Switch cover injection mold

Abstract

The utility model discloses a switch cover injection mould, relates to the technical field of injection mould, including upper mould base, lower mould and circulating pump, be equipped with the upper mould right below the upper mould base, be equipped with the lower mould right below the upper mould, the outer side of lower mould is equipped with injection molding cavity equidistantly, and the injection molding cavity is equipped with the circulating pump. A demolding mechanism is arranged on the outer side of the lower mold, the demolding mechanism elastically connects the upper mold base and the lower mold and applies pressure to the upper mold base and the lower mold according to the separation requirement, a heat dissipation mechanism is arranged in the lower mold, and liquid in the lower mold is circularly cooled through the heat dissipation mechanism. And meanwhile, the outer side of the upper mold is subjected to circulating air cooling treatment. And in the cooling process, cold water is injected into the liquid cooling cavity through the circulating pump, and the cold water entering the liquid cooling cavity is quickly diffused under the driving of an impeller by utilizing the quick rotation of the impeller in the liquid cooling cavity, so that the heat dissipation uniformity of the injection molding part is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of injection molds, specifically to injection molds for switch covers. Background Technology

[0002] Injection molds are tools used to produce plastic products, giving them a complete structure and precise dimensions. Injection molding is a processing method used for the mass production of certain complex-shaped parts. Specifically, it involves injecting molten plastic under high pressure into a mold cavity using an injection molding machine, where it is then cooled and solidified to obtain the molded product.

[0003] The existing cooling method involves wrapping cooling pipes around the outside of the injection mold and using the flow of low-temperature water to carry away the heat from the injection mold and the workpiece to achieve cooling. However, as the low-temperature water flows in the pipes, its temperature gradually rises, which reduces the cooling rate of the injection mold and the workpiece, and there are obvious temperature differences between different parts of the workpiece. Summary of the Invention

[0004] The purpose of this invention is to provide an injection mold for a switch cover to solve the aforementioned defects caused by the prior art.

[0005] A switch cover injection mold includes an upper mold base, a lower mold, and a circulating pump. The upper mold is located directly below the upper mold base, and the lower mold is located directly below the upper mold. Injection cavities are evenly spaced on the outer side of the lower mold. A demolding mechanism is provided on the outer side of the lower mold. The demolding mechanism elastically connects the upper mold base and the lower mold. According to the separation requirement, the upper mold base and the lower mold are pressed tightly together. A heat dissipation mechanism is provided inside the lower mold. The heat dissipation mechanism circulates and cools the liquid inside the lower mold, while simultaneously circulating air cooling the outer side of the upper mold.

[0006] Preferably, the demolding mechanism includes a lower mold, a guide rod, a guide seat, a positioning groove, and a spring column. The lower mold has symmetrically arranged positioning grooves on its outer side. A spring column is connected inside the positioning groove. The top of the spring column is connected to the bottom of an inverted "T" guide rod. The top of the guide rod is connected to the bottom of the upper mold base. A guide seat is connected through the outer side of the guide rod. The bottom of the guide seat is welded to the outer side of the lower mold.

[0007] Preferably, the lower mold is connected to the bottom end of the spring column through positioning grooves that are set at equal intervals.

[0008] Preferably, the positioning groove is connected to the bottom end of the guide rod via a spring post connected to the top end.

[0009] Preferably, the heat dissipation mechanism includes a fan, a copper heat-conducting plate, a liquid-cooled chamber, an impeller, a circulating pump, and a circulating pipe. The fan is installed on the outside of the guide rod. The liquid-cooled chambers are evenly spaced inside the lower mold. Circulating pipes are symmetrically connected through the outside of the liquid-cooled chambers. A circulating pump is connected through one side of the lower mold. A copper heat-conducting plate is installed inside the liquid-cooled chamber, and an impeller is connected to the bottom bearing of the copper heat-conducting plate.

[0010] Preferably, the lower mold is connected to the output end of the circulating pump through liquid-cooled chambers with equal spacing inside.

[0011] Preferably, the lower mold is fitted to the top of the copper heat-conducting plate through an internally provided liquid-cooled chamber.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] 1. During the cooling process, cold water is injected into the liquid cooling chamber through a circulating pump. The impeller inside the liquid cooling chamber rotates rapidly, and the cold water entering the liquid cooling chamber spreads rapidly under the drive of the impeller, which improves the uniformity of heat dissipation of the injection molded parts. At the same time, a fan set on one side circulates air to cool the upper and lower molds, thereby accelerating the heat dissipation of the mold surface. The heat is also cooled during the separation of the upper and lower molds.

[0014] 2. Symmetrically arranged guide rods and spring pillars lift and separate the bottom end of the upper mold base, thereby improving the efficiency of separating the upper and lower molds at the bottom of the upper mold base. At the same time, the guide rods drive the fan to move synchronously, facilitating the injection of external circulating air into the injection cavity and accelerating the cooling rate of the material inside the injection cavity. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a schematic diagram of the overall side view structure of this utility model.

[0017] Figure 3 This is a schematic diagram of the front section structure of the lower mold in this utility model.

[0018] Figure 4 This is a side view of the lower mold structure in this utility model.

[0019] Figure 5 This is a top view of the lower mold structure in this utility model.

[0020] in:

[0021] 1. Upper mold base; 2. Upper mold; 3. Guide rod; 4. Injection cavity; 5. Lower mold; 6. Demolding mechanism; 7. Guide seat; 8. Positioning groove; 9. Fan; 10. Spring column; 11. Copper heat conduction plate; 12. Liquid cooling chamber; 13. Impeller; 14. Heat dissipation mechanism; 15. Circulation pump; 16. Circulation pipe. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0023] like Figures 1 to 5 As shown, the injection mold for the switch cover includes an upper mold base 1, a lower mold 5, and a circulating pump 15. The upper mold 2 is located directly below the upper mold base 1, and the lower mold 5 is located directly below the upper mold 2. Injection cavities 4 are evenly spaced on the outer side of the lower mold 5. A demolding mechanism 6 is provided on the outer side of the lower mold 5. The demolding mechanism 6 provides an elastic connection between the upper mold base 1 and the lower mold 5. According to the separation requirements, the upper mold base 1 and the lower mold 5 are pressed tightly together. A heat dissipation mechanism 14 is provided inside the lower mold 5. The heat dissipation mechanism 14 circulates and cools the liquid inside the lower mold 5, and at the same time, it provides circulating air cooling treatment to the outer side of the upper mold 2.

[0024] In this embodiment, the demolding mechanism 6 includes a lower mold 5, a guide rod 3, a guide seat 7, a positioning groove 8, and a spring column 10. The positioning groove 8 is symmetrically arranged on the outer side of the lower mold 5. The spring column 10 is connected inside the positioning groove 8. The bottom end of the inverted "T" guide rod 3 is connected to the top end of the spring column 10. The bottom end of the upper mold base 1 is connected to the top end of the guide rod 3. The guide seat 7 is connected through the outer side of the guide rod 3. The bottom end of the guide seat 7 is welded to the outer side of the lower mold 5.

[0025] In this embodiment, the lower mold 5 is connected to the bottom end of the spring column 10 through equally spaced positioning grooves 8. The positioning grooves 8 position the bottom end of the spring column 10 to ensure the stability of the lower mold 5 during lifting.

[0026] In this embodiment, the positioning groove 8 is connected to the bottom end of the guide rod 3 via a spring column 10 connected to the top end. The guide rod 3 moves up and down outside the guide seat 7, thereby controlling the height of the guide rod 3.

[0027] In this embodiment, the heat dissipation mechanism 14 includes a fan 9, a copper heat-conducting plate 11, a liquid cooling chamber 12, an impeller 13, a circulation pump 15, and a circulation pipe 16. The fan 9 is installed on the outside of the guide rod 3. The liquid cooling chambers 12 are evenly spaced inside the lower mold 5. The circulation pipes 16 are symmetrically connected through the outside of the liquid cooling chambers 12. The circulation pump 15 is connected through one side of the lower mold 5. The copper heat-conducting plate 11 is arranged inside the liquid cooling chamber 12. The impeller 13 is connected to the bottom bearing of the copper heat-conducting plate 11.

[0028] In this embodiment, the lower mold 5 is connected to the output end of the circulating pump 15 through liquid cooling chambers 12 with equal spacing inside. The liquid is circulated through the liquid cooling chambers 12, and the material is cooled by transferring heat through the copper heat-conducting plate 11.

[0029] In this embodiment, the lower mold 5 is attached to the top of the copper heat-conducting plate 11 through the internal liquid cooling chamber 12, and the heat is absorbed and circulated through the liquid cooling chamber 12, thereby improving heat transfer and increasing flow rate.

[0030] In practical applications, the injection mold for this type of switch cover includes the following tasks:

[0031] Step 1: Use the upper mold base 1 to position the top of the upper mold 2, and use the electric cylinder to drive the bottom protruding part of the upper mold 2 to insert into the injection cavity 4, thereby completing the docking of the upper mold 2 and the lower mold 5. The pressure of the hydraulic cylinder is transmitted to the plastic melt through the injection molding machine screw. Under the pressure, the plastic melt enters the transverse flow channel of the lower mold 5 through the nozzle of the injection molding machine, and the upper mold 2 and the lower mold 5 are used to shape the injected material.

[0032] Step 2: During the vertical downward movement of the upper mold base 1, the guide rods 3 symmetrically arranged on the upper mold base 1 are vertically guided on the outside of the guide seat 7. The spring column 10 is squeezed by the guide rods 3 during the downward movement, so that the tail end of the spring column 10 and the guide rod 3 moves down into the positioning groove 8. After the upper mold 2 and the lower mold 5 are attached, the tail end of the guide rod 3 is inserted into the positioning groove 8.

[0033] Step 3: During the injection molding process of connecting the upper mold 2 and the lower mold 5, the circulating pump 15 is turned on to inject cold water from the outside into the liquid cooling chamber 12. The copper heat transfer plate 11 transfers heat to the inside of the injection cavity 4. At the same time, the liquid drives the impeller 13 to rotate during the flow. When the liquid passes through the impeller 13, the rotation of the impeller 13 converts mechanical energy into energy. The liquid's energy is increased by the centrifugal force and tangential force in the impeller 13. When the liquid enters the pipe from the outlet of the impeller 13, the flow rate increases and the pressure decreases due to its increased energy.

[0034] Step 4: Simultaneously, the liquid is injected into the liquid cooling chamber 12 on the other side using the circulation pipe 16 on one side. Finally, the liquid that has absorbed heat is discharged from the liquid cooling chamber 12 on the lower mold 5. The fan 9 is turned on to cool the upper mold 2 and the lower mold 5. When the upper mold 2 and the lower mold 5 are separated, the fan 9 injects outside air into the injection cavity 4 to cool the injection switch cover.

[0035] Therefore, the above-disclosed embodiments are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. A switch cover injection mold, characterized in that: The system includes an upper mold base (1), a lower mold (5), and a circulating pump (15). An upper mold (2) is located directly below the upper mold base (1), and a lower mold (5) is located directly below the upper mold (2). Injection cavities (4) are evenly spaced on the outer side of the lower mold (5). A demolding mechanism (6) is located on the outer side of the lower mold (5). The demolding mechanism (6) provides an elastic connection between the upper mold base (1) and the lower mold (5). According to the separation requirements, the upper mold base (1) and the lower mold (5) are pressed together. A heat dissipation mechanism (14) is located inside the lower mold (5). The heat dissipation mechanism (14) circulates and cools the liquid inside the lower mold (5) while simultaneously circulating air cooling the outer side of the upper mold (2).

2. The injection mold for the switch cover according to claim 1, characterized in that: The demolding mechanism (6) includes a lower mold (5), a guide rod (3), a guide seat (7), a positioning groove (8), and a spring column (10). The lower mold (5) is symmetrically provided with positioning grooves (8) on the outside. The spring column (10) is connected inside the positioning groove (8). The top end of the spring column (10) is connected to the bottom end of an inverted "T" guide rod (3). The top end of the guide rod (3) is connected to the bottom end of the upper mold base (1). The guide seat (7) is connected through the outside of the guide rod (3). The bottom end of the guide seat (7) is welded to the outside of the lower mold (5).

3. The injection mold for the switch cover according to claim 2, characterized in that: The lower mold (5) is connected to the bottom end of the spring column (10) through positioning grooves (8) that are set at equal intervals.

4. The injection mold for the switch cover according to claim 2, characterized in that: The positioning groove (8) is connected to the bottom end of the guide rod (3) via a spring post (10) connected to the top end.

5. The injection mold for the switch cover according to claim 1, characterized in that: The heat dissipation mechanism (14) includes a fan (9), a copper heat-conducting plate (11), a liquid cooling chamber (12), an impeller (13), a circulation pump (15), and a circulation pipe (16). The fan (9) is installed on the outside of the guide rod (3). The liquid cooling chambers (12) are evenly spaced inside the lower mold (5). The circulation pipes (16) are symmetrically connected through the outside of the liquid cooling chambers (12). The circulation pump (15) is connected through one side of the lower mold (5). The copper heat-conducting plate (11) is installed inside the liquid cooling chamber (12). The impeller (13) is connected to the bottom bearing of the copper heat-conducting plate (11).

6. The injection mold for the switch cover according to claim 5, characterized in that: The lower mold (5) is connected to the output end of the circulating pump (15) through liquid-cooled chambers (12) with equal spacing inside.

7. The injection mold for the switch cover according to claim 5, characterized in that: The lower mold (5) is attached to the top of the copper heat-conducting plate (11) through the internal liquid cooling chamber (12).

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