Glue bottle assembly for semiconductor equipment

Abstract

The utility model relates to the field of semiconductor manufacturing, and provides a glue bottle assembly for semiconductor equipment, which comprises a glue bottle, a device table, a stand column arranged on the device table, a connecting rod, a sealing assembly, a glue pipe and a breather pipe, the glue pipe and the breather pipe are arranged on the sealing assembly, one end of the connecting rod is arranged on the stand column, and the other end of the connecting rod is arranged on the breather pipe. The connecting rod can ascend and descend along the stand column to adjust the height, the sealing assembly is arranged at the other end of the connecting rod and comprises a sealing cover and a sealing gasket, the sealing gasket is attached to the lower portion of the sealing cover, and during installation, the sealing gasket covers a bottle opening of the glue bottle. The bottle cap does not need to be customized according to the size of the glue bottle, the cost is low, and the equipment delivery period is greatly shortened.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a plastic bottle assembly for semiconductor equipment. Background Technology

[0002] In semiconductor wafer spin coaters, photoresist needs to be drawn from a bottle onto a pipeline. The bottle portion requires a cap that is screwed onto the bottle opening via a thread, ensuring a tight seal between the cap and the bottle.

[0003] There are various sizes of plastic bottles, and no uniform standard exists. When customers change to different models of plastic bottles, the bottle caps need to be remade according to the bottle size, diameter, thread, etc., resulting in high costs and long lead times.

[0004] Therefore, there is an urgent need to develop a sealing component that can be widely applied to different sizes of plastic bottles, so that the sealing component can be adapted to a variety of different models of plastic bottles, eliminating the need to customize the plastic bottle cap (i.e., the seal) according to the size of the plastic bottle, thereby shortening the delivery cycle of the equipment and reducing the manufacturing cost of the equipment. Utility Model Content

[0005] This application is made in order to solve the above-mentioned technical problems.

[0006] A glue bottle assembly for semiconductor equipment includes a glue bottle, a device platform, a column mounted on the device platform, a connecting rod, a sealing assembly, a glue tube, and a vent tube. The glue tube and the vent tube are mounted on the sealing assembly. One end of the connecting rod is mounted on the column, and the connecting rod is movable up and down along the column to adjust its height. The sealing assembly is mounted on the other end of the connecting rod. The sealing assembly includes a sealing cap and a sealing gasket. The sealing gasket is attached to the underside of the sealing cap, and during installation, the sealing gasket covers the mouth of the glue bottle.

[0007] Preferably, the size of the sealing gasket is larger than the diameter of the bottle opening, so that the sealing gasket can cover the bottle opening and ensure a sealing effect.

[0008] Preferably, the sealing cover is provided with a vent hole, one end of the vent pipe passes through the vent hole, and the other end of the vent pipe is connected to the outside.

[0009] Preferably, the sealing cap is provided with a connection hole, and one end of the rubber tube extends through the connection hole into the inside of the rubber bottle.

[0010] Preferably, the sealing gasket is made of a soft material, such as silicone or other relatively soft material.

[0011] Preferably, during installation, the sealing gasket covers the mouth of the glue bottle, and the pressure between the mouth of the glue bottle and the sealing gasket causes the sealing gasket to deform. The mouth of the glue bottle and the sealing gasket exert a certain pressure, which improves the sealing effect. The deformation of the sealing gasket is relatively minor.

[0012] Preferably, the size of the sealing gasket is between 10mm and 50mm, which can meet the bottle opening size of almost all plastic bottles.

[0013] Preferably, the sealing cap includes a cap body and a boss disposed below the cap body. The boss has a groove, and the sealing gasket is engaged in the groove to form a connection with the sealing cap.

[0014] Preferably, the size of the boss is smaller than the diameter of the bottle opening.

[0015] Preferably, the connecting rod is fixed to the column by clamping, and the operator can manually adjust the height of the connecting rod to accommodate plastic bottles of different heights.

[0016] Preferably, in another embodiment, the column may also be equipped with a guide rail and a drive motor so that the connecting rod can be electrically adjusted in height.

[0017] Compared with the prior art, the advantages of the technical solution of this application include at least the following:

[0018] 1. Existing plastic bottles all require corresponding caps to achieve sealing requirements. Furthermore, most caps use threaded connections. However, due to varying manufacturing needs of different customers, plastic bottles come in diverse sizes, necessitating custom-made caps that result in long customization cycles and relatively high costs. In contrast to existing technologies, this invention provides a sealing component for plastic bottles. This component can be adjusted in height via a column to accommodate bottles of different heights. Simultaneously, a sealing gasket covers the bottle opening, allowing the sealing component to adapt to different bottle opening diameters. This eliminates the need for custom-made caps based on bottle dimensions, reducing costs and significantly shortening equipment delivery times.

[0019] 2. Unlike existing technologies, in this utility model, the sealing gasket is larger than the diameter of the bottle mouth, so that the sealing gasket can cover the bottle mouth. Furthermore, the bottle mouth and the sealing gasket exert a certain pressure, resulting in a better sealing effect.

[0020] The embodiments of this application can achieve other advantageous technical effects not listed one by one. These other technical effects may be partially described below and can be expected and understood by those skilled in the art after reading this application. Attached Figure Description

[0021] The above-described features and advantages, as well as other features and advantages, and the ways in which they are implemented, of these embodiments will become more apparent and the embodiments of this application will be better understood by referring to the following description in conjunction with the accompanying drawings, in which:

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0023] Figure 2 This is a schematic diagram of the sealing assembly of this utility model.

[0024] The features represented by the numbers in the attached diagram are as follows:

[0025] 1-Glue bottle, 11-Bottle mouth, 2-Device platform, 3-Column, 4-Connecting rod, 5-Sealing assembly, 51-Sealing cap, 511-Cap body, 512-Boss, 513-Groove, 52-Sealing gasket, 53-Vent hole, 54-Connecting hole, 6-Glue tube, 7-Vent pipe. Detailed Implementation

[0026] The details of one or more embodiments of this application will be set forth in the following description of the accompanying drawings and specific embodiments. Other features, objects, and advantages of this application will become clear from these descriptions, drawings, and claims.

[0027] It should be understood that the illustrated and described embodiments are not limited in application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the accompanying drawings. The illustrated embodiments may be other embodiments and can be implemented or performed in various ways. The examples are provided by way of explanation rather than limitation of the disclosed embodiments. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of this application without departing from the scope or spirit of this disclosure. For example, features illustrated or described as part of one embodiment may be used with another embodiment to still produce another embodiment. Therefore, this disclosure covers such modifications and variations that fall within the scope of the appended claims and their equivalents.

[0028] Similarly, it is understood that the phrases and terms used in this document are for descriptive purposes and should not be considered restrictive. The use of “including,” “contains,” or “has,” and their variations, in this document is intended to include, in an open-ended manner, the items listed thereafter, their equivalents, and any additional items.

[0029] The present application will now be described in more detail with reference to various embodiments and examples of several aspects thereof.

[0030] Example 1

[0031] A plastic bottle assembly for semiconductor devices, such as Figure 1 As shown, the device includes a glue bottle 1, a platform 2, a column 3 mounted on the platform 2, a connecting rod 4, a sealing assembly 5, a glue tube 6, and a vent pipe 7. The glue tube 6 and the vent pipe 7 are mounted on the sealing assembly 5. One end of the connecting rod 4 is mounted on the column 3, and the connecting rod 4 can be raised and lowered along the column 3 to adjust its height. The sealing assembly 5 is mounted on the other end of the connecting rod 4. Figure 2 As shown, the sealing assembly 5 includes a sealing cap 51 and a sealing gasket 52. The sealing gasket 52 is attached to the underside of the sealing cap 51. During installation, the sealing gasket 52 covers the bottle opening 11 of the glue bottle 1. When replacing the glue bottle 1, the operator only needs to raise the connecting rod 4 along the column 3 to separate the sealing assembly 5 from the bottle opening 11, then replace the glue bottle 1, and then insert the glue tube 6 into the glue bottle 1. The connecting rod 4 is lowered along the column 3 to a suitable height relative to the bottle opening 11 of the glue bottle 1, so that the sealing gasket 52 is slightly squeezed against the bottle opening 11 to complete the installation. This operation is more convenient than the threaded bottle cap method, and there is no need to customize the bottle cap according to the size of the glue bottle 1. The cost is low and the equipment delivery cycle is greatly shortened.

[0032] In one embodiment, the sealing gasket 52 is larger than the diameter of the bottle mouth 11 of the glue bottle 1, so that the sealing gasket 52 can cover the bottle mouth 11 and ensure a sealing effect.

[0033] In one embodiment, the sealing cover 51 is provided with a vent hole 53, one end of the vent pipe 7 is inserted into the vent hole 53, and the other end of the vent pipe 7 is connected to the outside.

[0034] In one embodiment, the sealing cap 51 is provided with a connection hole 54, and one end of the rubber tube 6 extends through the connection hole 54 into the inside of the rubber bottle 1.

[0035] In one embodiment, the sealing gasket 52 is made of a soft material, such as silicone or other relatively soft material.

[0036] In one embodiment, during installation, the sealing gasket 52 covers the bottle opening 11 of the glue bottle 1, and the bottle opening 11 of the glue bottle 1 is squeezed against the sealing gasket 52, causing the sealing gasket 52 to deform. The bottle opening 11 of the glue bottle 1 and the sealing gasket 52 have a certain squeezing force, which makes the sealing effect better. The deformation of the sealing gasket 52 is relatively minor.

[0037] In one embodiment, the sealing gasket 52 is preferably 50 mm in size, which is sufficient to meet the bottle opening 11 size of almost all plastic bottles 1.

[0038] In one embodiment, the sealing cover 51 includes a cover body 511 and a boss 512 disposed below the cover body 511. The boss 512 is provided with a groove 513 (not shown in the figure), and the sealing gasket 52 is engaged in the groove 513 and connected to the sealing cover 51.

[0039] In one embodiment, the size of the boss 512 is smaller than the diameter of the bottle opening 11 of the glue bottle 1.

[0040] In one embodiment, the connecting rod 4 is fixed to the column 3 by clamping, and the operator can manually adjust the height of the connecting rod 4 to accommodate different heights of the plastic bottles 1.

[0041] The foregoing description of several embodiments of this application has been provided for illustrative purposes. This foregoing description is not intended to be exhaustive, nor is it intended to limit the application to the precise configurations, constructions, and / or steps disclosed; obviously, many modifications and variations can be made in light of the teachings above. The scope of this invention and all its equivalents are intended to be defined by the appended claims.

Claims

1. A glue bottle assembly for a semiconductor device, characterized by: The utility model provides a kind of rubber bottle, device table, column, connecting rod, sealing assembly, rubber pipe and breather tube, the rubber pipe and the breather tube are arranged on the sealing assembly, one end of the connecting rod is arranged on the column, and the connecting rod can be lifted along column to adjust height, the sealing assembly is arranged on the other end of connecting rod, the sealing assembly includes sealing cover and sealing pad, the sealing pad is fitted below the sealing cover, when installation, the sealing pad covers the bottle mouth of the rubber bottle.

2. A vial assembly for a semiconductor device as defined in claim 1, wherein: Ventilation hole is provided on the sealing cover, one end of the breather tube is provided in the ventilation hole, and the other end of the breather tube is communicated with the outside.

3. A vial assembly for a semiconductor device as defined in claim 1, wherein: Connecting hole is provided on the sealing cover, one end of the rubber pipe extends to the inside of rubber bottle through the connecting hole.

4. A vial assembly for a semiconductor device as defined in claim 1, wherein: The sealing pad is made of soft material.

5. A vial assembly for a semiconductor device as defined in claim 4, wherein: When installation, the sealing pad covers the bottle mouth of the rubber bottle, and the bottle mouth of the rubber bottle is extruded with the sealing pad so that the sealing pad is deformed.

6. A vial assembly for a semiconductor device as defined in claim 1, wherein: The size of the sealing pad is between 10mm-50mm.

7. A vial assembly for a semiconductor device as defined in claim 1, wherein: The sealing cover includes cover body, boss arranged below cover body, the boss is provided with embedding groove, the sealing pad is clamped in the embedding groove to form connection with the sealing cover.

8. A vial assembly for a semiconductor device as defined in claim 7, wherein: The size of the boss is less than the diameter of the bottle mouth of the rubber bottle.

9. A vial assembly for a semiconductor device as defined in claim 1, wherein: The connecting rod is fixed on the column in clamping mode, and the height of the connecting rod is adjusted manually.

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