Integrated circuit polishing solution filling equipment

Abstract

The utility model provides integrated circuit polishing solution filling equipment which comprises a support and a solution storage tank arranged on the support and further comprises a fixed discharging pipe, a movable discharging pipe and a discharging valve, the fixed discharging pipe is vertically arranged on a discharging opening in the bottom of the solution storage tank, the movable discharging pipe is vertically arranged on the fixed discharging pipe in a clearance sliding fit mode, and the discharging valve is arranged on the fixed discharging pipe. The discharging valve is arranged on a bottom outlet of the movable discharging pipe, an adjusting mechanism used for adjusting the length of the movable discharging pipe extending out of the fixed discharging pipe is arranged on the fixed discharging pipe, and a cut-off mechanism is further arranged on the fixed discharging pipe. During filling, the extension length of the movable discharging pipe is adjusted firstly, the discharging valve is in a closed state, the cut-off mechanism is in an open state, the polishing solution enters the movable discharging pipe, then the cut-off mechanism is closed, and the polishing solution below the cut-off mechanism is the required quantitative polishing solution. And finally, a discharge valve is opened to enable the polishing liquid to flow into a container tank for receiving materials. And quantitative filling according to the capacity of the container is realized.

Description

Technical Field

[0001] This utility model relates to the field of polishing slurry dispensing technology, specifically to an integrated circuit polishing slurry filling device. Background Technology

[0002] Silicon carbide substrate polishing refers to the process of polishing the surface of a silicon carbide substrate. Silicon carbide (SiC) is a material widely used in semiconductors, optoelectronics, photovoltaics, and other fields. The smoothness and finish of its surface have a significant impact on device performance. After production, the polishing slurry often needs to be stored. Silicon carbide substrate polishing slurry is usually a highly corrosive chemical solution, so it requires special care during storage.

[0003] In existing methods of storing polishing slurry after production, prolonged storage can lead to sedimentation, which in turn affects the slurry's performance. Therefore, it is necessary to repackage the polishing slurry to maintain the uniformity of each small portion. However, currently, the production workshop lacks large-scale repackaging equipment, and repackaging relies on manual quantitative dispensing. Manual control introduces certain errors, and when the repackaging tank overflows, it can cause corrosion, posing a safety hazard. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides an integrated circuit polishing slurry filling device, which solves the problems mentioned in the background section.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit polishing slurry filling device, comprising a support and a storage tank mounted on the support, and further comprising a fixed discharge pipe, a movable discharge pipe, and a discharge valve. The fixed discharge pipe is vertically mounted on the discharge port at the bottom of the storage tank. The movable discharge pipe is vertically and slidably fitted onto the fixed discharge pipe. The discharge valve is mounted on the bottom outlet of the movable discharge pipe. The fixed discharge pipe is provided with an adjustment mechanism for adjusting the length of the movable discharge pipe extending beyond the fixed discharge pipe. The fixed discharge pipe is also provided with a flow-stopping mechanism.

[0008] Preferably, the adjusting mechanism includes a bearing housing, a screw, and a nut threaded onto the screw. The bearing housing is mounted on a fixed discharge pipe, the end of the screw is connected to the inner ring of the bearing in the bearing housing, and the nut is connected to a movable discharge pipe.

[0009] Preferably, the intercepting mechanism includes a cylinder, a piston rod, and two baffles. The cylinder is horizontally disposed on and communicates with the fixed discharge pipe. The piston rod is piston-slidably adapted to the cylinder. The two baffles are disposed inside the fixed discharge pipe and located on the upper and lower sides of the cylinder. The two baffles have discharge holes that are open vertically. When the end of the piston rod is inserted into the fixed discharge pipe, it can block the discharge holes.

[0010] Preferably, at least one sealing ring is provided on the outer wall of the top end of the movable discharge pipe.

[0011] Preferably, two sets of sealing rings are provided on the outside of the piston rod. When the end of the piston rod is inserted into the fixed discharge pipe, the two sets of sealing rings are located on both sides of the discharge hole.

[0012] Preferably, a handle is provided at the outer end of the piston rod.

[0013] (III) Beneficial Effects

[0014] This invention provides an integrated circuit polishing slurry filling device. It has the following beneficial effects:

[0015] 1. This integrated circuit polishing slurry filling equipment first adjusts the extension length of the movable discharge pipe during filling, with the discharge valve in the closed state and the intercepting mechanism in the open state, allowing the polishing slurry to enter the movable discharge pipe. Then, the intercepting mechanism closes, and the polishing slurry below the intercepting mechanism is the required quantitative amount. Finally, the discharge valve is opened to allow the polishing slurry to flow into the receiving container. This achieves quantitative filling according to the container capacity, avoiding the safety hazards caused by polishing slurry overflowing from the container. Attached Figure Description

[0016] Figure 1 This is an overall isometric view of the present invention;

[0017] Figure 2 This is a schematic diagram of the bottom of the liquid storage tank of this utility model;

[0018] Figure 3 This is a cross-sectional view of the fixed discharge pipe of this utility model.

[0019] In the diagram: 1. Support, 2. Storage tank, 3. Fixed discharge pipe, 4. Movable discharge pipe, 5. Discharge valve, 6. Cut-off mechanism, 7. Bearing seat, 8. Screw, 9. Nut, 10. Sealing ring one, 61. Cylinder body, 62. Piston column, 63. Handle, 64. Baffle, 65. Discharge hole, 66. Sealing ring two. Detailed Implementation

[0020] This utility model embodiment provides an integrated circuit polishing slurry filling device, such as... Figure 1-3 As shown, it includes a support 1 and a liquid storage tank 2 mounted on the support 1. The liquid storage tank 2 is fixed upside down on the support 1, with the outlet of the liquid storage tank 2 facing downwards.

[0021] This device also includes a fixed discharge pipe 3, a movable discharge pipe 4, and a discharge valve 5. The fixed discharge pipe 3 is vertically installed at the discharge port at the bottom of the storage tank 2. The movable discharge pipe 4 is vertically slidably fitted onto the fixed discharge pipe 3. The outer wall of the movable discharge pipe 4 is clearance-fitted with the inner wall of the fixed discharge pipe 3. At least one sealing ring 10 is provided on the outer wall of the top end of the movable discharge pipe 4. By providing the sealing ring 10, the polishing liquid can be prevented from flowing out from the gap between the fixed discharge pipe 3 and the movable discharge pipe 4.

[0022] The discharge valve 5 is located at the bottom outlet of the movable discharge pipe 4. The discharge valve 5 can be a butterfly valve, ball valve, etc., as long as it can open and close the outlet.

[0023] The fixed discharge pipe 3 is equipped with an adjustment mechanism for adjusting the length of the movable discharge pipe 4 extending out of the fixed discharge pipe 3, and the fixed discharge pipe 3 is also equipped with a flow-stopping mechanism 6.

[0024] The length of the movable discharge tube 4 extending beyond the fixed discharge tube 3 is adjusted by the adjustment mechanism to achieve quantitative control. A scale can be set vertically on the movable discharge tube 4 for precise adjustment of the extension length of the movable discharge tube 4.

[0025] During filling, first adjust the extension length of the movable discharge pipe 4, with the discharge valve 5 in the closed state and the intercepting mechanism 6 in the open state, allowing the polishing liquid to enter the movable discharge pipe 4. Then, the intercepting mechanism 6 is closed, and the polishing liquid below the intercepting mechanism 6 is the required quantitative amount of polishing liquid. Finally, open the discharge valve 5 to let the polishing liquid flow into the receiving container. This achieves quantitative filling.

[0026] Specifically, such as Figure 2 As shown, the adjusting mechanism includes a bearing housing 7, a screw 8, and a nut 9 threaded onto the screw 8. The bearing housing 7 is mounted on the fixed discharge pipe 3. The end of the screw 8 is connected to the inner ring of the bearing in the bearing housing 7. The nut 9 is connected to the movable discharge pipe 4. The position of the nut 9 is adjusted by rotating the screw 8, thereby raising and lowering the movable discharge pipe 4.

[0027] like Figure 3 As shown, the flow-stopping mechanism 6 includes a cylinder 61, a piston rod 62, and two baffles 64. The cylinder 61 is horizontally arranged on and communicates with the fixed discharge pipe 3. The piston rod 62 is piston-like and slidably adapted to the cylinder 61. The two baffles 64 are arranged inside the fixed discharge pipe 3 and located on the upper and lower sides of the cylinder 61. The two baffles 64 are provided with discharge holes 65 that are vertically connected. When the inner end of the piston rod 62 is outside the fixed discharge pipe 3, the discharge hole 65 communicates with the movable discharge pipe 4. When the end of the piston rod 62 is inserted into the fixed discharge pipe 3, it can block the discharge hole 65.

[0028] Two sets of sealing rings 66 are provided on the outside of the piston rod 62. When the end of the piston rod 62 is inserted into the fixed discharge pipe 3, the two sets of sealing rings 66 are located on both sides of the discharge hole 65. The two sets of sealing rings 66 are used to prevent polishing liquid from flowing out of the cylinder body 61 from the gap between the discharge hole 65 and the piston rod 62.

[0029] A handle 63 is provided at the outer end of the piston rod 62. The piston rod 62 can be driven by the handle 63, or an electric method such as a cylinder can be used instead of the handle 63.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit polishing slurry filling device, comprising a support (1) and a storage tank (2) disposed on the support (1), characterized in that: It also includes a fixed discharge pipe (3), a movable discharge pipe (4), and a discharge valve (5). The fixed discharge pipe (3) is vertically installed at the discharge port at the bottom of the storage tank (2). The movable discharge pipe (4) is vertically and slidably fitted onto the fixed discharge pipe (3). The discharge valve (5) is installed at the bottom outlet of the movable discharge pipe (4). The fixed discharge pipe (3) is provided with an adjustment mechanism for adjusting the length of the movable discharge pipe (4) extending out of the fixed discharge pipe (3). The fixed discharge pipe (3) is also provided with a flow-stopping mechanism (6).

2. The integrated circuit polishing slurry filling equipment according to claim 1, characterized in that: The adjustment mechanism includes a bearing housing (7), a screw (8), and a nut (9) with a threaded fit on the screw (8). The bearing housing (7) is mounted on the fixed discharge pipe (3). The end of the screw (8) is connected to the inner ring of the bearing in the bearing housing (7). The nut (9) is connected to the movable discharge pipe (4).

3. The integrated circuit polishing slurry filling equipment according to claim 1, characterized in that: The intercepting mechanism (6) includes a cylinder (61), a piston rod (62), and two baffles (64). The cylinder (61) is horizontally arranged on the fixed discharge pipe (3) and communicates with it. The piston rod (62) is piston-like and slidably adapted to the cylinder (61). The two baffles (64) are arranged inside the fixed discharge pipe (3) and located on the upper and lower sides of the cylinder (61). The two baffles (64) are provided with discharge holes (65) that are vertically connected. When the end of the piston rod (62) is inserted into the fixed discharge pipe (3), it can block the discharge hole (65).

4. The integrated circuit polishing slurry filling equipment according to claim 2, characterized in that: At least one sealing ring (10) is provided on the outer wall of the top of the movable discharge pipe (4).

5. The integrated circuit polishing slurry filling equipment according to claim 3, characterized in that: Two sets of sealing rings (66) are provided on the outside of the piston column (62). When the end of the piston column (62) is inserted into the fixed discharge pipe (3), the two sets of sealing rings (66) are located on both sides of the discharge hole (65).

6. The integrated circuit polishing slurry filling equipment according to claim 3, characterized in that: A handle (63) is provided at the outer end of the piston rod (62).

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