Laser processing device

Abstract

The utility model relates to a laser processing device which comprises a machine frame, a laser device and a processing platform, the laser device and the processing platform are both arranged on the machine frame, the laser device is provided with a plurality of emitting ports capable of emitting lasers with different wavelengths respectively, and the emitting ports are distributed at intervals in the x direction. The machining platform comprises a fixing assembly capable of fixing materials to be machined, the fixing assembly is movably arranged in the x direction relative to the rack, and light paths of lasers emitted by the emitting ports intersect with the moving path of the fixing assembly. The laser processing device provided by the utility model solves the problems of poor overall processing precision and low processing efficiency caused by the fact that the existing laser processing equipment cannot complete processing of a composite base material through single feeding.

Description

Technical Field

[0001] This utility model relates to the field of laser processing equipment technology, and in particular to a laser processing device. Background Technology

[0002] Composite matrix materials are composed of two or more different types of materials to achieve a variety of properties and functions, including flexible matrix material layers and functional material layers. Composite matrix materials are mainly used in the automotive industry, flexible electronics, and biomedicine, and high-precision processing technology is fundamental to ensuring their application.

[0003] With the diversification of application scenarios, the composition of composite matrix materials is becoming increasingly complex. Different material layers of composite matrix materials need to be processed using lasers of different wavelengths. Traditional laser processing equipment cannot complete the processing of such composite matrix materials in a single feeding, resulting in a deviation in the fixed position of the material during the second feeding compared to the first feeding. The two processing trajectories are difficult to overlap, leading to poor overall processing accuracy and low processing efficiency. Utility Model Content

[0004] The main purpose of this invention is to propose a laser processing device that aims to solve the problem that existing laser processing equipment cannot complete the processing of composite matrix materials in a single feeding, resulting in poor overall processing accuracy and low processing efficiency.

[0005] To achieve the above objectives, this utility model proposes a laser processing device, comprising a frame, a laser, and a processing platform. The laser and the processing platform are both mounted on the frame. The laser has multiple emission ports that can emit lasers of different wavelengths, and the multiple emission ports are spaced apart in the x-direction. The processing platform includes a fixing component for fixing the material to be processed. The fixing component is movable relative to the frame in the x-direction, and the optical path of the laser emitted from each emission port intersects with the moving path of the fixing component.

[0006] According to some embodiments of the present invention, the processing platform further includes an xy drive component, which is disposed on the frame and is driven to be connected to the fixed component. The fixed component is driven by the xy drive component to move in the x and y directions respectively.

[0007] According to some embodiments of the present invention, the processing platform further includes a mounting base and a first rotating member. The mounting base is connected to the xy drive assembly, and the first rotating member is connected to the fixed assembly. The axis of the first rotating member extending along the y direction is rotatably arranged relative to the mounting base.

[0008] According to some embodiments of the present invention, the mounting base is movable relative to the xy drive platform in the z direction.

[0009] According to some embodiments of the present invention, the fixing component has an adsorption surface for adsorbing and fixing the material to be processed.

[0010] According to some embodiments of the present invention, the fixing component includes a connecting seat and a second rotating member. The connecting seat is connected to the first rotating member. The second rotating member is rotatably disposed relative to the connecting seat, and the axis of rotation is perpendicular to the axis of rotation of the first rotating member. The adsorption surface is formed on the side of the second rotating member facing away from the connecting seat.

[0011] According to some embodiments of the present invention, the central axis of the adsorption surface is coaxial with the rotation axis of the first rotating member.

[0012] According to some embodiments of the present invention, it further includes multiple optical path adjustment mechanisms, each of which is configured in correspondence with each of the emission ports. Each optical path adjustment mechanism includes a galvanometer group, which is disposed between the laser and the processing platform and is located on the optical path of the laser emitted from the corresponding emission port.

[0013] According to some embodiments of the present invention, the optical path adjustment mechanism further includes a beam expander group and a focusing field lens group. The beam expander group is disposed on the side of the galvanometer group facing the emission port, and the focusing field lens group is disposed on the side of the galvanometer group facing the fixed component. Both the beam expander group and the focusing field lens group are located on the optical path of the laser emitted from the corresponding emission port.

[0014] According to some embodiments of the present invention, the optical path adjustment mechanism further includes a folding mirror group, which is disposed on the side of the laser's emission port facing the galvanometer group. The folding mirror group includes multiple mirrors with adjustable angles, and the multiple mirrors are all located on the optical path of the laser emitted from the corresponding emission port.

[0015] This utility model has at least the following beneficial effects:

[0016] In this invention, the material to be processed is first fixed on the fixing component of the processing platform. Then, one of the laser's emission ports emits a laser of a specific wavelength to process the upper material layer of the material. Since the optical paths of the lasers emitted from each emission port intersect with the moving path of the fixing component, after processing, the fixing component can move in the x-direction to the optical path of the laser emitted from another emission port, where another laser of a different specific wavelength is emitted to process the lower material layer of the material. This allows for the processing of the composite matrix material to be completed in a single loading operation. Because only one loading operation is required, there is no issue of deviation in the fixed position of the material during two loading operations. This ensures that the two processing trajectories remain overlapping under the same control logic, improving overall processing accuracy and efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of a laser processing device provided in an embodiment of this utility model;

[0019] Figure 2 for Figure 1 A schematic diagram of the processing platform.

[0020] Explanation of reference numerals in the attached figures:

[0021] 100-Laser processing device; 1-Frame; 11-Universal wheel; 12-Support component; 2-Laser; 21-Emitting port; 3-Processing platform; 31-Fixing component; 311-Connecting seat; 312-Second rotating component; 32-XY drive component; 33-Mounting seat; 34-First rotating component; 4-Optical path adjustment mechanism; 41-Galvanometer group; 42-Beam expander group; 43-Focusing field lens group; 44-Reflecting mirror group; 441-Reflecting mirror. Detailed Implementation

[0022] The technical solutions in the embodiments of this utility model are described clearly and completely below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0025] This utility model provides a laser processing device. Figures 1 to 2 This invention provides a specific embodiment of a laser processing device.

[0026] like Figure 1 and Figure 2 As shown, this utility model embodiment provides a laser processing device 100, including a frame 1, a laser 2, and a processing platform 3. The laser 2 and the processing platform 3 are both mounted on the frame 1. The laser 2 has multiple emission ports 21 that can emit lasers of different wavelengths respectively. The multiple emission ports 21 are spaced apart in the x-direction. The processing platform 3 includes a fixing component 31 for fixing the material to be processed. The fixing component 31 is movable relative to the frame 1 in the x-direction. The optical path of the laser emitted from each emission port 21 intersects the moving path of the fixing component 31.

[0027] In this invention, the material to be processed is first fixed on the fixing component 31 of the processing platform 3. Then, one of the emission ports 21 of the laser 2 emits a laser of a specific wavelength to perform laser processing on the upper material layer of the material to be processed. Since the optical paths of the lasers emitted from each emission port 21 intersect with the moving path of the fixing component 31, after processing, the fixing component 31 can move in the x-direction to the optical path of the laser emitted from another emission port 21, from which another laser of a specific wavelength is emitted to perform laser processing on the lower material layer of the material to be processed, thus achieving the processing of the composite matrix material in a single loading operation. Because only one loading operation is performed, there is no problem of deviation in the fixed position of the material to be processed during two loading operations, ensuring that the two processing trajectories remain overlapping under the same control logic, thereby improving the overall processing accuracy and efficiency.

[0028] It should be noted that in some embodiments, such as Figure 1 As shown, the bottom of the frame 1 is provided with multiple casters 11, which makes the laser processing device 100 movable. On the one hand, this makes the laser processing device 100 easier to transport, and on the other hand, it makes the laser processing device 100 suitable for various work sites.

[0029] Preferably, such as Figure 1 As shown, the bottom of the frame 1 is provided with multiple support members 12, which are movable relative to the frame 1 in the z-direction. When the laser processing device 100 needs to be moved, the multiple support members 12 rise and contact the ground through the casters 11. After the laser processing device 100 moves to the workstation, the multiple support members 12 descend and contact the ground, thus fixing the laser processing device 100 on the workstation.

[0030] In order to ensure that the optical paths of the lasers emitted from each of the emission ports 21 intersect the moving path of the fixed component 31, the emission ports 21 need to be located above the fixed component 31. This restricts the installation position of the laser 2. Therefore, in some embodiments, such as Figure 1 As shown, the laser processing apparatus 100 further includes multiple optical path adjustment mechanisms 4, each corresponding to one of the emission ports 21. Each optical path adjustment mechanism 4 includes a galvanometer group 41, which is located between the laser 2 and the processing platform 3, and positioned on the optical path of the laser emitted from the corresponding emission port 21. This arrangement allows the laser 2 to be placed flat on the frame 1, with the emission port 21 emitting a horizontal laser beam. The laser beam is reflected by the reflecting mirrors within the galvanometer group 41, thus changing the optical path of the laser and allowing it to act on the material to be processed on the fixed assembly 31 for laser processing.

[0031] To prevent the reflective lens from directly contacting the high-energy light beam, which could lead to coating ablation or thermal deformation, in some embodiments, such as... Figure 1 As shown, the optical path adjustment mechanism 4 further includes a beam expander group 42 and a focusing field lens group 43. The beam expander group 42 is located on the side of the galvanometer group 41 facing the emission port 21, and the focusing field lens group 43 is located on the side of the galvanometer group 41 facing the fixing component 31. Both the beam expander group 42 and the focusing field lens group 43 are located on the optical path of the laser emitted from the corresponding emission port 21. With this configuration, the laser emitted from the emission port 21 is first expanded by the beam expander group 42 to reduce the energy density of the laser. After being reflected by the reflecting mirror inside the galvanometer group 41, the laser is focused by the focusing field lens to increase the energy density of the laser. Expanding the laser beam before focusing it can, on the one hand, avoid the reflecting mirror directly contacting the high-energy beam, which could lead to coating ablation or thermal deformation; on the other hand, the divergence angle can be compressed during beam expansion to reduce the focused spot, significantly improving the energy density of the focused laser.

[0032] Furthermore, in some embodiments, such as Figure 1 As shown, the optical path adjustment mechanism 4 further includes a retroreflector group 44, which is located on the side of the laser 2's emission port 21 facing the galvanometer group 41. The retroreflector group 44 includes multiple adjustable-angle reflectors 441, all of which are located on the optical path of the laser emitted from the corresponding emission port 21. With this arrangement, the optical path of the laser emitted from the emission port 21 can be changed through reflection by the multiple reflectors 441 and adjustment of the angle of each reflector 441, thus allowing the laser 2 to be installed in any position according to actual needs.

[0033] In some embodiments, such as Figure 1 and Figure 2 As shown, the processing platform 3 also includes an xy drive assembly 32, which is mounted on the frame 1. The xy drive assembly 32 is driven to move in the x and y directions by the fixing assembly 31. This configuration allows the fixing assembly 31 to move in the x and y directions, driven by the xy drive assembly 32, thus moving the material to be processed in the x and y directions. This causes the laser to move relative to the material in the x and y directions, thereby cutting and processing finished products of different shapes.

[0034] To accommodate the cutting needs of materials of different shapes, in some embodiments, such as Figure 2As shown, the processing platform 3 also includes a mounting base 33 and a first rotating component 34. The mounting base 33 is connected to the xy drive assembly 32, and the first rotating component 34 is connected to the fixed assembly 31. The axis of the first rotating component 34 extending along the y-direction is rotatably set relative to the mounting base 33. When cutting materials with wavy end faces, the cutting angle changes when the laser cuts the curved end face, which affects the cutting quality. Therefore, by rotating the first rotating component 34, the fixed assembly 31 is driven to rotate, causing the material to be cut to rotate, thereby ensuring that the end face is perpendicular to the laser and improving the cutting quality.

[0035] Different materials require lasers with different defocusing amounts for cutting; therefore, in some embodiments, such as... Figure 2 As shown, the mounting base 33 is movable relative to the xy drive platform in the z-direction. This configuration allows adjustment of the distance between the laser focus and the material to be processed by raising and lowering the mounting base 33. By changing the defocusing amount, the laser spot diameter and energy density can be adjusted to suit the cutting requirements of different materials.

[0036] The specific method by which the fixing component 31 fixes the material to be processed is not limited; it can be a clamping method or an adsorption method. In this embodiment, for example... Figure 2 As shown, the fixing component 31 has an adsorption surface for adsorbing and fixing the material to be processed. With this configuration, the adsorption method exposes the entire end face of the material to be processed to the laser. Compared with the clamping method, there are no dead corners in the cutting, and more shapes can be cut. In addition, the fixing component 31 can provide support for the material to be processed, preventing the material from shaking slightly during laser cutting and affecting the cutting quality.

[0037] Furthermore, in some embodiments, such as Figure 2 As shown, the fixing component 31 includes a connecting seat 311 and a second rotating member 312. The connecting seat 311 is connected to the first rotating member 34. The second rotating member 312 is rotatably disposed relative to the connecting seat 311, and the axis of rotation is perpendicular to the axis of rotation of the first rotating member 34. The adsorption surface is formed on the side of the second rotating member 312 facing away from the connecting seat 311. With this configuration, the laser can cut various shapes on the material to be processed through the cooperative rotation of the first rotating member 34 and the second rotating member 312.

[0038] Furthermore, in some embodiments, such as Figure 2As shown, the central axis of the adsorption surface is coaxial with the rotation axis of the first rotating member 34. This arrangement ensures that when the first rotating member 34 rotates, the material to be processed adsorbed on the adsorption surface rotates along the axis of rotation of the first rotating member 34, making it convenient for operators to adjust the rotation parameters of the first rotating member 34 according to the cutting trajectory of the material to be processed.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser processing apparatus characterized by comprising: The machine frame, the laser and the processing platform are arranged on the machine frame, the laser has a plurality of emitting ports for emitting laser beams of different wavelengths, the emitting ports are arranged at intervals in the x direction, the processing platform comprises a fixing assembly for fixing materials to be processed, the fixing assembly is arranged to move in the x direction relative to the machine frame, and the light paths of the laser beams emitted by the emitting ports intersect the moving path of the fixing assembly.

2. The laser processing apparatus according to claim 1, wherein The processing platform further comprises an xy driving assembly arranged on the machine frame, the xy driving assembly is drivingly connected to the fixing assembly, and the fixing assembly is driven by the xy driving assembly to move in the x direction and the y direction.

3. The laser processing apparatus according to claim 2, wherein The processing platform further comprises a mounting seat and a first rotating member, the mounting seat is connected to the xy driving assembly, and the first rotating member is connected to the fixing assembly, the first rotating member is arranged to rotate relative to the mounting seat along an axis extending in the y direction.

4. The laser processing apparatus according to claim 3, wherein The mounting seat is arranged to move in the z direction relative to the xy driving assembly.

5. The laser processing apparatus according to claim 3, wherein The fixing assembly has an adsorption surface for adsorbing and fixing the materials to be processed.

6. The laser processing apparatus according to claim 5, wherein The fixing assembly comprises a connecting seat and a second rotating member, the connecting seat is connected to the first rotating member, the second rotating member is arranged to rotate relative to the connecting seat, and the axis direction of the rotation of the second rotating member is perpendicular to the axis direction of the rotation of the first rotating member, and the second rotating member is formed with the adsorption surface on the side opposite to the connecting seat.

7. The laser processing apparatus according to claim 5, wherein The central axis of the adsorption surface is coaxially arranged with the rotating shaft of the first rotating member.

8. The laser processing apparatus of claim 1, wherein A plurality of light path adjusting mechanisms are arranged one-to-one corresponding to the emitting ports, each light path adjusting mechanism comprises a galvanometer group, the galvanometer group is arranged between the laser and the processing platform and located on the light path of the laser beam emitted by the corresponding emitting port.

9. The laser processing apparatus as claimed in claim 8, wherein The light path adjusting mechanism further comprises an expander mirror group and a focusing field mirror group, the expander mirror group is arranged on the side of the galvanometer group facing the emitting port, the focusing field mirror group is arranged on the side of the galvanometer group facing the fixing assembly, and the expander mirror group and the focusing field mirror group are located on the light path of the laser beam emitted by the corresponding emitting port.

10. The laser processing apparatus as claimed in claim 8, wherein The light path adjusting mechanism further comprises a turnaround mirror group, the turnaround mirror group is arranged on the side of the emitting port of the laser facing the galvanometer group, the turnaround mirror group comprises a plurality of reflecting mirrors with adjustable angles, and the plurality of reflecting mirrors are located on the light path of the laser beam emitted by the corresponding emitting port.

Images