Improved mechanism for automatically reducing fragments of heterojunction battery

Abstract

The utility model relates to the technical field of heterojunction batteries, and discloses an improved mechanism for automatically reducing fragments of a heterojunction battery, which comprises a battery piece, a screw hole, a fixed barrier strip, an extending bevel edge, a fixed screw hole and a connecting column, the upper end of the battery piece is fixedly provided with the screw hole, and the lower end of the battery piece is fixedly provided with the fixed barrier strip. A fixing barrier strip is fixedly arranged at the upper end of the battery piece, an extending bevel edge is fixedly arranged at one end of the fixing barrier strip, a fixing screw hole is fixedly formed in the upper side of the battery piece, a connecting column is fixedly arranged at the lower end of the fixing screw hole, and a connecting bolt is fixedly arranged at the lower end of the connecting column. According to the improved mechanism for automatically reducing the fragments of the heterojunction battery, the PEEKs on each section of automatic belt rapid runway of the conventional heterojunction CVD (Chemical Vapor Deposition) are more and are used for contacting a silicon wafer and lifting the silicon wafer, and novel cushion blocks are replaced on each section of automatic belt rapid runway of the CVD to reduce the landing edges of the silicon wafer, so that the aim of reducing the fragment rate is fulfilled.

Description

Technical Field

[0001] This utility model relates to the field of heterojunction battery technology, specifically to an improved mechanism for automatically reducing debris in heterojunction batteries. Background Technology

[0002] Heterojunction batteries are a popular battery technology with advantages such as high efficiency, low-temperature manufacturing process, no PID phenomenon, and the ability to be developed into thin sheets, and have broad development prospects. However, compared with other types of batteries, their automated structure is more complex, resulting in more fragmentation.

[0003] The prior art patent document CN217426768U discloses a heterojunction solar cell, which includes an N-type monocrystalline silicon wafer. The front side of the N-type monocrystalline silicon wafer is sequentially deposited with a front intrinsic amorphous silicon layer, an n-type doped amorphous silicon thin film, a front TCO film layer, and a front metal grid layer. The back side of the N-type monocrystalline silicon wafer is sequentially deposited with a back intrinsic amorphous silicon layer, a first microcrystalline silicon layer, a first p-type doped microcrystalline silicon layer, a second microcrystalline silicon layer, a second p-type doped microcrystalline silicon layer, a back TCO film layer, and a back... The metal gate layer has the following characteristics: the thickness of the front intrinsic amorphous silicon layer and the back intrinsic amorphous silicon layer are both 2-10 nm; the thickness of the n-type doped amorphous silicon thin film is 5-10 nm; the thickness of the front TCO film layer and the back TCO film layer are both 80-120 nm; the thickness of the first microcrystalline silicon layer is 3-10 nm; the thickness of the first p-type doped microcrystalline silicon layer is 3-8 nm; the thickness of the second p-type doped microcrystalline silicon layer is 4-10 nm; and the front metal gate layer... The number of grid lines is 70-120, and the number of grid lines in the back metal grid layer is 90-140. The number of grid lines in the front metal grid layer is the same as that in the back metal grid layer. The structure after each combination is not described in detail. The back intrinsic amorphous silicon layer, the first microcrystalline silicon layer, the first P-type doped microcrystalline silicon layer, the second microcrystalline silicon layer, and the second P-type doped microcrystalline silicon layer are sequentially deposited on the back of the N-type single crystal silicon wafer. Microcrystalline silicon has a wider optical bandgap, which can not only improve the electrical performance of heterojunction cells, enhance conductivity, and increase the utilization rate of the 300-1100 nm wavelength spectrum, further improving the conversion efficiency of heterojunction cells, but also reduce the back resistance of heterojunction cells to a certain extent. With the low resistance and the TCO back low sheet resistance process, the number of back grid lines can be reduced during screen printing, reducing silver paste consumption and thus reducing costs. At the same time, the light-receiving area of ​​the back surface of the heterojunction cell is increased, which greatly improves the bifaciality of the heterojunction cell.

[0004] Currently, there are many PEEKs on the high-speed conveyor belts of various sections of heterojunction CVD, which are used to contact and support silicon wafers. The original PEEKs had right-angled edges with little curvature. During the high-speed movement of the conveyor belt, the right-angled edges were prone to scratches and positional displacement. Later, due to design flaws, the PEEKs were prone to overlap and breakage. The design of the PEEKs was changed to reduce the scratch and breakage rate. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] The purpose of this invention is to provide an improved mechanism for automatically reducing debris in heterojunction batteries, in order to solve the problem mentioned in the background art that the original PEEK has right-angled sides with little warping, which can easily cause scratches and positional displacement during rapid belt movement.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: an improved mechanism for automatically reducing debris in heterojunction batteries. This improved mechanism includes a battery cell, screw holes, a fixing baffle, an extending bevel, a fixing screw hole, a connecting post, a connecting bolt, a heat sink, a heat absorber, a heat collector, a transition plate, a heat pipe, a first connecting rod, a heat-conducting motor, a heat-conducting drive shaft, heat-conducting fan blades, a second connecting rod, a heat dissipation motor, a heat dissipation drive shaft, and heat dissipation fan blades. A screw hole is fixedly provided at the upper end of the battery cell. A fixing baffle is fixedly provided at the upper end of the battery cell. An extending bevel is fixedly provided at one end of the fixing baffle. A fixing screw hole is fixedly provided on the upper side of the battery cell. A connecting post is fixedly provided at the lower end of the fixing screw hole. A connecting bolt is fixedly provided at the lower end of the connecting post. A heat sink is fixedly provided at one end of the battery cell.

[0009] Preferably, a heat-absorbing plate is fixedly installed inside the solar cell, and a heat-collecting plate is fixedly installed at one end of the heat-absorbing plate. Since there are currently many PEEKs on the automated conveyor belts of heterojunction CVD, they are used to contact and support the silicon wafers. By replacing the pads on the automated conveyor belts of Maiwei CVD, the overlap of silicon wafers can be reduced, thereby reducing the breakage rate.

[0010] Preferably, a transition plate is fixedly provided at one end of the heat collection plate, and a heat pipe is fixedly provided at one end of the transition plate. The PEEK is still set with a raised edge, but the raised edge angle is increased to prevent the silicon wafer from contacting the side of the fixing screw and causing scratches. The two sides of the PEEK are changed to bevels to prevent scratches during movement and to prevent fragmentation and overlap when the wafer is picked up and placed by the gantry in the subsequent work station.

[0011] Preferably, a connecting rod is fixedly installed inside the heat pipe, and a heat-conducting motor is fixedly installed in the middle of the connecting rod.

[0012] Preferably, a heat-conducting drive shaft is fixedly installed at one end of the heat-conducting motor, and a heat-conducting fan blade is fixedly installed at one end of the heat-conducting drive shaft. The installation of the fixing screw hole, connecting column, and connecting bolt facilitates the further connection and fixation of the screw hole and fixing strip, and improves the installation effect of the improved mechanism for automatically reducing debris in heterojunction batteries.

[0013] Preferably, a connecting rod two is fixedly installed inside the battery cell, and a heat dissipation motor is fixedly installed in the middle of the connecting rod two. The use of the heat absorption plate facilitates the heat absorption of the heterojunction battery. Then, through the heat collection plate and the transition plate, the heat is collected. Then, by turning on the heat conduction motor, the heat conduction drive shaft starts to rotate, driving the heat conduction fan blades to rotate, and conducting the heat of the heterojunction battery to the heat dissipation plate.

[0014] Preferably, a heat dissipation drive shaft is fixedly provided at one end of the heat dissipation motor, and a heat dissipation fan blade is fixedly provided at one end of the heat dissipation drive shaft. By controlling the start of the heat dissipation motor, the heat dissipation drive shaft starts to rotate, which drives the heat dissipation fan blade to rotate, thereby improving the heat dissipation effect of the heterojunction cell.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. The improved mechanism for reducing fragmentation in heterojunction cells is designed to address the issue that the existing PEEK on the automated conveyor belts of heterojunction CVD systems is primarily used to contact and support silicon wafers. By replacing the PEEK with new pads on the automated conveyor belts of the CVD systems, the overlap of silicon wafers is reduced, thereby reducing the fragmentation rate.

[0017] 2. The improved mechanism for automatically reducing debris in heterojunction cells still uses a raised edge design via PEEK, but the angle of the raised edge is increased to prevent the silicon wafer from contacting the fixing screw side and causing scratches. The two sides of the PEEK are changed to bevels to prevent scratches during movement and to prevent debris and overlap during subsequent wafer handling by the gantry at the work station. The installation of fixing screw holes, connecting columns, and connecting bolts facilitates further connection and fixation of screw holes and fixing bars, improving the installation effect of the improved mechanism for automatically reducing debris in heterojunction cells.

[0018] 3. The improved mechanism for automatically reducing debris in heterojunction solar cells facilitates heat absorption by using a heat-absorbing plate. Then, through the heat collection plate and transition plate, the heat is collected and the heat-conducting motor is turned on, causing the heat-conducting drive shaft to rotate, which in turn drives the heat-conducting fan blades to rotate, transferring the heat from the heterojunction solar cell to the heat dissipation plate. Then, by controlling the start of the heat dissipation motor, the heat dissipation drive shaft is turned on, which in turn drives the heat dissipation fan blades to rotate, thus improving the heat dissipation effect of the heterojunction solar cell. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a schematic cross-sectional view of the present invention.

[0021] Figure 3 This is a schematic diagram of the heat collection plate structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the heat dissipation fan blade structure of this utility model.

[0023] In the diagram: 1. Battery cell; 2. Screw hole; 3. Fixing baffle; 4. Extending bevel; 5. Fixing screw hole; 6. Connecting post; 7. Connecting bolt; 8. Heat sink; 9. Heat absorber plate; 10. Heat collector plate; 11. Transition plate; 12. Heat pipe; 13. Connecting rod one; 14. Heat-conducting motor; 15. Heat-conducting drive shaft; 16. Heat-conducting fan blade; 17. Connecting rod two; 18. Heat dissipation motor; 19. Heat dissipation drive shaft; 20. Heat dissipation fan blade. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-4This utility model provides a technical solution: an improved mechanism for automatically reducing debris in heterojunction batteries. This improved mechanism includes a battery cell 1, screw holes 2, a fixing baffle 3, an extending bevel 4, fixing screw holes 5, a connecting post 6, a connecting bolt 7, a heat sink 8, a heat absorber 9, a heat collector 10, a transition plate 11, a heat pipe 12, a first connecting rod 13, a heat-conducting motor 14, a heat-conducting drive shaft 15, a heat-conducting fan blade 16, a second connecting rod 17, a heat dissipation motor 18, a heat dissipation drive shaft 19, and a heat dissipation fan blade 20. The upper end of the battery cell 1 is fixedly provided with screw holes 2, and the upper end of the battery cell 1 is fixedly provided with a fixing baffle 3. One end of the fixing baffle 3 is fixedly provided with an extending bevel 4. The upper side of the battery cell 1 is fixedly provided with fixing screw holes 5, and the lower end of the fixing screw holes 5 is fixedly provided with a connecting post 6. The lower end of the connecting post 6 is fixedly provided with a connecting bolt 7, and one end of the battery cell 1 is fixedly provided with a heat sink 8.

[0026] A heat-absorbing plate 9 is fixedly installed inside the solar cell 1. A heat-collecting plate 10 is fixedly installed at one end of the heat-absorbing plate 9. A transition plate 11 is fixedly installed at one end of the heat-collecting plate 10. A heat-conducting pipe 12 is fixedly installed at one end of the transition plate 11. A connecting rod 13 is fixedly installed inside the heat-conducting pipe 12. A heat-conducting motor 14 is fixedly installed in the middle of the connecting rod 13. The PEEK still uses a raised edge setting, but the raised edge angle is increased to prevent the silicon wafer from contacting the fixing screw side and causing scratches. The two sides of the PEEK are changed to bevels to prevent scratches during movement and to prevent fragmentation and overlap when the wafer is picked up and placed by the gantry of the subsequent work station. Then, the installation of the fixing screw hole 5, the connecting column 6, and the connecting bolt 7 facilitates the further connection and fixation of the screw hole 2 and the fixing baffle 3, improving the installation effect of the improved mechanism for reducing fragmentation in the automated heterojunction cell.

[0027] A heat-conducting drive shaft 15 is fixedly installed at one end of the heat-conducting motor 14, and a heat-conducting fan blade 16 is fixedly installed at one end of the heat-conducting drive shaft 15. A connecting rod 2 17 is fixedly installed inside the battery cell 1, and a heat dissipation motor 18 is fixedly installed in the middle of the connecting rod 2 17. A heat dissipation drive shaft 19 is fixedly installed at one end of the heat dissipation drive shaft 18, and a heat dissipation fan blade 20 is fixedly installed at one end of the heat dissipation drive shaft 19. The use of the heat absorption plate 9 facilitates the heat absorption of the heterojunction battery. Then, through the heat collection plate 10 and the transition plate 11, and then by turning on the heat-conducting motor 14, the heat-conducting drive shaft 15 starts to rotate, driving the heat-conducting fan blade 16 to rotate, thus transferring the heat from the heterojunction battery to the heat dissipation plate 8. Then, by controlling the turning on the heat dissipation motor 18, the heat dissipation drive shaft 19 starts to rotate, driving the heat dissipation fan blade 20 to rotate, thereby improving the heat dissipation effect of the heterojunction battery.

[0028] Working principle: The PEEK still uses a raised edge setting, but the raised edge angle is increased to prevent the silicon wafer from contacting the fixing screw side and causing scratches. The two sides of the PEEK are changed to bevels to prevent scratches during movement and to prevent fragmentation and overlap during subsequent wafer handling by the gantry at the workstation. Then, the installation of fixing screw holes 5, connecting columns 6, and connecting bolts 7 facilitates the further connection and fixation of screw holes 2 and fixing bars 3, improving the installation effect of the improved mechanism for reducing fragmentation in the heterojunction cell automation. Then, the use of heat absorption plate 9 facilitates the heat absorption of the heterojunction cell. Then, the heat is collected by heat collection plate 10 and transition plate 11. Then, the opening of heat conduction motor 14 causes heat conduction drive shaft 15 to start rotating, driving heat conduction fan blades 16 to rotate, transferring the heat from the heterojunction cell to heat sink 8. Then, by controlling the opening of heat dissipation motor 18, heat dissipation drive shaft 19 starts rotating, driving heat dissipation fan blades 20 to rotate, improving the heat dissipation effect of heterojunction cell.

[0029] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. An improved mechanism for the automation of the reduction of debris in a heterojunction cell, the improved mechanism for the automation of the reduction of debris in a heterojunction cell comprising a cell piece (1), a screw hole (2), a fixed baffle (3), an extended bevel (4), a fixed screw hole (5), a connecting column (6), a connecting bolt (7), a heat dissipation plate (8), a heat absorption plate (9), a heat collection plate (10), and a transition plate (11), characterized in that: The upper end of the battery cell (1) is fixedly provided with a screw hole (2), the upper end of the battery cell (1) is fixedly provided with a fixing strip (3), one end of the fixing strip (3) is fixedly provided with an extending inclined edge (4), the upper side of the battery cell (1) is fixedly provided with a fixing screw hole (5), the lower end of the fixing screw hole (5) is fixedly provided with a connecting post (6), the lower end of the connecting post (6) is fixedly provided with a connecting bolt (7), and one end of the battery cell (1) is fixedly provided with a heat sink plate (8).

2. The improved mechanism for automatic reduction of shreds of a heterojunction cell as claimed in claim 1 wherein: A heat-absorbing plate (9) is fixedly installed inside the battery cell (1), and a heat-collecting plate (10) is fixedly installed at one end of the heat-absorbing plate (9).

3. The improved mechanism for automatic reduction of shreds of a heterojunction cell as claimed in claim 2 wherein: A transition plate (11) is fixedly provided at one end of the heat collection plate (10), and a heat-conducting pipe (12) is fixedly provided at one end of the transition plate (11).

4. The improved mechanism for automatic reduction of shreds of a heterojunction cell according to claim 3, wherein: A connecting rod (13) is fixedly installed inside the heat pipe (12), and a heat-conducting motor (14) is fixedly installed in the middle of the connecting rod (13).

5. The improved mechanism for automatic reduction of shreds of a heterojunction cell as claimed in claim 4 wherein: A heat-conducting drive shaft (15) is fixedly provided at one end of the heat-conducting motor (14), and a heat-conducting fan blade (16) is fixedly provided at one end of the heat-conducting drive shaft (15).

6. The improved mechanism for automatic reduction of shunts in a heterojunction cell of claim 5, wherein: A connecting rod 2 (17) is fixedly installed inside the battery cell (1), and a heat dissipation motor (18) is fixedly installed in the middle of the connecting rod 2 (17).

7. The improved mechanism for automatic reduction of shunts in a heterojunction cell of claim 6, wherein: A cooling drive shaft (19) is fixedly provided at one end of the cooling motor (18), and a cooling fan blade (20) is fixedly provided at one end of the cooling drive shaft (19).

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