Cavity structure for horizontal double-sided electroplating

Abstract

The utility model provides a horizontal double-sided electroplated cavity structure which comprises a lower cavity assembly and a liftable upper cover assembly, the lower cavity assembly comprises a lower cavity body, a first anode disc and a first jet flow disc, the lower cavity body is provided with a first anode groove, a jet flow disc mounting step, a low liquid level limiting step and a high liquid level limiting step from inside to outside in a step-up mode, a plurality of first anode terminals are distributed in the first anode groove in a multi-ring circumferential mode, and the first anode disc is positioned on the first anode terminals. The first jet flow disc is mounted on the jet flow disc mounting step, a low-liquid-level liquid discharging groove is annularly formed in the middle of the low-liquid-level limiting step, a first liquid inlet is formed in the middle of the first anode groove, and high-liquid-level liquid discharging grooves are formed in the four corners of the high-liquid-level limiting step respectively. The utility model relates to the field of TGV electroplating technology.

Description

Technical Field

[0001] This utility model relates to the field of TGV electroplating process, and in particular to a cavity structure for horizontal double-sided electroplating. Background Technology

[0002] In the TGV (Through Glass Via) electroplating process, the horizontal double-sided electroplating chamber is a key piece of equipment for achieving uniform plating on both sides of the panel and semiconductor circuitry. However, the liquid level control design of the existing electroplating chamber has significant shortcomings. Traditional chambers typically use a fixed liquid level mode, which cannot distinguish the liquid level requirements of the loading / unloading stage and the electroplating stage. During loading / unloading, if the liquid level fails to drop to a safe range quickly, the electroplating solution is prone to splashing out and contaminating the fixtures or equipment. Furthermore, if the liquid level cannot be stably maintained at a high level during the electroplating process, it will lead to anode exposure, making double-sided electroplating impossible.

[0003] In addition, traditional anode layouts often adopt single-layer or simple partitioned designs, with current density distribution concentrated in the central area. This results in significant differences in the uniformity of the plating layer between the edge and the central area of ​​the electroplated part, making it difficult to meet the stringent requirements of high-precision semiconductor circuits for plating consistency. Furthermore, existing jetting disks mostly adopt a planar fixed structure and lack a stepped positioning design. During installation, the jetting direction is easily deviated due to the accumulation of tolerances, which in turn affects the uniformity of the plating solution flow and exacerbates the problem of uneven plating distribution.

[0004] Regarding the drainage system, existing technologies rely on a single level control valve, which cannot achieve efficient switching between rapid drainage at low levels during the loading and unloading stage and stable overflow at high levels during the electroplating stage. This design not only leads to low level regulation efficiency but also poses a risk to process stability due to valve switching delays or leaks, severely restricting the improvement of electroplating yield.

[0005] Therefore, the inventors urgently need a cavity structure with horizontal double-sided electroplating to solve the above problems. Utility Model Content

[0006] To address the shortcomings of the existing technology, this utility model provides a cavity structure for horizontal double-sided electroplating, aiming to solve the problems of inaccurate liquid level control, uneven anode current distribution, and insufficient jet stability in the existing horizontal double-sided electroplating cavity.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a cavity structure for horizontal double-sided electroplating, including a lower cavity assembly and a liftable upper cover assembly. The lower cavity assembly includes a lower cavity body, a first anode plate, and a first jet plate. The lower cavity body is provided with a first anode groove, a jet plate mounting step, a low liquid level limiting step, and a high liquid level limiting step in a stepped manner from the inside to the outside. A plurality of first anode terminals are distributed in multiple rings around the first anode groove. The first anode plate is positioned on the plurality of first anode terminals. The first jet plate is mounted on the jet plate mounting step. A low liquid level drain groove is provided in a ring shape in the middle of the low liquid level limiting step. A first liquid inlet is provided in the middle of the first anode groove. High liquid level drain grooves are provided at the four corners of the high liquid level limiting step.

[0008] Based on the above, the beneficial effect of a cavity structure for horizontal double-sided electroplating is that it solves the problems of inaccurate liquid level control, uneven anode current distribution, and insufficient jet stability in existing horizontal double-sided electroplating cavities; mainly reflected in:

[0009] 1. This utility model achieves precise layered control of the electroplating liquid level by setting a first anode tank, a jet plate installation step, a low liquid level limiting step, and a high liquid level limiting step in the lower cavity body. It solves the problem of accurately lowering the liquid level to the low liquid level limiting step when loading and unloading plates in traditional electroplating chambers, without having to drain all the electroplating liquid, and avoiding splashing and overflow caused by excessive liquid level during electroplating.

[0010] 2. This utility model uses a number of first anode terminals arranged in multiple rings around the first anode tank to allow the anode current to be independently controlled by region, which solves the problem of uneven current distribution in traditional electroplating chambers and ensures the uniformity of the plating layer in the center and edge areas of the electroplated part.

[0011] 3. This utility model uses a stepped installation method to fix the first spray plate, which ensures the horizontal installation accuracy of the spray plate, solves the problem of uneven distribution of electroplating solution caused by installation deviation in traditional spray plates, and improves the stability of plating solution flow.

[0012] 4. This utility model achieves dual-mode switching between rapid drainage at low liquid level during loading and unloading and stable overflow at high liquid level during electroplating by using a low liquid level limiting step and a high liquid level limiting step for a high liquid level drainage tank. This solves the problems of low efficiency and easy leakage in traditional drainage systems and improves process reliability.

[0013] Furthermore, the upper cover assembly includes an upper cover body, a second anode plate, and a second spray plate. The upper cover body includes an egg-shaped frame connected to an external lifting mechanism and an upper spray frame disposed at the bottom of the egg-shaped frame. The bottom of the upper spray frame is provided with a second anode groove. Several second anode terminals are distributed in multiple rings around the second anode groove. The second anode plate is positioned on several second anode terminals. The second spray plate is installed outside the second anode groove. A second liquid inlet is provided in the middle of the second anode groove.

[0014] Based on the above, the beneficial effect of the egg-shaped frame is that its arc structure and rigid connection with the external lifting mechanism ensure the horizontal stability of the upper spray frame; the beneficial effect of the second anode groove is that the second anode plate is positioned by the multi-ring circumferentially distributed second anode terminals, which solves the problem of uneven distribution of upper anode current and improves the uniformity of the coating thickness on the upper surface of the electroplated parts.

[0015] Furthermore, the low-level drain tank is connected to an external drain system via a first drain pipe, and the high-level drain tank is connected to an external drain system via a second drain pipe, with each of the first and second drain pipes equipped with an independent valve.

[0016] Based on the above, the beneficial effects of the low-level drain tank are that, through the ring structure and the rapid flow guidance of the first drain pipe, it solves the problem of low electroplating solution discharge efficiency during loading and unloading, and enables the liquid level in the cavity to drop rapidly to a safe height; the beneficial effects of the high-level drain tank are that, through the four-corner distribution and the overflow control of the second drain pipe, it solves the risk of plating solution overflow caused by liquid level fluctuations during electroplating, and maintains process stability; the beneficial effects of the independent valve are that, by separately controlling the on / off state of the first and second drain pipes, it solves the contradiction between rapid drainage and precise overflow that traditional single-valve systems cannot simultaneously achieve, and enables flexible switching of liquid level modes.

[0017] Furthermore, both the first jet disk and the second jet disk are porous disk structures. The first jet disk is connected to the first liquid inlet through a first liquid inlet pipe, and the second jet disk is connected to the second liquid inlet through a second liquid inlet pipe.

[0018] Based on the above, the beneficial effect of the multi-hole disk structure is that it forms a laminar liquid curtain through a uniformly distributed array of nozzles, which solves the problem of uneven plating solution distribution caused by traditional single-point spraying and achieves uniform coverage of plating solution on the workpiece surface.

[0019] Furthermore, the cavity structure also includes a rotating clamp assembly, which includes a drive unit and a clamping part disposed at the output end of the drive unit. The drive unit surrounds the outside of the lower cavity assembly, and the clamping end of the clamping part extends between the low liquid level limiting step and the high liquid level limiting step. The clamping part includes a cathode ring, a plurality of cathode conductive rods circumferentially distributed at the lower end of the cathode ring, and a clamping support frame. The cathode ring is fixed above the high liquid level limiting step, and the lower ends of the plurality of cathode conductive rods are connected to the clamping support frame through cathode conductive blocks.

[0020] Based on the above, the beneficial effects of the rotating fixture assembly are as follows: Through the linkage design of the drive unit and the fixture unit, it solves the electroplating dead angle problem caused by traditional fixed fixtures, achieving uniform electroplating on both sides of the workpiece; the beneficial effect of the drive unit is that, by being positioned around the outer side of the lower cavity assembly, it solves the problem of traditional center drives occupying electroplating space, optimizing the utilization rate of the cavity's internal space; the beneficial effect of the cathode ring is that, by being fixed above the high liquid level limiting step, it allows the electrical signal from the power cathode to be introduced into the fixture unit through the drive unit, and finally reaches the electroplating solution; the beneficial effect of the cathode conduction rod is that, by connecting the cathode conduction blocks circumferentially, it solves the problem of excessive current density at a single point, achieving stable conduction through multiple channels; the beneficial effect of the fixture support frame is that it clamps the electroplated parts, ensuring the positional accuracy of the electroplating process; the beneficial effect of the cathode conduction blocks is that they directly conduct cathode electrical signals to the electroplating solution, optimizing current conduction efficiency.

[0021] Furthermore, both the first anode disk and the second anode disk are annular insoluble anodes. The annular regions of the first anode disk and the second anode disk are concentrically distributed and independently controlled, and the first anode terminal and the second anode terminal are respectively connected to multiple independent power supplies.

[0022] Based on the above, the beneficial effects of the annular insoluble anode are as follows: by using corrosion-resistant materials to make the annular structure, it solves the problem of plating solution contamination caused by the consumption of traditional soluble anodes, extends the anode's service life, and maintains the purity of the plating solution; the beneficial effects of concentric distribution and independent control are as follows: by arranging the annular areas of the upper and lower anode disks concentrically and controlling them independently, it solves the problem of uneven plating thickness caused by edge effects during electroplating, and achieves precise control of the current density on the workpiece surface.

[0023] Furthermore, during the electroplating operation, the height of the second anode tank is located between the low liquid level limiting step and the high liquid level limiting step.

[0024] To more clearly illustrate the above-mentioned features of this utility model and the objectives it aims to achieve, the present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0025] Figure 1 : This is an exploded view of the present invention;

[0026] Figure 2 : This is an exploded view of the present invention from another perspective;

[0027] Figure 3 : This is a schematic diagram showing the clamping part of this utility model located inside the lower cavity body;

[0028] Figure 4 : This is a schematic diagram of the first anode groove of this utility model;

[0029] Figure 5 : This is a schematic diagram of the installation of the second anode disk of this utility model;

[0030] Figure 6 : This is a schematic diagram of the second anode groove of this utility model.

[0031] Reference numerals: 1-Lower cavity assembly, 11-Lower cavity body, 111-First anode tank, 1111-First anode terminal, 1112-First liquid inlet, 112-Spray plate mounting step, 113-Low liquid level limiting step, 1131-Low liquid level drain tank, 1132-First drain pipe, 114-High liquid level limiting step, 1141-High liquid level drain tank, 1142-Second drain pipe, 12-First anode plate, 13-First spray plate, 131-First... 1. Liquid inlet pipe; 2. Rotating clamp assembly; 21. Drive unit; 22. Clamp unit; 221. Cathode ring; 222. Cathode conduction rod; 223. Clamp support frame; 224. Cathode conduction block; 3. Upper cover assembly; 31. Upper cover body; 311. Egg-shaped frame; 312. Upper spray frame; 3121. Second anode groove; 3122. Second anode terminal; 3123. Second liquid inlet; 32. Second anode plate; 33. Second jet plate; 331. Second liquid inlet pipe. Detailed Implementation

[0032] like Figures 1-6As shown, a cavity structure for horizontal double-sided electroplating includes a lower cavity assembly 1 and a liftable upper cover assembly 3. The lower cavity assembly 1 includes a lower cavity body 11, a first anode plate 12, and a first jet plate 13. The lower cavity body 11 is provided with a first anode groove 111, a jet plate mounting step 112, a low liquid level limiting step 113, and a high liquid level limiting step 114 arranged in a stepped manner from the inside to the outside. A plurality of first anode terminals 1111 are arranged in multiple rings around the first anode groove 111. The first anode plate 12 is positioned on the plurality of first anode terminals 1111. The first jet plate 13 is installed on the jet plate mounting step 112. A low liquid level drain groove 1131 is arranged in a ring shape in the middle of the low liquid level limiting step 113. A first liquid inlet 1112 is arranged in the middle of the first anode groove 111. High liquid level drain grooves 1141 are respectively arranged at the four corners of the high liquid level limiting step 114.

[0033] The upper cover assembly 3 includes an upper cover body 31, a second anode disk 32, and a second spray disk 33. The upper cover body 31 includes an egg-shaped frame 311 connected to an external lifting mechanism and an upper spray frame 312 disposed at the bottom of the egg-shaped frame 311. The bottom of the upper spray frame 312 is provided with a second anode groove 3121. Several second anode terminals 3122 are distributed in multiple rings around the second anode groove 3121. The second anode disk 32 is positioned on the several second anode terminals 3122. The second spray disk 33 is installed outside the second anode groove 3121. A second liquid inlet 3123 is provided in the middle of the second anode groove 3121.

[0034] The low-level drain tank 1131 is connected to the external drain system through the first drain pipe 1132, and the high-level drain tank 1141 is connected to the external drain system through the second drain pipe 1142. The first drain pipe 1132 and the second drain pipe 1142 are each equipped with an independent valve.

[0035] Both the first jet disk 13 and the second jet disk 33 are porous disk structures. The first jet disk 13 is connected to the first liquid inlet 1112 through the first liquid inlet pipe 131, and the second jet disk 33 is connected to the second liquid inlet 3123 through the second liquid inlet pipe 331.

[0036] The cavity structure also includes a rotating clamp assembly 2, which includes a drive unit 21 and a clamping part 22 disposed at the output end of the drive unit 21. The drive unit 21 surrounds the outside of the lower cavity assembly 1. The clamping end of the clamping part 22 extends between the low liquid level limiting step 113 and the high liquid level limiting step 114. The clamping part 22 includes a cathode ring 221, a plurality of cathode conducting rods 222 circumferentially distributed at the lower end of the cathode ring 221, and a clamping support frame 223. The cathode ring 221 is fixed above the high liquid level limiting step 114. The lower ends of the plurality of cathode conducting rods 222 are connected to the clamping support frame 223 through cathode conducting blocks 224.

[0037] Both the first anode disk 12 and the second anode disk 32 are annular insoluble anodes. The annular regions of the first anode disk 12 and the second anode disk 32 are independently controlled in a concentric distribution, and the first anode terminal 1111 and the second anode terminal 3122 are respectively connected to multiple independent power supplies.

[0038] During electroplating, the height of the second anode tank 3121 is located between the low liquid level limiting step 113 and the high liquid level limiting step 114.

[0039] In summary, the specific embodiments of this utility model are as follows:

[0040] During the electroplating preparation stage, the external lifting mechanism drives the upper cover assembly 3 to rise to the open position, and the operator installs the workpiece to be electroplated on the fixture support frame 223.

[0041] During the electroplating solution injection stage, the external lifting mechanism drives the upper cover assembly 3 to descend to the closed position. At this time, the height of the second anode tank 3121 is between the low liquid level limiting step 113 and the high liquid level limiting step 114. The first liquid inlet 1112 and the second liquid inlet 3123 simultaneously introduce electroplating solution. The electroplating solution enters the first spray plate 13 through the first liquid inlet pipe 131 and enters the second spray plate 33 through the second liquid inlet pipe 331 as the liquid level rises.

[0042] During the electroplating process, multiple independent power supplies supply power to the first anode terminal 1111 and the second anode terminal 3122 respectively. The first anode plate 12 and the second anode plate 32 generate an electric field. The drive unit 21 drives the clamping unit 22 to rotate at a constant speed. The workpiece completes double-sided electroplating under the dual action of the electric field and the electroplating solution. During the electroplating process, the high liquid level limiting step 114 maintains the process liquid level. Excess electroplating solution is discharged through the high liquid level drain tank 1141. The independent valve of the second drain pipe 1142 adjusts the opening according to the process requirements to ensure the liquid level is stable. When it is necessary to replace the electroplated part, the low liquid level drain tank 1131 located in the low liquid level limiting step 113 begins to overflow to ensure the liquid level safety during the loading and unloading stage. Then the upper cover assembly 3 is raised to start replacing the new electroplated part.

[0043] When the electroplating is completed, the power supply is stopped and the electroplating solution is drained. The upper cover assembly 3 is raised, and the rotating clamp assembly 2 is rotated to the unloading position. The operator takes out the electroplated workpiece, and the entire system is reset to prepare for the next operation.

[0044] The above description is only the optimal solution embodiment of this utility model and is not intended to limit this utility model. Various modifications or substitutions made by those skilled in the art to this utility model without departing from the essence and protection scope of this utility model should also be within the protection scope of this utility model.

Claims

1. A horizontal dual-sided electroplating cavity structure, characterized by: The application relates to a battery, which comprises a lower cavity assembly (1) and a liftable upper cover assembly (3), wherein the lower cavity assembly (1) comprises a lower cavity body (11), a first anode disc (12) and a first jet disc (13), the lower cavity body (11) is provided with a first anode groove (111), a jet disc mounting step (112), a low liquid level limiting step (113) and a high liquid level limiting step (114) from inside to outside in a step-up manner, a plurality of first anode terminals (1111) are distributed in a multi-ring and circumferential manner in the first anode groove (111), the first anode disc (12) is positioned on the plurality of first anode terminals (1111), the first jet disc (13) is mounted on the jet disc mounting step (112), a low liquid level drainage groove (1131) is annularly arranged in the middle part of the low liquid level limiting step (113), a first liquid inlet (1112) is arranged in the middle part of the first anode groove (111), and high liquid level drainage grooves (1141) are arranged at four corners of the high liquid level limiting step (114) respectively.

2. A horizontal double-sided electroplated cavity structure according to claim 1, wherein: The upper cover assembly (3) comprises an upper cover body (31), a second anode disc (32) and a second jet disc (33), the upper cover body (31) comprises an egg-shaped frame body (311) connected with an external lifting mechanism and an upper spraying frame (312) arranged at the bottom end of the egg-shaped frame body (311), a second anode groove (3121) is arranged at the bottom end of the upper spraying frame (312), a plurality of second anode terminals (3122) are distributed in a multi-ring and circumferential manner in the second anode groove (3121), the second anode disc (32) is positioned on the plurality of second anode terminals (3122), the second jet disc (33) is mounted outside the second anode groove (3121), and a second liquid inlet (3123) is arranged in the middle part of the second anode groove (3121).

3. A horizontal double-sided electroplated cavity structure according to claim 1, wherein: The low liquid level drainage groove (1131) is connected to an external liquid drainage system through a first liquid drainage pipe (1132), the high liquid level drainage groove (1141) is connected to the external liquid drainage system through a second liquid drainage pipe (1142), and the first liquid drainage pipe (1132) and the second liquid drainage pipe (1142) are respectively provided with independent valves.

4. A horizontal double-sided electroplated cavity structure according to claim 2, wherein: The first jet disc (13) and the second jet disc (33) are both porous disc structures, the first jet disc (13) is in communication with the first liquid inlet (1112) through a first liquid inlet pipeline (131), and the second jet disc (33) is in communication with the second liquid inlet (3123) through a second liquid inlet pipeline (331).

5. A horizontal double-sided electroplated cavity down structure according to claim 1, wherein: The cavity structure further comprises a rotating clamp assembly (2), which comprises a driving part (21) and a clamp part (22) arranged at the output end of the driving part (21), the driving part (21) is arranged outside the lower cavity assembly (1), the clamping end of the clamp part (22) extends into the low liquid level limiting step (113) and the high liquid level limiting step (114), the clamp part (22) comprises a cathode ring (221), a plurality of cathode conductive rods (222) distributed circumferentially at the lower end of the cathode ring (221), and a clamp support frame (223), the cathode ring (221) is fixed above the high liquid level limiting step (114), the lower ends of the plurality of cathode conductive rods (222) are connected with the clamp support frame (223) through a cathode conductive block (224).

6. A horizontal double-sided electroplated cavity down structure according to claim 2, wherein: The first anode disc (12) and the second anode disc (32) are annular insoluble anodes, the annular regions of the first anode disc (12) and the second anode disc (32) are independently controlled in concentric distribution, and the first anode terminal (1111) and the second anode terminal (3122) are respectively connected with multiple independent power supplies.

7. A horizontal double-sided electroplated cavity down structure according to claim 2, wherein: During electroplating operation, the height of the second anode groove (3121) is located between the low liquid level limiting step (113) and the high liquid level limiting step (114).

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