MOS device pin bending device

Abstract

The utility model relates to the technical field of bending devices, and discloses an MOS device pin bending device which comprises a base, the middle end of the upper side of the base is fixedly connected with a placing table, the outer side of one end of the base is fixedly connected with a control box, the outer end of the upper side of the base is fixedly connected with a top plate, and the middle end of the placing table is provided with an adjusting assembly. The adjusting assembly comprises a motor fixedly connected to one side of the placement table, a motor output shaft penetrates through the placement table and is fixedly connected with a threaded rod, the end, away from the motor, of the threaded rod is rotatably connected into the placement table, threaded plates are in threaded engagement with the outer sides of the two ends of the threaded rod, and the ends, away from the threaded rod, of the threaded plates are fixedly connected with transmission plates. The ends, away from the threaded plate, of the transmission plates are fixedly connected with clamping plates, the opposite sides of the two clamping plates are fixedly connected with first rubber pads, MOS devices of different models can be clamped and fixed through the adjusting assembly, the bending position can be adjusted according to pins of the MOS devices of different models, the clamping application range is effectively improved, and the clamping efficiency is improved. And the bending efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of bending device technology, specifically to a bending device for MOS device pins. Background Technology

[0002] A MOS device is a device composed of metal electrodes, an oxide insulating layer, and a semiconductor substrate. By changing the gate voltage, the electric field on the semiconductor surface is controlled, thereby regulating the current between the source and drain. When the gate voltage reaches a certain threshold, an inversion layer is formed on the semiconductor surface, allowing current to flow between the source and drain, thus achieving switching control of the current. During the manufacturing process of a MOS device, the pins need to be bent using a bending device.

[0003] A search revealed that Chinese patent application CN201921929807.8 discloses a MOS device pin bending device, comprising a chassis, a pin bending device body fixedly connected to the top of the chassis, a horizontal plate movably connected to the inner wall of the chassis, a fixed plate fixedly connected to the top of the horizontal plate, a MOS device body movably connected to the top of the fixed plate, and pin bodies fixedly connected to both sides of the MOS device body. This prior art, through the coordination of the chassis, pin bending device body, horizontal plate, fixed plate, MOS device body, pin bodies, clamp, pin support mechanism, moving plate, sliding sleeve and sliding rod mechanism, control plate, moving column, fixed sleeve, sliding block, and positioning rod, allows the clamp to move inward to fix MOS device bodies of different sizes, thereby achieving the effect of fixing MOS devices of different sizes and solving the problem that existing MOS device pin bending devices cannot fix MOS devices of different sizes.

[0004] In the aforementioned prior art, positioning rods on both sides are manually pushed, which in turn move sliding blocks and fixing sleeves to clamp different types of MOS devices. This clamping method can only clamp different types of MOS devices. However, as the MOS device model changes, the pin positions and bend positions also change. The aforementioned prior art is not convenient to adjust according to the pin positions and bend positions of different types of MOS devices, thus reducing its applicability. Utility Model Content

[0005] The purpose of this invention is to provide a MOS device pin bending device to solve the problem that existing MOS device pin bending devices are inconvenient for adjusting the pins and pin bending positions of different types of MOS devices.

[0006] This utility model provides the following technical solution: a MOS device pin bending device, including a base, a placement platform fixedly connected to the middle of the upper side of the base, a control box fixedly connected to the outer side of one end of the base, a top plate fixedly connected to the outer side of the upper side of the base, and an adjustment component provided in the middle of the placement platform. The adjustment component includes a motor fixedly connected to one side of the placement platform, and a threaded rod fixedly connected to the output shaft of the motor through the placement platform. The end of the threaded rod away from the motor is rotatably connected inside the placement platform, and threaded plates are threadedly engaged on the outer sides of both ends of the threaded rod. A transmission plate is fixedly connected to the end of the threaded plate away from the threaded rod.

[0007] Through the above technical solution, the threaded engagement between the threaded rod and the threaded plate allows the threaded plate to drive the transmission plates on both sides to move.

[0008] As a preferred embodiment of the above technical solution, a clamping plate is fixedly connected to the end of the transmission plate away from the threaded plate, and a first rubber pad is fixedly connected to the opposite side of the two sets of clamping plates.

[0009] The above technical solution utilizes the relative movement of the clamping plate and the first rubber pad to initially clamp the MOS device.

[0010] As a preferred embodiment of the above technical solution, a first electric telescopic rod is fixedly connected inside the clamping plate, and a first pressure plate is fixedly connected to the upper end of the first electric telescopic rod. A second rubber pad is fixedly connected to the lower side of the end of the first pressure plate away from the first electric telescopic rod.

[0011] The above technical solution utilizes a first electric telescopic rod to move a first pressure plate and a second rubber pad, thereby providing secondary clamping and restriction for the placed MOS device.

[0012] As a preferred embodiment of the above technical solution, a second electric telescopic rod is fixedly connected to the lower sides of both ends of the placement platform, and a bending plate is fixedly connected to the end of the second electric telescopic rod away from the placement platform.

[0013] The above technical solution utilizes a second electric telescopic rod to move the bending plate, thereby adjusting the position of the needle bend.

[0014] As a preferred embodiment of the above technical solution, a double-headed electric telescopic rod is fixedly connected to the middle of the upper side of the top plate, and a controller is electrically connected to one side of the double-headed electric telescopic rod. The lower end of the controller is fixedly connected to the top plate, and a moving plate is fixedly connected to the output shafts at both ends of the double-headed electric telescopic rod.

[0015] The above technical solution allows for the movement of the movable plate via a double-headed electric telescopic rod, facilitating the adjustment of the downward bending position.

[0016] As a preferred embodiment of the above technical solution, the two ends of the movable plate are fixedly connected to limit blocks, and a slide rail is sleeved on the outer side of the end of the limit block away from the movable plate, and the lower end of the slide rail is fixedly connected to the top plate.

[0017] The above technical solution uses a limiting block to move within the slide rail, thereby restricting the movement of the moving plate.

[0018] As a preferred embodiment of the above technical solution, a third electric telescopic rod is fixedly connected to the upper side of the movable plate, and the lower end of the third electric telescopic rod passes through the movable plate and is fixedly connected to a second pressure plate.

[0019] The above technical solution allows the second pressure plate to be moved by the third electric telescopic rod, facilitating the downward bending of the pins of the MOS device by the second pressure plate.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] This MOS device pin bending device can clamp and fix different types of MOS devices by adjusting the components, and can also adjust the bending position according to the pins of different types of MOS devices, thus effectively improving the clamping applicability and bending efficiency. Attached Figure Description

[0022] Figure 1 A first-view three-dimensional structural diagram of a pin bending device for a MOS device;

[0023] Figure 2 A second-view three-dimensional structural diagram of a pin bending device for a MOS device;

[0024] Figure 3 A schematic cross-sectional view of a pin bending device for a MOS device.

[0025] Figure 4 This is an enlarged schematic diagram of the inner structure of a mounting platform for a pin bending device of a MOS device.

[0026] In the diagram: 1. Base; 11. Placement platform; 12. Control box; 13. Top plate; 21. Motor; 22. Threaded rod; 23. Threaded plate; 24. Transmission plate; 25. Clamping plate; 26. First rubber pad; 27. First electric telescopic rod; 28. First pressure plate; 29. ​​Second rubber pad; 210. Second electric telescopic rod; 211. Bending plate; 212. Double-headed electric telescopic rod; 213. Controller; 214. Moving plate; 215. Limiting block; 216. Slide rail; 217. Third electric telescopic rod; 218. Second pressure plate. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0028] like Figure 1 - Figure 4 As shown, this utility model provides a technical solution: a MOS device pin bending device, including a base 1, a placement platform 11 fixedly connected to the upper middle of the base 1, a control box 12 fixedly connected to the outer side of one end of the base 1, a top plate 13 fixedly connected to the outer side of the upper side of the base 1, and an adjustment component provided in the middle of the placement platform 11. The adjustment component includes a motor 21 fixedly connected to one side of the placement platform 11, and a threaded rod 22 fixedly connected through the output shaft of the motor 21 through the placement platform 11. The end of the threaded rod 22 away from the motor 21 is rotatably connected to the placement platform 11, and threaded plates 23 are threadedly engaged on the outer sides of both ends of the threaded rod 22. A transmission plate 24 is fixedly connected to the end of the threaded plate 23 away from the threaded rod 22. The device can clamp and fix different types of MOS devices by adjusting the component, thereby improving the clamping applicability range and bending efficiency.

[0029] It should be noted that the threaded rod 22 is a bidirectional threaded rod, and two sets of threaded plates 23 are engaged with the outer threads at both ends of the threaded rod 22, and the two sets of threaded plates 23 move in opposite directions.

[0030] like Figure 4 As shown, a clamping plate 25 is fixedly connected to one end of the transmission plate 24 away from the threaded plate 23, and a first rubber pad 26 is fixedly connected to one side of the two sets of clamping plates 25 facing each other. The transmission plate 24 drives the clamping plates 25 and the first rubber pad 26 to move, so that the clamping plates 25 and the first rubber pad 26 can squeeze and restrict the two sides of the MOS device.

[0031] like Figure 2 and Figure 4 As shown, a first electric telescopic rod 27 is fixedly connected inside the clamping plate 25, and a first pressure plate 28 is fixedly connected to the upper end of the first electric telescopic rod 27. A second rubber pad 29 is fixedly connected to the lower side of the end of the first pressure plate 28 away from the first electric telescopic rod 27. The first pressure plate 28 and the second rubber pad 29 are moved by the operation of the first electric telescopic rod 27, which facilitates the compression and restriction of the upper side of the MOS device.

[0032] like Figure 2 As shown, a second electric telescopic rod 210 is fixedly connected to the lower side of both ends of the placement platform 11, and a bending plate 211 is fixedly connected to the end of the second electric telescopic rod 210 away from the placement platform 11. The bending plate 211 can be moved and adjusted by the operation of the second electric telescopic rod 210.

[0033] like Figure 1As shown, a double-headed electric telescopic rod 212 is fixedly connected to the middle of the upper side of the top plate 13, and a controller 213 is electrically connected to one side of the double-headed electric telescopic rod 212. The lower end of the controller 213 is fixedly connected to the top plate 13, and a moving plate 214 is fixedly connected to the output shafts at both ends of the double-headed electric telescopic rod 212. The moving plate 214 is moved by the double-headed electric telescopic rod 212 to facilitate the adjustment of the position of the two sets of third electric telescopic rods 217.

[0034] like Figure 1 As shown, the two ends of the movable plate 214 are fixedly connected to limit blocks 215, and a slide rail 216 is sleeved on the outer side of the end of the limit block 215 away from the movable plate 214. The lower end of the slide rail 216 is fixedly connected to the top plate 13. The movement of the movable plate 214 is restricted by the movement of the limit block 215 within the slide rail 216.

[0035] like Figure 3 As shown, a third electric telescopic rod 217 is fixedly connected to the upper side of the movable plate 214. The lower end of the third electric telescopic rod 217 passes through the movable plate 214 and is fixedly connected to a second pressure plate 218. The operation of the third electric telescopic rod 217 drives the second pressure plate 218 to move, thereby allowing the second pressure plate 218 to bend the pins of the MOS device.

[0036] Working principle: When bending the pins of a MOS device, the MOS device is first placed on the bending plates 211 at both ends of the placement platform 11. The position of the bending plates 211 is adjusted according to the model of the MOS device. During adjustment, the second electric telescopic rod 210 is controlled to extend and retract via the control box 12. After the second electric telescopic rod 210 extends and retracts, it drives the bending plates 211 to move and adjust. When the bending plates 211 are adjusted to the appropriate position, the second electric telescopic rod 210 is closed. Then, the motor 21 is started. After the motor 21 starts, the output shaft drives the threaded rod 22 to rotate. After the threaded rod 22 rotates, it engages with the threaded plate 23, causing the threaded plate 23 to drive the transmission plate 24 and clamping plate 25 to move. The movement of the clamping plates 25 on both sides drives the first rubber pad 26 to clamp the placed MOS device. After clamping and fixing, the control box 12 controls the movement of the device. The first electric telescopic rod 27 is activated, which drives the first pressure plate 28 and the second rubber pad 29 to move downwards. This allows the first pressure plate 28 and the second rubber pad 29 to clamp and restrict the MOS device for a second time. Then, the controller 213 controls the operation of the double-headed electric telescopic rod 212. After the double-headed electric telescopic rod 212 is in operation, its output shaft pushes the moving plate 214 to move. The moving plate 214, through the limit block 215 and the slide rail 216, drives the third electric telescopic rod 217 and the second pressure plate 218 to move and adjust. When the second pressure plate 218 is adjusted to the appropriate position, the double-headed electric telescopic rod 212 is closed, and then the third electric telescopic rod 217 is activated to push the second pressure plate 218 downwards. This allows the second pressure plate 218 to squeeze the pins of the clamped MOS device, causing it to bend under the positioning of the bending plate 211.

[0037] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A pin bending device for a MOS device, comprising a base (1), characterized in that: The base (1) is fixedly connected to the middle of the upper side of the base (1), and a control box (12) is fixedly connected to the outer side of one end of the base (1). The top plate (13) is fixedly connected to the outer side of the upper side of the base (1), and an adjustment component is provided in the middle of the placement platform (11). The adjustment component includes a motor (21) fixedly connected to one side of the placement platform (11), and a threaded rod (22) is fixedly connected through the placement platform (11) by the output shaft of the motor (21). The end of the threaded rod (22) away from the motor (21) is rotatably connected to the placement platform (11), and a threaded plate (23) is threadedly engaged on the outer side of both ends of the threaded rod (22). A transmission plate (24) is fixedly connected to the end of the threaded plate (23) away from the threaded rod (22).

2. The MOS device pin bending device according to claim 1, characterized in that: The transmission plate (24) is fixedly connected to a clamping plate (25) at one end away from the threaded plate (23), and a first rubber pad (26) is fixedly connected to one side of the two sets of clamping plates (25) opposite to each other.

3. The pin bending device for a MOS device according to claim 2, characterized in that: The clamp (25) is internally fixedly connected to a first electric telescopic rod (27), and the upper end of the first electric telescopic rod (27) is fixedly connected to a first pressure plate (28). The lower side of the end of the first pressure plate (28) away from the first electric telescopic rod (27) is fixedly connected to a second rubber pad (29).

4. The MOS device pin bending device according to claim 1, characterized in that: The lower sides of both ends of the placement platform (11) are fixedly connected to a second electric telescopic rod (210), and the end of the second electric telescopic rod (210) away from the placement platform (11) is fixedly connected to a bending plate (211).

5. The MOS device pin bending device according to claim 1, characterized in that: A double-headed electric telescopic rod (212) is fixedly connected to the middle of the upper side of the top plate (13), and a controller (213) is electrically connected to one side of the double-headed electric telescopic rod (212). The lower end of the controller (213) is fixedly connected to the top plate (13), and a moving plate (214) is fixedly connected to the output shafts at both ends of the double-headed electric telescopic rod (212).

6. The MOS device pin bending device according to claim 5, characterized in that: The movable plate (214) is fixedly connected to two limit blocks (215) at both ends, and a slide rail (216) is sleeved on the outer side of the end of the limit block (215) away from the movable plate (214), and the lower end of the slide rail (216) is fixedly connected to the top plate (13).

7. The MOS device pin bending device according to claim 6, characterized in that: A third electric telescopic rod (217) is fixedly connected to the upper side of the movable plate (214), and a second pressure plate (218) is fixedly connected to the lower end of the third electric telescopic rod (217) through the movable plate (214).

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