Chip capacitor implanting mechanism based on thick rubber plate
By replacing the electromagnet with a motor vibration device, the resonance problem caused by the electromagnet was solved, enabling stable implantation of surface mount capacitors and improving the service life and sealing quality of the equipment.
CN224164154UActive Publication Date: 2026-04-24ZHAOQING YINGTUO AUTOMATION EQUIP TECH CO LTD +1
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Patent Information
- Application Number
- CN202520983778.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-16
- Publication Date
- 2026-04-24
- Estimated Expiration
- 2035-05-16
AI Technical Summary
Technical Problem
In the prior art, the use of electromagnets in the implantation of patch capacitors may cause resonance in other magnetic material structures within the implantation mechanism, affecting the sealing quality and equipment lifespan.
Method used
A motor vibration device is used instead of an electromagnet, and it acts directly on the implantation device through a mechanical connection to achieve vibration implantation of the patch capacitor, thus avoiding resonance.
Benefits of technology
It effectively avoids resonance in the implantation mechanism, extends the service life of the equipment, and improves the sealing quality and implantation efficiency of the chip capacitor.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses a chip capacitor implanting mechanism based on a thick rubber plate. The chip capacitor implanting mechanism comprises a mounting base, a mounting seat, an implanting device, an implanting conveying device and a motor vibration device, the implanting device comprises an implanting base plate, an implanting top plate and an implanting frame which are sequentially arranged at intervals from bottom to top, the implanting base plate and the implanting frame are connected through a vertically-extending supporting column, the implanting top plate is arranged between the implanting base plate and the implanting frame in a vertically-moving mode, and the conveying face of the implanting conveying device is located above the implanting top plate. According to the scheme, the motor vibration device is used for replacing an electromagnet in the prior art to achieve vibration implantation of the chip capacitor, the motor vibration device is driven by the motor, and the output end of the motor vibration device is only connected with the implantation device, so that the chip capacitor can be implanted after vibration acts on the implantation device in the implantation process; and then the chip capacitor positioned on the implanting device is driven to vibrate, and the chip capacitor is effectively implanted into the lead-in plate in cooperation with the swinging effect of the mounting seat.
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