Camera module driving device

Abstract

A camera module driving apparatus is provided. The camera module driving apparatus includes a camera module driving integrated circuit IC including: a communication port, a driving port, and a power port; a driver configured to output a driving current based on a set driving intensity within the camera module driving IC; and a driving intensity optimizer configured to sense a voltage of power supplied to at least one of a communication port and a power port in the camera module driving IC, and set the driver to a driving intensity corresponding to the voltage of the power supply; and the driving intensity optimizer is configured to be in a suspended state while changing the driving intensity setting of the driver when the voltage of the power is changed so that the corresponding driving intensity is changed.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0009299, filed on January 22, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0003] The following description pertains to the camera module driver. Background Technology

[0004] Typically, a device may include a camera such as a camera module. For a camera module, it is necessary to control the position of its lens, and the position of the lens that may be included in the camera module can be controlled based on a drive signal.

[0005] Integrated circuits (ICs) can be provided to generate drive signals. The importance of reducing power consumption and miniaturizing / simplifying ICs is increasing.

[0006] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Utility Model Content

[0007] The summary portion of this invention is intended to provide a brief overview of the chosen concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0008] In general, a camera module driving device includes a camera module driving integrated circuit (IC), which includes: a communication port, a driving port, and a power port; a driver configured to output a driving current based on a set driving strength in the camera module driving IC; and a driving strength optimizer configured to sense the voltage of a power supplied to at least one of the communication port and the power port in the camera module driving IC, and configured to set the driver to have a driving strength corresponding to the voltage of the power, wherein the driving strength optimizer is configured to pause while changing the setting of the driving strength of the driver when the voltage of the power changes to cause a corresponding change in the driving strength.

[0009] The drive intensity optimizer can be configured to resume operation after being in the paused state.

[0010] The drive strength optimizer may include: a comparator configured to sense the voltage of the power supply and output a value based on the sensed voltage; and a latch configured to receive the output value based on the sensed voltage and output a set value of the drive strength of the driver; wherein the drive strength optimizer may be configured to pause based on a change in the value based on the sensed voltage input through a first input terminal of a plurality of input terminals of the latch, and may be configured to resume operation based on a value input through a second input terminal of the plurality of input terminals.

[0011] The drive strength optimizer may include: a comparator configured to sense the voltage of the power supply and output a value based on the sensed voltage; and a latch configured to receive the output value based on the sensed voltage and output a set value of the drive strength of the driver; wherein the drive strength optimizer is configured to pause based on a change in the value based on the sensed voltage input through a first input terminal of a plurality of input terminals of the latch.

[0012] The drive strength optimizer may also include a plurality of resistors configured to reduce the voltage of the power at a predetermined ratio and output the reduced voltage of the power to the comparator, and the comparator may be configured to output a value based on a high-low relationship between the voltage output from the plurality of resistors and a reference voltage, as a value output based on the sensed voltage.

[0013] The camera module driver may further include: an interface configured to receive a communication signal through the communication port of the camera module driver IC, wherein the interface may be configured to transmit a communication signal through the communication port based on the drive current of the driver, and the drive strength optimizer may be configured to sense the voltage of the power supplied to the communication port.

[0014] The camera module driver may further include: an interface configured to receive a communication signal through the communication port of the camera module driver IC; and a controller configured to control the drive current of the driver based on the received communication signal, wherein the driver may be configured to output the drive current, wherein a ratio based on the set drive intensity is applied to a current value determined by the controller in the drive current.

[0015] The driver may include: a first driving semiconductor circuit element connected in the bridge structure; and a second driving semiconductor circuit element connected in the bridge structure; wherein the driver may be configured to switch between operation of at least one of the first driving semiconductor circuit element and the second driving semiconductor circuit element based on the set driving strength.

[0016] The size W / L of each of the first driving semiconductor circuit elements can be greater than the size W / L of each of the second driving semiconductor circuit elements.

[0017] The driver may include: a first driving semiconductor circuit element coupled in the bridge structure; a second driving semiconductor circuit element coupled in the bridge structure; and a third driving semiconductor circuit element coupled in the bridge structure; wherein the driver is configured to switch between operation of at least two of the first driving semiconductor circuit element, the second driving semiconductor circuit element, and the third driving semiconductor circuit element based on the set driving strength, wherein the size of each of the third driving semiconductor circuit elements is 1.6 times or greater and 2.4 times or less than the size of each of the first driving semiconductor circuit elements, and is 1.6 times or greater and 2.4 times or less than the size of each of the second driving semiconductor circuit elements, and wherein the size of each of the first driving semiconductor circuit elements is 0.8 times or greater and 1.2 times or less than the size of each of the second driving semiconductor circuit elements.

[0018] In the driver, when set to a first drive strength, a first group of the first or second drive semiconductor circuit elements is turned on, a second group of the first or second drive semiconductor circuit elements can be turned off, and the third drive semiconductor circuit element is turned off. When set to a second drive strength, the first and second drive semiconductor circuit elements are turned on, and the third drive semiconductor circuit element is turned off. Alternatively, the first and second drive semiconductor circuit elements can be turned off, and the third drive semiconductor circuit element is turned on. When set to a third drive strength, a first group of the first or second drive semiconductor circuit elements is turned on, a second group of the first or second drive semiconductor circuit elements is turned off, and the third drive semiconductor circuit element is turned on. When set to a fourth drive strength, the first, second, and third drive semiconductor circuit elements are turned on.

[0019] In general, a camera module driving device includes a camera module driver integrated circuit (IC), which includes: a communication port, a drive port, and a power port; a driver configured to output a drive current based on a set drive strength in the camera module driver IC; and a drive strength optimizer configured to sense the voltage of a power supplied to at least one of the communication port and the power port in the camera module driver IC, and configured to set the driver to have a drive strength corresponding to the voltage of the power, wherein the drive strength optimizer includes: a comparator configured to sense the voltage of the power and output a value based on the sensed voltage; and a latch configured to receive the output value based on the sensed voltage and output the set value of the drive strength of the driver.

[0020] The drive strength optimizer may also include a plurality of resistors configured to reduce the voltage of the power at a predetermined ratio and output the reduced voltage of the power to the comparator, and the comparator may be configured to output a value based on a high-low relationship between the voltage output from the plurality of resistors and a reference voltage, as a value output based on the sensed voltage.

[0021] The camera module driver may further include an interface configured to receive a communication signal through the communication port of the camera module driver IC, wherein the interface is configured to transmit a communication signal through the communication port based on the drive current of the driver, and wherein the drive strength optimizer is configured to sense the voltage of the power supplied to the communication port.

[0022] The camera module driving device may further include: an interface configured to receive a communication signal through the communication port of the camera module driving IC; and a controller configured to control the drive current of the driver based on the received communication signal; wherein the driver is configured to output the drive current, in which a ratio based on the set drive intensity is applied to a current value determined by the controller.

[0023] The driver may include: a first driving semiconductor circuit element coupled in the bridge structure; and a second driving semiconductor circuit element coupled in the bridge structure, wherein the driver is configured to switch between operation of at least one of the first driving semiconductor circuit element and the second driving semiconductor circuit element based on the set driving strength.

[0024] Other features and aspects will become apparent from the accompanying drawings and the detailed description below. Attached Figure Description

[0025] Figure 1 An exemplary camera module driver and an exemplary device including a camera module are shown according to one or more embodiments.

[0026] Figure 2A and Figure 2B An exemplary camera module drive device is shown, which optimizes the drive strength of a first driver (included in the driver) according to one or more embodiments.

[0027] Figure 3A and Figure 3B An exemplary camera module drive device is shown that optimizes the drive strength of a second driver (included in the driver) according to one or more embodiments.

[0028] Figure 4A and Figure 4B This is a circuit diagram illustrating a driver for an exemplary camera module driver according to one or more embodiments.

[0029] Figure 5A The diagram illustrates the correspondence between the drive strength setting value of the driver of an exemplary camera module driving device according to one or more embodiments and the on / off states of the first drive semiconductor circuit element, the second drive semiconductor circuit element, and the third drive semiconductor circuit element.

[0030] Figure 5B and Figure 5C It shows the basis Figure 5A A diagram showing the corresponding relationship between the drive current of the driver.

[0031] Figure 6A , Figure 6B , Figure 6C , Figure 6D and Figure 6E This is a circuit diagram illustrating an exemplary camera module driver according to one or more embodiments.

[0032] Figure 7 This is a graph showing the timing of voltage changes for the power supplied through the port, the power supplied to the camera module driver IC, and the reset voltage changes for the drive intensity optimizer.

[0033] Figure 8 This is a flowchart illustrating the operational sequence of an exemplary camera module driver according to one or more embodiments.

[0034] Throughout the accompanying drawings and detailed embodiments, the same reference numerals refer to the same elements unless otherwise described. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and descriptions of elements in the drawings may be exaggerated. Detailed Implementation

[0035] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding the disclosure of this application. For example, the order of operations described herein and / or the sequence of operations described herein are merely examples and are not limited to the order set forth herein, except for the order of operations and / or the order of operations which must occur in a specific sequence, but can be changed, as will become apparent upon understanding the disclosure of this application. As another example, the order of operations and / or the order of operations can be performed in parallel, except for the order of operations and / or at least a portion of the order of operations which must occur in a sequence (e.g., a specific sequence). Furthermore, for clarity and conciseness, descriptions of features known upon understanding the disclosure of this application may be omitted.

[0036] Although terms such as “first,” “second,” and “third,” or A, B, (a), (b), may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Each of these terms is not intended to define, for example, the importance, sequence, or order of the corresponding component, part, region, layer, or section, but only to distinguish the corresponding component, part, region, layer, or section from other components, parts, regions, layers, or sections. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as the second component, second part, second region, second layer, or second section.

[0037] Throughout this specification, when a component, element, or layer is described as "on another component, element, or layer," "connected to," "attached to," or "joined to" another component, element, or layer, it may be directly "on another component, element, or layer," directly "connected to," "attached to," or "joined to" another component, element, or layer (e.g., in contact with another component, element, or layer), or one or more other components, elements, or layers may reasonably be present between that component, element, or layer and that other component, element, or layer. When a component, element, or layer is described as "directly on another component, element, or layer," "directly connected to," "directly attached to," or "directly joined to" another component, element, or layer, then there are no other components, elements, or layers between that component, element, or layer and that other component, element, or layer. Similarly, expressions such as "between" and "directly between," and "adjacent" and "directly adjacent" may also be interpreted as described above.

[0038] The terminology used herein is for describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to equally include the plural forms. As non-limiting examples, the terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof, or alternatives to the stated features, quantities, operations, components, elements, and / or combinations thereof. Furthermore, while one embodiment may describe the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof using the terms “comprising,” “including,” and “having,” other embodiments may exist in which one or more of the stated features, quantities, operations, components, elements, and / or combinations thereof are absent.

[0039] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items. Phrases such as “at least one of A, B, and C” are intended to have a disjunctive meaning, and these phrases also include examples in which one or more of A, B, and C may be present (e.g., any combination of one or more of A, B, and C), unless the corresponding description and implementation require that the enumeration (e.g., “at least one of A, B, and C”) be interpreted as having a conjunctive meaning.

[0040] The features described herein may be embodied in various forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatus, and / or systems described herein will be apparent upon understanding the disclosure of this application. In this document, the use of the term “may” (e.g., regarding what an example or implementation may include or implement) with respect to an example or implementation means that there exists at least one example or implementation that includes or implements such a feature, and that all examples or implementations are not limited thereto. The terms “example” or “implementation” as used herein have the same meaning (e.g., the phrase “in one example” has the same meaning as “in one implementation,” and “in one or more examples” has the same meaning as “in one or more implementations”).

[0041] One or more examples may provide a camera module driver that stably optimizes the drive strength of the driver based on changes in the voltage of the supplied power supply.

[0042] Reference Figure 1An exemplary camera module driver device according to embodiments of the present disclosure may include a camera module driver IC 100a. A device including a camera module driver device may also include a camera module 200, a processor 310, and an image sensor 320.

[0043] In the example, the device may be, but is not limited to, a vehicle, a smartphone, a personal digital assistant, a digital camera, a digital still camera, a network system, a computer, a monitor, a tablet computer, a laptop computer, a netbook, a television, a video game, a smartwatch, an automotive part, etc.

[0044] Camera module 200 may include lens 210, the position of which can be controlled based on the drive current of camera module driver IC 100a. In the example, lens 210 may be implemented as a lens module in which multiple lenses can be arranged, may be located at the center of camera module 200, and may include a permanent magnet such that its position is controlled by a magnetic field. The position of lens 210 can be controlled in the Z-axis direction by autofocus (AF) control, and can be controlled in the X-axis or Y-axis direction by optical image stabilization (OIS-X, OIS-Y). In the example, camera module 200 may include position sensors (such as Hall sensors) and accelerometer sensors (such as gyroscope sensors), and the position of lens 210 can be controlled based on the detection results of the position sensors and accelerometer sensors.

[0045] In the example, camera module 200 may include a printed circuit board, and Figure 3A and Figure 3B The drive coil L' shown can be mounted on a printed circuit board within the camera module 200. In this example, the camera module driver IC 100a can also be mounted on the printed circuit board and positioned around the winding of the drive coil L'.

[0046] Image sensor 320 can generate an image by receiving light passing through lens 210. In this example, image sensor 320 may include a CMOS image sensor and may include an image sensor package that provides placement space for the CMOS image sensor. In this example, camera module 200 may be disposed on the Z-axis upper surface of the image sensor package, and the CMOS image sensor may be disposed between the image sensor package and camera module 200.

[0047] According to an embodiment, the camera module driver IC 100a can output a drive current to control the position of the image sensor 320 instead of the lens 210. In this example, the image sensor 320 may be one of the components included in the camera module 200. The method for controlling the position of the lens 210 may be a lens shifting method, and the method for controlling the position of the image sensor 320 may be a sensor shifting method. The camera module driver IC 100a can output the drive current based on the lens shifting method and / or the sensor shifting method.

[0048] At least one of the processor 310 and the image sensor 320 can send communication signals to a camera module driver device including the camera module driver IC 100a. The camera module driver IC 100a can receive communication signals through the interface 110.

[0049] Processor 310 can receive images from image sensor 320. In this example, processor 310 may be an application processor (AP) configured to execute a specific application within the device. In a non-limiting example, the AP may be an image signal processor (ISP). Alternatively, if the device is relatively small, processor 310 may be a processor that controls the overall operation of the device (e.g., a main processor, a core processor).

[0050] An apparatus including a camera module driving device according to one or more embodiments may include an IC power system and a first power system, and may also include a second power system based on an embodiment. In the example, the IC power system, the first power system, and the second power system may be used as paths through which IC power (e.g., 2.8V), first power (e.g., 1.2V), and second power (e.g., 1.8V) supplied from the PMIC (Power Management Integrated Circuit) pass.

[0051] In the example, the IC power system can be connected to the camera module driver IC 100a and / or an additional driver, and the first and second power systems can be connected to the processor 310, the image sensor 320, the gyroscope sensor, the pull-up resistor, and the electrically erasable programmable read-only memory (EEPROM).

[0052] Communication between at least two of the camera module driver IC 100a, processor 310, image sensor 320, gyroscope sensor, additional driver, and EEPROM can be configured based on at least one of I2C (internal integrated circuit), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), and general purpose input / output (GPIO).

[0053] In the example, communication between the camera module driver IC 100a and the processor 310 can be based on I2C, communication between the camera module driver IC 100a and the image sensor 320 can be based on GPIO, communication between the camera module driver IC 100a and the gyroscope sensor can be based on SPI, and communication between the processor 310 and the image sensor 320 can be based on MIPI.

[0054] In the example, a device including a camera module driver according to one or more embodiments may include a first power system and a second power system. MIPI may be based on the first power system, and I2C, GPIO, and SPI may be based on the second power system. Since the camera module driver IC 100a can transmit and receive communication signals based on at least one of I2C, GPIO, and SPI, the voltage level (e.g., 1.8V) of the communication signals transmitted and received by the camera module driver IC 100a based on the second power system can be higher than the voltage level (e.g., 1.2V) of the first power system, and therefore can be high. Consequently, the level (e.g., 1.8V) of the power used by the camera module driver IC 100a to output drive current can also be high, and the drive current can be increased overall.

[0055] In the example, a device including a camera module driver according to one or more embodiments may include a first power system. I2C, GPIO, SPI, and MIPI may be based on the first power system. Since the camera module driver IC 100a can transmit and receive communication signals based on at least one of I2C, GPIO, SPI, and MIPI, the voltage level (e.g., 1.2V) of the communication signals transmitted and received by the camera module driver IC 100a based on the first power system can be low. Therefore, the level (e.g., 1.2V) of the power used by the camera module driver IC 100a to output drive current can also be low, and the drive current can be smaller overall.

[0056] According to one or more embodiments, the device including the camera module driver may use a first power system and a second power system, or use an additional power system, or the voltage levels of the first power system and the second power system may vary depending on the device design. From the design perspective of the camera module driver IC 100a, the design or manufacturing information of the device may be uncertain.

[0057] Therefore, the camera module driver IC 100a can effectively optimize the output drive current by flexibly responding to uncertainties in device design information. In the example, when the camera module driver IC 100a outputs a drive current based on a relatively high voltage level (e.g., 1.8V) of the second power system, it can optimize the drive current by reducing the drive current intensity. In the example, when the camera module driver IC 100a outputs a drive current based on a relatively low voltage level (e.g., 1.2V) of the first power system, it can optimize the drive current by increasing the drive current intensity.

[0058] Figure 2A This is a block diagram illustrating the structure of a drive strength optimizer 130 of a camera module drive device 1000a according to one or more embodiments, the drive strength optimizer 130 optimizing the drive strength of a first driver 120a, and Figure 2B This is a block diagram showing the suspension of the drive intensity optimizer 130 of the camera module drive device 1000a. Figure 3A This is a block diagram illustrating the structure of a drive strength optimizer 130 of a camera module drive device 1000b according to one or more embodiments, which optimizes the drive strength of a second driver 120b, and Figure 3B This is a block diagram showing the pause of the drive intensity optimizer 130 of the camera module drive device 1000b.

[0059] Reference Figure 2A , Figure 2B , Figure 3A and Figure 3B The camera module driving devices 1000, 1000a and 1000b according to one or more embodiments may include a camera module driver IC 100a, a driver 120 and a drive intensity optimizer 130.

[0060] The camera module driver IC 100a may include a communication port 101, a drive port 102, and a power port 103. In this example, the communication port 101, drive port 102, and power port 103 may be implemented as pins or pads on a typical semiconductor chip, serving as electrical paths.

[0061] Communication port 101 can be the electrical path through which communication signals COM are sent and received between the camera module driver IC 100a and the external component 300. For example, the external component 300 can be at least one of a processor, an image sensor, and a gyroscope sensor disposed in the device.

[0062] The drive port 102 can be electrically connected to a drive coil L' located outside the camera module driver IC 100a, and can be the electrical path through which the drive current flows. When the drive current flows through the drive coil L', the drive coil L' can generate a magnetic field, and the position of the lens of the camera module 200 can be controlled by the Lorentz force based on the magnetic field.

[0063] Power port 103 can be electrically connected to the IC power system PO_main. For example, the IC power system PO_main can be generated by a PMIC (Power Management Integrated Circuit) located in the device, can be a relatively high voltage (e.g., 2.8V), can be the main power supply for the camera module driver IC 100a, and can be used as the energy necessary for multiple operations of the camera module driver IC 100a. In this example, capacitor C34 can be connected between power port 103 and ground port 104, and can stabilize the IC power system PO_main.

[0064] At least one of the communication port 101 and the power port 103 may include an electrical path through which a power supply VDDIO provided from the outside to the inside of the camera module driver IC 100a passes. The power supply VDDIO may be a second power supply (e.g., 1.8V) based on a second power system, or a first power supply (e.g., 1.2V) based on a first power system.

[0065] Driver 120 can be configured to output drive current based on a set drive strength within camera module driver IC 100a. Drive strength optimizer 130 can be configured to sense the voltage of power supply VDDIO within camera module driver IC 100a and set driver 120 to a drive strength corresponding to the voltage of power supply VDDIO. For example, when power supply VDDIO is based on a second power source (e.g., 1.8V) of a second power system, drive strength optimizer 130 can output a low drive strength setting (or a high drive strength setting) to driver 120 to reduce the drive strength of driver 120.

[0066] For example, when the power supply VDDIO is based on a first power level (e.g., 1.2V) of a first power system, the drive strength optimizer 130 can output a high drive strength setting (or a low drive strength setting) to the driver 120 to increase the drive strength of the driver 120. Therefore, the overall magnitude of the drive current output by the driver 120 may be insensitive to changes in the voltage level of the power supply VDDIO, and thus can flexibly respond to uncertainties in the voltage level of the power supply VDDIO.

[0067] In the example, when the overall magnitude of the drive current output by driver 120 is too large, overshoot or undershoot of the drive current may occur. Overshoot and undershoot of the drive current can be noise factors in the communication signal COM sent and received between the camera module driver IC 100a and the external component 300.

[0068] In the example, if the overall amplitude of the drive current output by driver 120 is too low, the rise time and fall time of the drive current may become too long. When the rise time and fall time are too long, it may be difficult to ensure the stability of the lens position control of camera module 200, or it may be difficult to ensure the performance of communication signal COM (e.g., data transmission / reception rate, bit error rate, etc.).

[0069] However, since the camera module drive devices 1000, 1000a and 1000b according to one or more embodiments can optimize the overall magnitude of the drive current, they can prevent overshoot and undershoot of the drive current, reduce noise of the communication signal COM, and prevent the rise time and fall time from becoming too long.

[0070] Reference Figure 2B and Figure 3B When the voltage of the power supply VDDIO changes, causing a corresponding change in drive strength, the drive strength optimizer 130 can be configured to pause while simultaneously changing the drive strength setting of the driver 120. For example, the drive strength optimizer 130 in the paused state can maintain the drive strength setting value output to the driver 120, prevent the drive strength setting value from being affected by the voltage of the power supply VDDIO, or not sense the voltage of the power supply VDDIO.

[0071] Therefore, the driver 120 can stably perform the drive strength setting operation after receiving the drive strength setting value changed by the drive strength optimizer 130, can stably optimize the drive strength, and can prevent failures during the drive strength optimizer process.

[0072] In the example, immediately following a change in the voltage level of the power supply VDDIO, the power supply VDDIO may be temporarily unstable. However, this instability of the power supply VDDIO is unlikely to significantly affect the drive strength setting operation of driver 120. Therefore, driver 120 can stably perform the drive strength setting operation.

[0073] In the example, even if the power supply VDDIO is a switch-mode power supply (SMPS), fluctuations in the power supply VDDIO are unlikely to significantly affect the drive strength setting operation of driver 120. Therefore, driver 120 can stably perform the drive strength setting operation.

[0074] When the drive strength setting operation of driver 120 is completed or stabilized, drive strength optimizer 130 can be configured to resume after being in a paused state. Therefore, when the voltage level of the power supply VDDIO may change again, drive strength optimizer 130 can reset the drive strength of driver 120. For example, the time from the moment drive strength optimizer 130 is in a paused state to the moment it resumes can be a time preset by a timer or a time naturally determined by the load during the drive strength setting operation.

[0075] Reference Figure 2A , Figure 2B , Figure 3A and Figure 3B The camera module drive devices 1000, 1000a and 1000b according to one or more embodiments may further include at least one of interface 110, controller 140 and voltage generator 150.

[0076] Voltage generator 150 may include an LDO (Low Dropout) circuit and can reduce the voltage of the IC power system PO_main to a set voltage. In this example, the set voltage may be a bias voltage that can be used throughout the camera module driver IC 100a and may also supply power to the second driver 120b. Figure 3A and Figure 3B (VDDIO).

[0077] Interface 110 can receive the communication signal COM through the communication port 101 in the camera module driver IC 100a. In this example, interface 110 can be implemented as a typical integrated circuit I / O (input / output) and can be configured to handle the transmission and reception of the communication signal COM.

[0078] Interface 110 can receive a power supply VDDIO from the external camera module driver IC 100a via communication port 101. Interface 110 can operate based on the power supply VDDIO and can pass the power supply VDDIO to the drive strength optimizer 130. The drive strength optimizer 130 can sense the voltage of the power supply VDDIO.

[0079] In this example, by using the communication signal COM received through interface 110, the camera module driver IC 100a can synchronize with external component 300, receive information from the processor of external component 300 needed to determine the target position of the camera module's lens, receive feedback information from the image sensor of external component 300, or receive acceleration information from the gyroscope sensor of external component 300 needed to determine the drive current flowing in drive coil L'. In this example, at least a portion of the communication signal COM received through interface 110 can be a pulse waveform.

[0080] The controller 140 can control the drive current of the driver 120 based on the communication signal COM. For example, the controller 140 can perform the overall digital processing operation of the camera module driver IC 100a. For example, the controller 140 can store or load autofocus control logic or optical image stabilization control logic, perform calculations by applying information to the above control logic, and control the second driver 120b based on the calculation results.

[0081] Driver 120 can output a drive current, which is applied to a current value determined by controller 140 according to a set ratio of drive intensity. For example, controller 140 can determine a control value CONT and provide it to driver 120. The control value CONT can be... Figure 4A and Figure 4B The control values ​​are PDRV and NDRV, and may include a first control value CONT1 and / or a second control value CONT2.

[0082] In the example, driver 120 may include a first driver 120a and / or a second driver 120b. First driver 120a may be included in interface 110, and interface 110 may use the drive current output by first driver 120a. For example, first driver 120a may receive a first control value CONT1 from controller 140 and output a drive current based on the first control value CONT1. Interface 110 may send a communication signal based on the drive current to external component 300 via communication port 101, the drive strength of which is optimized by drive strength optimizer 130. Therefore, noise introduced to the device by the communication signal sent by camera module driver 1000a can be reduced, and the performance of the communication signal can be reliably ensured.

[0083] In the example, the second driver 120b can receive a second control value CONT2 from the controller 140 and output a drive current through the drive port 102 based on the second control value CONT2. Since the drive strength of the drive current can be optimized by the drive strength optimizer 130, the noise introduced by the camera module drive device 1000a to the device can be reduced during the process of controlling the position of the lens of the camera module 200. In addition, since the rise time and fall time of the drive current can be prevented from becoming too long, the stability / efficiency of the lens position control of the camera module 200 can be stably ensured.

[0084] Figure 4A and Figure 4B This is a circuit diagram showing a first driver 120a and a second driver 120b of a camera module driving device according to one or more embodiments. Figure 4AThe structure of the first driver 120a outputting current Iout1 through a single output terminal is shown, and Figure 4B The diagram illustrates the structure of the second driver 120b, which outputs currents Iout1 and Iout2 through differential output terminals, but is not limited thereto. For example, when the communication standard of the camera module driver requires differential signals, the first driver 120a can be implemented using a structure that outputs current through differential output terminals. In the example, according to the camera module of the camera module driver (… Figure 1 In the specific structure of 200), the second driver 120b can be implemented using a structure that outputs current through a single output terminal.

[0085] Reference Figure 4A and Figure 4B Drivers 120a and 120b can receive control values ​​PDRV and NDRV from controller 140 and generate control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3 based on PDRV and NDRV. Drivers 120a and 120b may include switches SWP and SWN to toggle whether to generate each of the control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3. The control values ​​PDRV and NDRV may be seeds for currents Iout1 and Iout2.

[0086] The drive strength optimizer 130 can output a drive strength setting value and determine the switching states of switches SWP and SWN based on the drive strength setting value. In the example, each of switches SWP and SWN can be implemented as a transistor, the drive strength setting value can be output to the gate terminal of the transistor, and the switching state of the electrical path between the drain and source terminals of the transistor can be determined based on the voltage at the gate terminal.

[0087] Drivers 120a and 120b may include first driving semiconductor circuit elements MN11, MP11, MN21, and MP21 connected in the bridge structure; second driving semiconductor circuit elements MN12, MP12, MN22, and MP22 connected in the bridge structure; and may also include third driving semiconductor circuit elements MN13, MP13, MN23, and MP23 connected in the bridge structure. In the example, the bridge structure may be one of an H-bridge, a half-bridge, and a full-bridge. In the example, depending on the type of bridge structure, a portion of the first driving semiconductor circuit elements MN21 and MP21, the second driving semiconductor circuit elements MN22 and MP22, and the third driving semiconductor circuit elements MN23 and MP23 may be omitted.

[0088] In the example, each of the first driving semiconductor circuit elements MN11, MP11, MN21 and MP21, the second driving semiconductor circuit elements MN12, MP12, MN22 and MP22, and the third driving semiconductor circuit elements MN13, MP13, MN23 and MP23 may include a driving transistor (e.g., NMOS, PMOS), and may also include a diode connected between the drain and source terminals of the driving transistor, depending on the design. At least a portion of the control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2 and NDRV3 may be sent to the gate terminal of the driving transistor, and the current between the drain and source terminals of the driving transistor may be determined by at least a portion of the control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2 and NDRV3.

[0089] In the example, the control values ​​PDRV1_INV, PDRV2_INV, PDRV3_INV, NDRV1_INV, NDRV2_INV, and NDRV3_INV can be the output values ​​of a CMOS inverter based on inputting the control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3 to the CMOS inverter. The driver 120 may also include a CMOS inverter.

[0090] The sum of the first drive currents of the first driving semiconductor circuit elements MN11, MP11, MN21, and MP21, the second drive currents of the second driving semiconductor circuit elements MN12, MP12, MN22, and MP22, and the third drive currents of the third driving semiconductor circuit elements MN13, MP13, MN23, and MP23 can be currents Iout1 and Iout2. Therefore, switching the use of the first driving semiconductor circuit elements MN11, MP11, MN21, and MP21, switching the use of the second driving semiconductor circuit elements MN12, MP12, MN22, and MP22, and switching the use of the third driving semiconductor circuit elements MN13, MP13, MN23, and MP23 can be switching the overall magnitude of the drive currents of drivers 120a and 120b and switching the intensity of the drive currents of drivers 120a and 120b.

[0091] Drivers 120a and 120b can switch between using at least one of the first driving semiconductor circuit elements MN11, MP11, MN21 and MP21 and the second driving semiconductor circuit elements MN12, MP12, MN22 and MP22 according to a set driving intensity, and can also switch between using the third driving semiconductor circuit elements MN13, MP13, MN23 and MP23 according to an embodiment. In the example, drivers 120a and 120b can determine the switching states of switches SWP and SWN based on the drive strength setpoint input from the drive strength optimizer 130, generate control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3 according to the switching states of switches SWP and SWN, and use first drive semiconductor circuit elements MN11, MP11, MN21, and MN11, second drive semiconductor circuit elements MN12, MP12, MN22, and MP22, and third drive semiconductor circuit elements MN13, MP13, MN23, and MP23 according to the determined generated control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3.

[0092] The drive currents Iout1 and Iout2 of drivers 120a and 120b can be proportional to the difference between the voltage level of the power supply VDDIO and the voltage level of the low voltage VSS. In the example, the low voltage VSS can be ground voltage or... Figure 3A The voltage generated by voltage generator 150. The power supply VDDIO can be a second power source based on a second power system (e.g., 1.8V) or a first power source based on a first power system (e.g., 1.2V). In the example, when the power supply VDDIO is a secondary power supply (e.g., 1.8V), a portion of control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3 may not be used, and the drive strength of drivers 120a and 120b may be reduced. In the example, when the power supply VDDIO is a primary power supply (e.g., 1.2V), all control values ​​PDRV1, PDRV2, PDRV3, NDRV1, NDRV2, and NDRV3 may be used, and the drive strength of drivers 120a and 120b may be increased.

[0093] In the example, the size W / L of each of the first driving semiconductor circuit elements MN11, MP11, MN21, and MP21 can be greater than the size W / L of each of the second driving semiconductor circuit elements MN12, MP12, MN22, and MP22. Therefore, the number of examples of the total drive current of the first driving semiconductor circuit elements MN11, MP11, MN21, and MP21 and the second driving semiconductor circuit elements MN12, MP12, MN22, and MP22 can vary, allowing for more precise setting of the drive strength of drivers 120a and 120b. The size W / L can be the width divided by the length of the electrical path (e.g., channel) formed between the drain and source terminals of the transistor, and the current flowing between the drain and source terminals can be proportional to the size W / L.

[0094] Reference Figure 4A , Figure 4B and Figure 5A The drive strength settings P1 and P2 can be determined by four examples. In the examples, when the drive strength settings P1 and P2 are L (low) and L respectively, the first drive semiconductor circuit elements MN11 and MP11 can be in the on state, and the second drive semiconductor circuit elements MN12 and MP12 and the third drive semiconductor circuit elements MN13 and MP13 can be in the off state. Therefore, the drive strength can be 1, and the drive current X1 can be minimized.

[0095] In the example, when the drive intensity settings P1 and P2 are L and H (high) respectively, the first drive semiconductor circuit elements MN11 and MP11 and the second drive semiconductor circuit elements MN12 and MP12 can be in the on state, and the third drive semiconductor circuit elements MN13 and MP13 can be in the off state.

[0096] Optionally, according to an embodiment, when the drive intensity settings P1 and P2 are L and H (high) respectively, the first drive semiconductor circuit elements MN11 and MP11 and the second drive semiconductor circuit elements MN12 and MP12 can be in the off state, and the third drive semiconductor circuit elements MN13 and MP13 can be in the on state. Therefore, the drive intensity can be 2.

[0097] In the example, when the drive strength settings P1 and P2 are H and L respectively, the first drive semiconductor circuit elements MN11 and MP11 and the third drive semiconductor circuit elements MN13 and MP13 can be in the on state, and the second drive semiconductor circuit elements MN12 and MP12 can be in the off state. Therefore, the drive strength can be 3.

[0098] In the example, when the drive strength settings P1 and P2 are H and H respectively, the first drive semiconductor circuit elements MN11 and MP11, the second drive semiconductor circuit elements MN12 and MP12, and the third drive semiconductor circuit elements MN13 and MP13 can be in the on state. Therefore, the drive strength can be 4, and the drive current X4 can be the maximum.

[0099] The difference between the driving current X2 of driving intensity 2 and the driving current X3 of driving intensity 3 can be implemented such that the size W / L of each of the third driving semiconductor circuit elements MN13 and MP13 is greater than the size W / L of each of the second driving semiconductor circuit elements MN12 and MP12.

[0100] In the example, the size of each of the third driving semiconductor circuit elements MN13 and MP13 can be 1.6 times or greater and 2.4 times or less (median: 2 times) the size of each of the first driving semiconductor circuit elements MN11 and MP11, and can be 1.6 times or greater and 2.4 times or less (median: 2 times) the size of each of the second driving semiconductor circuit elements MN12 and MP12. The size of each of the first driving semiconductor circuit elements MN11 and MP11 can be 0.8 times or greater and 1.2 times or less (median: 1) the size of each of the second driving semiconductor circuit elements MN12 and MP12. Therefore, the driving current X1 according to driving intensity 1, the driving current X2 according to driving intensity 2, the driving current X3 according to driving intensity 3, and the driving current X4 according to driving intensity 4 can have a nearly linear relationship with each other. A linear relationship means that the slope of the driving current change can be constant as the driving intensity value changes.

[0101] Figure 5B and Figure 5C The horizontal axis represents Figure 3B The voltage VPAD of the driving coil L' Figure 5B The vertical axis represents from Figure 4A and Figure 4B The drive currents of the N-type drive semiconductor circuit elements MN11, MN12, and MN13 excluded from the P-type drive semiconductor circuit elements MP11, MP12, and MP13, and Figure 5C The vertical axis represents from Figure 4A and Figure 4B The driving current of P-type driving semiconductor circuit elements MP11, MP12, and MP13 excluded from the N-type driving semiconductor circuit elements MN11, MN12, and MN13.

[0102] Reference Figure 5BAs the drive strength settings P1 and P2 of the N-type drive semiconductor circuit elements MN11, MN12, and MN13 increase, the increase slope of the drive currents (7.26 mA, 14.5 mA, 21.1 mA, and 28.4 mA) can be almost linear. Similarly, as the drive strength settings P1 and P2 of the P-type drive semiconductor circuit elements MP11, MP12, and MP13 increase, the increase slope of the drive currents (3.21 mA, 6.42 mA, 9.63 mA, and 12.8 mA) can be almost linear.

[0103] refer to Figures 6A to 6E According to one or more embodiments, the drive strength optimizer 130 of the camera module driver IC 100a of the camera module driver device may include a comparator 132 and a latch 134, and may also include a plurality of resistors R1 and R2 and an inverter 136.

[0104] Comparator 132 can sense the voltage of the power supply VDDIO and output a value based on the sensed result. In this example, comparator 132 can be implemented based on an operational amplifier.

[0105] Latch 134 can receive values ​​based on the sensing results and output drive strength settings P1 and P2 for driver 120. Latch 134 can have multiple input terminals S and R, and can have an output terminal Q. In the example, latch 134 can be implemented based on multiple NOR gates or multiple NAND gates.

[0106] refer to Figure 6A and Figure 7 When the value of input terminal R to latch 134 is L (low) and the value of input terminal S to latch 134 changes from L to H (high), the value of output terminal Q can change from L to H. For example, when the power supply VDDIO increases from a first power (e.g., 1.2V) to a second power (e.g., 1.8V), the value of input terminal S can change from L to H.

[0107] Then, if the value input to input terminal R is unlikely to change, the value of output terminal Q can be maintained even if the value input to input terminal S changes from H to L. Therefore, latch 134 can keep drive strength optimizer 130 in a suspended state by maintaining the value of output terminal Q until the value input to input terminal R can change. In this example, latch 134 can maintain the value of output terminal Q regardless of the voltage of the power supply VDDIO until the value input to input terminal R changes.

[0108] The time from when the value of input terminal S to latch 134 changes from L to H until the value of input terminal R changes, the driver 120 can stably perform the drive strength setting operation, and is essentially unaffected by the drive strength optimizer 130.

[0109] The driver 120 can change the voltage at the VDD terminal and the voltage at the nRESET terminal after terminating or stabilizing the drive strength setting operation. Therefore, the value of the input terminal R to the latch 134 can be changed. Thus, the drive strength optimizer 130 can be restarted.

[0110] Multiple resistors R1 and R2 can reduce the voltage of the power supply VDDIO by a predetermined ratio and output the reduced voltage to comparator 132. The predetermined ratio can be determined by the resistance relationship between the multiple resistors R1 and R2. Comparator 132 can output a value based on the high-low relationship between the voltage output from the multiple resistors R1 and R2 and the reference voltage VREF, as a value based on the sensing result.

[0111] Reference Figure 7 The voltage change at the power supply VDDIO terminal can occur earlier than the voltage change at the VDD terminal, and the voltage change at the nRESET terminal can occur later than the voltage change at the VDD terminal. Therefore, it is possible to control... Figure 6A The voltage at the VDD terminal is adjusted to control the pause time of the drive strength optimizer 130. For example, the voltage change time at the VDD terminal may be a time preset by a timer in the driver 120, or a time naturally determined by the load in the driver 120 during the drive strength setting operation of the driver 120.

[0112] Reference Figure 6B and Figure 6D The camera module driver ICs 100b and 100d of the camera module driver apparatus according to one or more embodiments may further include firmware 145, which sets a portion of drive strength setting values ​​P1 and P2 to preset values. Among the drive strength setting values ​​P1 and P2, those values ​​set by firmware 145 may vary depending on the embodiment.

[0113] Reference Figure 6C The camera module driver IC100c of the camera module driver device according to one or more embodiments can unify the drive intensity settings P1 and P2.

[0114] Reference Figure 6EThe drive strength optimizer 130 of the camera module driver IC 100e in one or more embodiments of the camera module driver device may include a plurality of comparators 132a and 132b, a plurality of latches 134a and 134b, a plurality of inverters 136a and 136b, and a plurality of resistors R1, R2, and R3. The plurality of comparators 132a and 132b can sense the voltage of the power supply VDDIO based on a plurality of different reference voltages VREF1 and VREF2. The plurality of latches 134a and 134b can each output drive strength setting values ​​P1 and P2.

[0115] Reference Figure 8 According to one or more embodiments, a camera module driving device and a device including a camera module can sequentially perform an operation of sensing the voltage of the power supply VDDIO (operation S110), an operation of optimizing the driving strength according to the voltage of the power supply VDDIO (operation S120), and an operation of stabilizing the driving strength of the driver (operation S130).

[0116] In the operation of sensing the voltage of the power supply VDDIO (operation S110), the camera module drive device and equipment can sense whether the value obtained by multiplying the voltage of the power supply VDDIO by a predetermined ratio R2 / (R1+R2) based on the resistance values ​​of multiple resistors is greater than the reference voltage VREF (operation S111). When the voltage of the power supply VDDIO is high, the value of the latch input terminal S can be H (operation S112), and when the voltage of the power supply VDDIO is low, the value of the latch input terminal S can be L (operation S113). Thereafter, based on whether the value of the latch input terminal S has changed (operation S114), it can be determined whether to continue the drive strength optimization operation (operation S120).

[0117] In the operation of optimizing the drive strength according to the voltage of the power supply VDDIO (operation S120), the camera module drive device and equipment can determine the output terminal Q of the latch based on whether the value of the input terminal S of the latch has changed (operation S121), determine the drive strength setting value P1 and / or P2 based on the output terminal Q of the latch (operation S122), and optimize the drive strength of the driver based on the drive strength setting value P1 and / or P2 (operation S123).

[0118] In the drive strength stabilization operation of the driver (operation S130), the camera module drive device and equipment can change the voltage of the VDD terminal after optimizing the drive strength of the driver (operation S131), change the value of the nRESET terminal according to the change in the voltage of the VDD terminal (operation S132), and change the value of the input terminal R of the latch according to the change in the value of the nRESET terminal (operation S133). Afterwards, depending on the change in the value of the input terminal S of the latch (operation S134), the drive strength setting of the driver can be maintained (operation S135), or it can be determined whether the operation of sensing the voltage of the power supply VDDIO can be performed (operation S110).

[0119] According to one or more embodiments, a camera module drive device can stably optimize the drive strength of the driver based on changes in the voltage of the supplied power supply.

[0120] In the example, the camera module driver can prevent failures during the drive strength optimization process, is robust to temporary instabilities in the power supplied during the drive strength optimization process, and can stably increase the degree of freedom of the supplied power.

[0121] In the example, the camera module driver can reliably resolve instabilities in the power supply configuration outside the camera module driver IC, which can be advantageous in miniaturizing the camera module driver IC and can reliably improve the operational stability / efficiency of the camera module driver IC.

[0122] While this disclosure includes specific examples, it will be apparent upon understanding the disclosure of this application that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Appropriate results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in a different manner and / or replaced or supplemented by other components or their equivalents.

[0123] Therefore, in addition to the above disclosure and all the accompanying drawings, the scope of this disclosure also includes the claims and their equivalents, that is, all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. A camera module driving apparatus comprising: a camera module driving integrated circuit (IC) comprising: a communication port, a driving port for electrically connecting to a driving coil, and a power port; a driver configured to output a driving current based on a set driving strength in the camera module driving IC; and a driving strength optimizer configured to sense a voltage of power supplied to at least one of the communication port and the power port in the camera module driving IC, and configured to set the driver to have a driving strength corresponding to the voltage of the power, characterized in that the driving strength optimizer is configured to be in a suspended state while changing the set of the driving strength of the driver when the voltage of the power changes so that a corresponding driving strength changes. 2.The camera module driving apparatus according to claim 1, characterized in that the driving strength optimizer is configured to resume an operating state after being in the suspended state.

3. The camera module driving device according to claim 2, wherein the driving strength optimizer comprises: a comparator configured to sense the voltage of the power, and output a value based on the sensed voltage; and a latch configured to receive the output value based on the sensed voltage, and output a set value of the driving strength of the driver; wherein the driving strength optimizer is configured to be suspended based on a change in the value based on the sensed voltage input through a first input terminal among a plurality of input terminals of the latch, and configured to resume an operating state based on a value input through a second input terminal among the plurality of input terminals.

4. The camera module driving device according to claim 1, wherein the driving strength optimizer comprises: a comparator configured to sense the voltage of the power, and output a value based on the sensed voltage; and a latch configured to receive the output value based on the sensed voltage, and output a set value of the driving strength of the driver; wherein the driving strength optimizer is configured to be suspended based on a change in a value based on the sensed voltage input through a first input terminal among a plurality of input terminals of the latch. 5.The camera module driving apparatus according to claim 4, the driving strength optimizer further comprises a plurality of resistors configured to reduce the voltage of the power at a predetermined ratio, and output the reduced voltage of the power to the comparator, and the comparator is configured to output a value based on a high-low relationship between a voltage output from the plurality of resistors and a reference voltage, as a value output based on the sensed voltage. 6.The camera module driving apparatus according to claim 1, further comprising: an interface configured to receive a communication signal through the communication port of the camera module driving IC, characterized in that the interface is configured to transmit a communication signal through the communication port based on the driving current of the driver, and the driving strength optimizer is configured to sense the voltage of the power supplied to the communication port. 7.The camera module driving apparatus according to claim 1, further comprising: an interface configured to receive a communication signal through the communication port of the camera module driving IC; and an interface configured to receive a communication signal through the communication port of the camera module driving IC. a controller configured to control the drive current of the driver based on the received communication signal, characterized in that the driver is configured to output the drive current in which a ratio based on the set drive strength is applied to a current value determined by the controller.

8. The camera module driving apparatus according to claim 1, wherein the driver includes: a first drive semiconductor circuit element coupled in a bridge structure; and a second drive semiconductor circuit element coupled in a bridge structure; wherein the driver is configured to switch between operations of at least one of the first drive semiconductor circuit element and the second drive semiconductor circuit element based on the set drive strength.

9. The camera module driving apparatus according to claim 8, characterized in that each of the first drive semiconductor circuit elements is larger in size than each of the second drive semiconductor circuit elements.

10. The camera module driving apparatus according to claim 1, wherein the driver includes: a first drive semiconductor circuit element coupled in a bridge structure; a second drive semiconductor circuit element coupled in a bridge structure; and a third drive semiconductor circuit element coupled in a bridge structure; wherein the driver is configured to switch between operations of at least two of the first drive semiconductor circuit element, the second drive semiconductor circuit element, and the third drive semiconductor circuit element based on the set drive strength, wherein each of the third drive semiconductor circuit elements is larger in size than or equal to 1.6 times the size of each of the first drive semiconductor circuit elements and smaller than or equal to 2.4 times the size of each of the first drive semiconductor circuit elements, and larger than or equal to 1.6 times the size of each of the second drive semiconductor circuit elements and smaller than or equal to 2.4 times the size of each of the second drive semiconductor circuit elements, and wherein each of the first drive semiconductor circuit elements is larger in size than or equal to 0.8 times the size of each of the second drive semiconductor circuit elements and smaller than or equal to 1.2 times the size of each of the second drive semiconductor circuit elements.

11. The camera module driving apparatus according to claim 10, in the driver, when set to have a first drive strength, a first group of the first drive semiconductor circuit elements or the second drive semiconductor circuit elements is turned on, a second group of the first drive semiconductor circuit elements or the second drive semiconductor circuit elements is turned off, and the third drive semiconductor circuit elements are turned off, when set to have a second drive strength, the first drive semiconductor circuit elements and the second drive semiconductor circuit elements are turned on, and the third drive semiconductor circuit elements are turned off, or the first drive semiconductor circuit elements and the second drive semiconductor circuit elements are turned off, and the third drive semiconductor circuit elements are turned on, when set to have a third driving strength, a first group of the first driving semiconductor circuit element or the second driving semiconductor circuit element is turned on, a second group of the first driving semiconductor circuit element or the second driving semiconductor circuit element is turned off, and the third driving semiconductor circuit element is turned on, and when set to have a fourth driving strength, the first driving semiconductor circuit element, the second driving semiconductor circuit element, and the third driving semiconductor circuit element are turned on. 12.A camera module driving apparatus comprising: a camera module driving integrated circuit (IC) comprising: a communication port, a driving port for electrically connecting to a driving coil, and a power port; a driver configured to output a driving current based on a set driving strength in the camera module driving IC; and a driving strength optimizer configured to sense a voltage of a power supplied to at least one of the communication port and the power port in the camera module driving IC, and configured to set the driver to have a driving strength corresponding to the voltage of the power, characterized in that the driving strength optimizer comprises: a comparator configured to sense the voltage of the power, and output a value based on the sensed voltage; and a latch configured to receive the output value based on the sensed voltage, and output a set value of the driving strength of the driver. 13.The camera module driving apparatus of claim 12, characterized in that the driving strength optimizer further comprises a plurality of resistors configured to reduce the voltage of the power at a predetermined ratio, and output the reduced voltage of the power to the comparator, and the comparator is configured to output a value based on a high-low relationship between a voltage output from the plurality of resistors and a reference voltage, as a value output based on the sensed voltage. 14.The camera module driving apparatus of claim 12, further comprising: an interface configured to receive a communication signal through the communication port of the camera module driving IC, characterized in that the interface is configured to transmit a communication signal through the communication port based on the driving current of the driver, and the driving strength optimizer is configured to sense the voltage of the power supplied to the communication port. 15.The camera module driving apparatus of claim 12, further comprising: an interface configured to receive a communication signal through the communication port of the camera module driving IC; and a controller configured to control the driving current of the driver based on the received communication signal, characterized in that the driver is configured to output the driving current in which a ratio based on the set driving strength is applied to a current value determined by the controller. the driver comprises:

16. The camera module driving apparatus according to claim 12, wherein a first driving semiconductor circuit element coupled in a bridge structure; and a second driving semiconductor circuit element coupled in a bridge structure, ​ The driver is configured to switch between operation of at least one of the first drive semiconductor circuit element and the second drive semiconductor circuit element based on the set drive strength.

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