Protective film for wafer cutting

Abstract

The utility model relates to the technical field of wafer manufacturing, and discloses a protective film for wafer cutting, which comprises an adhesive layer, a base material layer, an adhesive layer and an anti-sticking layer, the base material layer is arranged at the upper end of the adhesive layer, the upper end of the adhesive layer is fixedly connected with the base material layer through coated silica gel, the adhesive layer is arranged at the upper end of the base material layer, and the anti-sticking layer is fixedly connected with the adhesive layer through coated silica gel. The upper end of the base material layer is fixedly connected with the adhesion layer through the coated silica gel, the anti-sticking layer is arranged at the upper end of the adhesion layer, and the upper end of the adhesion layer is fixedly connected with the anti-sticking layer through the coated silica gel. According to the utility model, the polytetrafluoroethylene particle material is made into the anti-sticking layer which is uniformly stacked on the adhesion layer to form an uneven surface, so that the condition that the protective film is stripped and deformed due to overlarge unwinding force is avoided, and the heat resistance of the protective film is improved through the base material layer and the adhesion layer which are respectively made of the polyolefin material and the polyimide material; and the polyolefin material also has relatively good impact resistance, so that the wafer protection capability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer manufacturing technical field especially relates to a wafer cutting protection film. BACKGROUND

[0002] Wafer cutting protection film is a kind of thin film material for protecting the surface of semiconductor silicon wafer in wafer manufacturing process, it is placed on the surface of wafer can prevent wafer surface from being contaminated, scratched or damaged in wafer cutting, processing, handling and storage process.

[0003] But, because protection film is rolled up and stored, when uncoiling protection film needs to exert certain uncoiling force, and the wafer cutting protection film of current market mostly needs larger uncoiling force to uncoil protection film, it is easy to cause thin film to peel off deformation, and the wafer cutting protection film of current market mostly has lower high-temperature resistance, protection film is easy to deform or melt in wafer cutting process, reduces the protection ability to wafer.

[0004] Therefore, the technical personnel in the art provide a wafer cutting protection film to solve the problems in the background art. UTILITY MODEL CONTENT

[0005] The utility model discloses a wafer cutting protection film, by making polytetrafluoroethylene material into granular, forms a layer of anti-sticking layer and coats in the adhesion layer, forms uneven surface structure on protection film, avoids the situation that the film is peeled off and deformed due to the uncoiling force being too large, and the heat resistance of protection film is improved by the substrate layer and the adhesion layer made of polyolefin material and polyimide material respectively, and the polyolefin material also has good impact resistance, and the strength of protection film is enhanced.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] A wafer cutting protection film, including glue layer, substrate layer, adhesion layer and anti-sticking layer, the substrate layer is arranged at the upper end of glue layer, the upper end of glue layer is fixedly connected with substrate layer through the silica gel of coating, the adhesion layer is arranged at the upper end of substrate layer, the upper end of substrate layer is fixedly connected with adhesion layer through the silica gel of coating, the anti-sticking layer is arranged at the upper end of adhesion layer, and the upper end of adhesion layer is fixedly connected with anti-sticking layer through the silica gel of coating.

[0008] By the technical scheme, the anti-adhesion layer is attached to the upper end of the adhesive layer and is made of polytetrafluoroethylene material and is uniformly coated on the adhesive layer in a granular form, so that a concave-convex surface structure is formed on the protective film. The anti-adhesion layer is arranged on the outermost layer of the protective film, so that when the protective film is in a rolled storage state, the adhesive layer is in contact with the concave-convex anti-adhesion layer on the surface, and the two layers are difficult to be firmly bonded, thereby reducing the unrolling force required for unrolling the protective film. The substrate layer made of polyolefin material is the thickest layer in the protective film, and the adhesive layer made of polyimide material can provide good support for the protective film, maintain the basic shape of the protective film, and improve the temperature resistance and strength of the protective film, so as to meet higher process requirements and provide protection for the accuracy and yield of wafer processing.

[0009] Further, the adhesive layer is a 5-20 μm thin layer made of UV adhesion-reducing glue.

[0010] By the technical scheme, the adhesive layer made of UV adhesion-reducing glue is arranged at the lower end of the substrate layer and is the bottom layer of the protective film and is in direct contact with the wafer. The UV adhesion-reducing glue has good ductility and is not easy to deform the protective film. The UV adhesion-reducing glue has the characteristics that the adhesion is strong under normal conditions, and the adhesion is sharply reduced after UV irradiation. Therefore, the protective film is suitable for being attached to the surface of the wafer before wafer cutting, provides protection for the wafer, and is not easy to leave residual glue after the protective film is peeled off from the wafer after wafer cutting processing is completed, and has less influence on the subsequent wafer processing procedure.

[0011] Further, the substrate layer is a 25-150 μm thin layer made of polyolefin material.

[0012] By the technical scheme, the substrate layer is made to be the thickest layer in the protective film, and the good heat resistance and impact resistance of the polyolefin material make the protective film not easy to deform or melt due to high temperature during wafer cutting, so that the protective film can provide good protection for the wafer after being attached to the wafer, and can better adapt to higher process requirements, thereby providing protection for the accuracy and yield of wafer processing.

[0013] Further, the adhesive layer is a 5-50 μm thin layer made of polyimide material.

[0014] By the technical scheme, the polyimide material is made into an adhesive layer to provide an attachment base for the upper anti-adhesion layer. The polyimide has good thermal stability, and the substrate layer further improves the heat resistance of the protective film, thereby avoiding the situation that the protective film deforms or melts due to high temperature and falls off from the wafer, and being conducive to improving the protection capability of the protective film for the wafer.

[0015] Further, the anti-adhesion layer is a 5-25 μm thin layer formed by accumulation of polytetrafluoroethylene particles.

[0016] By the above technical scheme, a layer of anti-sticking layer is uniformly coated on the upper end of the adhesive layer, the anti-sticking layer is made of polytetrafluoroethylene particles, the polytetrafluoroethylene has a low friction coefficient, the friction force when the anti-sticking layer contacts with the upper end object is reduced, the anti-sticking layer is not directly formed into a thin film by the polytetrafluoroethylene, but is formed into a granular accumulation, the granular particles can form a concave-convex structure on the surface of the protective film, when the protective film is curled, the adhesive layer is difficult to be directly and firmly bonded with the anti-sticking layer, thereby reducing the unrolling force required when the protective film is unrolled, and preventing the unrolling force from being too large to cause the protective film to be peeled and deformed.

[0017] The utility model has the advantages of the following beneficial effects:

[0018] 1. The protective film for wafer cutting has the advantages that a layer of anti-sticking layer with a thickness of 5-25 μm is attached to the upper end of the adhesive layer, the anti-sticking layer is made of polytetrafluoroethylene material and is uniformly coated on the adhesive layer in a granular form, a concave-convex surface structure is formed on the protective film, the friction coefficient of the polytetrafluoroethylene material is extremely low, and the protective film is easy to unroll under high peeling force, thereby avoiding the situation that the film is peeled and deformed due to the unrolling force being too large.

[0019] 2. The protective film for wafer cutting has the advantages that the polyolefin material is made into a base material layer with a thickness of 25-150 μm, and the polyimide material is made into an adhesive layer with a thickness of 5-50 μm, the polyolefin material and the polyimide material both have good heat resistance, the polyolefin material has high impact resistance, the heat resistance and strength of the protective film are improved, the wafer is well protected, the process conditions of higher requirements can be met, and the accuracy and yield of wafer processing are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 FIG. 1 is a structural schematic view of the protective film for wafer cutting according to the utility model;

[0021] Fig. 2 FIG. 2 is a side sectional view of the protective film for wafer cutting according to the utility model.

[0022] LEGEND:

[0023] 1. Adhesive layer; 2. Base material layer; 3. Adhesive layer; 4. Anti-sticking layer. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0025] With reference to Figs. 1-2 The utility model provides a kind of implementation mode: a wafer cutting protective film, including adhesive layer 1, substrate layer 2, attachment layer 3 and anti-adhesion layer 4, substrate layer 2 is set to the upper end of adhesive layer 1, the upper end of adhesive layer 1 is fixedly connected with substrate layer 2 by coating silicone, attachment layer 3 is set to the upper end of substrate layer 2, the upper end of substrate layer 2 is fixedly connected with attachment layer 3 by coating silicone, anti-adhesion layer 4 is set to the upper end of attachment layer 3, the upper end of attachment layer 3 is fixedly connected with anti-adhesion layer 4 by coating silicone.

[0026] By attaching a layer of thickness 5~25 μm anti-adhesion layer 4 on the upper end of attachment layer 3, and anti-adhesion layer 4 is made of polytetrafluoroethylene material and is made into granular uniform coating on attachment layer 3, so that uneven surface structure is formed on protective film, and the friction coefficient of polytetrafluoroethylene material is extremely low, so that protective film is easy to unroll under high peeling force, avoid the situation that film is peeled and deformed because unrolling force is too large, and by making polyolefin material into thickness 25~150 μm substrate layer 2, and cooperating with polyimide material to make 5~50 μm attachment layer 3, polyolefin material and polyimide material both have good heat resistance, and polyolefin material has higher impact resistance, so as to improve the temperature resistance and strength of protective film, can satisfy higher requirement process condition, provide guarantee for the accuracy and yield of wafer processing.

[0027] The adhesive layer 1 is a 5-20 μm thin layer made of UV debonding adhesive. By setting an adhesive layer 1 made of UV debonding adhesive at the lower end of the substrate layer 2 and at the bottom layer of the protective film, the protective film is in direct contact with the wafer. The UV debonding adhesive has good ductility and is not easy to deform the protective film. The UV debonding adhesive has strong adhesion in normal state and the adhesion sharply decreases after UV irradiation. Therefore, the protective film is suitable for being adhered to the wafer surface before wafer cutting, provides protection for the wafer, and is not easy to leave residual adhesive after the protective film is peeled off from the wafer, which has little effect on the subsequent wafer processing procedure. The substrate layer 2 is a 25-150 μm thin layer made of polyolefin material. By making the substrate layer 2 the thickest layer in the protective film, the polyolefin material has good heat resistance and impact resistance, and is not easy to deform or melt due to high temperature during wafer cutting. After the protective film is adhered to the wafer, the wafer can be well protected, and the protective film can better adapt to higher process conditions, providing protection for the accuracy and yield of wafer processing. The adhesive layer 3 is a 5-50 μm thin layer made of polyimide material. By making the polyimide material into an adhesive layer 3, the upper anti-adhesion layer 4 is provided with an adhesive substrate. The polyimide has good thermal stability, which further improves the heat resistance of the protective film and avoids the situation that high temperature deforms or melts the protective film and falls off from the wafer. This is conducive to improving the protection ability of the protective film for the wafer. The anti-adhesion layer 4 is a 5-25 μm thin layer formed by stacking polytetrafluoroethylene particles. By uniformly coating an anti-adhesion layer 4 on the upper end of the adhesive layer 3, the anti-adhesion layer 4 is made of polytetrafluoroethylene particles. The polytetrafluoroethylene has a low friction coefficient, which reduces the friction force when the anti-adhesion layer 4 contacts the upper object. The anti-adhesion layer 4 is not formed by directly forming a thin film of polytetrafluoroethylene, but is formed by stacking particles. The particles can form a concave-convex structure on the surface of the protective film, so that the adhesive layer 1 is difficult to firmly adhere to the anti-adhesion layer 4 when the protective film is rolled up, thereby reducing the unrolling force required when the protective film is unrolled, and preventing the protective film from being peeled off and deformed.

[0028] Working principle: when using the wafer cutting protective film, under the effect of the anti-sticking layer 4 made of polytetrafluoroethylene particles as the material, the surface of the protective film is uneven, so that the adhesive layer 1 is difficult to be directly and firmly bonded with the anti-sticking layer 4, the staff can use a small uncoiling force to uncoil the protective film, pull it apart on the wafer surface, use the adhesive layer 1 made of UV adhesive to bond the protective film on the wafer surface, prevent the protective film from deviating or falling off from the wafer surface, then in the process of cutting the wafer, the base material layer 2 made of polyolefin material and the adhesive layer 3 made of polyimide material provide good support for the protective film, maintain the basic shape of the protective film, not easy to deform or melt at high temperature, can provide good protection for the wafer, after the wafer cutting is completed, the protective film is irradiated by UV light, the adhesive layer 1 made of UV adhesive has a sharp decrease in viscosity, the staff removes the protective film, and it is not easy to leave residual glue.

[0029] Finally, it should be noted that: the above only for the preferred specific embodiments of the present application, and is not intended to limit the present application, although the foregoing detailed description of the present application, for those skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.

Claims

1. A protective film for wafer cutting, comprising a glue layer (1), a base material layer (2), an adhesive layer (3) and an anti-sticking layer (4), characterized in that: The substrate layer (2) is arranged on the upper end of the glue layer (1), the upper end of the glue layer (1) is fixedly connected with the substrate layer (2) through the coated silica gel, the adhesion layer (3) is arranged on the upper end of the substrate layer (2), the upper end of the substrate layer (2) is fixedly connected with the adhesion layer (3) through the coated silica gel, the anti-adhesion layer (4) is arranged on the upper end of the adhesion layer (3), and the upper end of the adhesion layer (3) is fixedly connected with the anti-adhesion layer (4) through the coated silica gel.

2. The protective film for wafer cutting according to claim 1, wherein: The glue layer (1) is a 5-20 μm thin layer made of UV debonding glue.

3. The protective film for wafer dicing according to claim 1, wherein: The substrate layer (2) is a 25-150 μm thin layer made of polyolefin material.

4. The protective film for wafer dicing according to claim 1, wherein: The adhesion layer (3) is a 5-50 μm thin layer made of polyimide material.

5. The protective film for wafer dicing according to claim 1, wherein: The anti-adhesion layer (4) is a 5-25 μm thin layer made of polytetrafluoroethylene particles.

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