PCIE patch cord structure

Abstract

The utility model discloses a PCIE patch cord structure which comprises a base circuit board, a golden finger circuit board, a power line, a front signal line and a back signal line, the front of the base circuit board is provided with a base front line, the back of the base circuit board is provided with a base back line, the front of the golden finger circuit board is provided with a golden finger front line, and the back of the golden finger circuit board is provided with a golden finger back line. A connector is arranged on the base circuit board, a golden finger strip is arranged on the golden finger circuit board, the power line is respectively connected with the base circuit board and the golden finger circuit board, and two ends of the front signal line are respectively connected with the base front line and the golden finger line front line. And two ends of the back signal line are respectively connected with the base back circuit and the golden finger back circuit. Through holes do not need to be arranged, and the balance of signal transmission quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to connecting line technical field, concretely is a kind of PCIE adapter cord structure mainly applied in various electronic equipment. BACKGROUND

[0002] PCI-E adapter cord is a kind of conversion equipment, can be converted to the interface of PCI-E equipment extension connection to another PCIE equipment interface such as graphic card type, so as to be used in certain equipment or application.Specifically, it can convert the signal of PCI-E slot into transmission signal extended to another PCIE equipment interface such as graphic card and minimize the attenuation value to ensure its normal use, so as to be connected with corresponding equipment.This kind of adapter cord is widely used in computer, especially for graphic card, to ensure the fast and effective, complete transmission of signal.

[0003] The existing PCIE connecting line usually includes signal line, circuit board, and the circuit board is provided with connection and corresponding connection terminal, limited by the size specification of connector, the size of circuit board also has corresponding size, signal line is welded side by side on the front or back of circuit board, and in order to meet the connection of signal line, corresponding circuit needs to be set on the front and back of circuit board, and the position of the same side surface of circuit board often cannot meet the setting of all circuits.Currently, signal line is basically set on the same surface of circuit board, i.e.the back or front, at this time, it is necessary to set separate through hole on circuit board to ensure that signal line can be conducted with the circuit of the other surface, and then realize the communication with corresponding terminal, so as to realize the signal transmission loss caused by the circuit on the back and front of circuit board to the same extent as far as possible.However, the setting of through hole increases additional preparation process, and the position setting of through hole also needs to be preset, which increases production cost and production time, and unstable signal transmission affects its characteristics. SUMMARY

[0004] In order to solve the above technical problems, the application provides a PCIE adapter cord structure capable of improving signal transmission uniformity.

[0005] In order to solve the above technical problems, the application adopts the following technical solutions:

[0006] A PCIE adapter structure, comprising a baseboard, a gold finger board, a power line, a front signal line and a back signal line, the baseboard is provided with a baseboard front side circuit on the front side and a baseboard back side circuit on the back side, the gold finger board is provided with a gold finger front side circuit on the front side and a gold finger back side circuit on the back side, the baseboard is provided with a connector, the gold finger board is provided with a gold finger strip, the power line is connected with the baseboard and the gold finger board respectively, the two ends of the front signal line are connected with the baseboard front side circuit and the gold finger front side circuit respectively, and the two ends of the back signal line are connected with the baseboard back side circuit and the gold finger back side circuit respectively.

[0007] As a further improvement, the front signal line and the back signal line are alternately distributed with intervals.

[0008] As a further improvement, the power line has two, one of which is used to connect the baseboard front side and the gold finger board front side, and the other is used to connect the baseboard back side and the gold finger board back side.

[0009] As a further improvement, the two power lines are arranged on the same side and are distributed opposite to each other, and the power line is provided with a power line head, the baseboard is provided with a baseboard front side power pad on the front side and a baseboard back side power pad on the back side, the gold finger board is provided with a gold finger front side power pad on the front side and a gold finger back side power pad on the back side, the power line head of one of the power lines is connected with the baseboard front side power pad and the gold finger front side power pad, and the power line head of the other power line is connected with the baseboard back side power pad and the gold finger back side power pad.

[0010] As a further improvement, the two ends of the front signal line and the back signal line are provided with wire joints, the baseboard is provided with a baseboard front side wiring pad on the front side and a baseboard back side wiring pad on the back side, the gold finger board is provided with a gold finger front side wiring pad on the front side and a gold finger back side wiring pad on the back side, the wire joints at the two ends of the front signal line are connected with the baseboard front side wiring pad and the gold finger front side wiring pad respectively, and the wire joints at the two ends of the back signal line are connected with the baseboard back side wiring pad and the gold finger back side wiring pad respectively.

[0011] As a further improvement, the connector is provided with a connecting pin, the baseboard is provided with a switch pad, and the connecting pin is connected with the switch pad.

[0012] As a further improvement, the wire joint comprises a tape block and a wire pin, one end of the wire pin is inserted into the tape block, the tape block is provided with an aluminum foil, and the outer surface of the wire pin is provided with an insulation layer.

[0013] As a further improvement, the baseboard is provided with a via hole for mounting the connector.

[0014] As a further improvement, the number of the front side lines of the base, the front side lines of the gold finger and the front side signal lines are the same; the number of the back side lines of the base, the back side lines of the gold finger and the back side signal lines are the same.

[0015] As a further improvement, the front side signal lines and the back side signal lines are flat structures.

[0016] Compared with the prior art, the utility model has the following beneficial technical effects:

[0017] Through setting up the front side signal lines and the back side signal lines which are independent of each other, connecting the front side and the back side of the corresponding line board respectively, not needing to set up a single through hole for penetrating the line board and connecting the front and back lines, the front side lines and the back side lines do not need to penetrate and extend to the other surface, avoiding the use of the traditional through hole, thereby simplifying the preparation process, reducing the production cost and improving the signal transmission efficiency and maintaining the balance of signal transmission. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0019] Figure 2 It is another three-dimensional structure schematic view of the utility model from another angle;

[0020] Figure 3 It is a connection schematic view of the base line board in the utility model;

[0021] Figure 4 It is another connection schematic view of the base line board in the utility model from another angle;

[0022] Figure 5 It is a connection schematic view of the gold finger line board in the utility model;

[0023] Figure 6 It is another connection schematic view of the gold finger line board in the utility model from another angle;

[0024] Figure 7 It is a connection schematic view of the power line in the utility model;

[0025] Figure 8 It is a connection schematic view of the front side signal line in the utility model;

[0026] Figure 9 It is a connection schematic view of the back side signal line in the utility model;

[0027] Figure 10 It is a local structure schematic view of the front side signal line in the utility model.

[0028] Reference signs:

[0029] Base circuit board 1, base front power pad 101, base back power pad 102, base front wiring pad 103, base back wiring pad 104, gold finger circuit board 2, gold finger front power pad 201, gold finger back power pad 202, gold finger front wiring pad 203, gold finger back wiring pad 204, power line 3, front signal line 4, back signal line 5, connector 6, gold finger strip 7, wire joint 8, tape block 81, wire pin 82, connection pin 9, switch pad 10, via 11. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described below in detail with reference to the accompanying drawings, wherein the same or similar components are denoted by the same or similar reference numerals throughout the drawings. The embodiments described below by reference to the drawings are exemplary and are for the purpose of explaining the present application only, and should not be understood as limiting the present application.

[0031] In the description of the present application, it should be understood that, if there are terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, which are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0032] In the description of the present application, it should be noted that, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected. It can be mechanically connected, or it can be electrically connected. It can be directly connected, or it can be indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] Example 1

[0034] As Figure 1And 2 As shown in the figure, a PCIE adapter structure includes a baseboard 1, a gold finger board 2, a power line 3, a front signal line 4 and a back signal line 5. The front of the baseboard 1 is provided with a baseboard front line, and the back is provided with a baseboard back line. The front of the gold finger board is provided with a gold finger front line, and the back is provided with a gold finger back line. The baseboard 1 is provided with a connector 6, and the gold finger board 2 is provided with a gold finger strip 7. The power line 3 is connected with the baseboard 1 and the gold finger board 2 respectively. The two ends of the front signal line are connected with the baseboard front line and the gold finger front line respectively, and the two ends of the back signal line are connected with the baseboard back line and the gold finger back line respectively.

[0035] Among them, the baseboard 1 refers to the substrate that carries the connector 6 and arranges the double-sided line, which can be realized by a multi-layer printed circuit board. The front line and the back line form independent signal transmission channels respectively. The gold finger board refers to the interface conversion substrate that sets the gold finger strip, which can be realized by a flexible circuit board. The double-sided line directly corresponds to the target interface pin. The power line refers to the conductive medium that connects the baseboard and the gold finger board, which can be realized by a copper core wire, and is used to establish a stable power transmission path.

[0036] The front signal line refers to the signal transmission conductor arranged on the front, which can be realized by a flat cable, and is directly connected with the baseboard front line and the gold finger front line. The back signal line refers to the signal transmission conductor arranged on the back, which can be realized by a wire material of the same material as the front signal line, and is directly connected with the baseboard back line and the gold finger back line, so that the front signal line and the back signal line are relatively independent, and the baseboard front line does not need to extend to the back through the baseboard. Similarly, the gold finger front line also does not need to extend to the back through the gold finger board. The connector refers to the physical interface component installed on the baseboard, which can be realized by a standard PCI-E socket, and is used for plugging with external equipment. The gold finger strip refers to the conductive contact piece arranged on the edge of the gold finger board, which can be realized by a gold-plated copper contact, and is used to establish electrical connection with the target equipment.

[0037] Specifically, the baseboard 1 forms front and back independent line layers through double-sided wiring design. The front signal line 4 is directly welded between the baseboard front line and the gold finger front line, and the back signal line 5 is directly welded between the baseboard back line and the gold finger back line. The power line establishes the power path between the baseboard and the gold finger board, and ensures the power supply required for signal transmission. The connector and the gold finger strip are respectively used as input and output interfaces, and the connection between devices is completed through physical plugging. The structure realizes the space separation layout of the front signal line and the back signal line, and completes the construction of the signal transmission path without setting a through hole.

[0038] The double-sided wiring method is used to improve the space utilization of the circuit board, and the via hole processing procedure is cancelled on the process level, thereby effectively reducing the production complexity and equipment debugging time.

[0039] The double-sided independent wiring method improves the layout freedom of the circuit, and meets the high-density signal transmission demand. The simplified process reduces the manufacturing cost, and enhances the product consistency and reliability, thereby meeting the technical requirements of the computer hardware equipment for high-speed and stable signal transmission.

[0040] The power lines 3 are provided with two lines, which are connected from the front and back surfaces of the base circuit board and the gold finger circuit board, to ensure the conduction of the power supply.

[0041] The power line refers to a conductor structure for transmitting power, which can be implemented by using a copper core conductor covered with an insulating layer, and is connected to the circuit board by welding or crimping.

[0042] In order to facilitate connection, the two power lines 3 are arranged on the same side and face each other, and the power line 3 has a power line head. The front surface of the base circuit board 1 is provided with a base front surface power pad 101, and the back surface is provided with a base back surface power pad 102. The front surface of the gold finger circuit board 2 is provided with a gold finger front surface power pad 201, and the back surface is provided with a gold finger back surface power pad 202. The power line head of one of the two power lines 3 is connected to the base front surface power pad 101 and the gold finger front surface power pad 201, and the power line head of the other power line 3 is connected to the base back surface power pad 102 and the gold finger back surface power pad 202.

[0043] Specifically, two independent power lines 3 are arranged between the base circuit board 1 and the gold finger circuit board 2, and are respectively connected to the front and back surfaces of the two circuit boards. The base front surface power pad forms a loop with the gold finger front surface power pad through one power line, and the base back surface power pad forms a loop with the gold finger back surface power pad through another power line. By distributing the power supply path on two independent planes, the front and back surface current transmission does not interfere with each other, and the problem of heat concentration caused by a single power line carrying too much current is avoided.

[0044] The present application forms a spatial isolation between the power transmission path and the signal transmission path through the front and back independent power supply design, thereby effectively reducing the influence of electromagnetic interference on the signal integrity.

[0045] Embodiment two

[0046] Reference Figures 1-6As shown in FIG. 10, both ends of the front signal line 4 and the back signal line 5 are provided with wire connectors 8, the front surface of the base circuit board 1 is provided with a base front surface wiring pad 103, the back surface is provided with a base back surface wiring pad 104, the front surface of the gold finger circuit board 2 is provided with a gold finger front surface wiring pad 203, the back surface is provided with a gold finger back surface wiring pad 204, the wire connectors 8 at both ends of the front signal line 4 are connected with the base front surface wiring pad 103 and the gold finger front surface wiring pad 203 respectively, and the wire connectors 8 at both ends of the back signal line 5 are connected with the base back surface wiring pad 104 and the gold finger back surface wiring pad 204 respectively.

[0047] The wire connector 8 refers to an interface component for physically connecting the wire and the circuit board, which can be implemented by a combination structure of a tape block 81 and a wire pin 82, the wire pin is inserted into the tape block and shielded from interference by an aluminum foil, and the insulation layer prevents short circuit. The base front surface wiring pad refers to a metal contact area on the front surface of the base circuit board, which can be implemented by a copper gold-plated pad, used for fixing the wire connector and forming a conductive path. The gold finger front surface wiring pad refers to a metal contact area on the front surface of the gold finger circuit board, which can be implemented by the same material and structure as the base front surface wiring pad, used for realizing direct communication of the signal transmission path.

[0048] Specifically, the front signal line is welded on the base front surface wiring pad and the gold finger front surface wiring pad through the wire connectors at both ends respectively, and the back signal line is welded on the base back surface wiring pad and the gold finger back surface wiring pad through the wire connectors at both ends respectively. The tape block of the wire connector ensures the stability of signal transmission through mechanical fixation and aluminum foil shielding, and the insulation layer of the wire pin avoids short circuit with adjacent lines. The front and back surfaces of the base circuit board and the gold finger circuit board are provided with corresponding wiring pads, so that the signal line can be directly connected to the two surfaces without the need for through-hole trans-layer conduction.

[0049] The present application directly arranges wiring pads on the front and back surfaces of the circuit board, so that the signal line is directly connected to the corresponding pad through the wire connector, eliminating the processing step of the through-hole. The through-hole of the prior art needs accurate position planning and increases the process complexity, while the present application directly connects the double-sided pad and the wire connector, reducing the manufacturing process.

[0050] The direct connection mode of the wire connector and the corresponding wiring pad avoids the loss of signal caused by trans-layer transmission, improves the signal integrity and transmission reliability. The shielding design of the tape block and the aluminum foil further reduces external interference and ensures the stability of signal transmission.

[0051] Embodiment three

[0052] With particular reference to Figures 7-9As shown, the connector 7 is provided with a connecting pin 9, and the base circuit board 1 is provided with a switch pad 10, and the connecting pin 9 is connected with the switch pad 10. The connecting pin refers to a metal contact structure on the connector for conducting signals, which can be made of copper alloy material and surface plated gold for implementation, and is used to realize the physical and electrical connection between the connector and the circuit board.

[0053] The switch pad 10 refers to a conductive area pre-set on the base circuit board, which can be implemented by a copper foil pad formed by surface mounting technology, and is used to fix the connecting pin and establish an electrical path.

[0054] The connection between the connecting pin and the switch pad refers to fixing and conducting them by welding or crimping, which can be implemented by reflow soldering process or hot pressing process, and is used to ensure the stability and reliability of signal transmission.

[0055] In addition, the base circuit board 1 is provided with a via hole 11 for installing the connector, which can reduce the installation difficulty of the connector. The via hole refers to a through-hole structure penetrating the front and back surfaces of the base circuit board, which can be formed by mechanical drilling or laser drilling process, and its inner wall can be covered with conductive material to realize electrical connection. The function of the via hole is to provide a through installation space for the connector.

[0056] The same number means that the number of the base front circuit, the gold finger front circuit and the front signal line one-to-one corresponds, ensuring that the signal path is completely matched. The base back circuit, the gold finger back circuit and the back signal line adopt the same number matching principle to avoid the need for interlayer conduction.

[0057] Specifically, each base front circuit on the front surface of the base circuit board is directly connected with the gold finger front circuit on the front surface of the gold finger circuit board through the corresponding front signal line, and the layout of the back circuit follows the same rule. By matching the number of circuits, the signal transmission path forms a complete channel independently on the front and back surfaces without the need for cross-layer connection through the through-hole. For example, when the front signal line uses eight, the base front circuit and the gold finger front circuit are also configured as eight to ensure that each signal line can be independently corresponded to a circuit.

[0058] In some specific embodiments, the number of base front circuits can be adjusted according to the signal transmission demand, for example, set to sixteen, at which time the gold finger front circuit and the front signal line are adjusted to the same number synchronously. The configuration of the back circuit is symmetrical to the front, forming a double-sided independent transmission system.

[0059] Through the above technical solutions, the application solves the problem of signal loss caused by the through-hole, reduces the processing procedures of the circuit board, and improves the consistency of the signal transmission path. By directly corresponding the number of front and back circuits and signal lines, the complexity caused by cross-layer connection is avoided, and the production time and cost are reduced

[0060] It should be noted that the above only describes the preferred embodiments of the present application and is not used to limit the present application. Although the present application is described in detail with reference to the embodiments, those skilled in the art can modify the technical solutions described in the foregoing embodiments, or equivalently replace some of the technical features, but any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A PCIE adapter structure, comprising: The base circuit board, the gold finger circuit board, the power supply line, the front signal line and the back signal line are provided, the front surface of the base circuit board is provided with a base front surface circuit, the back surface of the base circuit board is provided with a base back surface circuit, the front surface of the gold finger circuit board is provided with a gold finger front surface circuit, the back surface of the gold finger circuit board is provided with a gold finger back surface circuit, the base circuit board is provided with a connector, the gold finger circuit board is provided with a gold finger strip, the power supply line is connected with the base circuit board and the gold finger circuit board respectively, the two ends of the front signal line are connected with the base front surface circuit and the gold finger front surface circuit respectively, and the two ends of the back signal line are connected with the base back surface circuit and the gold finger back surface circuit respectively.

2. The PCIE adapter structure of claim 1, wherein, The front signal line and the back signal line are alternately distributed.

3. The PCIE adapter structure of claim 1, wherein, The power supply line has two power supply lines, one of which is used for connecting the front surface of the base circuit board and the front surface of the gold finger circuit board, and the other is used for connecting the back surface of the base circuit board and the back surface of the gold finger circuit board.

4. The PCIE adapter structure of claim 3, wherein, The two power supply lines are arranged on the same side and face each other, and the power supply line has a power supply line head, the front surface of the base circuit board is provided with a base front surface power supply pad, the back surface of the base circuit board is provided with a base back surface power supply pad, the front surface of the gold finger circuit board is provided with a gold finger front surface power supply pad, and the back surface of the gold finger circuit board is provided with a gold finger back surface power supply pad, the power supply line head of one of the power supply lines is connected with the base front surface power supply pad and the gold finger front surface power supply pad, and the power supply line head of the other power supply line is connected with the base back surface power supply pad and the gold finger back surface power supply pad.

5. The PCIE adapter structure of claim 1, wherein, The two ends of the front signal line and the back signal line are provided with wire joints, the front surface of the base circuit board is provided with a base front surface wiring pad, the back surface of the base circuit board is provided with a base back surface wiring pad, the front surface of the gold finger circuit board is provided with a gold finger front surface wiring pad, and the back surface of the gold finger circuit board is provided with a gold finger back surface wiring pad, the wire joints at the two ends of the front signal line are connected with the base front surface wiring pad and the gold finger front surface wiring pad respectively, and the wire joints at the two ends of the back signal line are connected with the base back surface wiring pad and the gold finger back surface wiring pad respectively.

6. The PCIE adapter structure of claim 1, wherein, The connector is provided with a connecting pin, and the base circuit board is provided with a switch pad, and the connecting pin is connected with the switch pad.

7. The PCIE adapter structure of claim 5, wherein, The wire joint comprises a tape block and a wire pin, one end of the wire pin is inserted into the tape block, the tape block is provided with an aluminum foil, and the outer surface of the wire pin is provided with an insulating layer.

8. The PCIE adapter structure of claim 1, wherein, The base circuit board is provided with a via for mounting the connector.

9. The PCIE adapter structure of claim 1, wherein, The base front surface circuit, the gold finger front surface circuit and the front signal line have the same number, and the base back surface circuit, the gold finger back surface circuit and the back signal line have the same number.

10. The PCIE adapter structure of claim 1, wherein, The front signal line and the back signal line are both flat structures.

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