Wafer fixing device

Abstract

The utility model relates to the technical field of wafer processing, and discloses a wafer fixing device, which comprises a bearing sheet and a bracket main body, the multiple bearing pieces are arranged in the height direction of the support body at intervals, and each bearing piece is connected with the support body. Each bearing sheet is provided with a bearing tongue, the bearing tongues are flush with the surfaces of the bearing sheets, the bearing sheets are connected with the edge of the wafer, the bearing tongues are connected with the circle center of the wafer, the bearing sheets can bear the edge position of the wafer, and the bearing tongues can bear the center position of the wafer, so that the wafer can be better fixed; deformation of the wafer due to self material and gravity is avoided. The technical problem that in the prior art, the wafer is prone to warping in the drying process is solved, and the technical effects that the wafer is smoother and not prone to deformation in the drying process are achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer fixing device. Background Technology

[0002] In the chip manufacturing process, pattern transfer is required, which typically refers to photolithography. Photolithography is a pattern copying technology and a crucial step in chip manufacturing. Simply put, inspired by photography, photolithography utilizes the photosensitive properties of photoresist to precisely copy the pattern from a photomask onto the photoresist coated on the wafer. After spin-coating the photoresist onto the wafer, it needs to be baked to shape it. After development, the patterned photoresist is baked again to reinforce the details of each pattern.

[0003] Wafers can be made of materials other than metals, such as resin or silicon, which are prone to warping. During the drying process, wafers are usually supported around the edges but not in the center. Therefore, the center of the wafer is prone to warping, which causes the wafer to deform and affects the yield. Utility Model Content

[0004] The purpose of this invention is to provide a wafer fixing device to solve the technical problem that wafers are prone to warping during drying in the prior art.

[0005] To solve the above-mentioned technical problems, this utility model provides a wafer fixing device, including a support plate and a bracket body;

[0006] The support pieces are provided in multiple ways, and the multiple support pieces are arranged at intervals along the height direction of the support body, and each support piece is connected to the support body;

[0007] Each of the support pieces is provided with a support tongue, which is flush with the surface of the support piece. The support piece is connected to the edge of the wafer, and the support tongue is connected to the center of the wafer.

[0008] In an optional embodiment, the support piece is provided with through holes, and a plurality of the through holes are arranged at intervals along the surface of the support piece.

[0009] In an optional embodiment, the support body includes a top plate, a bottom plate, and connecting rods;

[0010] The top plate and the bottom plate are arranged parallel to each other and spaced apart. The two ends of the connecting rod are respectively connected to the top plate and the bottom plate. A plurality of supporting plates are respectively disposed between the top plate and the bottom plate, and each supporting plate is respectively connected to the connecting rod.

[0011] In an optional embodiment, the connecting rod passes through a plurality of the support plates, and a sleeve is provided on the connecting rod. The sleeve is disposed between two adjacent support plates, and each end of the sleeve abuts against one of the support plates.

[0012] In an optional embodiment, two connecting rods are provided, which are parallel and spaced apart, and the distance between the two connecting rods is greater than the diameter of the wafer.

[0013] In an optional embodiment, the support body further includes a fixing rod, the two ends of which are connected to the top plate and the bottom plate respectively. The fixing rod is spaced apart from the connecting rod, and the fixing rod abuts against the side of the wafer.

[0014] In an optional implementation, a fixing plate is also included;

[0015] The two ends of the fixing plate are connected to the top plate and the bottom plate respectively. The fixing plate is provided with a plurality of ventilation holes, each of which is disposed through the fixing plate.

[0016] In an optional implementation, a handle is also included;

[0017] The handle is fixed to the fixed plate, and the length of the handle is set at an angle to the height of the fixed plate. Both ends of the handle are connected to the fixed plate.

[0018] In an optional implementation, a stop bar is also included;

[0019] Multiple baffles are provided, and the multiple baffles are slidably connected to the top plate and the bottom plate respectively, so that adjacent baffles are brought closer to or further away from each other.

[0020] In an optional embodiment, the top plate, the bottom plate, and the support plate are respectively provided with grooves, and each of the stop bars extends into one of the grooves.

[0021] This utility model provides a wafer fixing device, including support plates and a support body. Multiple support plates are arranged at intervals along the height direction of the support body, and each support plate is connected to the support body. Each support plate has a support tongue, which is flush with the surface of the support plate. The support plate connects to the edge of the wafer, and the support tongue connects to the center of the wafer. The support plate supports the edge of the wafer, while the support tongue supports the center, thus better fixing the wafer and preventing deformation due to its material and gravity. This solves the technical problem of wafer warping during drying in existing technologies, achieving a flatter wafer that is less prone to deformation during drying. Attached Figure Description

[0022] Figure 1 This is a front view of the wafer fixing device mentioned in the embodiments of this utility model;

[0023] Figure 2 This is a side view of the wafer fixing device mentioned in the embodiments of this utility model;

[0024] Figure 3 This is a top view of the wafer fixing device mentioned in the embodiments of this utility model;

[0025] Figure 4 This is a schematic diagram of the support piece mentioned in the embodiments of this utility model.

[0026] In the diagram, 1-support plate; 2-bracket body; 201-top plate; 202-bottom plate; 203-connecting rod; 204-fixing rod; 3-support tongue; 4-through hole; 5-fixing plate; 6-handle; 7-stop bar; 8-groove. Detailed Implementation

[0027] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In related technologies, wafers can be made of materials other than metals, such as resin, silicon, or other materials that are prone to warping. During the drying process, wafers are generally supported around their perimeter. However, the center of the wafer is prone to warping during the drying process, which causes the wafer to deform and affects the yield.

[0030] In view of this, such as Figures 1-4 As shown, some embodiments of this utility model provide a wafer fixing device, including a support plate 1 and a support body 2; multiple support plates 1 are provided, and the multiple support plates 1 are arranged at intervals along the height direction of the support body 2, and each support plate 1 is connected to the support body 2; each support plate 1 is provided with a support tongue 3, the support tongue 3 is flush with the surface of the support plate 1, the support plate 1 is connected to the edge of the wafer, and the support tongue 3 is connected to the center of the wafer.

[0031] In the above embodiment, the support body 2 can be provided with a receiving space for accommodating the wafer and the support plate 1. Multiple support plates 1 can be provided in the receiving space. The multiple support plates 1 are parallel to each other and evenly arranged. The multiple support plates 1 are respectively connected to the support body 2. The support plate 1 can be annular or U-shaped. A support tongue 3 can be provided in the middle of the support plate 1. The surface of the support tongue 3 can be flush with the surface of the support plate 1. So that after the wafer is placed on the support plate 1, the wafer can abut against the support plate 1 and the support tongue 3 respectively, thereby better fixing the wafer. The robot can extend from one side of the support body 2 into the receiving space with the wafer and place it on the support plate 1. Alternatively, the robot can extend into the receiving space with the wafer and extend it out of the receiving space.

[0032] This utility model provides a wafer fixing device in several embodiments, including a support plate 1 and a support body 2. Multiple support plates 1 are arranged at intervals along the height direction of the support body 2, and each support plate 1 is connected to the support body 2. Each support plate 1 has a support tongue 3, which is flush with the surface of the support plate 1. The support plate 1 is connected to the edge of the wafer, and the support tongue 3 is connected to the center of the wafer. The support plate 1 supports the edge of the wafer, while the support tongue 3 supports the center of the wafer, thereby better fixing the wafer and preventing deformation due to its material and gravity. This solves the technical problem of wafer warping during drying in the prior art, achieving a flatter wafer that is less prone to deformation during drying.

[0033] In an optional embodiment, the support piece 1 is provided with through holes 4, and a plurality of through holes 4 are arranged at intervals along the surface of the support piece 1.

[0034] In the above embodiments, the through hole 4 can be provided through the thickness direction of the support sheet 1. The through hole 4 can be circular or other shapes, thereby reducing the weight of the support sheet 1. The through hole 4 can also allow each layer of wafer to receive hot air and dry more thoroughly. Furthermore, the support tongue 3 can also be provided with through holes 4, thereby reducing the weight of the support tongue 3 and facilitating heat conduction at the support tongue 3.

[0035] In an optional embodiment, the support body 2 includes a top plate 201, a bottom plate 202, and a connecting rod 203; the top plate 201 and the bottom plate 202 are arranged parallel to each other and spaced apart, the two ends of the connecting rod 203 are respectively connected to the top plate 201 and the bottom plate 202, and a plurality of support pieces 1 are respectively arranged between the top plate 201 and the bottom plate 202, and each support piece 1 is respectively connected to the connecting rod 203.

[0036] In the above embodiments, both the top plate 201 and the bottom plate 202 can be made of metal. The top plate 201 and the bottom plate 202 are parallel to each other and spaced apart. The top plate 201 and the bottom plate 202 are approximately circular in shape. The two ends of the connecting rod 203 are connected to the top plate 201 and the bottom plate 202 respectively. The top plate 201, the bottom plate 202 and the connecting rod 203 form an accommodating space. At the same time, the support piece 1 can also be set perpendicular to the connecting rod 203. The support piece 1 can be set parallel to the top plate 201 and the bottom plate 202 respectively. Each support piece 1 can be connected to the connecting rod 203 respectively, thereby fixing the support piece 1.

[0037] In an optional embodiment, the connecting rod 203 passes through multiple support plates 1, and a sleeve is provided on the connecting rod 203. The sleeve is disposed between two adjacent support plates 1, and the two ends of the sleeve abut against one support plate 1 respectively.

[0038] In the above embodiment, the connecting rod 203 can be cylindrical, and its two ends can be bolted to the top plate 201 and the bottom plate 202 respectively. The connecting rod 203 can pass through multiple support plates 1, and each support plate 1 can be provided with a round hole or a cavity. The connecting rod 203 can extend into the cavity and engage with the support plate 1. Multiple sleeves can be sleeved on the connecting rod 203. The sleeves can be cylindrical and can slide along the length of the connecting rod 203. The distance between two adjacent support plates 1 can be the length of the sleeve, so that the sleeves can separate two adjacent support plates 1.

[0039] In an optional embodiment, two connecting rods 203 are provided, which are parallel and spaced apart, and the distance between the two connecting rods 203 is greater than the diameter of the wafer.

[0040] In the above embodiment, the two ends of the two connecting rods 203 are respectively connected to the top plate 201 and the bottom plate 202 by bolts. The support plate 1 can be provided with two concave cavities. Each connecting rod 203 extends into one concave cavity and is connected, so that the two connecting rods 203 cooperate to fix the support plate 1, making the support plate 1 more secure. Furthermore, the distance between the two connecting rods 203 is greater than the diameter of the wafer, so that the wafer can easily enter and exit the accommodating space between the two connecting rods 203.

[0041] In an optional embodiment, the support body 2 further includes a fixing rod 204, the two ends of which are connected to the top plate 201 and the bottom plate 202 respectively. The fixing rod 204 and the connecting rod 203 are spaced apart, and the fixing rod 204 abuts against the side of the wafer.

[0042] In the above embodiment, the fixing rod 204 can be arranged parallel to the connecting rod 203. The two ends of the fixing rod 204 can be bolted to the top plate 201 and the bottom plate 202 respectively. There can be two fixing rods 204, which are spaced apart. The two fixing rods 204 can also be connected to each support piece 1 through a sleeve to make each support piece 1 more secure. The two fixing rods 204 can be arranged on the side away from the opening of the accommodating space. After the wafer is inserted into the accommodating space and abuts against the support piece 1 and the support tongue 3, the wafer can abut against the two fixing rods 204 to make the wafer more stable.

[0043] In an optional embodiment, a fixing plate 5 is also included; the two ends of the fixing plate 5 are connected to the top plate 201 and the bottom plate 202 respectively, and the fixing plate 5 is provided with a plurality of ventilation holes, each ventilation hole penetrating the fixing plate 5.

[0044] In the above embodiments, the fixing plate 5 can be made of metal and can be rectangular. The two ends of the fixing plate 5 can be connected to the top plate 201 and the bottom plate 202 respectively by bolts. There can also be two fixing plates 5, which can be set far apart from each other. Each fixing plate 5 can be provided with multiple vent holes, each vent hole can be circular, and each vent hole can be evenly arranged along the surface of the fixing plate 5. Multiple wafers can be dried through the multiple vent holes. The fixing plate 5 can also be connected to multiple support pieces 1. The fixing plate 5 can be provided with long grooves, and the support pieces 1 can be inserted into the grooves and slide until the support pieces 1 abut against the fixing rod 204, so that each support piece 1 can be fixed.

[0045] In an optional embodiment, a handle 6 is also included; the handle 6 is fixed on the fixing plate 5, the length of the handle 6 is set at an angle to the height of the fixing plate 5, and the two ends of the handle 6 are respectively connected to the fixing plate 5.

[0046] In the above embodiment, the handle 6 can be connected to the fixing plate 5 by bolts. There can also be two handles 6, each of which can be connected to a fixing plate 5. The length direction of the handle 6 can be set at an angle to the height direction of the fixing plate 5. The two handles 6 can be set parallel to each other. The two handles 6 can be fixed to the fixing plate 5 by the base. Thus, the operator can use the two handles 6 to drive multiple wafers in and out of the drying equipment.

[0047] In an optional embodiment, a stop bar 7 is also included; multiple stop bars 7 are provided, and the multiple stop bars 7 are slidably connected to the top plate 201 and the bottom plate 202 respectively, so that adjacent stop bars 7 are close to or far away from each other.

[0048] In the above embodiment, two stop bars 7 can be provided. The two stop bars 7 can be arranged in parallel and can be respectively positioned close to a connecting rod 203. Each stop bar 7 can slide relative to the top plate 201 and the bottom plate 202. During the sliding process of the two stop bars 7, the two stop bars 7 can be kept perpendicular to the top plate 201 by the action of bolts, so that the two stop bars 7 can remain parallel to each other. The two stop bars 7 can move closer to each other or further away from each other. When the two stop bars 7 can move closer to each other, the distance between the two stop bars 7 is less than the diameter of the wafer, so that the perimeter of multiple wafers can be abutted by the stop bars 7, the fixing plate 5, and the fixing rod 204, so that the wafers are fixed. When the two stop bars 7 move further away from each other, the distance between the two stop bars 7 can be greater than the diameter of the wafer, so that the wafers can be taken out from the receiving space.

[0049] In an optional embodiment, the top plate 201, the bottom plate 202 and the support plate 1 are respectively provided with grooves 8, and each stop bar 7 extends into the groove 8.

[0050] In the above embodiment, the top plate 201, the bottom plate 202 and each support piece 1 are provided with two grooves 8. In the length direction of the two stop rods 7, one groove 8 on each side of the top plate 201, the bottom plate 202 and each support piece 1 are arranged opposite to each other, and the openings of each groove 8 can be arranged oppositely, so that each stop rod 7 can be inserted through the opening of a groove 8, thereby allowing the two stop rods 7 to move away from and closer to each other.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer fixing device characterized by comprising: The supporting piece and the support body are included; The supporting pieces are arranged in multiple, and the multiple supporting pieces are arranged in intervals along the height direction of the support body, and each supporting piece is connected with the support body; Each supporting piece is provided with a supporting tongue, the supporting tongue and the surface of the supporting piece are arranged in a flush manner, the supporting piece is connected with the edge of the wafer, and the supporting tongue is connected with the center of the wafer.

2. The wafer fixing device according to claim 1, wherein The supporting piece is provided with a through hole, and multiple through holes are arranged in intervals along the surface of the supporting piece.

3. The wafer fixing device according to claim 1, wherein The support body includes a top plate, a bottom plate and a connecting rod; The top plate and the bottom plate are arranged in parallel and in intervals, the two ends of the connecting rod are connected with the top plate and the bottom plate respectively, and multiple supporting pieces are arranged between the top plate and the bottom plate respectively, and each supporting piece is connected with the connecting rod.

4. The wafer fixing device according to claim 3, wherein The connecting rod is arranged in multiple, and the two ends of the connecting rod are connected with the top plate and the bottom plate respectively, and multiple supporting pieces are arranged between the top plate and the bottom plate respectively, and each supporting piece is connected with the connecting rod.

5. The wafer fixing device according to claim 3, wherein The connecting rod is arranged in multiple, and the two ends of the connecting rod are connected with the top plate and the bottom plate respectively, and multiple supporting pieces are arranged between the top plate and the bottom plate respectively, and each supporting piece is connected with the connecting rod.

6. The wafer fixing device according to claim 4, wherein The connecting rod is arranged in multiple, and the two ends of the connecting rod are connected with the top plate and the bottom plate respectively, and multiple supporting pieces are arranged between the top plate and the bottom plate respectively, and each supporting piece is connected with the connecting rod.

7. The wafer fixing device according to claim 3, wherein The support body further includes a fixing rod, the two ends of the fixing rod are connected with the top plate and the bottom plate respectively, the fixing rod is arranged in intervals with the connecting rod, and the fixing rod is abutted with the side surface of the wafer. The fixing plate is further included; 8. The wafer fixing device according to claim 7, wherein The two ends of the fixing plate are connected with the top plate and the bottom plate respectively, the fixing plate is provided with multiple air holes, and each air hole is arranged in penetrating the fixing plate. The handle is further included; 9. The wafer fixing device according to claim 3, wherein The handle is fixed on the fixing plate, the length of the handle is arranged in an angle with the height of the fixing plate, and the two ends of the handle are connected with the fixing plate respectively. The blocking rod is further included; 10. The wafer fixing device according to claim 9, wherein The blocking rod is arranged in multiple, and the multiple blocking rods are connected with the top plate and the bottom plate in sliding mode respectively, so that the adjacent blocking rods are close to or away from each other. The top plate, the bottom plate and the supporting piece are respectively provided with a groove, and each blocking rod extends into the groove.

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