model discloses a lead frame resistant to stacking inclination, and belongs to the technical field of lead frames. Comprising a frame main body on which a plurality of chip mounting units are arranged in an array; the chip mounting unit comprises a slide holder and a pin structure, and the slide holder is connected with the frame main body through the pin structure; the pin structure is formed by integrally connecting an inner pin and an outer pin, and the outer pin is arranged on the frame main body; the inner pin comprises an inclined connecting section extending from the outer pin to the slide holder, and a linear supporting section vertically extending from the tail end of the inclined connecting section to the slide holder; when the frame main bodies are stacked in a multi-layer stacking mode, the upper surface of the lower-layer slide holder and the lower end of the upper-layer linear supporting section form vertical bearing fit, the lower-layer inclined connecting section and the upper-layer outer pins form transverse limiting fit, stacking stability is achieved through composite contact constraint in the vertical direction and the horizontal direction, and it is ensured that stacking is not inclined; and the situation that the position of the vacuum suction nozzle needs to be frequently adjusted when a packaging mold manufacturer grabs is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of lead frame, concretely relates to a lead frame of anti -stacking inclination. BACKGROUND

[0002] As the core carrier of semiconductor package, lead frame bears multiple functions such as chip mounting, electrical connection and mechanical support, and the traditional lead frame is usually made of metal sheet by stamping or etching process, and its structure includes frame body and multiple chip mounting units distributed on it. Each chip mounting unit is composed of a carrier platform (for fixing a chip) and a pin structure (connecting the carrier platform and the frame body), and the electrical conduction between the chip and the external circuit is realized through the pin structure.

[0003] However, with the development of packaging technology towards high density and thinness, lead frames need to be stacked in multiple layers during production and transportation to improve efficiency, and most of the current lead frames have structural design defects, which are prone to tilting or misplacement during stacking, specifically as follows:

[0004] The pin structure of the current lead frame is connected to the carrier platform by simple bending, which lacks effective multidirectional support, and when multiple frames are stacked, the pin structure is prone to deformation under pressure, resulting in the accumulation of stacking deviation with each layer, and eventually causing overall tilting.

[0005] Once the lead frame is tilted after stacking, it will cause the subsequent packaging factory to frequently adjust the position of the vacuum suction nozzle during vacuum suction, affecting production efficiency. UTILITY MODEL CONTENTS

[0006] The utility model discloses to the above-mentioned problems existing in the prior art, propose a kind of air purifier filter element structure of filter screen convenient to assemble and disassemble.

[0007] The utility model discloses the following technical solutions can be realized:

[0008] A kind of lead frame of anti -stacking inclination, comprising:

[0009] Frame body, which is arranged with multiple chip mounting units in array;

[0010] The chip mounting unit includes a carrier platform and a pin structure, and the carrier platform is connected to the frame body by the pin structure;

[0011] The pin structure is composed of an inner pin and an outer pin, wherein

[0012] The outer pin is arranged on the frame body;

[0013] The inner pin comprises an inclined connecting section extending from the outer pin to the slide stage, and a straight supporting section vertically extending from the end of the inclined connecting section to the slide stage;

[0014] When the frame bodies are stacked in a multi-layer stacking manner, the upper surface of the slide stage of the lower layer forms a vertical supporting fit with the lower end of the straight supporting section of the upper layer, and the inclined connecting section of the lower layer forms a horizontal limiting fit with the outer pin of the upper layer, so that the stacking stability is realized through the composite contact in the vertical direction and the horizontal direction.

[0015] As a further improvement of the utility model, the included angle between the inclined connecting section and the outer pin is between 120°-140°.

[0016] As a further improvement of the utility model, the thickness of the inclined connecting section is 0.6-0.8 times the thickness of the outer pin.

[0017] As a further improvement of the utility model, the slide stage is provided with the pin structure on both sides in the width direction, wherein the slide stage is connected with the pin structure on one side, and the slide stage forms a spaced cut-off with the pin structure on the other side.

[0018] As a further improvement of the utility model, the end surface of the slide stage spaced from the pin structure is a side packaging surface, and the bottom surface of the slide stage for mounting a chip is a bottom packaging surface, wherein,

[0019] The side packaging surface is provided with a double-step anti-seepage structure and a transition groove, and the double-step anti-seepage structure and the transition groove form a water vapor walking path.

[0020] The bottom packaging surface is provided with a waterproof groove, and the waterproof groove is located close to the side packaging surface.

[0021] As a further improvement of the utility model, the double-step anti-seepage structure comprises a first step surface and a second step surface, and the recess depth of the first step surface is greater than that of the second step surface.

[0022] As a further improvement of the utility model, the first step surface is provided with a first step surface, and the recess depth of the first step surface is greater than that of the second step surface.

[0023] As a further improvement of the utility model, the first step surface is provided with a first step surface, and the recess depth of the first step surface is greater than that of the second step surface.

[0024] As a further improvement of the utility model, the first step surface and the second step surface are transitioned through a first arc surface provided by the outer convex.

[0025] As a further improvement of this utility model, the transition groove and the first stepped surface are transitioned by a second arc surface that is convexly arranged.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. When the frame body is stacked in multiple layers, the upper surface of the lower layer stage can make close contact with the lower end of the straight support section of the upper layer inner pin, forming an effective vertical support. At the same time, the inclined connecting section of the lower layer and the outer pin of the upper layer also form a lateral limiting fit. Through the combined action of the vertical support fit and the lateral limiting fit, the stacking offset problem is effectively prevented, the offset accumulated layer by layer is reduced, and good balance and stability are maintained even in high-density stacking. This avoids the need for packaging mold manufacturers to frequently adjust the position of the vacuum nozzle when gripping.

[0028] 2. The angle between the inclined connection section and the outer pin is between 120° and 140°, and the thickness of the inclined connection section is 0.6-0.8 times the thickness of the outer pin. This makes the lead frames of adjacent layers more flat and tightly fitted between the inclined connection sections, the outer pins, and the stage during stacking. This optimized contact method effectively reduces gaps or misalignments caused by structural mismatch. At the same time, the lateral limiting effect in the horizontal direction is strengthened, thereby effectively limiting the relative movement between adjacent frames and further reducing the risk of tilting of the overall stacked structure.

[0029] 3. By using the double-step anti-seepage structure and transition groove design on the packaging surface of the substrate stage, the water vapor travel path is extended. On the one hand, this improves the ability to block water vapor after glue injection, and on the other hand, it also enhances the glue locking force, thereby ensuring a better sealing effect.

[0030] 4. When processing the first step surface, since there is a distance between the extension line of the inner end face of the first step 1 and the waterproof groove, the stress generated during processing will not be directly transmitted to the location of the waterproof groove. This design effectively isolates the connection between the initial processing stress and the waterproof groove, reducing the risk of deformation of the waterproof groove.

[0031] 5. The second stepped surface is a secondary grooved process based on the first stepped surface. Its processing depth is shallower, so compared with the first stepped surface, it applies less pressure during processing, further reducing the possibility of affecting the waterproof groove.

[0032] 6. The extension line of the inner end face of the second step surface is set collinearly with the central axis of the waterproof groove, so that the pressure transmitted to the waterproof groove is evenly distributed along the central axis to the left and right, avoiding local deformation caused by stress concentration. Attached Figure Description

[0033] Figure 1 is the structural schematic diagram of the lead frame of the anti-stacking and tilting of the utility model;

[0034] Figure 2 is the structural schematic diagram of the Figure 1 side view of the utility model;

[0035] Figure 3 is the structural schematic diagram of the slide glass platform, inner lead and outer lead of the utility model;

[0036] Figure 4 is the structural schematic diagram of the Figure 3 the partial enlarged view of A in the utility model;

[0037] Figure 5 is the stacking schematic diagram of the slide glass platform, inner lead and outer lead when the plurality of lead frames of the utility model are stacked.

[0038] In the figure, 100, frame body; 110, inner lead; 111, inclined connecting section; 112, straight line supporting section; 120, outer lead;

[0039] 200, slide glass platform; 210, interval break; 220, side packaging surface; 221, first step surface; 222, second step surface; 223, transition groove; 224, first arc surface; 225, second arc surface; 230, bottom packaging surface; 231, waterproof groove. DETAILED DESCRIPTION

[0040] The following is the specific embodiment of the utility model and further describes the technical method of the utility model in combination with the drawings, but the utility model is not limited to these embodiments.

[0041] As shown in Figures 1-5 the utility model provides a kind of lead frame of anti-stacking and tilting, comprising:

[0042] frame body 100, which is arranged with multiple chip mounting units, chip mounting unit includes slide glass platform 200 and lead structure, slide glass platform 200 is connected with frame body 100 by lead structure;

[0043] lead structure is integrally connected by inner lead 110 and outer lead 120, wherein,

[0044] outer lead 120 is arranged on frame body 100;

[0045] inner lead 110 includes the inclined connecting section 111 extending from outer lead 120 to slide glass platform 200 direction, and the straight line supporting section 112 vertically extending to slide glass platform 200 from the end of inclined connecting section 111;

[0046] When the improved frame body 100 is stacked in multiple layers, the upper surface of the lower slide 200 can be in close contact with the lower end of the straight support section 112 of the upper inner lead 110, forming an effective vertical support, and the inclined connecting section 111 of the lower layer and the outer lead 120 of the upper layer also form a transverse limiting fit.

[0047] In this way, through the combined contact constraint in the vertical and horizontal directions, the stability and anti-inclination ability of the overall stack are greatly improved.

[0048] It should be noted that in the prior art, the lead frame is inclined when stacked, and as the number of stacked layers increases, the stacking offset accumulates layer by layer, causing the overall structure to tilt, which affects the production efficiency of subsequent packaging manufacturers when vacuum suction is performed.

[0049] Compared with the prior art, the lead frame provided by the embodiment enhances the overall stability and anti-inclination performance of the lead frame when stacked in multiple layers by specifically designing the structure of the inner lead 110 and introducing the combination of the inclined connecting section 111 and the straight support section 112.

[0050] Specifically, the vertical support fit and the transverse limiting fit between the upper and lower lead frames work together to effectively prevent stacking offset and reduce the accumulated offset layer by layer, ensuring that the balance and stability are maintained even in high-density stacking, thereby avoiding the risk of overall tilting.

[0051] Therefore, subsequent packaging manufacturers do not need to frequently adjust the position of the vacuum suction nozzle when vacuum suction is performed, and the entire process is automated without human intervention, thereby improving production efficiency.

[0052] Preferably, the angle between the inclined connecting section 111 and the outer lead 120 is between 120° and 140°, and the thickness of the inclined connecting section 111 is 0.6-0.8 times the thickness of the outer lead 120. The thickness ratio in combination with the angle between the inclined connecting section 111 and the outer lead 120 enables the adjacent two layers of lead frames to be more flat and closely fitted between the inclined connecting sections 111, the outer leads 120, and the slide 200, which effectively reduces the gap or misalignment problem caused by structural mismatch.

[0053] In addition, due to the flat and close fit between the inclined connecting section 111 and the outer lead 120, the horizontal transverse limiting effect is enhanced during the stacking process, thereby effectively limiting the relative movement between the adjacent two layers of frames, which not only reduces the accumulated offset layer by layer, but also further reduces the risk of tilting of the overall stacked structure.

[0054] The flat contact fit and the reduced offset work together to make the stacked lead frame more stable as a whole, which is particularly suitable for high-density stacking scenarios and can significantly improve the reliability during production, transportation and use.

[0055] Preferably, the slide 200 is provided with a pin structure on both sides in the width direction, wherein the slide 200 is connected with the pin structure on one side, and the slide 200 and the pin structure on the other side form a spacing break 210, and the end face where the spacing break 210 is located is used for packaging.

[0056] Specifically, the end face of the slide 200 separated from the pin structure is a side packaging face 220, and the bottom face of the slide 200 for mounting the chip is a bottom packaging face 230, wherein,

[0057] The side packaging face 220 is provided with a double-step anti-seepage structure and a transition groove 223, and the double-step anti-seepage structure and the transition groove 223 form a water vapor walking path.

[0058] The bottom packaging face is provided with a waterproof groove 231, and the waterproof groove 231 is located close to the side packaging face 220.

[0059] In general, through the design of the double-step anti-seepage structure and the transition groove 223, the water vapor walking path is extended, which on the one hand improves the ability to block water vapor after glue injection, and on the other hand enhances the glue locking force, thereby ensuring better sealing effect.

[0060] In addition, the waterproof groove 231 on the bottom packaging face 230 further improves the waterproof and moisture-proof performance of the entire packaging structure, providing more reliable protection for the semiconductor chip.

[0061] These improvements work together to make the lead frame still maintain excellent performance in the face of harsh environmental conditions, and are very suitable for application in semiconductor devices with high packaging requirements.

[0062] Specifically, the double-step anti-seepage structure includes a first step face 221 and a second step face 222, and the recess depth of the first step face 221 is greater than that of the second step face 222, wherein,

[0063] The extension line of the inner end face of the first step face 221 is spaced apart from the waterproof groove 231;

[0064] The extension line of the inner end face of the second step face 222 is arranged in line with the center axis of the waterproof groove 231.

[0065] It should be noted that the stress generated during the processing of the stepped surface is transmitted to the position where the waterproof groove 231 is located. In order to prevent the waterproof groove 231 from being deformed due to pressure, in the embodiment, the first stepped surface 221 is processed first, and then the second stepped surface 222 is processed.

[0066] In the processing of the first stepped surface 221, since there is a distance between the extension line of the inner end surface of the first stepped surface 221 and the waterproof groove 231, the stress generated during processing is not directly transmitted to the position where the waterproof groove 231 is located. Such a design effectively isolates the connection between the initial processing stress and the waterproof groove 231, reducing the risk of deformation of the waterproof groove 231.

[0067] The second stepped surface 222 is processed based on the first stepped surface 221, and the processing depth is relatively shallow. Therefore, compared with the first stepped surface 221, the pressure applied during processing is smaller, further reducing the possibility of affecting the waterproof groove 231.

[0068] Thus, the pressure on the waterproof groove 231 during processing is reduced, and the deformation of the waterproof groove 231 due to pressure is reduced. The extension line of the inner end surface of the second stepped surface 222 is arranged in line with the center axis of the waterproof groove 231, so that the pressure transmitted to the waterproof groove 231 is evenly distributed along the center axis, avoiding local deformation caused by stress concentration.

[0069] In particular, due to the arrangement of the extension line of the inner end surface of the second stepped surface 222 in line with the center axis of the waterproof groove 231, even if there is a small amount of processing stress, it will be evenly distributed along the center axis of the waterproof groove 231, thereby avoiding the deformation of the waterproof groove 231 caused by local stress concentration.

[0070] Further, the first arc surface 224 is arranged between the first stepped surface 221 and the second stepped surface 222, the second arc surface 225 is arranged between the transition groove 223 and the first stepped surface 221, and the first arc surface 224 and the second arc surface 225 are arranged in an outwardly convex manner. The arrangement of the first arc surface 224 and the second arc surface 225 further prolongs the path of the water vapor and forms a stronger locking force.

[0071] The technical means disclosed by the utility model scheme is not limited to the technical means disclosed by the above technical means, and also includes technical solutions composed of any combination of the above technical features. The above is the specific implementation manner of the utility model, and it should be pointed out that for ordinary technical personnel in the technical field, without departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements are also considered to be within the protection scope of the utility model.

[0072] It should be noted that all directional indications (such as upper, lower, left, right, front, rear, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications will also change accordingly.

[0073] In addition, the descriptions such as "first", "second", "one" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. The terms "connection", "fixation" and the like should be understood in a broad sense, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0074] The technical solutions of various embodiments of the present application can be combined with each other, but must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0075] The specific embodiments described herein are merely illustrative of the present application. Those skilled in the art of the present application can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but will not deviate from the spirit of the present application or exceed the scope defined by the appended claims.

Claims

1. A lead frame resistant to stacking tilt, characterized by, The utility model relates to a chip mounting frame structure, including: a frame body is arranged with multiple chip mounting units in array; the chip mounting unit includes a slide and a pin structure, and the slide is connected with the frame body through the pin structure; the pin structure is integrally connected by an inner pin and an outer pin, wherein, the outer pin is arranged on the frame body; the inner pin includes an inclined connecting section extending from the outer pin to the slide and a straight supporting section vertically extending from the end of the inclined connecting section to the slide; when the frame body is stacked in a multi-layer stacking manner, the upper surface of the slide of the lower layer and the lower end of the straight supporting section of the upper layer form a vertical supporting fit, and the inclined connecting section of the lower layer and the outer pin of the upper layer form a horizontal limiting fit, and the stacking stability is realized through the composite contact of the vertical direction and the horizontal direction.

2. The anti-stacking, sloped lead frame of claim 1, wherein, The included angle between the inclined connecting section and the outer pin is between 120 DEG and 140 DEG.

3. The anti-stacking, sloped lead frame of claim 1, wherein, The thickness of the inclined connecting section is 0.6-0.8 times the thickness of the outer pin.

4. The anti-stacking, sloped lead frame of claim 1, wherein, Both sides of the slide along the width direction are provided with the pin structure, wherein the slide is connected with the pin structure on one side, and the slide and the pin structure on the other side form a spaced break.

5. The anti-stacking, sloped lead frame of claim 4, wherein, The end surface of the slide and the pin structure is a side packaging surface, and the bottom surface of the slide for mounting chips is a bottom packaging surface, wherein, the side packaging surface is provided with a double-step anti-seepage structure and a transition groove, and the double-step anti-seepage structure and the transition groove form a water vapor walking path; the bottom packaging surface is provided with a waterproof groove, and the position of the waterproof groove is close to the side packaging surface.

6. A leadframe of claim 5, wherein, The double-step anti-seepage structure includes a first step surface and a second step surface, and the recess depth of the first step surface is greater than that of the second step surface.

7. A leadframe of claim 6, wherein, The extension line of the inner end surface of the first step surface is away from the waterproof groove.

8. The anti-stack slanted leadframe of claim 7, wherein, The extension line of the inner end surface of the second step surface is arranged in line with the central axis of the waterproof groove.

9. The anti-stack slanted leadframe of claim 6, wherein, The first step surface and the second step surface are transitioned through the first arc surface arranged outwardly.

10. The anti-stacking, sloped lead frame of claim 6, wherein, The transition groove and the first step surface are transitioned through the second arc surface arranged outwardly.

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