Electronic tag implanting device
By combining the gripping mechanism and the pressing component, the spring antenna of the bare RFID electronic tag is pressed into the tire rubber, solving the problem of bare tag implantation and achieving efficient and secure tag fixation, thus meeting the automation needs of intelligent manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO HIGHWAY IOT TECH CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-04-24
AI Technical Summary
Existing technologies cannot effectively embed bare RFID electronic tags into tires, especially given the need for increased tire automation in the context of smart manufacturing, where efficient embedding devices are lacking.
The PCB board of the electronic tag is fixed by a gripping mechanism, and the spring antenna is pressed into the rubber of the tire by a pressing assembly. The rubber's fluidity is used to fix the tag. The pressing assembly avoids the PCB board to ensure its exposure.
It enables efficient implantation of bare tags, improves the fixation strength and information interaction capability of electronic tags in tires, and meets the automation needs of intelligent manufacturing.
Smart Images

Figure CN224158928U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of tire technology, and more particularly to an electronic tag implantation device. Background Technology
[0002] In traditional tire tread production, vulcanized electronic tags serve as the unique identifier for tires throughout their circulation process. However, with the continuous advancement of smart manufacturing and the increasing automation in the tire industry, RFID (Radio Frequency Identification) electronic tags for tires are poised for widespread application. Before embedding RFID electronic tags into tires, pre-processing is required: the tag is placed inside two layers of specially formulated rubber sheets, pressed and wrapped, then the protective film attached to the rubber sheets is peeled off, followed by cutting, gripping, and label application. However, current methods cannot embed bare tags. Summary of the Invention
[0003] The purpose of this utility model application is to provide an electronic tag implantation device for facilitating the implantation of bare tags.
[0004] This application provides an electronic tag implantation device, which includes: a gripping mechanism for gripping a PCB board of an electronic tag, and a pressing assembly disposed on the gripping mechanism for pressing the spring antenna of the electronic tag into the rubber of a tire; wherein the pressing assembly avoids the PCB board of the electronic tag.
[0005] In the above technical solution, the PCB board of the electronic tag is fixed by a gripping mechanism to fix the electronic tag, and the spring antenna of the electronic tag is pressed into the rubber of the tire by a pressing component, thereby facilitating the implantation of the bare tag.
[0006] In one specific implementation, there are two pressing components, and the two pressing components are arranged on both sides of the gripping mechanism.
[0007] In one specific implementation, the gripping mechanism includes a support base and a gripping assembly disposed on the support base, with two pressing assemblies arranged on both sides of the gripping assembly;
[0008] The pressing assembly includes a support member fixedly connected to the support base, and a pressing head that is retractable relative to the support member.
[0009] In one specific implementation, there are multiple pressure heads, which are spaced apart along the length of the spring antenna.
[0010] In one specific implementation, the support base has a channel, and the pressure head is located within the channel and can move back and forth within the channel;
[0011] When the pressure head extends to a first set position relative to the fixing member, the pressure head is at least partially located outside the channel and can press the spring antenna into the rubber of the tire.
[0012] In one specific implementation, the channel is a through hole or notch formed in the support.
[0013] In one specific implementation, along the arrangement direction of the pressing components, the ratio of the distance between the two pressing heads to the length of the PCB board is greater than 1.5.
[0014] In one specific implementation, the gripping component is a vacuum suction cup, an adhesive component with an adhesive surface, or a mechanical gripper. Attached Figure Description
[0015] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments provided according to this disclosure and should not be construed as limiting the scope of this disclosure.
[0016] Figure 1 This is a schematic diagram of the structure of the electronic tag provided in the embodiments of this application;
[0017] Figure 2 This is a schematic diagram of the electronic tag implantation device provided in the embodiments of this application;
[0018] Figure 3 This is a schematic diagram of the working state of the electronic tag implantation device provided in the embodiments of this application. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.
[0020] It should be noted that, unless otherwise defined, the technical or scientific terms used in one or more embodiments of this specification should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar words used in one or more embodiments of this specification do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0021] To facilitate understanding of the electronic tag implantation device provided in this application embodiment, its application scenario is first described. The electronic tag implantation device provided in this application embodiment is applied to tires to implant electronic tags into the tires. Current implantation devices are all designed for implanting electronic tags with packaging layers, and there is no structure for directly implanting bare tags into the tires. Therefore, this application embodiment provides an electronic tag implantation device to facilitate the implantation of bare tags into tires. A detailed description is then provided below with reference to the specific accompanying drawings and embodiments.
[0022] refer to Figure 1 As shown, Figure 1 A schematic diagram of the structure of the electronic tag 100 is shown. The electronic tag 100 provided in this embodiment includes a PCB board 110 and a spring antenna 120. The PCB board 110 carries an RFID chip, which embodies the main function of the electronic tag 100. The spring antenna 120 transmits and receives signals, allowing external information to be written into the RFID chip or read from the RFID chip. During setup, the spring antenna 120 is fixedly connected to the PCB board 110, and there are two spring antennas 120, positioned on opposite sides of the PCB board 110, thus forming the entire electronic tag 100 as shown in the diagram. Figure 1 The elongated structure shown is illustrated. Using the two spring antennas 120 described above enhances the information interaction capability of the electronic chip 110. Furthermore, when the two spring antennas 120 are arranged as described above, they can also serve as a connection structure for fixing the electronic tag 100 to the tire. For example, embedding the two spring antennas 120 into the tire improves the stability of the electronic tag 100.
[0023] In one alternative design, the width of the PCB board 110 is greater than the width of the spring antenna 120, thus forming a watch-like structure, and a step is formed in the width direction of the electronic chip to facilitate the fixation of the spring antenna 120 inside the tire.
[0024] refer to Figure 2 and Figure 3 As shown, Figure 2 A schematic diagram of the electronic tag implantation device provided in an embodiment of this application is shown. Figure 3 This diagram illustrates the implantation of an electronic tag using the electronic tag implantation device provided in this embodiment. The electronic tag implantation device mainly includes a gripping mechanism 10 and a pressing assembly 20. The gripping mechanism 10 grips the PCB board 110 of the electronic tag, while the pressing assembly 20 presses the spring antenna 120 of the electronic tag into the rubber of the tire 200. When pressing the spring antenna 120, the pressing assembly 20 avoids the PCB board 110 of the electronic tag. In the specific configuration of the gripping mechanism 10 and the pressing assembly 20, the pressing assembly 20 is mounted on the gripping mechanism 10.
[0025] Continue to refer to Figure 2 and Figure 3 As shown, in use, the gripping mechanism 10 first grips the PCB board 110 of the electronic tag, and an external drive mechanism moves the gripping mechanism 10 to move the electronic tag, which is carried in a tray or box, onto the tire 200 where the electronic tag is to be transplanted. Then, the pressing assembly 20 presses the spring antenna 120 of the electronic tag into the tire 200, and the rubber itself flows to both sides and inside the spring antenna 120. Because the rubber is sticky before vulcanization, the rubber that has flowed to different locations will stick together upon re-contact, thus fixing the electronic tag to the rubber. Figure 3 It can be seen that when the electronic tag is pressed into the rubber, only the spring antenna 120 is pressed into the rubber, while the PCB board 110 is exposed outside the tire 200.
[0026] As can be seen from the above description, the electronic tag implantation device provided in this application embodiment uses a gripping mechanism 10 to fix the PCB board 110 of the electronic tag to fix the electronic tag, and uses a pressing component 20 to press the spring antenna 120 of the electronic tag into the rubber of the tire 200, thereby facilitating the implantation of the bare tag.
[0027] Continue to refer to Figure 2As shown, the embodiments of this application provide two pressing components 20, which are arranged on both sides of the gripping mechanism 10. This ensures that the number of pressing components 20 corresponds to the number of spring antennas 120. During implantation, each pressing component 20 presses the corresponding spring antenna 120 into the rubber. It should be understood that the pressing components 20 provided in these embodiments are not limited to two, but can also be one or more. For example, when using one, one pressing component 20 can simultaneously press two spring antennas 120 into the rubber. When using multiple pressing components 20, one spring antenna 120 can be pressed into the rubber by two or more pressing components 20.
[0028] In a specific example, the gripping mechanism 10 includes a support base 11 and a gripping component 12 disposed on the support base 11. The support base 11 serves as a support structure to support components of the electronic tag implantation device, while the gripping component 12 is used to fix the PCB board 110 of the electronic tag. Exemplarily, the gripping component 12 can be a vacuum suction cup, an adhesive component with an adhesive surface, or a mechanical gripper. Thus, the PCB board 110 can be fixed using different methods. In actual production, different specific gripping components 12 can be selected as needed.
[0029] When setting up the pressing components 20, the two pressing components 20 are arranged on both sides of the gripping component 12, so that the two pressing components 20 correspond to the two spring antennas 120.
[0030] In one example, the pressing assembly 20 includes a support member 21 fixedly connected to the support base 11, and a pressing head 22 retractable relative to the support member 21. That is, in the embodiment of this application, the gripping assembly 12 has a fixed member (support member 21) and a movable member (pressing head 22), wherein the fixed member is fixed to the support base 11 so that the pressing assembly 20 is connected to the gripping mechanism 10. Furthermore, the spring antenna 120 is pressed into the rubber by the telescopic movement of the movable member.
[0031] In a specific example, the gripping mechanism 10 may include a hydraulic cylinder or a pneumatic cylinder, wherein the cylinder body of the hydraulic cylinder or pneumatic cylinder is fixedly connected to the support base 11 as a support member 21, and the piston rod of the hydraulic cylinder or pneumatic cylinder is connected to a pressure head 22. Thus, the spring antenna 120 can be pressed into the rubber by hydraulic or pneumatic power.
[0032] In a specific example, one pressure head 22 may be used, or there may be multiple pressure heads 22. For example, there may be multiple pressure heads 22, which are spaced apart along the length of the spring antenna 120. When pressing the spring antenna 120 into the tire 200, multiple pressure heads 22 can be used to press the spring antenna 120 into the rubber, thereby improving the pressing effect.
[0033] When the pressing assembly 20 mates with the support base 11, the support base 11 may have a channel 111, and the pressing head 22 is located within the channel 111 and can move back and forth within the channel 111. For example, when the pressing head 22 is driven by a hydraulic cylinder or a pneumatic cylinder, the hydraulic cylinder or pneumatic cylinder is fixed to the support base 11, and the piston rod is inserted into the channel 111. The pressing head 22 is also located within the channel 111, and can move back and forth within the channel 111 when the piston rod extends or retracts. When pressing the spring antenna 120 into the rubber, the pressing head 22 extends relative to the fixing member to a first set position, and the pressing head 22 is at least partially located outside the channel 111, allowing the spring antenna 120 to be pressed into the rubber of the tire 200. After pressing, the pressing head 22 retracts, moving back into the channel 111.
[0034] The aforementioned channel 111 can be implemented in different ways. For example, channel 111 is a through hole or notch formed on the support base 11.
[0035] In one specific implementation, along the arrangement direction of the pressing assembly 20, the ratio of the distance between the two pressing heads 22 to the length of the PCB board 110 is greater than 1.5. For example, the ratio of the distance between the two pressing heads 22 to the length of the PCB board 110 can be different values such as 1.5, 1.6, 2, or 2.5. When this structure is adopted, the pressing heads 22 can avoid the PCB board 110 when pressing in the spring antenna 120, thereby improving the safety of the PCB board 110 during pressing.
[0036] In one example, the surface of the pressure plate that mates with the spring antenna 120 can be a plane or an arcuate surface. Alternatively, the surface of the pressure plate that mates with the spring antenna 120 can have a plane and an arcuate surface connected to the plane, wherein the arcuate surface serves as a guide surface so that the portion of the spring antenna 120 near the PCB board 110 bends according to the guide of the arcuate surface.
[0037] One or more embodiments of this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments of this specification should be included within the scope of protection of this disclosure.
[0038] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. An electronic tag implantation device, characterized in that, include: A gripping mechanism for gripping a PCB board of an electronic tag, and a pressing assembly disposed on the gripping mechanism for pressing the spring antenna of the electronic tag into the rubber of a tire; wherein the pressing assembly avoids the PCB board of the electronic tag.
2. The electronic tag implantation device according to claim 1, characterized in that, The number of pressing components is two, and the two pressing components are arranged on both sides of the gripping mechanism.
3. The electronic tag implantation device according to claim 2, characterized in that, The gripping mechanism includes a support base and a gripping assembly disposed on the support base, with two pressing assemblies arranged on both sides of the gripping assembly; The pressing assembly includes a support member fixedly connected to the support base, and a pressing head that is retractable relative to the support member.
4. The electronic tag implantation device according to claim 3, characterized in that, The number of pressure heads is multiple, and the multiple pressure heads are arranged at intervals along the length direction of the spring antenna.
5. The electronic tag implantation device according to claim 3, characterized in that, The support base has a channel, and the pressure head is located in the channel and can move back and forth within the channel; When the pressure head extends to a first set position relative to the fixing member, the pressure head is at least partially located outside the channel and can press the spring antenna into the rubber of the tire.
6. The electronic tag implantation device according to claim 5, characterized in that, The channel is a through hole or notch formed on the support base.
7. The electronic tag implantation device according to claim 2, characterized in that, Along the arrangement direction of the pressing components, the ratio of the distance between the two pressing heads to the length of the PCB board is greater than 1.
5.
8. The electronic tag implantation device according to any one of claims 3 to 7, characterized in that, The gripping component is a vacuum suction cup, an adhesive component with an adhesive surface, or a mechanical claw.