Novel anti-cracking floor heating backfilling structure
By using wire mesh and a high-strength self-leveling layer in the underfloor heating backfill structure, combined with insulation boards, the problems of unstable and cracked underfloor heating backfill materials were solved, achieving efficient construction and high flatness, and reducing the probability of renovation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG KUNSHI CONSTRUCTION TECHNOLOGY CO LTD
- Filing Date
- 2025-03-13
- Publication Date
- 2026-04-24
AI Technical Summary
Existing underfloor heating backfill materials have unstable performance, low construction efficiency, are prone to cracking, and have poor flatness, which affects the performance.
The structure adopts a combination of wire mesh and high-strength self-leveling layer, along with insulation board and underfloor heating pipes, to form a crack-resistant underfloor heating backfill structure. Galvanized wire mesh and high-strength self-leveling mortar are used, with the wire mesh covered by a self-leveling layer and the underfloor heating pipes wrapped in insulation board to form a stable construction layer.
It improves construction efficiency, reduces the risk of cracking, ensures high flatness, shortens the construction cycle, increases space utilization efficiency, extends the life of underfloor heating pipes, and reduces the probability of renovation.
Smart Images
Figure CN224161371U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of underfloor heating structures, and in particular to a novel crack-resistant underfloor heating backfill structure. Background Technology
[0002] Currently, the commonly used backfill materials for underfloor heating are on-site mixed mortar with added sunflower seed shells or pea gravel, and gypsum-based self-leveling compounds. When manually mixed on-site, the proportions are highly arbitrary, resulting in unstable material performance. Moreover, the flatness error after manual spreading and leveling is relatively large, the construction efficiency is slow, the later curing period is long, and the material has a large thermal expansion and contraction, which can easily cause cracking and hollowing, affecting the installation and use of the surface material.
[0003] Moreover, the quality of gypsum self-leveling materials varies greatly. Because gypsum is naturally afraid of water, it is prone to powdering and loss of strength when exposed to water or moisture. It is also brittle, lacks toughness, has a large deformation rate, and is prone to cracking in the later stages.
[0004] Therefore, a new type of crack-resistant underfloor heating backfill structure is proposed, which can make the underfloor heating system less prone to cracking after backfilling, achieve high flatness, improve construction efficiency, and greatly reduce the probability of underfloor heating system renovation and reconstruction. Summary of the Invention
[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the existing technology and provide a new type of crack-resistant underfloor heating backfill structure, which makes the underfloor heating backfill less prone to cracking, has high flatness, improves construction efficiency, and greatly reduces the probability of underfloor heating renovation and reconstruction.
[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0007] A novel crack-resistant underfloor heating backfill structure includes a foundation surface and underfloor heating pipes placed on the foundation surface. A covering layer is poured on top of the underfloor heating pipes. Wire mesh is installed or laid on top of the covering layer, and a self-leveling layer is covered on top of the wire mesh. The self-leveling layer is made of self-leveling material.
[0008] As a preferred option, an insulation board is also provided between the covering layer and the base surface, and the insulation board wraps around the underfloor heating pipes.
[0009] Preferably, the insulation board has raised blocks, and the raised blocks are arranged in a circumferential array to form at least one circular piece, which is laid under the underfloor heating pipe.
[0010] As a preferred material, the insulation board is made of polystyrene.
[0011] Preferably, the wire mesh has square holes.
[0012] Preferably, the wire mesh surface is galvanized.
[0013] Preferably, the thickness of the covering layer is 3cm to 6cm.
[0014] As a preferred option, the self-leveling layer is a structural layer formed using high-strength self-leveling mortar.
[0015] Preferably, the thickness of the self-leveling layer is 1cm to 2cm.
[0016] As a preferred option, the underfloor heating pipes are laid in a "linear" or "serpentine" pattern.
[0017] The beneficial effects of using this utility model are as follows:
[0018] 1. A novel crack-resistant underfloor heating backfill structure, comprising a foundation surface and underfloor heating pipes placed on the foundation surface, with a covering layer poured on top of the underfloor heating pipes. A wire mesh is installed or laid on top of the covering layer, for example, the wire mesh can be fixed with clips. In this embodiment, the wire mesh is laid flat directly, and a self-leveling layer is placed on top of the wire mesh. The self-leveling layer uses self-leveling material and a combination of a self-leveling layer and galvanized wire mesh. The wire mesh replaces the traditional fiberglass mesh, enhancing crack resistance. In this embodiment, the self-leveling layer is a structural layer formed using high-strength self-leveling mortar. The high-strength self-leveling material is mixed with water according to a specified ratio upon arrival at the site. Due to its stable material properties, the construction speed is accelerated, and it solidifies and forms within 4-6 hours, allowing for walking on walls or ceilings, thus shortening the construction cycle.
[0019] Because the shrinkage ratio of high-strength self-leveling material is only 1 / 10 that of cement mortar, it is less affected by temperature changes, less prone to cracking, and has extremely small flatness error, which can be controlled within the range of 2mm to 3mm. The surface material can be directly laid, meeting the requirements for thin-lay methods of flooring, vinyl flooring, stone, and slab flooring. Since the structure is minimally affected by thermal expansion and contraction, the risk of cracking is greatly reduced. The backfill thickness can be adjusted according to the diameter of the underfloor heating pipes, reducing the backfill thickness by 1-2cm compared to traditional methods, thereby increasing the effective usable height of the space and improving space utilization efficiency.
[0020] The insulation board has raised blocks, which are arranged in a circumferential array to form at least one circular component. The circular component array is laid under the underfloor heating pipe. The raised blocks forming a circular component provide better support for the underfloor heating pipe and have a better shockproof effect.
[0021] The wire mesh has square holes, which facilitate the laying of high-strength self-leveling material and make it easier to solidify. The surface of the wire mesh is galvanized to prevent it from rusting due to moisture.
[0022] These features and advantages of the present invention will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description
[0023] The present invention will be further described below with reference to the accompanying drawings:
[0024] Figure 1 This is a schematic diagram of the overall structure of a new type of crack-resistant underfloor heating backfill. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0026] The concepts involved in this application will first be explained with reference to the accompanying drawings. It should be noted that the following explanation of each concept is only to make the content of this application easier to understand and does not imply any limitation on the scope of protection of this application.
[0027] Example 1:
[0028] A new type of crack-resistant underfloor heating backfill structure, such as Figure 1 As shown, the system includes a base surface 1 and underfloor heating pipes 2 placed on the base surface 1. A covering layer 3 is poured on top of the underfloor heating pipes 2. Wire mesh 4 is clipped or laid on top of the covering layer 3, for example, it can be fixed with clips. In this embodiment, the wire mesh 4 is laid flat directly. A self-leveling layer 6 is covered on top of the wire mesh 4. The self-leveling layer 6 uses self-leveling material. By using the self-leveling layer 6 plus galvanized wire mesh 4, the wire mesh 4 replaces the traditional fiberglass mesh, enhancing crack resistance. In this embodiment, the self-leveling layer 6 is a structural layer formed by high-strength self-leveling mortar. The high-strength self-leveling material is mixed with water according to the ratio after arrival on site. Due to its stable material properties, the construction speed is accelerated, and it solidifies and forms in 4-6 hours, supporting walking for wall or ceiling construction, shortening the construction cycle.
[0029] Because the shrinkage ratio of high-strength self-leveling material is only 1 / 10 that of cement mortar, it is less affected by temperature changes, less prone to cracking, and has extremely small flatness error, which can be controlled within the range of 2mm to 3mm. The surface material can be directly laid, meeting the requirements for thin-lay surface materials such as flooring, vinyl flooring, stone, and slab flooring. Since the structure is minimally affected by thermal expansion and contraction, the risk of cracking is greatly reduced. The backfill thickness can be adjusted according to the diameter of the underfloor heating pipe 2, reducing the backfill thickness by 1-2cm compared to traditional methods, thereby increasing the effective usable height of the space and improving space utilization efficiency.
[0030] An insulation board 5 is also provided between the covering layer 3 and the base surface 1. The insulation board 5 wraps around the floor heating pipe 2, which can protect the floor heating pipe 2 from damage to a certain extent, extend the service life of the floor heating pipe 2, and has good heat preservation effect, as well as moisture-proof and sound insulation functions.
[0031] The insulation board 5 is provided with protrusions 7, and the protrusions 7 are arranged in a circumferential array to form at least one circular piece 8. The circular piece 8 is laid in an array under the floor heating pipe 2. The protrusions 7 forming the circular piece 8 provide better support for the floor heating pipe 2 and have a better shockproof effect.
[0032] The insulation board 5 is made of polystyrene.
[0033] The wire mesh 4 has square holes 9, which facilitate the laying of high-strength self-leveling material and make it easier to solidify.
[0034] The surface of wire mesh 4 is galvanized to prevent it from rusting due to moisture and other factors.
[0035] The thickness of the covering layer 3 is 3cm to 6cm. If the covering layer 3 is less than 3cm, it is not easy to completely cover the underfloor heating pipe 2. If it is greater than 6cm, it is not conducive to space utilization.
[0036] The thickness of the self-leveling layer 6 is 1cm to 2cm. If the self-leveling layer 6 is less than 1cm, it will not be able to completely cover the wire mesh 4. If it is more than 2cm, it will not be able to solidify.
[0037] The underfloor heating pipe 2 is laid in a "linear" or "serpentine" pattern. In this embodiment, the underfloor heating pipe 2 is laid in a "linear" pattern, which allows for faster installation.
[0038] The above are merely specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Those skilled in the art should understand that this utility model includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this utility model will be included within the scope of the claims.
Claims
1. A novel crack-resistant underfloor heating backfill structure, characterized in that, It includes a base surface and underfloor heating pipes placed on the base surface. A covering layer is poured on top of the underfloor heating pipes. Wire mesh is installed or laid on top of the covering layer. A self-leveling layer is covered on top of the wire mesh. The self-leveling layer is made of self-leveling material.
2. The novel crack-resistant underfloor heating backfill structure as described in claim 1, characterized in that, An insulation board is also provided between the covering layer and the base surface, and the insulation board wraps around the underfloor heating pipes.
3. The novel crack-resistant underfloor heating backfill structure as described in claim 2, characterized in that, The insulation board is provided with protrusions, and the protrusions are arranged in a circumferential array to form at least one circular component, which is laid under the floor heating pipe.
4. The novel crack-resistant underfloor heating backfill structure as described in claim 2, characterized in that, The insulation board material is polystyrene.
5. The novel crack-resistant underfloor heating backfill structure as described in claim 1, characterized in that, The wire mesh has square holes.
6. The novel crack-resistant underfloor heating backfill structure as described in claim 1, characterized in that, The surface of the wire mesh is galvanized.
7. The novel crack-resistant underfloor heating backfill structure as described in claim 1, characterized in that, The thickness of the covering layer is 3cm to 6cm.
8. The novel crack-resistant underfloor heating backfill structure as described in claim 1, characterized in that, The self-leveling layer is a structural layer formed using high-strength self-leveling mortar as the material.
9. A novel crack-resistant underfloor heating backfill structure as described in claim 1, characterized in that, The thickness of the self-leveling layer is 1cm to 2cm.
10. A novel crack-resistant underfloor heating backfill structure as described in any one of claims 1 to 9, characterized in that, The underfloor heating pipes are laid in a "linear" or "serpentine" pattern.