Main shaft device based on Bernoulli chuck

Abstract

The utility model relates to a main shaft device based on a Bernoulli chuck in the main shaft device field, which comprises a support seat, a Bernoulli adsorption assembly and a rotation driving member, the Bernoulli adsorption assembly comprises a Bernoulli suction cup and a Bernoulli base, the Bernoulli base is installed on the support seat through a hollow outer shaft, and the Bernoulli suction cup is installed on the support seat. A hollow connecting shaft is arranged in the outer shaft, a connecting rod used for providing airflow for the Bernoulli suction cup is arranged in the connecting shaft, a supporting frame is connected to the bottom of the rotary driving piece, a nano filter used for filtering the airflow is arranged in the supporting frame, and one end of the nano filter is connected with the end of the connecting rod through an adapter. According to the utility model, the nano filter is used for ensuring the cleanliness of airflow entering the Bernoulli suction cup, and the adapter is arranged, so that the phenomenon of wafer pollution caused by dust production due to aging of the sealing ring is avoided, and the uniformity and the stability of wafer etching are improved.

Description

Technical Field

[0001] This utility model relates to the field of spindle devices, specifically to a spindle device based on a Bernoulli chuck. Background Technology

[0002] In semiconductor manufacturing, the wafer, as the core carrier, undergoes multiple precision processes including photolithography, etching, resist removal, and cleaning. As the feature size of semiconductor devices continues to shrink, the requirements for surface quality, positioning accuracy, and process compatibility in wafer processing are becoming increasingly stringent. Especially in processes such as high-precision cleaning and low-temperature etching, the wafer must be fixed to the chuck surface in a non-contact or controlled-contact manner to avoid damage or contamination caused by mechanical stress. Therefore, a wafer holding spindle device (Bernoulli chuck) is typically used. The Bernoulli chuck allows the wafer to float and remain above the chuck, preventing contact between the wafer and the chuck. Furthermore, Bernoulli chucks are widely used in wafer transport, rotation processing, and inspection.

[0003] Existing Bernoulli chuck spindle systems typically consist of a spindle body, a chuck stage, a fluid channel, a drive motor, and a control system. Their working principle is based on the Bernoulli effect: high-pressure gas (such as nitrogen) is evenly distributed through the fluid channel inside the spindle to the microgrooves on the chuck surface. As the gas accelerates within the grooves, it creates a low-pressure region, causing the wafer to be stably adsorbed and suspended due to the pressure difference (typically reaching hundreds of Pascals) between the upper and lower surfaces. The spindle system drives the chuck to rotate via a motor, achieving dynamic positioning of the wafer during the process.

[0004] However, although existing Bernoulli chuck spindle devices for wafers meet certain requirements of current processes, they still have some shortcomings. When the airflow generated by the traditional chuck airflow diffuses on the chuck surface, the direct output of the airflow causes unfiltered particles in the airflow to be directly adsorbed onto the back side of the wafer by the Bernoulli effect. In addition, when the built-in sealing ring used for airflow sealing in existing Bernoulli chucks ages and generates dust, it is easy to cause wafer contamination. Furthermore, traditional Bernoulli chucks lack a high-efficiency filtration system, and particles in the airflow are easily deposited on the wafer surface or chuck grooves, causing process defects. This leads to chemical solution contamination of the wafer and affects the uniformity and consistency of the etching on the back side of the wafer and the stability of the etching quality. Utility Model Content

[0005] The purpose of this invention is to address the above-mentioned deficiencies by providing a spindle device based on a Bernoulli chuck, thereby solving the technical problem in the background art where the lack of airflow filtration affects the uniformity and consistency of etching on the back side of the wafer and the stability of etching quality.

[0006] The objective of this utility model is achieved through the following means:

[0007] A spindle device based on a Bernoulli chuck includes a support base, a Bernoulli adsorption assembly mounted on the support base, and a rotary drive component mounted on the support base. The rotary drive component can drive the Bernoulli adsorption assembly to rotate. The Bernoulli adsorption assembly includes a Bernoulli suction cup and a Bernoulli base. The Bernoulli suction cup is mounted on the Bernoulli base, and the Bernoulli base is mounted on the support base via a hollow outer shaft. A hollow connecting shaft is provided inside the outer shaft. One end of the connecting shaft extends towards the Bernoulli base and connects to the Bernoulli suction cup. The other end of the connecting shaft is connected to the output end of the rotary drive component via a coupling. A connecting rod for providing airflow to the Bernoulli suction cup is provided inside the connecting shaft. One end of the connecting rod is connected to the Bernoulli suction cup, and the other end of the connecting rod extends through the connecting shaft to the bottom of the rotary drive component. A support frame is connected to the bottom of the rotary drive component. A nanofilter for filtering airflow is provided inside the support frame. One end of the nanofilter is connected to the end of the connecting rod via an adapter, and the other end of the nanofilter is connected to an air inlet connector.

[0008] Furthermore, as described above, one end of the outer shaft is mounted on the support base, and the other end of the outer shaft is connected to the Bernoulli base. The outer shaft has multiple air intake channels for providing airflow to the Bernoulli base. The support base is provided with a universal joint that connects to the outer shaft, and the universal joint is provided with an air intake valve that communicates with the air intake channels.

[0009] The universal joint design enhances the flexibility of device installation, making it easy to adapt to airflow access requirements under different working conditions. At the same time, the air inlet valve can adjust the airflow, optimize the adsorption force of the Bernoulli chuck, and improve the stability of wafer fixation and process reliability.

[0010] Furthermore, as described above, the air intake channel is arranged around the outer shaft, and an annular adsorption area is formed on the Bernoulli suction cup.

[0011] The air intake channel surrounding the outer shaft works in synergy with the annular adsorption area of ​​the Bernoulli suction cup to allow the airflow to diffuse evenly along the circumference of the suction cup, forming a fully covered negative pressure adsorption area.

[0012] Furthermore, as described above, the support frame has an internal cavity, the nanofilter is disposed within the cavity, and an adapter sleeve is connected to the support frame via a rotating seat. The adapter sleeve has a through-hole, the air inlet connector is inserted into one end of the through-hole, and one end of the nanofilter is inserted into the other end of the through-hole.

[0013] Integrating the nanofilter within the cavity of the support frame and achieving modular connection via an adapter sleeve simplifies the airflow path and facilitates rapid replacement and maintenance of the nanofilter. This structure, through its sealed design, ensures that the filtered clean airflow is directly delivered to the Bernoulli chuck, effectively intercepting particulate impurities in the airflow and providing a stable clean environment for wafer processing.

[0014] Furthermore, as described above, the adapter is installed on one end of the support frame near the rotary drive component. The adapter has a mounting through hole. One end of the adapter is inserted and connected to the top of the nanofilter through the mounting through hole, and the other end of the adapter is connected to the rotary drive component. The Bernoulli suction cup has a main air outlet at its axis. One end of the connecting rod is connected to the main air outlet of the Bernoulli suction cup, and the other end of the connecting rod extends through the rotary drive component toward the mounting through hole of the adapter.

[0015] The adapter's axial alignment with the main exhaust port, combined with the embedded airflow channel in the connecting rod, ensures continuous airflow even during the operation of the rotating drive component. This guarantees a stable airflow supply required for the Bernoulli effect, while the concentrated exhaust from the main exhaust port enhances the negative pressure in the adsorption area, improving the reliability of wafer fixation.

[0016] The insertion of the adapter and adapter sleeve into the nanofilter reduces the use of sealing rings, effectively avoiding friction between the sealing rings and preventing wafer contamination caused by dust generation due to aging of the sealing rings. It also reduces the problem of chuck-inlet particulate contamination in existing technologies, further improving the uniformity and consistency of wafer etching and the stability of etching quality.

[0017] Furthermore, as described above, the nanofilter is connected to the adapter sleeve via an air inlet end, and the nanofilter is connected to the adapter via an exhaust end.

[0018] Furthermore, as described above, the rotary drive component is composed of a servo motor. The rotary drive component is mounted on the bottom of the support base, and the output shaft of the rotary drive component is connected to the end of the connecting shaft through a coupling, so that the rotary drive component can drive the connecting shaft to rotate the Bernoulli suction cup.

[0019] The beneficial effects of this invention are as follows: A connecting rod is installed inside the connecting shaft to provide airflow to the Bernoulli chuck. Airflow is directly delivered to the chuck via the connecting rod, reducing the contact area between the airflow and the inner wall of the pipe during transmission, thereby reducing the possibility of particle shedding and adsorption. Simultaneously, one end of the nanofilter is connected to the connecting rod via an adapter. Using the nanofilter, particles and chemical residues in the airflow can be efficiently intercepted, ensuring the cleanliness of the airflow entering the Bernoulli chuck and reducing wafer contamination. The other end of the nanofilter is connected to an air inlet connector, facilitating quick replacement of the air source or integration with external purification equipment, improving system flexibility and maintenance convenience, while ensuring a continuous and stable supply of high-quality airflow. The adapter design also prevents wafer contamination caused by dust generation due to aging of the sealing ring, further improving the uniformity and stability of wafer etching. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this embodiment;

[0021] Figure 2 This is a cross-sectional view of this embodiment;

[0022] Figure 3 for Figure 2 A magnified view of part A in the diagram;

[0023] Figure 4 for Figure 2 A magnified view of part B in the diagram;

[0024] Figure 5 This is a schematic diagram of the connection of the nanofilter in this embodiment;

[0025] The reference numerals in the figure are as follows: 1-Support base, 2-Rotary drive component, 3-Bernoulli suction cup, 4-Bernoulli base, 5-Outer shaft, 6-Connecting shaft, 7-Coupling, 8-Connecting rod, 9-Support frame, 10-Nano filter, 11-Adapter, 12-Inlet connector, 13-Inlet channel, 14-Universal connector, 15-Inlet valve, 16-Cavity, 17-Rotating base, 18-Adapter sleeve, 19-Connecting through hole, 20-Mounting through hole, 21-Inlet end, 22-Exhaust end. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0027] In this embodiment, refer to Figures 1-5The embodiment of this invention includes a spindle device based on a Bernoulli chuck, comprising a support base 1, a Bernoulli suction assembly mounted on the support base 1, and a rotary drive component 2 mounted on the support base 1. The rotary drive component 2 drives the Bernoulli suction assembly to rotate. The Bernoulli suction assembly includes a Bernoulli suction cup 3 and a Bernoulli base 4. The Bernoulli suction cup 3 is mounted on the Bernoulli base 4, and the Bernoulli base 4 is mounted on the support base 1 via a hollow outer shaft 5. A hollow connecting shaft 6 is disposed inside the outer shaft 5, and one end of the connecting shaft 6 extends towards the Bernoulli base 4 and connects to the Bernoulli suction cup 3. The other end of the connecting shaft 6 is connected to the output end of the rotary drive 2 via a coupling 7. The connecting shaft 6 is provided with a connecting rod 8 for providing airflow to the Bernoulli suction cup 3. One end of the connecting rod 8 is connected to the Bernoulli suction cup 3, and the other end of the connecting rod 8 extends through the connecting shaft 6 to the bottom of the rotary drive 2. The bottom of the rotary drive 2 is connected to a support frame 9. A nano filter 10 for filtering airflow is provided inside the support frame 9. One end of the nano filter 10 is connected to the end of the connecting rod 8 via an adapter 11, and the other end of the nano filter 10 is connected to an air inlet connector 12.

[0028] One end of the outer shaft 5 is mounted on the support base 1, and the other end of the outer shaft 5 is connected to the Bernoulli base 4. The outer shaft 5 has multiple air intake channels 13 for providing airflow to the Bernoulli base 4. The support base 1 is provided with a universal joint 14 that is connected to the outer shaft 5. The universal joint 14 is provided with an air intake valve 15 that communicates with the air intake channels 13.

[0029] The design of the universal joint 14 enhances the flexibility of device installation, making it easy to adapt to the airflow access requirements under different working conditions. At the same time, the air inlet valve 15 can adjust the airflow, optimize the adsorption force of the Bernoulli chuck 3, and improve the stability of wafer fixation and process reliability.

[0030] The air intake channel 13 is arranged around the outer shaft 5, and an annular adsorption area is formed on the Bernoulli suction cup 3. The air intake channel 13 surrounding the outer shaft 5 and the annular adsorption area of ​​the Bernoulli suction cup 3 work together to make the airflow diffuse evenly along the circumference of the suction cup, forming a fully covered negative pressure adsorption area.

[0031] By setting up a circumferentially distributed air intake channel 13 within the outer shaft 5, combined with the air intake valve 15 of the universal joint 14, uniform distribution and precise control of airflow can be achieved. The negative pressure at various points in the annular adsorption zone is relatively uniform, resulting in good stability of the adsorption force formed.

[0032] Specifically, using the Bernoulli effect of a Bernoulli chuck to adsorb and suspend wafers is a conventional technique in this field, and the specific principles and operating procedures will not be described here.

[0033] Reference Figure 2 and Figure 5 The support frame 9 has a cavity 16 inside, and the nano filter 10 is disposed in the cavity 16. The support frame 9 is connected to the adapter sleeve 18 through the rotating seat 17. The adapter sleeve 18 has a through hole 19 inside. The air inlet connector 12 is inserted into one end of the through hole 19, and one end of the nano filter 10 is inserted into the other end of the through hole 19.

[0034] The nanofilter 10 is integrated into the cavity 16 of the support frame 9 and modularly connected via the adapter sleeve 18, which simplifies the airflow path and facilitates the quick replacement and maintenance of the nanofilter 10. This structure, through its sealed design, ensures that the filtered clean airflow is directly delivered to the Bernoulli chuck 3, effectively intercepting particulate impurities in the airflow and providing a stable clean environment for wafer processing.

[0035] Reference Figure 2 and Figure 5 The adapter 11 is installed on one end of the support frame 9 near the rotary drive 2. The adapter 11 has a mounting through hole 20. One end of the adapter 11 is inserted and connected to the top of the nano filter 10 through the mounting through hole 20, and the other end of the adapter 11 is connected to the rotary drive 2. The Bernoulli suction cup 3 has a main air outlet at its axis. One end of the connecting rod 8 is connected to the main air outlet of the Bernoulli suction cup 3, and the other end of the connecting rod 8 extends through the rotary drive 2 toward the mounting through hole 20 of the adapter 11.

[0036] The adapter 11 is axially aligned with the main air outlet, and in conjunction with the embedded airflow channel of the connecting rod 8, it maintains continuous airflow even when the rotary drive 2 is running. This ensures a stable airflow supply required for the Bernoulli effect, while the concentrated exhaust from the main air outlet enhances the negative pressure intensity of the adsorption area, improving the reliability of wafer fixation.

[0037] The insertion arrangement of the adapter 11 and adapter sleeve 18 with the nanofilter 10 reduces the use of sealing rings, effectively avoiding sealing ring friction and reducing the problem of chuck inlet particulate contamination in existing technologies. This arrangement also prevents the aging of the sealing rings and the generation of dust that could lead to wafer contamination, further improving the uniformity and stability of wafer etching.

[0038] Reference Figure 5 The nanofilter 10 is connected to the adapter sleeve 18 via the air inlet end 21 and to the adapter 11 via the exhaust end 22.

[0039] The rotary drive 2 is composed of a servo motor and is installed at the bottom of the support base 1. The output shaft of the rotary drive 2 is connected to the end of the connecting shaft 6 through a coupling 7, so that the rotary drive 2 can drive the connecting shaft 6 to rotate the Bernoulli suction cup 3.

[0040] By using a servo motor as the rotary drive component 2, precise control of the rotation speed, angle, and acceleration of the Bernoulli chuck 3 can be achieved, meeting the high requirements for positioning accuracy and dynamic response in wafer processing.

[0041] The specific usage structure in this embodiment is as follows:

[0042] The connecting rod 8 is built into the connecting shaft 6. One end of the connecting shaft 6 is installed in the outer shaft 5 through a bearing and a sealing ring. The other end of the connecting shaft 6 passes through the outer shaft 5 and is coaxially connected to the output shaft of the servo motor through the coupling 7. The outer shaft 5 is installed on the top of the support base 1, and the servo motor is installed on the bottom of the support base 1. The nano filter 10 is installed in the cavity 16 of the support frame 9 through the adapter sleeve 18 and the adapter 11. The adapter sleeve 18 is connected to the support frame 9 through the rotating seat 17, and an air inlet connector 12 is inserted and connected to the adapter sleeve 18. After assembly, the support frame 9 is installed on the bottom of the servo motor. The end of the connecting rod 8 away from the Bernoulli suction cup 3 extends through the servo motor to the mounting through hole 20.

[0043] The connecting rod 8 provides the main airflow to the Bernoulli chuck 3, allowing air pressure to be directly delivered to the Bernoulli chuck 3 via the connecting rod 8. This reduces the contact area between the airflow and the inner wall of the pipe during transmission, thereby reducing the possibility of particle shedding and adsorption. Meanwhile, one end of the nanofilter 10 is connected to the connecting rod 8 via the adapter 11. The nanofilter 10 can efficiently intercept particles and chemical residues in the airflow, ensuring the cleanliness of the airflow entering the Bernoulli chuck 3 and reducing wafer contamination. The other end of the nanofilter 10 is connected to the air inlet connector 12, facilitating quick replacement of the air source or integration of external purification equipment, improving system flexibility and maintenance convenience, while ensuring a continuous and stable supply of high-quality airflow. The combination of the adapter sleeve 18, adapter 11, and nanofilter 10 also prevents wafer contamination caused by dust generation due to aging of the sealing ring, further improving the uniformity and consistency of wafer etching and the stability of etching quality.

[0044] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A Bernoulli chuck based spindle device, comprising a support base, a Bernoulli suction assembly arranged on the support base, and a rotary driving member arranged on the support base, the rotary driving member being capable of driving the Bernoulli suction assembly to rotate, characterized in that: The Bernoulli adsorption assembly includes a Bernoulli suction cup and a Bernoulli base. The Bernoulli suction cup is mounted on the Bernoulli base, which is mounted on a support base via a hollow outer shaft. A hollow connecting shaft is provided inside the outer shaft. One end of the connecting shaft extends toward the Bernoulli base and connects to the Bernoulli suction cup. The other end of the connecting shaft is connected to the output end of a rotary drive component via a coupling. A connecting rod for supplying airflow to the Bernoulli suction cup is provided inside the connecting shaft. One end of the connecting rod is connected to the Bernoulli suction cup, and the other end of the connecting rod extends through the connecting shaft to the bottom of the rotary drive component. A support frame is connected to the bottom of the rotary drive component. A nanofilter for filtering airflow is provided inside the support frame. One end of the nanofilter is connected to the end of the connecting rod via an adapter, and the other end of the nanofilter is connected to an air inlet connector.

2. A spindle apparatus based on a Bernoulli chuck according to claim 1, characterized in that: One end of the outer shaft is mounted on the support base, and the other end of the outer shaft is connected to the Bernoulli base. The outer shaft has multiple air intake channels for providing airflow to the Bernoulli base. The support base is provided with a universal joint that connects to the outer shaft, and the universal joint is provided with an air intake valve that communicates with the air intake channels.

3. A spindle apparatus based on a Bernoulli chuck according to claim 2, characterized in that: The air intake channel is arranged around the outer shaft, and an annular adsorption area is formed on the Bernoulli suction cup.

4. The spindle apparatus based on Bernoulli chuck according to claim 1, characterized in that: The support frame has an internal cavity, and the nanofilter is disposed in the cavity. An adapter sleeve is connected to the support frame via a rotating seat. The adapter sleeve has a through hole inside. The air inlet connector is inserted into one end of the through hole, and one end of the nanofilter is inserted into the other end of the through hole.

5. The spindle apparatus based on Bernoulli chuck according to any one of claims 1-4, characterized in that: The adapter is installed on one end of the support frame near the rotary drive component. The adapter has a mounting through hole. One end of the adapter is inserted and connected to the top of the nanofilter through the mounting through hole, and the other end of the adapter is connected to the rotary drive component. The Bernoulli suction cup has a main air outlet at its axis. One end of the connecting rod is connected to the main air outlet of the Bernoulli suction cup, and the other end of the connecting rod extends through the rotary drive component to the mounting through hole of the adapter.

6. The spindle apparatus based on Bernoulli chuck according to any one of claims 1-4, characterized in that: The nanofilter is connected to the adapter sleeve via an air inlet and to the adapter via an exhaust.

7. The spindle apparatus based on Bernoulli chuck according to any one of claims 1-4, characterized in that: The rotary drive is composed of a servo motor and is mounted on the bottom of the support base. The output shaft of the rotary drive is connected to the end of the connecting shaft through a coupling, so that the rotary drive can drive the connecting shaft to rotate the Bernoulli suction cup.

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