Control panel structure and superconducting quantum computer
By introducing an intermediate layer and a stacked design of vias and shielding holes into the superconducting quantum computer control board structure, the problems of easy solder ball detachment and high cost were solved, resulting in higher soldering quality and product reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- AKM ELECTRONICS INDAL PANYU
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-21
AI Technical Summary
Existing superconducting quantum computer control board structures suffer from problems such as solder ball detachment and deformation when using solder ball placement, and high manufacturing costs and difficult via machining when using pad soldering, resulting in low product yield.
The design employs a stacked structure, including a support plate, an intermediate layer, and an integrated plate. The intermediate layer is the circuit board dielectric layer, with vias and shielding vias, and is connected via a first pad. The integrated plate is soldered to the vias and shielding vias, and the intermediate layer provides support to prevent deformation.
It improved welding quality, reduced processing costs, enhanced signal isolation and signal integrity, and improved product quality and reliability.
Smart Images
Figure CN224154597U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of superconducting quantum computer technology, and in particular to a control board structure and a superconducting quantum computer. Background Technology
[0002] Quantum computing is a novel computing system based on the principle of coherent superposition in quantum mechanics, possessing superior performance compared to traditional computing systems. Superconducting quantum computing has gained widespread attention due to its potential for scalability. The main structure of a superconducting quantum computer includes superconducting qubits, a superconducting control system, and the quantum computer's operating system and software system. The more qubits a quantum computer has, the stronger its computing power; however, a larger number of qubits also means a greater number of ports on the control system board.
[0003] To achieve superconducting qubits, operation is required in ultra-low temperature environments. In this environment, the more connectors and wires there are, the greater the stress and the more complex the stress distribution. Whether the packaging substrate material (such as glass / silicon / epoxy / hydrocarbon) can withstand this stress in ultra-low temperature environments becomes a challenge. In conventional bump-fan-out POP (Package on Package) stacking structures, chips typically employ two soldering methods, see [link to relevant documentation]... Figure 1 One method uses solder balls 300' for soldering, where chip 500' is soldered to carrier board 200' via solder balls 300', and carrier board 200' and support board 100' are connected via solder balls 300'. The other method uses pads 700' for soldering; see [link to documentation]. Figure 2 Chip 500' is soldered to carrier board 200' or support board 100' via pad 700'. Carrier board 200' and support board 100' are interconnected via solder balls 300' and TSV vias 400' (Through Silicon Via) on silicon substrate 600'.
[0004] In POP structure boards using solder ball soldering, the height of components mounted on the carrier and support boards is affected by the height of the solder balls, which limits the mounting height. Furthermore, the board surface will deform when bearing a certain weight, posing reliability risks of solder ball detachment and deformation during soldering or after assembly. In POP structure boards using pad soldering, the manufacturing costs of the silicon substrate and TSV are relatively high, and the vias are difficult to process, resulting in low yield. Utility Model Content
[0005] The purpose of this invention is to provide a control board structure and a superconducting quantum computer, which aims to solve the problems of easy solder ball detachment and deformation when using solder ball soldering in existing control board structures, and high manufacturing cost, difficult through-hole processing, and low product yield when using pad soldering. This control board structure and superconducting quantum computer effectively improves the soldering quality and reduces the processing cost through a stacked design.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] A control panel structure, comprising:
[0008] Support plate;
[0009] An intermediate layer is disposed above the support plate. The intermediate layer is configured as a circuit board dielectric layer. The intermediate layer is provided with multiple hole groups. Each hole group includes a through hole and a shielding hole that penetrate the upper and lower surfaces of the intermediate layer. Multiple shielding holes are provided. The multiple shielding holes surround the periphery of the through hole. Both the through hole and the shielding hole are connected to the support plate through a first solder pad.
[0010] An integrated board is disposed above the intermediate layer, and the integrated board is connected to the through hole and the shielding hole through a first pad.
[0011] In some possible implementations, the intermediate layer is configured as a ring structure, and the control board structure further includes a first chip disposed on the bottom surface of the integrated board and housed in the central hole of the ring structure.
[0012] In some possible implementations, the ring structure is configured as a circular ring structure or a square ring structure.
[0013] In some possible implementations, the control board structure further includes a second chip and a plurality of devices disposed on the top surface of the integrated board, the plurality of devices being spaced apart on the outside of the second chip, and the second chip being soldered to the integrated board via solder balls or pads.
[0014] In some possible implementations, the first chip is soldered to the integrated board via solder balls or pads.
[0015] In some possible implementations, the through holes and the plurality of shielding holes in each of the hole groups form a quincunx structure.
[0016] In some possible implementations, each of the hole groups includes one through hole and six shielding holes spaced around the periphery of the through hole.
[0017] In some possible implementations, the bottom surface of the support plate is provided with a damage-resistant layer.
[0018] In some possible implementations, the damage protection layer is a copper layer.
[0019] The superconducting quantum computer provided by this invention includes a control board structure as described in any of the above embodiments.
[0020] The beneficial effects of this utility model are as follows: The control board structure of this utility model, by setting the intermediate layer as the circuit board dielectric layer, facilitates the adjustment of the thickness of the intermediate layer, which is not affected by the height of the solder balls, allowing the mounting height to be adjusted according to requirements, and facilitating the processing of vias and shielding holes; each hole group includes vias and shielding holes that penetrate the upper and lower surfaces of the intermediate layer, with multiple shielding holes surrounding the periphery of the vias. This arrangement helps to ensure that the requirements for signal isolation and signal integrity are met, and helps to reduce high-frequency signal transmission loss; when many components are mounted on the integrated board, the intermediate layer can provide a certain support force to the integrated board due to its setting, making the integrated board less prone to deformation and improving product quality.
[0021] The superconducting quantum computer provided by this utility model includes the above-mentioned control board structure. By setting the control board structure, the integrated board of the superconducting quantum computer can carry more devices, thereby improving the integration level. In addition, the setting of the intermediate layer improves the reliability of the superconducting quantum computer. Attached Figure Description
[0022] Figure 1 It is a conventional concave-convex fan-out POP stack structure that uses solder ball placement soldering in the existing technology;
[0023] Figure 2 It is an unconventional concave-convex fan-out POP stacking structure that uses pad soldering in existing technologies;
[0024] Figure 3 This is a schematic diagram of the control board structure provided in this embodiment of the utility model;
[0025] Figure 4 This is a top view of the intermediate layer provided in this embodiment of the utility model;
[0026] Figure 5 This is a structural diagram of the connector provided in this embodiment of the present invention when it is a coaxial line.
[0027] In the picture:
[0028] 100', Support plate; 200', Carrier plate; 300', Solder ball; 400', TSV hole; 500', Chip; 600', Silicon substrate; 700', Pad;
[0029] 100, Support plate; 200, Intermediate layer; 211, Through hole; 212, Shielding hole; 300, Integrated board; 400, First chip; 500, Second chip; 600, Device; 700, First pad; 800, Solder ball; 900, Connector. Detailed Implementation
[0030] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.
[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] This embodiment provides a control board structure and a superconducting quantum computer, aiming to solve the problems of easy solder ball detachment and deformation when using solder ball soldering in existing control board structures, and high manufacturing cost, difficult through-hole processing, and low product yield when using pad soldering. This control board structure and superconducting quantum computer effectively improves the soldering quality and reduces the processing cost through a stacked design.
[0035] like Figure 3 and Figure 4 As shown, the control board structure includes a support plate 100, an intermediate layer 200, and an integrated board 300. The support plate 100 is mainly used to support the connected lines (such as optical fibers or coaxial cables). The intermediate layer 200 is disposed above the support plate 100 and serves as a circuit board dielectric layer. Optionally, the circuit board dielectric layer is made of a circuit board material, the main material of which is an epoxy resin system material, for example, an FR-4 board. In other embodiments, the material of the intermediate layer 200 can also be other circuit board materials as needed, such as high-frequency, high-speed PTFE material or hydrocarbon materials. Multiple hole groups are provided on the intermediate layer 200. Each hole group includes a through hole 211 and a shielding hole 212 that penetrate the upper and lower surfaces of the intermediate layer 200. Multiple shielding holes 212 are provided, and the multiple shielding holes 212 surround the periphery of the through hole 211. Both the through hole 211 and the shielding hole 212 are connected to the support plate 100 through the first pad 700. The integrated plate 300 is disposed above the intermediate layer 200. The integrated plate 300 is connected to the through hole 211 and the integrated plate 300 is connected to the shielding hole 212 through the first pad 700.
[0036] The aforementioned control board structure, by setting the intermediate layer 200 as the circuit board dielectric layer, facilitates the adjustment of the thickness of the intermediate layer 200, which is not affected by the height of the solder balls 800. This allows the mounting height to be adjusted according to requirements and facilitates the processing of the vias 211 and shielding vias 212. Each hole group includes a via 211 and a shielding via 212 penetrating the upper and lower surfaces of the intermediate layer 200. Multiple shielding vias 212 surround the periphery of the via 211. This arrangement helps to ensure that the requirements for signal isolation and signal integrity are met, which is beneficial. To reduce high-frequency signal transmission loss; when multiple components 600 are mounted on the integrated board 300, the intermediate layer 200 provides support to the integrated board 300, making it less prone to deformation and improving product quality; this control board structure increases the welding process yield by at least 20%; both the via 211 and the shielding via 212 are soldered to the support plate 100 via the first solder pad 700, and both the via 211 and the shielding via 212 are soldered to the integrated board 300 via the first solder pad 700. Compared to soldering with solder balls 800, soldering with the first solder pad 700 also ensures that the thickness of the intermediate layer 200 is not affected by the height of the solder balls 800, and the operation is simple and the soldering effect is stable when soldering with the first solder pad 700.
[0037] Optionally, the bottom surface of the support plate 100 is provided with a damage-resistant layer. A connector 900 is typically mounted on the bottom surface of the support plate 100. By providing the damage-resistant layer, damage to the support plate 100 can be prevented from being caused by complex stresses generated by the connector 900. For example, the damage-resistant layer can be a copper layer, and the thickness of the copper layer can be set to 40μm-60μm. Additionally, the material of the support plate 100 can be a high-strength material, such as high-strength steel plate or high-strength aluminum plate. Optionally, the connector 900 can be a device, a coaxial cable, or an optical fiber. See also Figure 5 , Figure 5 A schematic diagram of the structure when the connecting piece 900 is a coaxial line.
[0038] Preferably, the intermediate layer 200 is configured as a ring structure. The control board structure also includes a first chip 400, which is disposed on the bottom surface of the integrated board 300 and housed within the central hole of the ring structure. This configuration ensures that the intermediate layer 200 does not affect the installation of the first chip 400. Furthermore, by housing the first chip 400 within the central hole of the ring structure, the intermediate layer 200 protects the first chip 400 from external damage. Optionally, the ring structure can be a circular ring or a square ring. In other embodiments, the intermediate layer 200 can also be configured as a ring structure of other regular or irregular shapes, or as a combination of multiple smaller ring structures, or as a solid block structure, depending on the requirements.
[0039] In this embodiment, the through-holes 211 and multiple shielding holes 212 of each hole group in the intermediate layer 200 form a quincunx structure. The multiple shielding holes 212 surround the periphery of the through-holes 211, improving signal isolation. Furthermore, the quincunx structure also enhances aesthetics. See [link to documentation]. Figure 4 In this embodiment, each hole group includes a through hole 211 and six shielding holes 212 spaced around the through hole 211. In other embodiments, the specific number of through holes 211 and shielding holes 212 can be set according to requirements.
[0040] In this embodiment, the first chip 400 is soldered to the integrated board 300 via solder balls 800 or pads. During actual assembly, the specific soldering method can be selected as needed. Optionally, the control board structure also includes a second chip 500 and several devices 600 disposed on the top surface of the integrated board 300. The devices 600 are spaced apart and located outside the second chip 500, and the second chip 500 is soldered to the integrated board 300 via solder balls 800 or pads. During actual assembly, the specific soldering method can be selected as needed.
[0041] In practical implementation, the integrated board 300 can be configured as a highly integrated board, i.e., a high-density circuit board or carrier board, to facilitate complex circuit connections. Highly integrated boards typically integrate multiple hardware modules, including system components such as processors, memory, storage devices, and input / output interfaces.
[0042] The superconducting quantum computer provided in this embodiment includes the control board structure described above. By setting the control board structure, the integrated board 300 of the superconducting quantum computer can carry more devices 600, thereby improving the integration level. Furthermore, the setting of the intermediate layer 200 improves the reliability of the superconducting quantum computer.
[0043] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A control board structure, characterized by, include: Support plate (100); An intermediate layer (200) is disposed above the support plate (100). The intermediate layer (200) is configured as a circuit board dielectric layer. The intermediate layer (200) is provided with a plurality of hole groups. Each hole group includes a through hole (211) and a shielding hole (212) penetrating the upper and lower surfaces of the intermediate layer (200). A plurality of shielding holes (212) are provided. The plurality of shielding holes (212) surround the periphery of the through hole (211). The through hole (211) and the shielding hole (212) are both connected to the support plate (100) through a first pad (700). An integrated board (300) is disposed above the intermediate layer (200). The integrated board (300) and the through hole (211) and the integrated board (300) and the shielding hole (212) are all connected through the first pad (700).
2. The control board structure according to claim 1, characterized by The intermediate layer (200) is configured as a ring structure, and the control board structure further includes a first chip (400), which is disposed on the bottom surface of the integrated board (300) and housed in the central hole of the ring structure.
3. The control board structure according to claim 2, characterized by The ring structure is configured as either a circular ring structure or a square ring structure.
4. The control board structure of claim 2, wherein The control board structure also includes a second chip (500) and a plurality of devices (600) disposed on the top surface of the integrated board (300). The plurality of devices (600) are spaced apart on the outside of the second chip (500). The second chip (500) is soldered to the integrated board (300) by solder balls (800) or pads.
5. The control board structure of claim 2, wherein The first chip (400) is soldered to the integrated board (300) via solder balls (800) or pads.
6. The control board structure according to any one of claims 1 to 5, characterized by The through holes (211) and the plurality of shielding holes (212) of each of the hole groups form a quincunx structure.
7. The control board structure according to claim 6, wherein Each of the hole groups includes one through hole (211) and six shielding holes (212) spaced around the through hole (211).
8. The control board structure according to any one of claims 1 to 5, characterized by The bottom surface of the support plate (100) is provided with a damage-resistant layer.
9. The control board structure of claim 8, wherein The damage protection layer is a copper layer.
10. A superconducting quantum computer, characterized by Includes the control panel structure as described in any one of claims 1-9.