Chip capacitor implanting mechanism based on thick rubber plate

Abstract

The utility model discloses a chip capacitor implanting mechanism based on a thick rubber plate. The chip capacitor implanting mechanism comprises a mounting base, a mounting seat, an implanting device, an implanting conveying device and a motor vibration device, the implanting device comprises an implanting base plate, an implanting top plate and an implanting frame which are sequentially arranged at intervals from bottom to top, the implanting base plate and the implanting frame are connected through a vertically-extending supporting column, the implanting top plate is arranged between the implanting base plate and the implanting frame in a vertically-moving mode, and the conveying face of the implanting conveying device is located above the implanting top plate. According to the scheme, the motor vibration device is used for replacing an electromagnet in the prior art to achieve vibration implantation of the chip capacitor, the motor vibration device is driven by the motor, and the output end of the motor vibration device is only connected with the implantation device, so that the chip capacitor can be implanted after vibration acts on the implantation device in the implantation process; and then the chip capacitor positioned on the implanting device is driven to vibrate, and the chip capacitor is effectively implanted into the lead-in plate in cooperation with the swinging effect of the mounting seat.

Description

Technical Field

[0001] This utility model relates to the technical field of chip capacitor production equipment, and in particular to a chip capacitor implantation mechanism based on a thick adhesive plate. Background Technology

[0002] Currently, fully automated end-sealing machines / production lines for surface mount capacitors typically use a stencil as the carrier for transferring the capacitors. Specifically, as detailed in Chinese Utility Model Patent CN218849426U, the end-sealing process involves first applying an adhesive film to one side of the stencil to seal one end of the mesh. After the film is smoothly adhered, the surface mount capacitors are inserted into the mesh, and the adhesive film adheres hundreds of miniature capacitors to the stencil, preventing them from falling off. Then, the other end of the capacitors without adhesive film is dipped in resin for end-sealing. During this insertion process, the ends of the surface mount capacitors are aligned by the adhesive film. However, due to potential manufacturing tolerances (such as varying lengths) in the surface mount capacitors themselves, the ends to be sealed within the same stencil are difficult to align perfectly after insertion, resulting in poor consistency in the resin dipping process and significantly affecting the end-sealing quality.

[0003] Therefore, to ensure the sealing quality of surface mount capacitors, some manufacturers have begun to use thick plastic plates instead of stencils as the transport carrier for surface mount capacitors. The thick plastic plate is a carrier that fixes the surface mount capacitor using silicone clamps. Therefore, to successfully implant the surface mount capacitor into the holes of the thick plastic plate, a guide plate needs to be placed on top of the thick plastic plate. First, the surface mount capacitor is implanted into the guide hole of the guide plate by vibration. Then, a bed of needles presses the surface mount capacitor located in the guide plate into the hole of the thick plastic plate (the guide holes of the guide plate correspond one-to-one with the holes of the thick plastic plate), thus completing the implantation process of the surface mount capacitor into the thick plastic plate.

[0004] In the prior art, the implantation device used in the capping process of chip capacitors generally uses electromagnets to achieve vibration implantation of the product. However, since electromagnets generate a magnetic field by the flow of current in the wire, this magnetic field can attract or repel other magnetic materials. In other words, electromagnets may cause resonance phenomena in the structure of other magnetic materials in the implantation mechanism. Utility Model Content

[0005] The purpose of this invention is to propose a patch capacitor implantation mechanism based on a thick adhesive plate, which can effectively avoid the resonance phenomenon of the electromagnet to the structure of other magnetic materials in the implantation mechanism, thereby preventing unnecessary vibration to the structure of other magnetic materials and overcoming the shortcomings of the prior art.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A chip capacitor implantation mechanism based on a thick adhesive plate includes a mounting base, a mounting seat, an implantation device, an implantation delivery device, and a motor vibration device.

[0008] The mounting base is installed on the top of the mounting base, and the center of the top of the mounting base and the center of the bottom of the mounting base are rotatably connected by a bearing seat, and the mounting base swings relative to the mounting base.

[0009] Both the implantation device and the implantation delivery device are mounted above the mounting base, and the implantation delivery device is located inside the implantation device; the implantation delivery device is used to deliver the assembly to the implantation device, and the delivery direction of the implantation delivery device is parallel to the swing direction of the mounting base; the assembly includes a thick adhesive plate and an inlet plate that are attached from bottom to top.

[0010] The motor vibration device is installed at the bottom of the mounting base, and the output end of the motor vibration device is connected to the implantation device. The motor vibration device is used to drive the implantation device to vibrate relative to the mounting base.

[0011] The implantation device includes an implantation base, an implantation top plate, and an implantation frame arranged sequentially from bottom to top. The implantation base and the implantation frame are connected by a vertically extending support column. The implantation top plate is movably disposed between the implantation base and the implantation frame, and the conveying surface of the implantation delivery device is located above the implantation top plate.

[0012] The bottom of the implantation frame includes a holding position and a clearance position, and the holding position and the clearance position are connected sequentially along a direction perpendicular to the conveying direction of the implantation delivery device; the holding position is used to hold the patch capacitor to be implanted, and the implantation top plate is used to abut the guide plate to be implanted against the clearance position.

[0013] Preferably, the motor vibration device includes a rotating motor, a transmission rod, and a drive rod; the rotating motor is mounted on the bottom of the mounting base;

[0014] The transmission rod is rotatably connected to the output end of the rotary motor, and the end of the transmission rod is rotatably connected to the end of the drive rod;

[0015] The top end of the drive rod passes through the mounting base and is fixedly connected to the implantation chassis.

[0016] Preferably, the implantation device further includes a limiting rod, which is movably mounted on the front side of the implantation chassis and can extend and retract from the conveying surface of the implantation delivery device.

[0017] Preferably, the implantation device further includes sliders, and the sliders are protrudingly mounted on both sides of the bottom of the implantation chassis;

[0018] The top two sides of the mounting base are provided with slide rails, and the extension direction of the slide rails is parallel to the conveying direction of the implantation delivery device.

[0019] The slider is slidably connected to the slide rail.

[0020] Preferably, at least two sets of implantation devices are provided, and the two sets of implantation devices are arranged side by side along the conveying direction of the implantation delivery device;

[0021] The implant delivery device is located inside the two sets of implant devices;

[0022] Two drive rods are provided. The two ends of the transmission rod are rotatably connected to the ends of the two drive rods respectively. The top end of one drive rod passes through the mounting base and is fixedly connected to the implantation base of one implantation device. The top end of the other drive rod passes through the mounting base and is fixedly connected to the implantation base of another implantation device.

[0023] Preferably, the upper surface of the implantation chassis is provided with a U-shaped rim, and the rim is located close to the edge of the implantation chassis;

[0024] The end of the implantation chassis is recessed inward and has a receiving groove, and the opening of the surrounding edge faces the receiving groove.

[0025] The holding position and the receiving groove are located on both sides of the swing shaft of the mounting base.

[0026] The technical solution provided by this utility model can include the following beneficial effects:

[0027] 1. This solution uses a motor vibration device to replace the electromagnet in the existing technology to achieve vibration implantation of the chip capacitor. Since the motor vibration device is driven by a motor and its output terminal is only connected to the implantation device, the chip capacitor located on the implantation device can be vibrated after the vibration is applied to the implantation device during the implantation process. In conjunction with the swinging action of the mounting base, the chip capacitor can be effectively implanted on the guide plate.

[0028] 2. Since the vibration of the motor vibration device acts directly on the implantation device through mechanical connection, and the amplitude of the vibration is very small, the resonance phenomenon between structures can be effectively avoided, thus extending the service life of the implantation mechanism. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the inlet plate and the thick adhesive plate in a chip capacitor implantation mechanism based on a thick adhesive plate according to this utility model.

[0030] Figure 2This is a schematic diagram of the structure of a chip capacitor implantation mechanism based on a thick adhesive plate according to this utility model, from one perspective.

[0031] Figure 3 This is a schematic diagram of another perspective of the chip capacitor implantation mechanism based on a thick adhesive plate according to this utility model.

[0032] Figure 4 This is a side view of a chip capacitor implantation mechanism based on a thick adhesive plate according to this utility model.

[0033] Figure 5 This is a partial structural schematic diagram of a chip capacitor implantation mechanism based on a thick adhesive plate according to this utility model.

[0034] Figure 6 This is a schematic diagram of the working state of a chip capacitor implantation mechanism based on a thick adhesive plate according to this utility model.

[0035] Among them: mounting base 21, mounting seat 22, slide rail 221, implantation device 23, implantation chassis 231, perimeter 2311, receiving trough 2312, implantation top plate 232, implantation frame 233, holding position 2331, clearance position 2332, limiting rod 234, slider 235, implantation conveying device 24, motor vibration device 25, rotating motor 251, transmission rod 252, drive rod 253;

[0036] Import plate 92, thick glue plate 93. Detailed Implementation

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] This technical solution provides a chip capacitor implantation mechanism based on a thick adhesive plate, including a mounting base 21, a mounting seat 22, an implantation device 23, an implantation delivery device 24, and a motor vibration device 25;

[0039] The mounting base 22 is mounted on the top of the mounting base 21, and the center of the top of the mounting base 21 and the center of the bottom of the mounting base 22 are rotatably connected by a bearing seat. The mounting base 22 swings relative to the mounting base 21.

[0040] The implantation device 23 and the implantation delivery device 24 are both mounted above the mounting base 22, and the implantation delivery device 24 is located inside the implantation device 23; the implantation delivery device 24 is used to deliver the assembly to the implantation device 23, and the delivery direction of the implantation delivery device 24 is parallel to the swing direction of the mounting base 22; the assembly includes a thick adhesive plate 93 and an inlet plate 92 that are attached to each other from bottom to top.

[0041] The motor vibration device 25 is installed at the bottom of the mounting base 22, and the output end of the motor vibration device 25 is connected to the implantation device 23. The motor vibration device 25 is used to drive the implantation device 23 to vibrate relative to the mounting base 22.

[0042] The implantation device 23 includes an implantation base 231, an implantation top plate 232, and an implantation frame 233 arranged sequentially from bottom to top. The implantation base 231 and the implantation frame 233 are connected by vertically extending support columns. The implantation top plate 232 is movably disposed between the implantation base 231 and the implantation frame 233, and the conveying surface of the implantation delivery device 24 is located above the implantation top plate 232.

[0043] The bottom of the implantation frame 233 includes a holding position 2331 and a clearance position 2332, and the holding position 2331 and the clearance position 2332 are connected sequentially along a direction perpendicular to the implantation delivery device 24; the holding position 2331 is used to hold the patch capacitor to be implanted, and the implantation top plate 232 is used to abut the guide plate 92 to be implanted against the clearance position 2332.

[0044] In the prior art, the implantation device used in the capping process of chip capacitors generally uses electromagnets to achieve vibration implantation of the product. However, since electromagnets generate a magnetic field by the flow of current in the wire, this magnetic field can attract or repel other magnetic materials. In other words, electromagnets may cause resonance phenomena in the structure of other magnetic materials in the implantation mechanism.

[0045] Therefore, to avoid resonance between the electromagnet and other magnetic materials in the implantation mechanism, and thus prevent unnecessary vibrations, this solution optimizes the structure of the implantation mechanism, such as... Figure 2-6As shown, the device includes a mounting base 21, a mounting seat 22, an implantation device 23, an implantation delivery device 24, and a motor vibration device 25. This solution utilizes the motor vibration device 25 to replace the electromagnet in the prior art for vibration implantation of the patch capacitor. Since the motor vibration device 25 is driven by a motor, and its output terminal is only connected to the implantation device 23, during the implantation process, vibration is applied to the implantation device 23, which in turn drives the patch capacitor located on the implantation device 23 to vibrate. This, combined with the oscillation action of the mounting seat 22, effectively implants the patch capacitor onto the guide plate 92. It should be noted that because the vibration of the motor vibration device 25 acts directly on the implantation device 23 through a mechanical connection, and the vibration amplitude is very small, resonance between structures can be effectively avoided, extending the service life of the implantation mechanism.

[0046] Specifically, the implantation process of the implantation institution in this plan includes the following steps:

[0047] (1) The assembly formed by the combination of the guide plate 92 and the thick adhesive plate 93 is transported to the top plate 232 of the implantation device 23 using the implantation conveying device 24; at the same time, the chip capacitor to be implanted is unloaded into the holding position 2331 of the implantation frame 233.

[0048] (2) The implantation top plate 232 moves upward and lifts the assembly located in the implantation delivery device 24, thereby causing the guide plate 92 in the assembly to abut against the clearance position 2332;

[0049] (3) Make the mounting base 22 swing relative to the mounting base 21, and at the same time use the motor vibration device 25 to drive the implantation device 23 to vibrate relative to the mounting base 22, so that the chip capacitor located in the holding position 2331 enters the clearance position 2332 and vibrates to be implanted into the inlet hole of the inlet plate 92.

[0050] (4) After implantation is completed, the motor vibration device 25 is turned off and the mounting base 22 is reset; then the implantation top plate 232 is moved downward and the assembly with the implanted chip capacitor is dropped back to the conveying surface of the implantation conveying device 24, and finally conveyed to the next process by the implantation conveying device 24.

[0051] It should be noted that the implantation delivery device 24 used in this solution is a conventional delivery device in the field, specifically a conveyor belt, which is not limited here.

[0052] To further explain, the motor vibration device 25 includes a rotating motor 251, a transmission rod 252, and a drive rod 253; the rotating motor 251 is mounted on the bottom of the mounting base 22;

[0053] The transmission rod 252 is rotatably connected to the output end of the rotary motor 251, and the end of the transmission rod 252 is rotatably connected to the end of the drive rod 253;

[0054] The top end of the drive rod 253 passes through the mounting base 22 and is fixedly connected to the implantation chassis 231.

[0055] Specifically, the motor vibration device 25 of this solution is powered by a rotating motor 251, and the vibration is transmitted to the implantation chassis 231 of the implantation device 23 by a transmission rod 252 and a drive rod 253 that are rotatably connected to each other. It has a simple structure, compact size, and can effectively avoid the transmission of vibration to other unnecessary mechanisms.

[0056] Furthermore, the implantation device 23 also includes a limiting rod 234, which is movably mounted on the front side of the implantation chassis 231 and can extend and retract from the conveying surface of the implantation delivery device 24.

[0057] In a preferred embodiment of this technical solution, by setting the limiting rod 234, the positioning and conveying of the assembly can be achieved without stopping the implantation conveying device 24, thereby avoiding the frequent start and stop of the implantation conveying device 24, which would have adverse effects on mechanical performance, service life, energy consumption and maintenance costs.

[0058] Furthermore, the implantation device 23 also includes a slider 235, which is protrudingly mounted on both sides of the bottom of the implantation chassis 231;

[0059] The mounting base 22 has slide rails 221 protruding from both sides of its top, and the extension direction of the slide rails 221 is parallel to the delivery direction of the implantation delivery device 24.

[0060] The slider 235 is slidably connected to the slide rail 221.

[0061] In another preferred embodiment of this technical solution, the implantation device 23 is mounted on the top of the mounting base 22 through the cooperation of the slider 235 and the slide rail 221. Under the premise that the implantation device 23 is stably installed on the top of the mounting base 22, sufficient vibration space is provided for the minor vibration of the implantation device 23 relative to the mounting base 22, thereby ensuring the implantation effect of the implantation device 23.

[0062] To further explain, at least two sets of the implantation device 23 are provided, and the two sets of implantation devices 23 are arranged side by side along the conveying direction of the implantation delivery device 24;

[0063] The implant delivery device 24 is located inside the two sets of implant devices 23;

[0064] Two drive rods 253 are provided. The two ends of the transmission rod 252 are rotatably connected to the ends of the two drive rods 253 respectively. The top end of one drive rod 253 passes through the mounting base 22 and is fixedly connected to the implantation base 231 of one implantation device 23. The top end of the other drive rod 253 passes through the mounting base 22 and is fixedly connected to the implantation base 231 of another implantation device 23.

[0065] To improve the implantation efficiency of the implantation mechanism, this solution can also provide at least two implantation devices 23 on the top of the mounting base 22, and the two implantation devices 23 can share a set of implantation delivery device 24 and a set of motor vibration device 25, thereby improving the implantation efficiency of the implantation mechanism without increasing equipment costs.

[0066] To further explain, the upper surface of the implantation chassis 231 is provided with a U-shaped rim 2311, and the rim 2311 is located close to the edge of the implantation chassis 231.

[0067] The end of the implantation chassis 231 is recessed inward and provided with a receiving groove 2312, and the opening of the surrounding edge 2311 faces the receiving groove 2312.

[0068] The holding position 2331 and the receiving groove 2312 are located on both sides of the swing shaft of the mounting base 22.

[0069] In addition, this solution also adds a perimeter 2311 to the upper surface of the implantation chassis 231 to prevent the chip capacitors from falling to other parts of the implantation mechanism. This ensures that during the vibration of the implantation process, the chip capacitors that fall from the holding position 2331 are always located on the upper surface of the implantation chassis 231 and are collected by the receiving groove 2312 during the swing of the mounting base 22, which facilitates product collection and avoids product waste.

[0070] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0071] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0072] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0073] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0074] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0075] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0076] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A chip capacitor implantation mechanism based on a thick adhesive plate, characterized in that: It includes a mounting base, mounting seat, implantation device, implantation delivery device, and motor vibration device; The mounting base is installed on the top of the mounting base, and the center of the top of the mounting base and the center of the bottom of the mounting base are rotatably connected by a bearing seat, and the mounting base swings relative to the mounting base. Both the implantation device and the implantation delivery device are mounted above the mounting base, and the implantation delivery device is located inside the implantation device; the implantation delivery device is used to deliver the assembly to the implantation device, and the delivery direction of the implantation delivery device is parallel to the swing direction of the mounting base; the assembly includes a thick adhesive plate and an inlet plate that are attached from bottom to top. The motor vibration device is installed at the bottom of the mounting base, and the output end of the motor vibration device is connected to the implantation device. The motor vibration device is used to drive the implantation device to vibrate relative to the mounting base. The implantation device includes an implantation base, an implantation top plate, and an implantation frame arranged sequentially from bottom to top. The implantation base and the implantation frame are connected by a vertically extending support column. The implantation top plate is movably disposed between the implantation base and the implantation frame, and the conveying surface of the implantation delivery device is located above the implantation top plate. The bottom of the implantation frame includes a holding position and a clearance position, and the holding position and the clearance position are connected sequentially along a direction perpendicular to the conveying direction of the implantation delivery device; the holding position is used to hold the patch capacitor to be implanted, and the implantation top plate is used to abut the guide plate to be implanted against the clearance position.

2. The chip capacitor implantation mechanism based on a thick adhesive plate according to claim 1, characterized in that: The motor vibration device includes a rotating motor, a transmission rod, and a drive rod; the rotating motor is mounted on the bottom of the mounting base; The transmission rod is rotatably connected to the output end of the rotary motor, and the end of the transmission rod is rotatably connected to the end of the drive rod; The top end of the drive rod passes through the mounting base and is fixedly connected to the implantation chassis.

3. The chip capacitor implantation mechanism based on a thick adhesive plate according to claim 1, characterized in that: The implantation device also includes a limiting rod, which is movably mounted on the front side of the implantation chassis and can extend and retract from the conveying surface of the implantation delivery device.

4. The chip capacitor implantation mechanism based on a thick adhesive plate according to claim 1, characterized in that: The implantation device also includes sliders, which are protrudingly mounted on both sides of the bottom of the implantation chassis; The top two sides of the mounting base are provided with slide rails, and the extension direction of the slide rails is parallel to the conveying direction of the implantation delivery device. The slider is slidably connected to the slide rail.

5. The chip capacitor implantation mechanism based on a thick adhesive plate according to claim 2, characterized in that: The implantation device is provided in at least two sets, and the two sets of implantation devices are arranged side by side along the conveying direction of the implantation delivery device; The implant delivery device is located inside the two sets of implant devices; Two drive rods are provided. The two ends of the transmission rod are rotatably connected to the ends of the two drive rods respectively. The top end of one drive rod passes through the mounting base and is fixedly connected to the implantation base of one implantation device. The top end of the other drive rod passes through the mounting base and is fixedly connected to the implantation base of another implantation device.

6. The chip capacitor implantation mechanism based on a thick adhesive plate according to claim 1, characterized in that: The upper surface of the implantation chassis is provided with a U-shaped rim, and the rim is located close to the edge of the implantation chassis. The end of the implantation chassis is recessed inward and has a receiving groove, and the opening of the surrounding edge faces the receiving groove. The holding position and the receiving groove are located on both sides of the swing shaft of the mounting base.

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