Multifunctional microphone

Abstract

The utility model provides a multifunctional microphone, and the microphone comprises a circuit board which is provided with a first groove located in the upper surface of the circuit board; the microphone MEMS chip and the microphone AISC chip are arranged on the circuit board; the barometer MEMS chip and the barometer ASIC chip are arranged in the first groove; and the filling glue is arranged in the first groove and wraps the barometer MEMS chip and the barometer ASIC chip. Integrated packaging of the microphone and the barometer is achieved, the packaging size can be reduced, and interference generated when the microphone and the barometer work can be effectively avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically to a multifunctional microphone. Background Technology

[0002] Currently, with rapid social development and the continuous improvement of human material needs, electronic products (such as mobile phones, computers, learning machines, smart bracelets, smartwatches, VR devices, smart headphones, etc.) are becoming increasingly integrated, and the requirements for product size are becoming increasingly stringent. To meet this demand, devices such as microphones and barometers used in electronic products are typically packaged using Micro-electromechanical Systems (MEMS) technology, and the packaging structures and assembly processes of these sensors have a high degree of similarity.

[0003] However, existing electronic products use microphones, barometers, and other independent components; each component is manufactured through similar processes, which wastes materials and manpower and increases costs; each component also needs to be mounted separately and occupies free space, increasing the product size; in addition, different sensors may interfere with each other when working, affecting the performance and stability of the equipment.

[0004] Based on the above problems, there is an urgent need to develop a technology that can effectively reduce the space occupied by multiple sensors, while avoiding mutual interference between different sensors during operation. Utility Model Content

[0005] The main technical problem addressed by this application is to provide a multifunctional microphone for integrating multiple sensors, including a microphone and a barometer, into a single package, thereby reducing the space occupied by the multiple sensors and avoiding interference caused by different sensors during operation.

[0006] This application discloses a multi-functional microphone, which includes:

[0007] A circuit board having a first groove located on its upper surface;

[0008] The microphone MEMS (Micro-Electrical-Mechanical System) chip and the microphone AISC (Application Specific Integrated Circuit) chip are mounted on the circuit board.

[0009] The barometer MEMS chip and the barometer ASIC chip are disposed in the first groove;

[0010] A filler adhesive is placed in the first groove to cover the barometer MEMS chip and the barometer ASIC chip.

[0011] In some alternative embodiments, the barometer ASIC chip is disposed at the bottom of the first groove, and the barometer MEMS chip is stacked on the barometer ASIC chip.

[0012] In some alternative implementations, the upper surface of the barometer MEMS chip is lower than or flush with the upper surface of the circuit board.

[0013] In some alternative embodiments, the barometer ASIC chip is electrically interconnected with the circuit board via bonding wires; the barometer MEMS chip is electrically interconnected with the barometer ASIC chip via bonding wires or conductive bumps.

[0014] In some alternative implementations, the microphone MEMS chip and the microphone AISC chip, and the microphone AISC chip and the circuit board, are electrically interconnected via bonding lines.

[0015] In some alternative embodiments, the circuit board also has a second groove on its upper surface, in which the microphone MEMS chip is disposed.

[0016] In some alternative implementations, the upper surface of the microphone MEMS chip is higher than the upper surface of the circuit board.

[0017] In some alternative embodiments, the filler is a silicone gel.

[0018] In some alternative embodiments, the multi-functional microphone further includes a housing that forms a cavity between the housing and the circuit board to accommodate the microphone MEMS chip, the microphone ASIC chip, the barometer MEMS chip, and the barometer ASIC chip.

[0019] In some alternative implementations, the circuit board has a sound hole that connects to the microphone MEMS chip.

[0020] As described above, this application proposes a multi-functional microphone. By adopting the above technical solution, this application has the following advantages: The multi-functional microphone of this application realizes the integrated packaging of the microphone and sensors such as barometers, which can reduce the space occupied by multiple sensors and reduce the packaging volume of the product; at the same time, by using filler glue to cover the barometer MEMS chip and barometer ASIC chip, interference generated during the operation of the microphone and barometer can be effectively avoided; in addition, by placing the barometer MEMS chip and barometer ASIC chip in the first groove on the circuit board, and filling the first groove with filler glue, the filler glue can be prevented from flowing to other areas and from affecting the microphone MEMS chip and microphone ASIC chip. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments and the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a cross-sectional structural schematic diagram of a multi-functional microphone according to an embodiment of this application;

[0023] Figure 2 This is a cross-sectional view of a multi-functional microphone according to another embodiment of this application. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0025] The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0026] The following detailed descriptions will be provided through specific embodiments.

[0027] refer to Figure 1 One embodiment of this application provides a multi-functional microphone, which includes:

[0028] Circuit board 1 has a first groove 101 located on its upper surface;

[0029] The microphone, including microphone MEMS chip 5 and microphone AISC chip 3, is mounted on circuit board 1;

[0030] A barometer, including a barometer MEMS chip 7 and a barometer ASIC chip 8, is disposed in the first groove 101;

[0031] The filler adhesive 6 is placed in the first groove 101 to cover the barometer MEMS chip 7 and the barometer ASIC chip 8.

[0032] In some alternative implementations, the barometer ASIC chip 8 is disposed at the bottom of the first recess 101, and the barometer MEMS chip 7 is stacked on the barometer ASIC chip 8.

[0033] In some alternative embodiments, the upper surface of the barometer MEMS chip 7 is lower than or flush with the upper surface of the circuit board 1. This ensures that the barometer MEMS chip 7 and the barometer ASIC chip 8 are completely located within the first recess 101.

[0034] In some alternative embodiments, the barometer ASIC chip 8 is electrically interconnected with the circuit board 1 via bonding wires 4; the barometer MEMS chip 7 is electrically interconnected with the barometer ASIC chip 8 via bonding wires 4 or conductive bumps. The bonding wires 4 are, for example, metal wires such as gold, silver, or copper wires.

[0035] In some alternative implementations, the microphone MEMS chip 5 and the microphone AISC chip 3, and the microphone AISC chip 3 and the circuit board 1 are electrically interconnected via bonding wires 4.

[0036] In some alternative embodiments, the circuit board 1 also has a second recess 102 located on the upper surface, and the microphone MEMS chip 5 is disposed in the second recess 102. This can reduce the height of the microphone MEMS chip 5, thereby helping to reduce the overall package height of the multi-functional microphone and save space.

[0037] In some alternative implementations, the microphone MEMS chip 5 and microphone ASIC chip 3, as well as the barometer MEMS chip 7 and barometer ASIC chip 8, can be mounted on the circuit board 1 using adhesives. The adhesives used include, but are not limited to, silicone and epoxy.

[0038] In some alternative embodiments, the upper surface of the microphone MEMS chip 5 is higher than the upper surface of the circuit board 1. That is, the lower portion of the microphone MEMS chip 5 is located within the second recess 102.

[0039] In some alternative embodiments, the filler in the first groove 101 is a silicone gel, which has good thermal insulation properties and good air permeability.

[0040] In some alternative embodiments, the multi-functional microphone of this application further includes a housing 2, with a cavity formed between the housing 2 and the circuit board 1 to accommodate the microphone MEMS chip 5, the microphone ASIC chip 4, the barometer MEMS chip 7, and the barometer ASIC chip 8.

[0041] In some alternative embodiments, the housing 2 and the circuit board 1 can be connected by welding, gluing or other methods, and can be an airtight connection.

[0042] In some optional embodiments, the circuit board 1 has a sound hole 9 that connects to the microphone MEMS chip 5. External air pressure signals (including sound signals, which can be considered a type of air pressure signal) are input to the microphone MEMS chip 5 through the sound hole 9, and then enter the cavity through the microphone MEMS chip 9 to act on the barometer MEMS chip 7. The microphone MEMS chip 5 can detect the sound signal through the sound hole 9 and convert it into an electrical signal. The microphone MEMS chip 5 is permeable, so the barometer MEMS chip 7 can detect the air pressure signal through the sound hole 9 and convert it into an electrical signal. This achieves the pickup of both sound and air pressure signals.

[0043] In some alternative embodiments, a waterproof and breathable membrane is also provided on the circuit board 1 to cover the acoustic hole 9. The waterproof and breathable membrane can be provided on the upper or lower surface of the circuit board 1.

[0044] In some alternative embodiments, the lower surface of the circuit board 1 is provided with solder pads, which are positioned to connect to external devices, such as the motherboard of an electronic device.

[0045] The above-described embodiments of this application disclose a multifunctional microphone, which can be assembled as follows: a microphone ASIC chip 3, a microphone MEMS chip 5, a barometer ASIC chip 8, and a barometer MEMS chip 9 are fixed to corresponding positions on a circuit board 1 by adhesive. The barometer ASIC chip is mounted in the first groove 101 on the circuit board 1, and the barometer MEMS chip 7 is stacked on top of the barometer ASIC chip 8. The above components can be electrically connected by bonding wires 4. The first groove 101 is filled with silicone gel, which serves as a heat insulation agent, as a filler 6.

[0046] The first groove 101 serves to prevent the silicone gel from flowing to other areas. Due to the high fluidity of the silicone gel, it ensures that the silicone gel completely covers the barometer ASIC chip 8 and the barometer MEMS chip 9, preventing them from interfering with the microphone. The silicone gel also isolates the microphone from interference caused by the barometer ASIC chip 8 and the barometer MEMS chip 7 during operation. Finally, the outer casing is encapsulated in the corresponding position on the circuit board.

[0047] Next, refer to Figure 2Another embodiment of this application provides a multi-functional microphone. Figure 2 The multi-functional microphone shown is similar to Figure 1 The multi-functional microphone shown differs in that:

[0048] exist Figure 2 In the multi-functional microphone shown, the second groove 102 has not yet been set on the circuit board 1, and the microphone MEMS chip 5 is directly mounted on the upper surface of the circuit board 1.

[0049] This method simplifies the structure of circuit board 1 and simplifies the manufacturing process.

[0050] The technical solution of this application has been described in detail above through specific embodiments. In the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0051] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and protection scope of the technical solutions of the embodiments of this application.

Claims

1. A multi-functional microphone, characterized in that, include: A circuit board having a first groove located on its upper surface; The microphone MEMS chip and the microphone AISC chip are mounted on the circuit board; The barometer MEMS chip and the barometer ASIC chip are disposed in the first groove; A filler adhesive is placed in the first groove to cover the barometer MEMS chip and the barometer ASIC chip.

2. The multi-functional microphone according to claim 1, characterized in that, The barometer ASIC chip is disposed at the bottom of the first groove, and the barometer MEMS chip is stacked on the barometer ASIC chip.

3. The multi-functional microphone according to claim 2, characterized in that, The upper surface of the barometer MEMS chip is lower than or flush with the upper surface of the circuit board.

4. The multi-functional microphone according to claim 2, characterized in that, The barometer ASIC chip is electrically interconnected with the circuit board via bonding wires; the barometer MEMS chip is electrically interconnected with the barometer ASIC chip via bonding wires or conductive bumps.

5. The multi-functional microphone according to claim 4, characterized in that, The microphone MEMS chip and the microphone AISC chip, as well as the microphone AISC chip and the circuit board, are electrically interconnected via bonding lines.

6. The multi-functional microphone according to claim 1, characterized in that, The circuit board also has a second groove on its upper surface, and the microphone MEMS chip is disposed in the second groove.

7. The multi-functional microphone according to claim 1, characterized in that, The upper surface of the microphone MEMS chip is higher than the upper surface of the circuit board.

8. The multi-functional microphone according to claim 1, characterized in that, The filler is a silicone gel.

9. The multi-functional microphone according to claim 1, characterized in that, The device further includes a housing, and a cavity is formed between the housing and the circuit board to accommodate the microphone MEMS chip, the microphone ASIC chip, the barometer MEMS chip, and the barometer ASIC chip.

10. The multi-functional microphone according to claim 9, characterized in that, The circuit board has a sound hole that connects to the microphone MEMS chip.

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