Automatic feeding mechanism for wafer bonding pretreatment
By designing an automatic feeding mechanism, which utilizes components such as servo motors and suction cups to achieve automatic wafer transport and fixation, the problem of complex manual feeding in wafer bonding preprocessing is solved, and feeding efficiency and processing quality are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2026-03-31
AI Technical Summary
In the existing technology, the wafer bonding pretreatment process requires manual feeding, which is complicated and involves frequent contact with the wafer, affecting the quality and making it impossible to achieve automatic feeding.
An automatic feeding mechanism was designed, including a conveying mechanism and a processing mechanism. It utilizes components such as servo motors, one-way threaded rods, suction cups, and clamping plates to achieve automatic wafer feeding and fixing, ensuring stability and accuracy.
It improves the efficiency and accuracy of wafer loading, reduces manual intervention, ensures processing quality and precision, and enhances processing efficiency and convenience.
Smart Images
Figure CN224069078U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer bonding technology, specifically to an automatic feeding mechanism for wafer bonding pretreatment. Background Technology
[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. Wafer bonding is a process used in the manufacture of microelectromechanical systems (MEMS), nanoelectromechanical systems (NMEMS), optoelectronic or microelectronic objects. Wafer bonding refers to the chemical and physical bonding of two mirror-polished homogeneous or heterogeneous wafers. After bonding, the atoms at the interface react under external force to form covalent bonds, achieving a specific bonding strength. The automated wafer bonding pretreatment feeding mechanism is a key component in semiconductor manufacturing, used to automatically transport wafers to the bonding equipment. When wafer bonding or pretreatment is required, workers often need to manually place the wafers into the operating table for processing or bonding. This complex operation and frequent contact with the wafers can affect their quality, hindering automated feeding and impacting usability. Utility Model Content
[0003] The purpose of this invention is to provide an automatic feeding mechanism for wafer bonding pretreatment to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution: an automatic feeding mechanism for wafer bonding pretreatment, comprising a base, a conveying mechanism on the top of the base, and a processing mechanism on the top of the conveying mechanism;
[0005] The conveying mechanism includes a load-bearing platform, which is fixedly connected to the top of the base. A support frame is fixedly connected to the top of the load-bearing platform. A first servo motor is fixedly connected to the inner side of the support frame. A rotating rod is fixedly connected to the top of the first servo motor. A rotating platform is fixedly connected to the top of the rotating rod. A placement box is fixedly connected to the top of the rotating platform. A support ring is fixedly connected to the bottom of the rotating platform. The support ring is slidably connected to the top of the support frame. A load-bearing frame is fixedly connected to the rear side of the top of the load-bearing platform. A second servo motor is fixedly connected to the left side of the load-bearing frame. A one-way threaded rod is fixedly connected to the right side of the second servo motor.
[0006] The unidirectional threaded rod is threadedly connected to a movable frame. An electric telescopic rod is fixedly connected to the top of the movable frame. A suction cup is fixedly connected to the bottom of the electric telescopic rod. A placement platform is fixedly connected to the rear side of the load-bearing frame. An air pump is fixedly connected to the top of the placement platform. A hose is fixedly connected to the front side of the air pump. The hose is fixedly connected to the top of the suction cup. A connecting frame is fixedly connected to the periphery of the hose.
[0007] Preferably, the flexible hose extends through the interior of the movable frame, and the connecting frame is fixedly connected to the rear side of the movable frame, so that the suction cup can work normally under the action of the flexible hose.
[0008] Preferably, the rotating rod is rotatably connected inside the support frame, and the right side of the one-way threaded rod is rotatably connected inside the load-bearing frame, so that the rotating table and the moving frame can be driven to work respectively under the action of the rotating rod and the one-way threaded rod.
[0009] Preferably, the top of the support frame is provided with a circular groove, and the support ring is slidably connected in the circular groove, so as to ensure the stability of the support ring during operation under the action of the circular groove.
[0010] Preferably, the processing mechanism includes a fixed frame, which is fixedly connected to the top of the base. A rectangular seat is fixedly connected to the top of the fixed frame, and an operating table is fixedly connected to the top of the rectangular seat. A bidirectional threaded rod is rotatably connected inside the rectangular seat. A knob is fixedly connected to the front side of the bidirectional threaded rod. A moving block is threadedly connected to the periphery of the bidirectional threaded rod. The moving block is slidably connected inside the rectangular seat. A clamping plate is fixedly connected to the rear side of the moving block, and the clamping plate is slidably connected inside the operating table.
[0011] Preferably, the rectangular base has a groove inside, and the movable block is slidably connected in the groove, which helps to ensure the stability of the movable block's movement under the action of the groove.
[0012] Preferably, the clamping plate is arc-shaped, and a rubber pad is provided on the inner side of the clamping plate to facilitate ensuring the stability of the wafer when pre-processing the wafer bonding.
[0013] Compared with the prior art, this utility model provides an automatic feeding mechanism for wafer bonding pretreatment, which has the following advantages:
[0014] 1. This automatic feeding mechanism for wafer bonding pretreatment, through its conveying mechanism, first places all wafers into the placement box when pretreatment of wafer bonding is required. A first servo motor drives a rotating rod, causing the rotating table and placement box to rotate, positioning the wafers in the placement box at the bottom of the suction cup. A second servo motor drives a one-way threaded rod, causing the moving frame to precisely move the electric telescopic rod and suction cup. Combined with an air pump, the wafers are sucked and transferred via a flexible hose, greatly improving the efficiency and accuracy of feeding. The flexible hose runs through the interior of the moving frame, and the connecting frame is fixed to the rear of the moving frame, ensuring the stability of the connection between the air pump and the suction cup. During movement, the hose will not become entangled or fall off, making the suction operation more reliable. Furthermore, four placement boxes are provided, increasing the wafer storage capacity. Under the action of the suction cup, the wafers can be transported to the operating table for bonding or pretreatment processing, improving processing efficiency and convenience, and reducing operator intervention.
[0015] 2. This automatic feeding mechanism for wafer bonding pretreatment, through its processing mechanism, allows the wafer to be placed in the operating table via a suction cup. Rotating the knob drives the bidirectional threaded rod to rotate, causing the moving block to slide within a groove in the rectangular base. This, in turn, causes the clamping plate to clamp and fix the wafer, ensuring its stability during wafer bonding pretreatment. The clamping plate is arc-shaped with rubber pads on its inner side, adapting to the shape of the wafer and increasing friction to prevent displacement during processing, thus ensuring processing accuracy and quality. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0018] Figure 2 This is a schematic diagram of the left-side structure of this utility model;
[0019] Figure 3 This is a schematic diagram of the conveying mechanism.
[0020] Figure 4 This is a schematic diagram of the top structure of the support frame;
[0021] Figure 5 This is a schematic diagram of the top structure of the load-bearing platform;
[0022] Figure 6 This is a schematic diagram of the machining mechanism.
[0023] In the diagram: 1. Base; 2. Conveying mechanism; 3. Processing mechanism; 21. Load-bearing platform; 22. Support frame; 23. First servo motor; 24. Load-bearing frame; 25. Rotating rod; 26. Support ring; 27. Rotating table; 28. Placement box; 29. Second servo motor; 291. Moving frame; 292. One-way threaded rod; 293. Placement platform; 294. Air pump; 295. Hoses; 296. Connecting frame; 297. Electric telescopic rod; 298. Suction cup; 31. Fixed frame; 32. Rectangular base; 33. Knob; 34. Two-way threaded rod; 35. Moving block; 36. Clamping plate; 37. Operating table. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] This utility model provides the following technical solution:
[0027] Example 1
[0028] Please see Figure 1-6 This utility model provides a technical solution: an automatic feeding mechanism for wafer bonding pretreatment, including a base 1, a conveying mechanism 2 on the top of the base 1, and a processing mechanism 3 on the top of the conveying mechanism 2;
[0029] The conveying mechanism 2 includes a support platform 21, which is fixedly connected to the top of the base 1. A support frame 22 is fixedly connected to the top of the support platform 21. A first servo motor 23 is fixedly connected to the inner side of the support frame 22. A rotating rod 25 is fixedly connected to the top of the first servo motor 23. A rotating table 27 is fixedly connected to the top of the rotating rod 25. A placement box 28 is fixedly connected to the top of the rotating table 27. A support ring 26 is fixedly connected to the bottom of the rotating table 27. The support ring 26 is slidably connected to the top of the support frame 22. A load-bearing frame 24 is fixedly connected to the rear side of the top of the support platform 21. A second servo motor 29 is fixedly connected to the left side of the load-bearing frame 24. A one-way threaded rod 292 is fixedly connected to the right side of the second servo motor 29.
[0030] A movable frame 291 is threadedly connected to the outer side of the one-way threaded rod 292. An electric telescopic rod 297 is fixedly connected to the top of the movable frame 291. A suction cup 298 is fixedly connected to the bottom of the electric telescopic rod 297. A placement platform 293 is fixedly connected to the rear side of the load-bearing frame 24. An air pump 294 is fixedly connected to the top of the placement platform 293. A hose 295 is fixedly connected to the front side of the air pump 294. The hose 295 is fixedly connected to the top of the suction cup 298. A connecting frame 296 is fixedly connected to the outer side of the hose 295.
[0031] The flexible hose 295 passes through the interior of the movable frame 291, and the connecting frame 296 is fixedly connected to the rear side of the movable frame 291, so that the suction cup 298 can work normally under the action of the flexible hose 295. The rotating rod 25 is rotatably connected to the interior of the support frame 22, and the one-way threaded rod 292 is rotatably connected to the right side of the load-bearing frame 24, so that the rotating rod 25 and the one-way threaded rod 292 can drive the rotating table 27 and the movable frame 291 to work respectively. The top of the support frame 22 has a circular groove, and the support ring 26 is slidably connected in the circular groove, so as to ensure the stability of the support ring 26 when working under the action of the circular groove.
[0032] Example 2
[0033] Please see Figure 1-6 Furthermore, based on Embodiment 1, the processing mechanism 3 further includes a fixed frame 31, which is fixedly connected to the top of the base 1. A rectangular seat 32 is fixedly connected to the top of the fixed frame 31, and an operating table 37 is fixedly connected to the top of the rectangular seat 32. A bidirectional threaded rod 34 is rotatably connected inside the rectangular seat 32. A knob 33 is fixedly connected to the front side of the bidirectional threaded rod 34, and a moving block 35 is threadedly connected to the outer side of the bidirectional threaded rod 34. The moving block 35 is slidably connected inside the rectangular seat 32, and a clamping plate 36 is fixedly connected to the rear side of the moving block 35. The clamping plate 36 is slidably connected inside the operating table 37. A sliding groove is provided inside the rectangular seat 32, and the moving block 35 is slidably connected inside the sliding groove to ensure the stability of the moving block 35 under the action of the sliding groove. The clamping plate 36 is arc-shaped, and a rubber pad is provided on the inner side of the clamping plate 36 to ensure the stability of the wafer when pre-processing wafer bonding is performed.
[0034] In actual operation, when this device is used and pre-processing of wafer bonding is required, all wafers are first placed into the placement box 28. The first servo motor 23 drives the rotating rod 25, which in turn drives the rotating table 27 and the placement box 28 to rotate, so that the wafers in the placement box 28 are at the bottom of the suction cup 298. At the same time, the second servo motor 29 drives the one-way threaded rod 292 to rotate, which in turn drives the moving frame 291 to move, so that the suction cup 298 is at the top of the wafer. At the same time, the electric telescopic rod 297 drives the suction cup 298 to move, so that the suction cup 298 contacts the wafer. With the help of the air pump 294, the wafer is picked up and transferred through the hose 295. During the picking up, the wafer can be transported to the operating table 37 by the electric telescopic rod 297 and the one-way threaded rod 292, which greatly improves the efficiency and accuracy of loading.
[0035] When the wafer is placed in the stage 293, the knob 33 can be rotated. Rotating the knob 33 drives the bidirectional threaded rod 34 to rotate, causing the moving block 35 to slide in the groove inside the rectangular base 32. This, in turn, drives the clamping plate 36 to clamp and fix the wafer, which facilitates the stability of the wafer when bonding or pre-processing. The clamping plate 36 is arc-shaped and has a rubber pad on the inside, which can adapt to the shape of the wafer and increase friction to prevent the wafer from shifting during processing, thus ensuring the accuracy and quality of processing.
[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
Claims
1. An automatic feeding mechanism for wafer bonding pretreatment, comprising a base (1), characterized in that: The top of the base (1) is provided with a conveying mechanism (2), and the top of the conveying mechanism (2) is provided with a processing mechanism (3). The conveying mechanism (2) comprises a bearing table (21), the bearing table (21) is fixedly connected to the top of the base (1), the top of the bearing table (21) is fixedly connected with a support frame (22), the inner side of the support frame (22) is fixedly connected with a first servo motor (23), the top of the first servo motor (23) is fixedly connected with a rotating rod (25), the top of the rotating rod (25) is fixedly connected with a rotating table (27), the top of the rotating table (27) is fixedly connected with a placing box (28), the bottom of the rotating table (27) is fixedly connected with a supporting ring (26), the supporting ring (26) is slidingly connected to the top of the support frame (22), the top of the bearing table (21) is fixedly connected with a bearing frame (24), the left side of the bearing frame (24) is fixedly connected with a second servo motor (29), and the right side of the second servo motor (29) is fixedly connected with a one-way threaded rod (292). The one-way threaded rod (292) is threadedly connected with a moving frame (291), the top of the moving frame (291) is fixedly connected with an electric telescopic rod (297), the bottom of the electric telescopic rod (297) is fixedly connected with a suction cup (298), the rear side of the bearing frame (24) is fixedly connected with a placing table (293), the top of the placing table (293) is fixedly connected with a suction pump (294), the front side of the suction pump (294) is fixedly connected with a hose (295), the hose (295) is fixedly connected to the top of the suction cup (298), and the hose (295) is fixedly connected with a connecting frame (296).
2. The automatic loading mechanism for wafer bonding pretreatment according to claim 1, wherein: The hose (295) penetrates into the moving frame (291), and the connecting frame (296) is fixedly connected to the rear side of the moving frame (291).
3. The automatic loading mechanism for wafer bonding pretreatment according to claim 1, wherein: The rotating rod (25) is rotatably connected to the inside of the support frame (22), and the right side of the one-way threaded rod (292) is rotatably connected to the bearing frame (24).
4. The automatic loading mechanism for wafer bonding pretreatment according to claim 1, wherein: The top of the support frame (22) is provided with a circular groove, and the supporting ring (26) is slidingly connected in the circular groove.
5. The automatic loading mechanism for wafer bonding pretreatment according to claim 1, wherein: The processing mechanism (3) comprises a fixed frame (31), the top of the fixed frame (31) is fixedly connected with a rectangular seat (32), the top of the rectangular seat (32) is fixedly connected with an operation table (37), the inside of the rectangular seat (32) is rotatably connected with a bidirectional threaded rod (34), the front side of the bidirectional threaded rod (34) is fixedly connected with a knob (33), the outside of the bidirectional threaded rod (34) is threadedly connected with a moving block (35), the moving block (35) is slidingly connected to the inside of the rectangular seat (32), the rear side of the moving block (35) is fixedly connected with a clamping plate (36), and the clamping plate (36) is slidingly connected to the inside of the operation table (37).
6. The automatic loading mechanism for wafer bonding pretreatment according to claim 5, wherein: The inside of the rectangular seat (32) is provided with a sliding groove, and the moving block (35) is slidingly connected in the sliding groove.
7. The automatic loading mechanism for wafer bonding pretreatment according to claim 5, wherein: The clamping plate (36) is in an arc shape, and the inner side of the clamping plate (36) is provided with a rubber pad.